CN206993475U - A kind of PCB independent heat dissipation device - Google Patents

A kind of PCB independent heat dissipation device Download PDF

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Publication number
CN206993475U
CN206993475U CN201720564936.6U CN201720564936U CN206993475U CN 206993475 U CN206993475 U CN 206993475U CN 201720564936 U CN201720564936 U CN 201720564936U CN 206993475 U CN206993475 U CN 206993475U
Authority
CN
China
Prior art keywords
installing plate
pcb
heat
groove
cooling oil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201720564936.6U
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Chinese (zh)
Inventor
黄勇奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mika Qi Technology Co Ltd
Original Assignee
Mika Qi Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mika Qi Technology Co Ltd filed Critical Mika Qi Technology Co Ltd
Priority to CN201720564936.6U priority Critical patent/CN206993475U/en
Application granted granted Critical
Publication of CN206993475U publication Critical patent/CN206993475U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model discloses a kind of PCB independent heat dissipation device, including installing plate, the installing plate is in plate armature, the corner location of the installing plate offers runs through fixed screw holes up and down, the utility model is in actual use, pcb board uniform and quickly pass to heat-conducting layer, dividing plate is now passed to by heat-conducting layer again and the cooling oil that insulate stores insulation cooling oil in groove, now pass through the raised bigger serface of the high specific heat capacity and sheet of the cooling oil that insulate, allow heat being absorbed quickly for transmitting to come from pcb board bottom surface, so effectively reduce the heatings of PCB in itself, and coordinate traditional surface air-cooled, so as to greatly improve the radiating efficiency of pcb board.

Description

A kind of PCB independent heat dissipation device
Technical field
Pcb board field is the utility model is related to, specifically a kind of PCB independent heat dissipation device.
Background technology
Printed circuit board { PCB }, also known as printed circuit board (PCB), it is the supplier of electronic component electrical connection.It Existing more than 100 years of development history;It is mainly designed to layout design;Major advantage using circuit board is to subtract significantly Few mistake for connecting up and assembling, improves the gentle productive labor rate of Automated water.It can be divided into single sided board, double according to the wiring board number of plies Panel, four laminates, six laminates and other multilayer circuit boards.
It is slightly chaotic because printed circuit board (PCB) is not general end product, therefore in the definition of title, such as:Personal electricity The motherboard of brain, referred to as mainboard, and can not directly be referred to as circuit board, although there is the presence of circuit board in motherboard, not It is identical, thus assess industry when both it is relevant can not but say it is identical.Again for example:Because there is integrated circuit part to be loaded in circuit board On, thus news media he be referred to as IC plates, but substantially he be also not equal to printed circuit board (PCB).The printed circuit that we generally say Plate refers to the circuit board of bare board-i.e. no upper component.
The type of cooling of current PCB is mostly that surface is air-cooled, and overall cooling effectiveness is very slow, it is difficult to meets need Ask.
Utility model content
The purpose of this utility model is to provide a kind of PCB independent heat dissipation device, to solve above-mentioned background technology The problem of middle proposition.
To achieve the above object, the utility model provides following technical scheme:
A kind of PCB independent heat dissipation device, including installing plate, the installing plate are in plate armature, the installation The corner location of plate offers runs through fixed screw holes up and down, coordinates screw to realize that the fixed of installing plate is pacified using fixed screw holes Dress;The upper surface of the installing plate offers square mounting groove, and smears what is formed provided with heat conductive silica gel in the mounting groove Heat-conducting layer, and release liners are posted on the surface of heat-conducting layer, by the way that pcb board is placed in mounting groove, now heat-conducting layer can be uniform Be bonded with the bottom surface of pcb board, the heat on such pcb board can pass to heat-conducting layer well, while release liners can be right Untapped heat-conducting layer is protected;The lower surface of the installing plate offers radiating groove, and radiating is provided with the radiating groove Component;The radiating subassembly includes frid, and there are multiple sheets projections, frid in the bottom surface of frid using the form one-shot forming of punching press Upper surface be provided with the insulation cooling oil that is stamped and formed out and store groove, insulation cooling oil, which is stored, is injected with insulation cooling oil in groove;Institute The upper surface location for stating frid is welded with dividing plate, keeps insulation cooling oil to store the sealing of groove using dividing plate, and the dividing plate with The bottom surface back side of mounting groove is close to, and heat conductive silica gel, the side of the frid are scribbled between dividing plate and the bottom surface back side of mounting groove Position is fixedly connected with the medial surface of radiating groove using gluing form, therefore in actual use, pcb board it is uniform and quick Pass to heat-conducting layer, dividing plate is now passed to by heat-conducting layer again and the cooling oil that insulate stores insulation cooling oil in groove, this When pass through the raised bigger serface of the high specific heat capacity and sheet of the cooling oil that insulate so that transmit the heat of coming from pcb board bottom surface Amount can be quickly absorbed, so effectively reduce the heatings of PCB in itself, and coordinate traditional surface air-cooled, so as to Greatly improve the radiating efficiency of pcb board.
As further program of the utility model:The inner bottom surface corner of the mounting groove offers pcb board fixing threaded hole.
As further program of the utility model:The frid and dividing plate are made of red copper material, and overall thermal passes Efficiency high is led, radiating is rapider.
As further program of the utility model:Installing plate between the mounting groove inner bottom surface and dividing plate upper surface Thickness is 1mm-1.5mm, and the installing plate is made of aluminum alloy material.
The beneficial effects of the utility model:The utility model is in actual use, the uniform and quick transmission of pcb board To heat-conducting layer, dividing plate now passed to by heat-conducting layer again and the cooling oil that insulate stores insulation cooling oil in groove, is now passed through The raised bigger serface of the high specific heat capacity and sheet of the cooling oil that insulate so that the heat that comes is transmitted from pcb board bottom surface can be with Being absorbed quickly, so effectively reduces the heatings of PCB in itself, and coordinates traditional surface air-cooled, so as to greatly Improve the radiating efficiency of pcb board.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made The every other embodiment obtained, belong to the scope of the utility model protection.
Referring to Fig. 1, in the utility model embodiment, a kind of PCB independent heat dissipation device, including installing plate 1, institute It is in plate armature to state installing plate 1, and the corner location of the installing plate 1 offers runs through fixed screw holes 5 up and down, utilizes fixation The cooperation screw of screw hole 5 realizes the fixed installation of installing plate 1;The upper surface of the installing plate 1 offers square mounting groove 2, And the heat-conducting layer 3 formed is smeared in the mounting groove 2 provided with heat conductive silica gel, and release liners 4 are posted on the surface of heat-conducting layer 3, are passed through Pcb board is placed in mounting groove 2, now heat-conducting layer 3 uniformly can be bonded with the bottom surface of pcb board, the heat on such pcb board Amount can pass to heat-conducting layer 3 well, while release liners 4 can be protected to untapped heat-conducting layer 3;The installing plate 1 lower surface offers radiating groove, and is provided with radiating subassembly in the radiating groove;The radiating subassembly includes frid 7, frid 7 Bottom surface have multiple sheet projections 10 using the form one-shot forming of punching press, the upper surface of frid 7 is provided with the insulation being stamped and formed out Cooling oil stores groove 9, and insulation cooling oil, which is stored, is injected with insulation cooling oil in groove 9;The upper surface location of the frid 7 is welded with Dividing plate 8, the sealing of groove 9 is stored using the holding insulation cooling oil of dividing plate 8, and the bottom surface back side of the dividing plate 8 and mounting groove 2 is tight Patch, and heat conductive silica gel is scribbled between dividing plate 8 and the bottom surface back side of mounting groove 2, the lateral location of the frid 7 uses gluing shape Formula is fixedly connected with the medial surface of radiating groove, therefore in actual use, pcb board uniform and quickly passes to heat-conducting layer 3, Dividing plate 8 is now passed to by heat-conducting layer 3 again and the cooling oil that insulate stores insulation cooling oil in groove 9, now passes through insulating cold The bigger serface of oily high specific heat capacity and sheet projection 10 so that the heat come is transmitted from pcb board bottom surface can be quickly Absorbed, the heatings of PCB in itself are so effectively reduced, and coordinate traditional surface air-cooled, so as to greatly improve The radiating efficiency of pcb board.
The inner bottom surface corner of the mounting groove 2 offers pcb board fixing threaded hole 6.
The frid 7 and dividing plate 8 are made of red copper material, and overall heat conduction efficiency is high, and radiating is rapider.
The thickness of installing plate 1 between the inner bottom surface of mounting groove 2 and dividing plate 8 upper surface is 1mm-1.5mm, and the peace Loading board 1 is made of aluminum alloy material.
Operation principle of the present utility model is:In actual use, pcb board uniform and heat-conducting layer is quickly passed to 3, dividing plate 8 is now passed to by heat-conducting layer 3 again and the cooling oil that insulate stores insulation cooling oil in groove 9, now passes through insulation The high specific heat capacity of cooling oil and the bigger serface of sheet projection 10 so that the heat come is transmitted from pcb board bottom surface can be very Fast is absorbed, and so effectively reduces the heatings of PCB in itself, and coordinates traditional surface air-cooled, so as to greatly carry The high radiating efficiency of pcb board.
It is obvious to a person skilled in the art that the utility model is not limited to the details of above-mentioned one exemplary embodiment, and And in the case of without departing substantially from spirit or essential attributes of the present utility model, it can realize that this practicality is new in other specific forms Type.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary, and is nonrestrictive, this practicality is new The scope of type limits by appended claims rather than described above, it is intended that the equivalency fallen in claim is contained All changes in justice and scope are included in the utility model.Any reference in claim should not be considered as limitation Involved claim.

Claims (4)

1. a kind of PCB independent heat dissipation device, including installing plate, the installing plate is in plate armature, the installing plate Corner location offer up and down run through fixed screw holes, it is characterised in that:The upper surface of the installing plate offers square Mounting groove, and the heat-conducting layer formed is smeared in the mounting groove provided with heat conductive silica gel, and release liners are posted on the surface of heat-conducting layer;Institute The lower surface for stating installing plate offers radiating groove, and is provided with radiating subassembly in the radiating groove;The radiating subassembly includes frid, There are multiple sheets projections the bottom surface of frid using the form one-shot forming of punching press, and the upper surface of frid is provided with the insulation being stamped and formed out Cooling oil stores groove, and insulation cooling oil, which is stored, is injected with insulation cooling oil in groove;The upper surface location of the frid be welded with every Plate, and the dividing plate is close to the bottom surface back side of mounting groove, and heat conductive silica gel is scribbled between dividing plate and the bottom surface back side of mounting groove, The lateral location of the frid is fixedly connected with the medial surface of radiating groove using gluing form.
A kind of 2. PCB independent heat dissipation device according to claim 1, it is characterised in that:The mounting groove it is interior Bottom surface corner offers pcb board fixing threaded hole.
A kind of 3. PCB independent heat dissipation device according to claim 1, it is characterised in that:The frid and every Plate is made of red copper material.
A kind of 4. PCB independent heat dissipation device according to claim 1, it is characterised in that:Bottom in the mounting groove The thickness of installing plate between face and dividing plate upper surface is 1mm-1.5mm, and the installing plate is made of aluminum alloy material.
CN201720564936.6U 2017-05-20 2017-05-20 A kind of PCB independent heat dissipation device Expired - Fee Related CN206993475U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720564936.6U CN206993475U (en) 2017-05-20 2017-05-20 A kind of PCB independent heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720564936.6U CN206993475U (en) 2017-05-20 2017-05-20 A kind of PCB independent heat dissipation device

Publications (1)

Publication Number Publication Date
CN206993475U true CN206993475U (en) 2018-02-09

Family

ID=61389888

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720564936.6U Expired - Fee Related CN206993475U (en) 2017-05-20 2017-05-20 A kind of PCB independent heat dissipation device

Country Status (1)

Country Link
CN (1) CN206993475U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180209

Termination date: 20180520

CF01 Termination of patent right due to non-payment of annual fee