CN206976393U - Thermoelectric separated composite metal substrate - Google Patents
Thermoelectric separated composite metal substrate Download PDFInfo
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- CN206976393U CN206976393U CN201720775275.1U CN201720775275U CN206976393U CN 206976393 U CN206976393 U CN 206976393U CN 201720775275 U CN201720775275 U CN 201720775275U CN 206976393 U CN206976393 U CN 206976393U
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- heat conduction
- metal substrate
- composite metal
- separated composite
- conduction boss
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Abstract
The utility model discloses a kind of thermoelectric separated composite metal substrate, including：Metallic plate, heat conduction boss, thermally conductive insulating layer and copper foil circuit layer, the thermally conductive insulating layer is bonded setting with the copper foil circuit layer, center after fitting sets milling through hole, the thermally conductive insulating layer presses with the metallic plate, the heat conduction boss is set in the milling through hole, the heat conduction boss is adapted to the milling through hole.The advantages of thermoelectric separated composite metal substrate of the present utility model has without being etched to metallic plate, heat conduction boss positioning precision is good, good concentricity, good heat dissipation effect.
Description
Technical field
It the utility model is related to technical field of heat dissipation, more particularly to a kind of thermoelectric separated composite metal substrate.
Background technology
In the LED industry of prior art, the metal substrate with heat conduction and heat radiation effect uses composite material system
Into metallic circuit substrate, the more conventional glass-fiber-plate of its heat conduction, heat dispersion is greatly improved, but due to line layer and metal
There is one layer of insulating materials between substrate, limit its heat conduction, the further lifting of heat dispersion.
Documents 1 (CN204966543U) disclose a kind of Novel composite metal material substrate, including bond successively
The copper part of copper foil circuit layer 1, insulation material layer 2 and aluminum bronze clad metal sheet 3, wherein aluminum bronze clad metal sheet 3 and insulation
Material layer 2 is bonding；The upper surface of copper part is provided with a copper protruding plate 4, the copper foil circuit layer 1 and insulating materials being bonded together
Layer 2 is provided with a first through hole 5 for being used to install copper protruding plate 4, and the upper surface and the upper surface of copper foil circuit layer 1 of copper protruding plate 4 are neat
It is flat.
In order to reduce insulating barrier to heat conduction, the influence of radiating, documents 2 (CN205611056U) disclose a kind of thermoelectricity point
From composition metal circuit plate, including metal level 1, thermally conductive insulating layer 2 and copper foil circuit layer 3, the metal level 1 is provided with convex portion 101
With groove 102, the thermally conductive insulating layer 2 and copper foil circuit layer 3 are embedded in the groove 102 of metal level 1.The groove of metal level 1
It is plane with convex portion 101.The metallic plate is made up of aluminium sheet or copper coin, and front is carried out by using acid liquid medicine or alkaline medicinal liquid
Etch process forms metal tabs 101, by copper foil and thermally conductive insulating layer milling through hole, and enables it good with metal tabs 101
It is chimeric, it is used for the heat conduction and heat radiation that is connected with semiconductor devices pedestal in use.The thermally conductive insulating layer 2 is located at copper foil circuit
3 bottom of layer.Using heat pressing process, the thermally conductive insulating layer 2 after bonding and copper foil circuit layer 3 are pressed into the groove 102 of metal level 1
It is interior.Attachment relief electronic device directly contacted with metal bosses, realize thermoelectricity separate, eliminate insulating barrier to heat conduction, radiating
Influence, there is heat conduction, the heat-sinking capability of lifting metal substrate.But with time-consuming, technique ratio in the presence of etching method making metal bosses
The problems such as more complicated, boss dimensional accuracy is difficult to control.
Utility model content
The utility model is based on above one or more problem, there is provided a kind of thermoelectric separated composite metal substrate,
To solve to need in the prior art to be etched metallic plate, heat conduction boss positioning precision is poor, radiating effect not enough
The problem of good.
The utility model provides a kind of thermoelectric separated composite metal substrate, including：Metallic plate, heat conduction boss, heat conduction are exhausted
Edge layer and copper foil circuit layer, the thermally conductive insulating layer are bonded setting with the copper foil circuit layer, the center after fitting
Milling through hole is set, and the thermally conductive insulating layer is pressed with the metallic plate, and the heat conduction boss is set in the milling through hole, described
Heat conduction boss is adapted to the milling through hole.
Preferably, the block insulating barrier of rectangular in cross-section is made using low glue overflow amount insulating materials in the thermally conductive insulating layer.
Preferably, the concentricity of the milling through hole is within 0.01mm.
Preferably, the heat conduction boss selects corresponding Heat Conduction Material by electroplating, spraying according to heat, light, magnetic property requirements
Or sputtering forms solid and is adapted to milling through hole, the upper surface of the heat conduction boss is concordant with the upper surface of copper foil circuit layer,
Or protrude from the upper surface of the copper foil circuit layer and be parallel to each other, or the upper surface less than the copper foil circuit layer and mutually flat
OK.
Preferably, the top of the heat conduction boss is in comb teeth shape, including multiple detent projections, each detent projection section are in
Rectangle.
Preferably, the bottom of the heat conduction boss is embedded in the metallic plate and contacted with the metal plate.
Preferably, the bottom of the heat conduction boss includes baseplane and the first arc-shaped thermal conductive surface positioned at baseplane both sides
With the second arc-shaped thermal conductive surface.
Preferably, the heat conduction boss is in inverted T-shaped, and the bottom of the heat conduction boss is in pan shape.
Preferably, the baseplane and the first arc-shaped thermal conductive surface and the second arc-shaped thermal conductive surface are integrally formed.
Preferably, the copper foil circuit layer forms cover layer with the insulating barrier, and the cover layer thickness is in 0.12mm
To between 0.18mm.
Thermoelectric separated composite base plate of the present utility model has without being etched to metallic plate, heat conduction boss is determined
Precision is good for position, good concentricity, the advantages of good heat dissipation effect.
Brief description of the drawings
Fig. 1 is the structural representation of the thermoelectric separated composite metal substrate of the utility model first embodiment.
Fig. 2 is the structural representation of the heat conduction boss of a variant embodiment in the utility model first embodiment.
Fig. 3 is the structural representation of the thermoelectric separated composite metal substrate of the utility model second embodiment.
Fig. 4 is the structural representation of the thermoelectric separated composite metal substrate of the embodiment of the utility model the 3rd.
Embodiment
The utility model is described in detail with reference to the accompanying drawings and examples.If it should be noted that do not conflict,
Each feature in the utility model embodiment and embodiment can be combined with each other, the scope of protection of the utility model it
It is interior.
Embodiment 1
Fig. 1 and Fig. 2 is referred to, the thermoelectric separated composite metal substrate of the utility model first embodiment mainly wraps
Include：Metallic plate 11, thermally conductive insulating layer 12 and copper foil circuit layer 13 and heat conduction boss 14, the thermally conductive insulating layer 12 and the copper foil
The fitting of line layer 13 is set, and the center after fitting sets milling through hole, the thermally conductive insulating layer 12 and the metallic plate 11
Pressing, the heat conduction boss 14 is set in the milling through hole, the heat conduction boss 14 is adapted to the milling through hole.
Thermoelectric separated composite base plate of the present utility model has without being etched to metallic plate, heat conduction boss is determined
The advantages of position precision is good, good concentricity, good heat dissipation effect.
Specifically, thermoelectric separated composite base plate of the present utility model can be realized in the following ways：It will lead first
Thermal insulation layer and the bonding of copper foil circuit layer (for convenience of describing, the plate bonded is referred to as A plates, is also cover plate)；Again by (cover plate) A
Plate is designed through hole according to pre-provisioning request；Then the A plates of the milling through hole milled out are pressed with metallic plate, made preliminary
Metal substrate；After finally metal substrate is processed by existing special process technology, heat conduction boss is installed.
Preferably, the block insulation of rectangular in cross-section is made using low glue overflow amount insulating materials in the thermally conductive insulating layer 12
Layer.Here the small material of the material choosing pressing glue overflow amount of thermally conductive insulating layer, it can be ensured that can't see excessive glue in the bottom after pressing in hole.
Preferably, the concentricity of the milling through hole is within 0.01mm.By electroplating, spraying and during sputtering technology,
A milling through hole positioning is only needed, ensureing the concentricity for the milling through hole that A plates (cover plate) mill out can be easier in the range of above-mentioned requirements,
This improves the radiating efficiency of thermoelectric separated composite metal substrate.
Suitable pressing parameter also may be selected, make A plates pressed with metallic plate after without layering, foaming, while ensure to press
Afterwards on metal substrate hole bottom overflow adhesive phenomenon.
Preferably, the heat conduction boss 14 selects corresponding Heat Conduction Material by electroplating, spraying according to heat, light, magnetic property requirements
Apply or sputtering forms solid and is adapted to milling through hole.Here the material of heat conduction boss can be according to physical properties such as heat, light, magnetic
It is required that the material that selection is adaptable, then the material according to heat conduction boss and metallic plate, the processing technology of suitable heat conduction boss is selected,
Such as electroplate, spray, sputter, ensure that the heat of heat conduction boss, light, magnetic property requirements are met.
Preferably, the upper surface of the heat conduction boss 14 is concordant with the upper surface of copper foil circuit layer 13, or protrudes from described
The upper surface of copper foil circuit layer 13 and it is parallel to each other, or the upper surface less than the copper foil circuit layer 13 and is parallel to each other.
As shown in Fig. 2 in a variant embodiment, the top of above-mentioned heat conduction boss 14 is in comb teeth shape, including multiple teeth
Shape projection 15, by using detent projection, it can make it that lamp bead contact surface in welding is good, lamp bead center can position very well.
Each rectangular in cross-section of detent projection 15, identical distance is spaced between each detent projection.In addition, in other variant embodiments
In, the shape of the heat conduction boss 14 can also have a variety of changes, be not limited to common rectangle, circle, can also be triangle
The shape such as shape, trapezoidal, pentagon, hexagon.
Preferably, the copper foil circuit layer forms cover layer with the insulating barrier, and the cover layer thickness is in 0.12mm
To between 0.18mm.
Embodiment 2
Fig. 3 is referred to, the thermoelectric separated composite metal substrate of the utility model second embodiment mainly includes：Metal
Plate 21, thermally conductive insulating layer 22 and copper foil circuit layer 23 and heat conduction boss 24.
Preferably, the bottom 25 of the heat conduction boss 24 is embedded in the metallic plate 21 and connect with the face of metallic plate 21
Touch, such bottom 25 and the contact surface of metallic plate 21 further increase, and compared to first embodiment, radiating effect further carries
Rise.
Embodiment 3
Fig. 4 is referred to, the thermoelectric separated composite metal substrate of the embodiment of the utility model the 3rd mainly includes：Metal
Plate 31, thermally conductive insulating layer 32 and copper foil circuit layer 33 and heat conduction boss 34.Preferably, the bottom 35 of the heat conduction boss 34 includes
Baseplane and the first arc-shaped thermal conductive surface and the second arc-shaped thermal conductive surface 36 positioned at baseplane both sides.First arc-shaped thermal conductive surface
The area of dissipation of heat conduction boss 31 is added with the second arc-shaped thermal conductive surface 36.First arc-shaped thermal conductive surface arc length and the second circular arc
The arc length of shape thermal conductive surface is more than the length of the baseplane line, and such radiating effect ratio will increase by 10% originally.
Preferably, the heat conduction boss 34 is in inverted T-shaped, and the bottom of the heat conduction boss 34 is in pan shape.
Preferably, the baseplane and the first arc-shaped thermal conductive surface and the second arc-shaped thermal conductive surface 36 are integrally formed.Here
The baseplane and the first arc-shaped thermal conductive surface and the second arc-shaped thermal conductive surface 36 are in smoothing junction.First arc-shaped thermal conductive surface and
Two arc-shaped thermal conductive surfaces 36 are respectively two sections of minor arcs.
The utility model is provided a kind of new thermoelectric separated composite metal substrate and realized using above frame mode, is simplified
The production technology of thermoelectric separated composite metal substrate, help to promote the application of thermoelectric separated metal substrate.
The utility model has the advantages that without being etched boss processing to metallic plate, technique can be simplified；Meanwhile can be with
The dimensional tolerance that etching boss is brought is eliminated, improves the dimensional accuracy of product；And can be according to electronic device light, thermal and magnetic
Deng performance requirement, the material for selecting to have respective physical characteristic does heat conduction boss, and realizes the multi-functional combination of metal substrate, meets
Different operating performance requirement.
Embodiment of the present utility model is the foregoing is only, not thereby limits the scope of the claims of the present utility model, it is all
It is the equivalent structure or equivalent flow conversion made using the utility model specification and accompanying drawing content, or directly or indirectly uses
In other related technical areas, similarly it is included in scope of patent protection of the present utility model.
Claims (10)
- A kind of 1. thermoelectric separated composite metal substrate, it is characterised in that including：Metallic plate, heat conduction boss, thermally conductive insulating layer with And copper foil circuit layer, the thermally conductive insulating layer are bonded setting with the copper foil circuit layer, the center after fitting sets milling Through hole, the thermally conductive insulating layer press with the metallic plate, convex in the milling through hole setting heat conduction boss, the heat conduction Platform is adapted to the milling through hole.
- 2. thermoelectric separated composite metal substrate as claimed in claim 1, it is characterised in that the thermally conductive insulating layer is using low The block insulating barrier of rectangular in cross-section is made in glue overflow amount insulating materials.
- 3. thermoelectric separated composite metal substrate as claimed in claim 2, it is characterised in that the concentricity of the milling through hole exists Within 0.01mm.
- 4. thermoelectric separated composite metal substrate as claimed in claim 3, it is characterised in that the heat conduction boss foundation heat, Light, magnetic property requirements select corresponding Heat Conduction Material to form solid by electroplating, spraying or sputter and be adapted to milling through hole, described The upper surface of heat conduction boss is concordant with the upper surface of copper foil circuit layer, or protrude from the copper foil circuit layer upper surface and mutually It is parallel, or upper surface less than the copper foil circuit layer and be parallel to each other.
- 5. thermoelectric separated composite metal substrate as claimed in claim 1, it is characterised in that the top of the heat conduction boss is in Comb teeth shape, including multiple detent projections, each detent projection rectangular in cross-section.
- 6. thermoelectric separated composite metal substrate as claimed in claim 1, it is characterised in that the bottom of the heat conduction boss is embedding Enter in the metallic plate and contacted with the metal plate.
- 7. thermoelectric separated composite metal substrate as claimed in claim 6, it is characterised in that the bottom bag of the heat conduction boss Include baseplane and the first arc-shaped thermal conductive surface and the second arc-shaped thermal conductive surface positioned at baseplane both sides.
- 8. thermoelectric separated composite metal substrate as claimed in claim 6, it is characterised in that the heat conduction boss is in inverted T-shaped, The bottom of the heat conduction boss is in pan shape.
- 9. thermoelectric separated composite metal substrate as claimed in claim 7, it is characterised in that the baseplane and the first circular arc Shape thermal conductive surface and the second arc-shaped thermal conductive surface are integrally formed.
- 10. the thermoelectric separated composite metal substrate as described in any one of claim 1 to 9, it is characterised in that the copper foil line Road floor and the insulating barrier form cover layer, and the cover layer thickness in 0.12mm between 0.18mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720775275.1U CN206976393U (en) | 2017-06-29 | 2017-06-29 | Thermoelectric separated composite metal substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720775275.1U CN206976393U (en) | 2017-06-29 | 2017-06-29 | Thermoelectric separated composite metal substrate |
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| CN206976393U true CN206976393U (en) | 2018-02-06 |
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ID=61406271
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| CN201720775275.1U Active CN206976393U (en) | 2017-06-29 | 2017-06-29 | Thermoelectric separated composite metal substrate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110071206A (en) * | 2018-12-29 | 2019-07-30 | 博罗康佳精密科技有限公司 | A kind of COB aluminum-based packaging plate and its preparation process |
| CN110290639A (en) * | 2019-07-31 | 2019-09-27 | 东莞市沃德普自动化科技有限公司 | A kind of equipment and PCB board thereof |
| CN111163584A (en) * | 2020-02-18 | 2020-05-15 | 江门市江海区创辉特电子有限公司 | Novel steel foil substrate structure |
-
2017
- 2017-06-29 CN CN201720775275.1U patent/CN206976393U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110071206A (en) * | 2018-12-29 | 2019-07-30 | 博罗康佳精密科技有限公司 | A kind of COB aluminum-based packaging plate and its preparation process |
| CN110071206B (en) * | 2018-12-29 | 2021-09-17 | 博罗康佳精密科技有限公司 | COB aluminum-based packaging plate and preparation process thereof |
| CN110290639A (en) * | 2019-07-31 | 2019-09-27 | 东莞市沃德普自动化科技有限公司 | A kind of equipment and PCB board thereof |
| CN111163584A (en) * | 2020-02-18 | 2020-05-15 | 江门市江海区创辉特电子有限公司 | Novel steel foil substrate structure |
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