CN206851244U - A kind of high heat conduction composite aluminum substrate - Google Patents
A kind of high heat conduction composite aluminum substrate Download PDFInfo
- Publication number
- CN206851244U CN206851244U CN201720710758.3U CN201720710758U CN206851244U CN 206851244 U CN206851244 U CN 206851244U CN 201720710758 U CN201720710758 U CN 201720710758U CN 206851244 U CN206851244 U CN 206851244U
- Authority
- CN
- China
- Prior art keywords
- aluminium base
- base substrate
- ceramic layer
- shaped
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 34
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 34
- 239000000758 substrate Substances 0.000 title claims abstract description 32
- 239000002131 composite material Substances 0.000 title claims abstract description 11
- 239000004411 aluminium Substances 0.000 claims abstract description 23
- 239000000919 ceramic Substances 0.000 claims abstract description 23
- 238000003780 insertion Methods 0.000 claims abstract description 7
- 230000037431 insertion Effects 0.000 claims abstract description 7
- 230000004888 barrier function Effects 0.000 claims 1
- 239000012212 insulator Substances 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of high heat conduction composite aluminum substrate, includes successively from bottom to up：Aluminium base substrate, ceramic layer, organic insulator, conductive layer；The aluminium base substrate and ceramic layer are equipped with the through hole that shaft section is T-shaped, the perpendicular end insertion of T-shaped through hole corresponding to aluminium base substrate and ceramic layer.The utility model is by introducing the T-shaped through hole between two layers of ceramic layer and aluminium base substrate, more preferably, can be conducted heat by the insertion between metal nuts, screw rod, obtain more preferable heat-conducting effect.
Description
Technical field
It the utility model is related to aluminium base field, more particularly to a kind of high heat conduction composite aluminum substrate.
Background technology
In existing composite aluminum substrate, ceramic layer is provided with aluminium base, because ceramic layer radiating is not good enough so that overall
Heat dispersion have a greatly reduced quality, therefore, the prior art is defective, it is necessary to improve.
Utility model content
The purpose of this utility model is overcome the deficiencies in the prior art, there is provided a kind of high heat conduction composite aluminum substrate.
The technical solution of the utility model is as follows：A kind of high heat conduction composite aluminum substrate, includes successively from bottom to up：Aluminium base
Substrate, ceramic layer, organic insulator, conductive layer；The aluminium base substrate and ceramic layer are equipped with the through hole that shaft section is T-shaped,
The perpendicular end insertion of T-shaped through hole corresponding to aluminium base substrate and ceramic layer.
It is preferred that the aluminium base substrate and the perpendicular stomidium footpath of T-shaped through hole corresponding to ceramic layer are identical.
Further, the horizontal end inserted num of T-shaped through hole on the aluminium base substrate and ceramic layer, perpendicular end is through there is screw rod.
Using such scheme, the utility model is by introducing the T-shaped through hole between two layers of ceramic layer and aluminium base substrate, more
Excellently, it can be conducted heat by the insertion between metal nuts, screw rod, obtain more preferable heat-conducting effect.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is the top view of ceramic layer in the utility model.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
Referring to Fig. 1 and Fig. 2, the utility model provides a kind of high heat conduction composite aluminum substrate, includes successively from bottom to up：Aluminium base
Plate substrate 1, ceramic layer 2, organic insulator 3, conductive layer 4；It is T-shaped that the aluminium base substrate 1 and ceramic layer 2, which are equipped with shaft section,
Through hole 5,6, the perpendicular end insertion of T-shaped through hole 5,6 corresponding to aluminium base substrate 1 and ceramic layer 2.
Wherein, it is identical to erect stomidium footpath for the aluminium base substrate 1 and T-shaped through hole corresponding to ceramic layer 25,6.
In the utility model, the T-shaped through hole 5,6 of corresponding insertion can conduct heat to the aluminium base substrate 1 of bottom, by it
Heat is distributed.
More preferably, can be by metal heat transfer in the utility model, specific scheme is the aluminium base substrate 1 and ceramics
T-shaped through hole 5,6 horizontal end inserted nums 7 on layer 2, perpendicular end, which is run through, screw rod (not shown).It is this to connect by nut 7, screw rod
Conducted heat after connecing, more efficient heat transfer can be obtained.
Preferred embodiment of the present utility model is these are only, is not limited to the utility model, it is all in this practicality
All any modification, equivalent and improvement made within new spirit and principle etc., should be included in guarantor of the present utility model
Within the scope of shield.
Claims (3)
1. a kind of high heat conduction composite aluminum substrate, it is characterised in that include successively from bottom to up：It is aluminium base substrate, ceramic layer, organic
Insulating barrier, conductive layer；The aluminium base substrate and ceramic layer are equipped with the through hole that shaft section is T-shaped, aluminium base substrate and ceramics
The perpendicular end insertion of T-shaped through hole corresponding to layer.
2. high heat conduction composite aluminum substrate according to claim 1, it is characterised in that the aluminium base substrate and ceramic layer pair
It is identical that the T-shaped through hole answered erects stomidium footpath.
3. high heat conduction composite aluminum substrate according to claim 2, it is characterised in that in the aluminium base substrate and ceramic layer
The horizontal end inserted num of T-shaped through hole, perpendicular end, which is run through, screw rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720710758.3U CN206851244U (en) | 2017-06-16 | 2017-06-16 | A kind of high heat conduction composite aluminum substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720710758.3U CN206851244U (en) | 2017-06-16 | 2017-06-16 | A kind of high heat conduction composite aluminum substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206851244U true CN206851244U (en) | 2018-01-05 |
Family
ID=60800922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720710758.3U Expired - Fee Related CN206851244U (en) | 2017-06-16 | 2017-06-16 | A kind of high heat conduction composite aluminum substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206851244U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108337862A (en) * | 2018-03-02 | 2018-07-27 | 惠州市博宇科技有限公司 | A kind of new energy electric motor vehicle special-purpose aluminum substrate |
-
2017
- 2017-06-16 CN CN201720710758.3U patent/CN206851244U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108337862A (en) * | 2018-03-02 | 2018-07-27 | 惠州市博宇科技有限公司 | A kind of new energy electric motor vehicle special-purpose aluminum substrate |
| CN108337862B (en) * | 2018-03-02 | 2019-09-06 | 惠州市博宇科技有限公司 | A kind of new energy electric motor vehicle special-purpose aluminum substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6151448B2 (en) | High power LED street lamp with low light emission failure and method for manufacturing the same | |
| CN106298758B (en) | A kind of SMD power device integrated morphology applied to electric car electric control product | |
| CN203840469U (en) | Set top box | |
| CN206851244U (en) | A kind of high heat conduction composite aluminum substrate | |
| CN204361079U (en) | A kind of Pagoda-shaped Multi-stage semi-conductor refrigerating device adopting high thermal conductive substrate | |
| CN203722987U (en) | Simple heat radiation structure of multiple power devices | |
| CN205355038U (en) | Heat pipe cooling ware structure of IGBT module in converter | |
| CN202469593U (en) | Efficient heat radiation device for LED (Light-Emitting Diode) lamp | |
| CN201555191U (en) | LED radiating device | |
| CN204593313U (en) | A kind of LED metal base printed circuit board heat abstractor | |
| CN203686956U (en) | Radiator | |
| CN207811649U (en) | A kind of novel heat-conducting piece | |
| CN205579491U (en) | Led lamp panel | |
| CN208028050U (en) | A kind of spliced uniform-temperature plate heat dissipating device | |
| CN202205731U (en) | Heat radiating module for IGBT (Insulated Gate Bipolar Transistor) module superconductive heat pipe | |
| CN204466036U (en) | A kind of aluminum-based circuit board | |
| CN205196209U (en) | Potsherd heat abstractor | |
| CN105081495A (en) | Novel radiator welding process method | |
| CN205406507U (en) | Thyristor radiator of easy equipment | |
| CN206223003U (en) | A kind of steel bushing Enhanced radiator | |
| CN204652857U (en) | Heat sink assembly | |
| CN201708182U (en) | Ceramic substrate for LED lamps | |
| CN202473813U (en) | Porcelain fuse connection base | |
| CN204829400U (en) | Whole lamp of indoor outer LED illumination with ultralow junction temperature characteristics | |
| CN203378200U (en) | Heat dissipation fin |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180105 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |