CN206849838U - A kind of circuit board package structure - Google Patents
A kind of circuit board package structure Download PDFInfo
- Publication number
- CN206849838U CN206849838U CN201720487791.4U CN201720487791U CN206849838U CN 206849838 U CN206849838 U CN 206849838U CN 201720487791 U CN201720487791 U CN 201720487791U CN 206849838 U CN206849838 U CN 206849838U
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- China
- Prior art keywords
- housing
- pin
- circuit board
- package structure
- conductive plate
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Abstract
The utility model discloses a kind of circuit board package structure, including housing and lead, the side of the housing is fixed with the 3rd pin, the opposite side of the housing is fixed with the first pin and second pin, conductive plate is connected with the middle part of the housing, the top of the housing and the crevice place of conductive plate are connected with PTC chip, and the bottom of the housing and the crevice place of conductive plate are connected with TVS chips.This kind of utility model is reasonable in design, easy to use, is especially suitable for being packaged circuit board, simple in construction, easy to use, small volume, is easily installed, and is adapted to be widely popularized.
Description
【Technical field】
Electronic circuit technology field is the utility model is related to, more particularly to a kind of circuit board package structure.
【Background technology】
At present, in board application technical field, in order that circuit protection mainboard IC is not burned out, it is necessary to which two products come
Protected, generated heat when PTC is excessively stream, resistance increase, disconnected in input, resistance reduces after cooling, can work on, TVS
For diode when the two poles of the earth are by reverse transient state high energy impact events, it can be with the speed of 10 minus 12 power second two-stage by its two interpolar
High impedance be changed into ground impedance and absorb up to thousands of watts of surge power, make the voltage clamping at the two poles of the earth in a predetermined value, circuit
Plate space increases, it means that higher cost.
【Utility model content】
Main purpose of the present utility model is to provide a kind of circuit board package structure, effectively can solved in background technology
The problem of.
To achieve the above object, the technical scheme that the utility model is taken is：
A kind of circuit board package structure, including housing and lead, the side of the housing are fixed with the 3rd pin, the shell
The opposite side of body is fixed with the first pin and second pin, and conductive plate, the top of the housing are connected with the middle part of the housing
PTC chip is connected with the crevice place of conductive plate, the bottom of the housing and the crevice place of conductive plate are connected with TVS chips.
Further, first pin is connected to the top of housing side by lead.
Further, the second pin is connected to the bottom of housing side by lead.
Further, the 3rd pin is connected to one end of conductive plate by lead.
Further, the section of the housing is convex shape structure.
Further, the PTC chip, TVS chips and conductive plate are distributed into laminated construction.
Further, the material of first pin, second pin and the 3rd pin is red copper.
Compared with prior art, the utility model has the advantages that：This kind of utility model is reasonable in design, user
Just, this encapsulation SMB-3 can be protected with a replacement two, PTC is done with TVS together with save space, and this kind of reality
With new, small product size is small, and function does not drop to be strengthened on the contrary, saves board area, can effectively reduce cost, is especially suitable for pair
Circuit board is packaged, simple in construction, easy to use, is easily installed, and is adapted to be widely popularized.
【Brief description of the drawings】
Fig. 1 is the utility model overall structure diagram.
Fig. 2 is internal structure schematic diagram of the present utility model.
In figure：1st, the first pin；2nd, second pin；3rd, housing；4th, the 3rd pin；5th, TVS chips；6th, lead；7th, PTC cores
Piece；8th, conductive plate.
【Embodiment】
Technological means, creation characteristic, reached purpose and effect to realize the utility model are easy to understand, below
With reference to embodiment, the utility model is expanded on further.
As shown in Figure 1-2, a kind of circuit board package structure, including housing 3 and lead 6, the side of the housing 3 are fixed with
3rd pin 4, the opposite side of the housing 3 are fixed with the first pin 1 and second pin 2, and the middle part of the housing 3, which is connected with, leads
Electroplax 8, the top of the housing 3 are connected with PTC chip 7, bottom and the conductive plate 8 of the housing 3 with the crevice place of conductive plate 8
Crevice place be connected with TVS chips 5, can effectively realize the encapsulation of this kind of circuit board for this.
Wherein, first pin 1 is connected to the top of the side of housing 3 by lead 6.
Wherein, the second pin 2 is connected to the bottom of the side of housing 3 by lead 6.
Wherein, the 3rd pin 4 is connected to one end of conductive plate 8 by lead 6.
Wherein, the section of the housing 3 is convex shape structure.
Wherein, the PTC chip 7, TVS chips 5 and conductive plate 8 are distributed into laminated construction, effective integration manufacture, reduce production
Product volume.
Wherein, first pin 1, the material of the pin 4 of second pin 2 and the 3rd are red copper, effectively improve product
Electric conductivity.
It should be noted that the utility model is a kind of circuit board package structure, during work, first by PTC chip 7, TVS
Chip 5 and the lamination of conductive plate 8 are distributed in inside housing 3, are then packaged protection by housing 3 and its internal component, can
Effective integration component, reduce small product size, finally by lead 6, the first pin 1, the pin 4 of second pin 2 and the 3rd work
With realizing the electric connection between component.
The advantages of general principle and principal character of the present utility model and the utility model has been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the utility model is not restricted to the described embodiments, described in above-described embodiment and specification
Simply illustrate principle of the present utility model, on the premise of the spirit and scope of the utility model is not departed from, the utility model is also
Various changes and modifications are had, these changes and improvements are both fallen within claimed the scope of the utility model.The utility model
Claimed scope is by appended claims and its equivalent thereof.
Claims (7)
1. a kind of circuit board package structure, including housing (3) and lead (6), it is characterised in that：The side of the housing (3) is consolidated
Surely there is the 3rd pin (4), the opposite side of the housing (3) is fixed with the first pin (1) and second pin (2), the housing (3)
Middle part be connected with conductive plate (8), the top of the housing (3) is connected with PTC chip (7), institute with the crevice place of conductive plate (8)
State the bottom of housing (3) and be connected with TVS chips (5) with the crevice place of conductive plate (8).
A kind of 2. circuit board package structure according to claim 1, it is characterised in that：First pin (1) is by drawing
Line (6) is connected to the top of housing (3) side.
A kind of 3. circuit board package structure according to claim 1, it is characterised in that：The second pin (2) is by drawing
Line (6) is connected to the bottom of housing (3) side.
A kind of 4. circuit board package structure according to claim 1, it is characterised in that：3rd pin (4) is by drawing
Line (6) is connected to one end of conductive plate (8).
A kind of 5. circuit board package structure according to claim 1, it is characterised in that：The section of the housing (3) is convex
Character form structure.
A kind of 6. circuit board package structure according to claim 1, it is characterised in that：The PTC chip (7), TVS chips
(5) it is distributed with conductive plate (8) into laminated construction.
A kind of 7. circuit board package structure according to claim 1, it is characterised in that：First pin (1), second are drawn
The material of pin (2) and the 3rd pin (4) is red copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720487791.4U CN206849838U (en) | 2017-05-04 | 2017-05-04 | A kind of circuit board package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720487791.4U CN206849838U (en) | 2017-05-04 | 2017-05-04 | A kind of circuit board package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206849838U true CN206849838U (en) | 2018-01-05 |
Family
ID=60794275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720487791.4U Active CN206849838U (en) | 2017-05-04 | 2017-05-04 | A kind of circuit board package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206849838U (en) |
-
2017
- 2017-05-04 CN CN201720487791.4U patent/CN206849838U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180514 Address after: 201317 358, room 7, No. 999, hang Nan Road, Pudong New Area, Shanghai. Co-patentee after: Jiangxi Sari Microelectronic Technology Co., Ltd. Patentee after: Sari Microelectronics (Shanghai) Co., Ltd. Address before: 200233 358, room 7, No. 999, hang Nan Road, Pudong New Area, Shanghai. Patentee before: Sari Microelectronics (Shanghai) Co., Ltd. |