CN202888169U

CN202888169U - Composite element integrating thermistor and semiconductor chip

Info

Publication number: CN202888169U
Application number: CN 201220638905
Authority: CN
Inventors: 李健; 覃迎峰; 连铁军; 晏国安
Original assignee: Shenzhen Changyuan Wayon Electronics Co Ltd
Current assignee: Shenzhen Changyuan Wayon Electronics Co Ltd
Priority date: 2012-11-28
Filing date: 2012-11-28
Publication date: 2013-04-17
Anticipated expiration: 2022-11-28

Abstract

The utility model provides a composite element integrating thermistor and a semiconductor chip. The composite element comprises a thermistor and a semiconductor chip, wherein the semiconductor chip is completely covered with an insulating substance, the semiconductor chip is provided with two electrodes, namely, a first electrode and a second electrode, the second electrode of the semiconductor chip is connected with one end of the thermistor, and the other end of the thermistor and a third electrode are welded together. Aiming at the defect in the prior art, the composite element provided by the utility model has the advantages that a pin manner is adopted, the thermistor does not needs a special structure design and is directly welded to the semiconductor chip, the problem that the qualification rate of the thermistor is low is solved; in addition, the thermistor is directly welded with the semiconductor chip, a connecting part not needs a special structural design, and the product cost is reduced.

Description

The composite component that thermistor and semiconductor chip are integrated

Technical field

The utility model relates to the circuit protection technical field, particularly the technical field of over-current over-voltage protection element.

Background technology

Prior art for will special surface-adhered type Zener diode 100 and surface-adhered type thermistor 200 by the welding (see figure 1) that stacks together, solved two elements separate use the requirement, the response speed that very much not are applicable to present integrated circuit board small design of taking up space slow, when running into large electric current or large voltage, its problem that will damage even burn of the long-time heating of Zener diode action.This surface-adhered type thermistor is for having two-layer dielectric film and four layers of metal forming, be provided with the etched figure layer on the metal forming, superimposed according to the order of metal forming, dielectric film, metal forming, thermistor, metal forming, dielectric film, metal forming successively, and form the cylindrical hole turning circuit by modes such as boring, cuttings.

Surface-adhered type thermistor process particular design in the prior art, complex process, product percent of pass is lower;

The welding procedure trouble need to be done special structure treatment between surface-adhered type Zener diode and the surface-adhered type thermistor.

The utility model content

In order to solve problem in the prior art, the utility model provides a kind of thermistor and semiconductor chip integrated composite component, comprise thermistor and semiconductor chip, coated by megohmite insulant around the semiconductor chip, semiconductor chip is provided with two electrodes, be respectively the first electrode and the second electrode, the second electrode of semiconductor chip is connected with an end of thermistor, and the other end and the third electrode of thermistor weld together.

As further improvement of the utility model, the second electrode of described semiconductor chip is connected with the top of thermistor with the technique of Reflow Soldering.

As further improvement of the utility model, described third electrode is provided with pad.

As further improvement of the utility model, thermistor is one deck or sandwich construction.

As further improvement of the utility model, the leg different edge of the first electrode and the second electrode or with on one side.

As further improvement of the utility model, thermistor and semiconductor chip are SMD or plug-in type.

As further improvement of the utility model, when thermistor and semiconductor chip are plug-in type, two pins of semiconductor chip are the first pin and the second pin, what be connected with thermistor one end is the second pin, the other end of thermistor is the 3rd pin, and the first pin and the 3rd pin divide the both sides that are listed in the 3rd pin.

As further improvement of the utility model, when thermistor and semiconductor chip are plug-in type, two pins of semiconductor chip are the first pin and the second pin, what be connected with thermistor one end is the second pin, the other end of thermistor is the 3rd pin, the first pin and the 3rd pin are bending-types, and are on the same straight line with the second pin.

As further improvement of the utility model, when thermistor and semiconductor chip were SMD, the pin of pasted sheet type thermistor and semiconductor chip was excurvation or interior curved.

The beneficial effects of the utility model are: for the defective of prior art existence, use the mode of pin instead, thermistor no longer needs to do the special construction design, direct and semiconductor chip welding gets final product, solved the low problem of thermistor qualification rate, thermistor is direct and the semiconductor chip welding in addition, and connecting portion no longer needs special structural design, and product cost reduces.

Description of drawings

Fig. 1 is the surface-adhered type Zener diode of prior art and surface-adhered type thermistor by the welding structural representation that stacks together;

Fig. 2 is the utility model pin excurvation, the product end view of homonymy not;

Fig. 3 is the utility model pin excurvation, the product vertical view of homonymy not;

Fig. 4 is the utility model plug-in type Facad structure schematic diagram;

Fig. 5 is the utility model plug-in type side structure schematic diagram;

Fig. 6 is product structure schematic diagram curved, not homonymy in the utility model pin;

Fig. 7 is the utility model semiconductor chip and the thermistor side-looking structural representation of directly fitting;

Fig. 8 is the utility model semiconductor chip and the direct adhesive product plan structure of thermistor schematic diagram;

Fig. 9 is the structural representation of the utility model pin homonymy.

Each component names is as follows among the figure: semiconductor chip 11, thermistor 12, the first electrode 13 and the second electrode 14, third electrode 15, pad 16, plug-in type semiconductor chip 21, plug-in type thermistor 22, the first pin 23, the second pin 24, the 3rd pin 25.

Embodiment

Below in conjunction with accompanying drawing the utility model is described further.

The utility model relates to the circuit protection technical field; the technical field of over-current over-voltage protection element particularly; specifically refer to the integrated component of a kind of thermistor and semiconductor chip, be mainly used in the overcurrent-overvoltage harm that helps responsive or accurate valuable components and parts such as IC etc. on the protection circuit plate to cause because of induction type peak voltage, transient voltage, mistake power supply etc.

The operation principle of overcurrent and overvoltage protective module is: when circuit voltage was in normal value, semiconductor chip was in off-state, and the thermistor resistance is minimum, did not affect the normal operation of circuit; When large electric current occurring in the circuit, thermistor is sensed large electric current, and its inner temperature can raise rapidly, the resistance of thermistor will be elevated to rapidly 3 more than the order of magnitude, be high-impedance state, circuit is off-state, has protected other components and parts in the circuit not to be damaged; When large voltage appears in circuit; semiconductor chip moves rapidly; and with voltage clamping to a specified magnitude of voltage, other components and parts are not damaged in the protective circuit, and the semiconductor chip action time can be generated heat; heat will pass to thermistor; after heat that thermistor is sensed acquired a certain degree, thermistor rapidly action was high-impedance state, and electric current reduces rapidly in the circuit; protect semiconductor chip not damaged, also protected the safety of other components and parts in the whole loop.

Overcurrent and overvoltage protective module of the present utility model comprises thermistor 12 and semiconductor chip 11; the technique of the second electrode 14 usefulness Reflow Solderings of semiconductor chip is connected with the top of thermistor 12; the bottom of thermistor 12 and third electrode 15 weld together; on third electrode 15, do again in addition a pad, coat with megohmite insulant around the semiconductor chip 11.

Used megohmite insulant can be plastics, insulating cement around semiconductor chip, any one in lacquer, the film etc.; Employed electrode and pad can be comprised of in copper, iron, tin, nickel, silver, the gold one or more in the product.

Thermistor can be made one deck or sandwich construction; The leg of the first electrode 13 and the second electrode 14 can different edge (such as Fig. 2) or with on one side, the utility model is only enumerated an example; Third electrode 15 can directly as pad (as shown in Figure 2), also can be done a pad (such as 16 among Fig. 2) below third electrode 15.

This product both can be SMD (such as Fig. 2), also can be plug-in type (such as Fig. 4 and Fig. 5); The first pin 23 in the plug-in type product (Fig. 4 and Fig. 5) and the 3rd pin 25 can divide the both sides that are listed in the second pin 24 (such as Fig. 4 and Fig. 5), also can be bending-types, and are on the same straight line with the second pin 24.

The pin of SMD product both can excurvation (such as Fig. 2), also can in curved (such as Fig. 6).

But the utility model also semiconductor chip 11 directly is attached to (such as Fig. 7) on the thermistor 12, and electrode 14 is drawn from semiconductor chip one utmost point, and electrode 13 is drawn from thermistor one utmost point, covers the resin of definite shape on the last semiconductor chip.

Above content is in conjunction with concrete preferred implementation further detailed description of the utility model, can not assert that implementation of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, without departing from the concept of the premise utility, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.

Claims

1. the integrated composite component of a thermistor and semiconductor chip, it is characterized in that: comprise thermistor (12) and semiconductor chip (11), coated by megohmite insulant around the semiconductor chip (11), semiconductor chip (11) is provided with two electrodes, be respectively the first electrode (13) and the second electrode (14), second electrode (14) of semiconductor chip is connected with an end of thermistor (12), and the other end of thermistor (12) and third electrode (15) weld together.

2. the integrated composite component of thermistor according to claim 1 and semiconductor chip, it is characterized in that: second electrode (14) of described semiconductor chip is connected with the top of thermistor (12) with the technique of Reflow Soldering.

3. the integrated composite component of thermistor according to claim 1 and semiconductor chip, it is characterized in that: described third electrode (15) is provided with pad (16).

4. the integrated composite component of thermistor according to claim 1 and semiconductor chip, it is characterized in that: thermistor is one deck or sandwich construction.

5. the integrated composite component of thermistor according to claim 1 and semiconductor chip is characterized in that: the leg different edge of the first electrode (13) and the second electrode (14) or with on one side.

6. the integrated composite component of thermistor according to claim 1 and semiconductor chip, it is characterized in that: thermistor (12) and semiconductor chip (11) are SMD or plug-in type.

7. the integrated composite component of thermistor according to claim 6 and semiconductor chip, it is characterized in that: when thermistor (12) and semiconductor chip (11) are plug-in type, two pins of semiconductor chip are the first pin (23) and the second pin (24), what be connected with thermistor one end is the second pin (24), the other end of thermistor is the 3rd pin (25), and the first pin (23) divides the both sides that are listed in the 3rd pin (25) with the 3rd pin (25).

8. the integrated composite component of thermistor according to claim 6 and semiconductor chip, it is characterized in that: when thermistor (12) and semiconductor chip (11) are plug-in type, two pins of semiconductor chip are the first pin (23) and the second pin (24), what be connected with thermistor one end is the second pin (24), the other end of thermistor is the 3rd pin (25), the first pin (23) is bending-type with the 3rd pin (25), and is on the same straight line with the second pin (24).

9. the integrated composite component of thermistor according to claim 6 and semiconductor chip, it is characterized in that: when thermistor (12) and semiconductor chip (11) were SMD, the pin of pasted sheet type thermistor (12) and semiconductor chip (11) was excurvation or interior curved.