CN206805049U - Baseplate support device and substrate board treatment - Google Patents
Baseplate support device and substrate board treatment Download PDFInfo
- Publication number
- CN206805049U CN206805049U CN201720636937.7U CN201720636937U CN206805049U CN 206805049 U CN206805049 U CN 206805049U CN 201720636937 U CN201720636937 U CN 201720636937U CN 206805049 U CN206805049 U CN 206805049U
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- Prior art keywords
- substrate
- thimble
- supporting surface
- perforate
- support device
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Abstract
The utility model provides a kind of baseplate support device and substrate board treatment, contacted successively with supporting surface from intermediate region to fringe region by control base board, so that the air of the substrate intermediate region exclusion to fringe region step by step successively, from so realize and be bonded complete between the substrate and the supporting surface, it is and then more accurate when follow-up light blockage coating or exposure etc. act.
Description
Technical field
It the utility model is related to the preparation field of display device, more particularly to a kind of baseplate support device and processing substrate dress
Put.
Background technology
At present, in the manufacturing process of liquid crystal display panel, multiple thimbles on workbench first rise from the workbench
Supporting surface, then substrate is positioned on the thimble by mechanical arm, then again by the contraction of the thimble, the substrate is again
Slowly drop on the supporting surface, the action such as light blockage coating or exposure is being carried out to the substrate.In above process, institute
The support end for stating multiple thimbles is identical with the distance of the supporting surface so that the substrate being carried on the thimble is put down all the time
Row is in the supporting surface.But the reason such as planarization or roughness due to the workbench, parallel to the institute of the supporting surface
When stating substrate and dropping on the supporting surface, because atmospheric pressure effect or electrostatic interaction etc. are also easy to produce the edge part of the substrate
Partial volume is easily first bonded with the supporting surface, residual so as to cause to have air between the substrate centre position and the supporting surface
Stay so that the centre position of the substrate can not be bonded completely with the substrate, and then be acted in light blockage coating or exposure etc.
Shi Rongyi produces larger error.
Utility model content
The purpose of this utility model is to provide a kind of baseplate support device, can exclude the substrate and the branch completely
Air between support face, ensure that the substrate is bonded completely with the substrate.
The baseplate support device includes workbench and multiple thimbles, and the workbench includes a supporting surface and from the branch
Support towards the multiple perforates extended in the workbench, and the multiple perforate is set perpendicular to the supporting surface, it is the multiple
Thimble is corresponded with the multiple perforate, and the thimble is carried out along perforate side in the perforate in the perforate
To flexible；Each thimble includes a support end；When the multiple thimble stretches out the supporting surface, the branch of the multiple thimble
Support end and support the substrate away from the supporting surface；When the multiple thimble is contracted in the perforate, the substrate is moved to
On the supporting surface, and the intermediate region of the substrate is bonded with the supporting surface successively to fringe region.
Wherein, when the multiple thimble supports the substrate, support described in the thimble to support of the substrate intermediate region
The support end of the thimble of substrate edge region with a distance from the supporting surface from gradually increasing.
Wherein, the thimble supports the substrate, and when the base plate coating has photoresist layer, the height of the adjacent thimble
Degree difference is less than the difference in height for the adjacent thimble for causing the photoresistance flowing.
Wherein, the workbench also includes the vacuum hole of multiple array arrangements, and the substrate is moved on the supporting surface
When, the vacuum hole corresponding to the vacuum hole to the substrate edge region corresponding to the substrate intermediate region is opened successively
Open.
Wherein, when the multiple thimble supports the substrate, the support end of the multiple thimble and the supporting surface away from
From all same.
Wherein, the baseplate support device also includes keeper, the keeper adjust the substrate position make it is described
Substrate is located at the presumptive area on the supporting surface.
Wherein, the support end of the thimble is provided with bolster.
Wherein, the baseplate support device also includes telescopic control device, and the telescopic control device controls the thimble
Contraction.
Wherein, the telescopic control device is pulsometer, and the telescopic control device is with the perforate away from the support
One end connection in face, the pulsometer is toward when inflating in the perforate, the thimble elongation；The pulsometer is out of described perforate
During pumping, the thimble shrinks.
The utility model also provides a kind of substrate board treatment, and the substrate board treatment includes mechanical arm and above-mentioned base
Plate supporting device, when the thimble extends farthest to a distance from from the supporting surface, the substrate is positioned over institute by the mechanical arm
State on thimble or taken away from the thimble.
The baseplate support device provided by the utility model, by controlling the substrate from intermediate region to fringe region
Contacted successively with the supporting surface, so that the exclusion to fringe region step by step successively of the air of intermediate region, so as to real
The purpose that now air between the substrate and the supporting surface is excluded completely, ensure that the substrate and the supporting surface are complete
Fitting, so it is more accurate when follow-up light blockage coating or exposure etc. act.
Brief description of the drawings
More clearly to illustrate construction feature and effect of the present utility model, come below in conjunction with the accompanying drawings with specific embodiment pair
It is described in detail.
Fig. 1 is the schematic cross-section of baseplate support device described in the utility model embodiment；
Fig. 2 is the top view of baseplate support device described in another embodiment of the utility model.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe.Wherein, being given for example only property of accompanying drawing illustrates that expression is only schematic diagram, it is impossible to is interpreted as to this patent
Limitation.
The utility model provides a kind of baseplate support device, for being supported to substrate, to ensure that the substrate is follow-up
Light blockage coating or the action such as exposure it is more accurate.The baseplate support device can be used for exposure machine, coating machine, pre-drier
Need to support substrate in the device further to be operated etc. various.
Referring to Fig. 1, the utility model provides a kind of baseplate support device 100, for being supported to substrate 10.It is described
Baseplate support device 100 includes workbench 20 and multiple thimbles 30.The thimble 30 is on the workbench 20.
The workbench 20 is to include a supporting surface 21 with certain thickness flat board, the workbench 20.The support
Face 21 is used to support the substrate 10, in order to carry out the action such as light blockage coating or exposure prebake conditions to the substrate 10.Enter one
Step, in the present embodiment, the perforate 22 of multiple array arrangements is additionally provided with the workbench 20.The perforate 22 is cylindric.
It is understood that the perforate 22 can also be other column structures such as quadrangular, pentagonal prism.The perforate 22 is from described
Supporting surface 21 is opened up into the workbench 20, and the perforate 22 is each perpendicular to the supporting surface 21 and opened up.It is described to open
Hole 22 can be the perforation for penetrating the workbench 20, only can also be provided with the accepting hole of opening in the side of supporting surface 21.
In the present embodiment, the perforate 22 is only in accepting hole of the side of supporting surface 21 provided with opening 221.And multiple perforates
22 size shape is identical.
The thimble 30 is the stretching structure on the workbench 20.In the present embodiment, the thimble 30 for institute
State the diameter identical column of perforate 22.The multiple thimble 30 corresponds with the multiple perforate 22, and the thimble 30 is proper
It is contained in well in the perforate 22, and progress carries out flexible fortune along the axial direction of the perforate 22 in the perforate 22
It is dynamic.In the present embodiment, each the thimble 30 includes a support end 31 for the perforate 22.The substrate 10 is laminated in the multiple
On the support end 31 of thimble 30, the substrate 10 is placed on the workbench 20 to be realized by the thimble 30
Taken away on supporting surface 21 or from the supporting surface 21.Specifically, when the support end 31 of the thimble 30 is extended to extreme higher position
When, the substrate 10 is positioned on the support end 31 of the thimble 30 by manipulator.Now, the substrate 10 is on the top
Away from the supporting surface 21 under the support of pin 30；After the placement of substrate 10 terminates, the thimble 30 is shunk, and makes the branch
Support end 31 is slowly slowly leaned on close to the supporting surface 21 of institute's workbench 20, i.e., described substrate 10 under the support of the thimble 30
The nearly supporting surface 21；When the thimble 30 is contracted to the perforate 22 that the support end 31 houses the workbench 20 completely
When middle, the substrate 10 is moved on the supporting surface 21 and is laminated in completely on the supporting surface 21.Pass through the thimble 30
The substrate 10 is placed on the supporting surface 21 of the workbench 20 or taken away from the supporting surface 21 by realization, can be to prevent
Only the substrate 10 is when being placed on the supporting surface 21 or taking the substrate 10 away from the supporting surface 21 by manipulator,
Operated because the substrate 10 is not easy to being bonded for supporting surface 21 manipulator and be easily destroyed the base
The situation of plate 10 occurs.
In the utility model, the substrate 10 is during being moved on the supporting surface 21, in the substrate 10
Between region contacted successively with the supporting surface 21 to fringe region.Specifically, in the present embodiment, the top of multiple array arrangements
When pin 30 supports the substrate 10, i.e., when described substrate 10 is not laminated in also on the supporting surface 21, support in the substrate 10
Between region thimble to the fringe region of substrate 10 thimble the support end 31 it is gradual from a distance from the supporting surface 21
Increase, makes the intermediate region of substrate 10 to fringe region from gradually increasing with a distance from the supporting surface 21, now, perpendicular to institute
The section for stating any direction of substrate 10 is U-shaped.Specifically, the thimble of the intermediate region of substrate 10 is supported to the substrate 10
The extreme higher position that the support end 31 of the thimble of fringe region can reach from gradually increasing with a distance from the supporting surface 21, and
During the thimble extends or shrinks, the thimble elongation or the speed shunk are identical so that the substrate 10 is not
When reaching on the supporting surface 21, the section perpendicular to any direction of substrate 10 is always U shapes.The substrate 10 is under
During being down on the supporting surface 21, the intermediate region of the substrate 10 connects with the supporting surface 21 successively to fringe region
Touch.And then the air of the intermediate region of substrate 10 is discharged to fringe region successively, the substrate 10 and supporting surface 21 it
Between will not have air residual, to realize the purpose that excludes the air between the substrate and the supporting surface completely.Pass through control
Make the substrate 10 to contact with the supporting surface 21 successively from intermediate region to fringe region, ensure the substrate 10 and the branch
Support face 21 is bonded completely, and then more accurate when follow-up light blockage coating or exposure etc. act.
Further, the support end 31 of the thimble 30 is provided with bolster (not shown).The bolster is fixed
In on the support end 31 of the thimble 30.In the present embodiment, the bolster is the elastomeric material with cushioning effect, when
When the substrate 10 is positioned on the thimble by the manipulator, the substrate 10 and institute can be prevented by the bolster
State the collision of the support end 31 of thimble 30 and caused by the substrate 10 destruction.
Further, the difference in height between the thimble 30 of arbitrary neighborhood is respectively less than the adjacent institute for causing photoresistance to flow
The minimum constructive height for stating thimble 30 is poor.Light blockage coating or exposure are carried out when being laminated in due to the substrate 10 on the supporting surface 21
Deng action, and after the action such as light blockage coating or exposure is completed, it is also necessary to lifted the substrate 10 by the thimble 31
Rise and away from the supporting surface 21.Now, the substrate 10 is during away from the supporting surface 21, the side of the substrate 10
The supporting surface 21 is left in edge region to intermediate region successively, i.e., described thimble 30 supports the substrate 10 away from the supporting surface
During 21, the section perpendicular to any direction of substrate 10 is U-shaped.When between the thimble 30 of arbitrary neighborhood
The minimum constructive height that difference in height is respectively less than the adjacent thimble 30 for causing photoresistance to flow is poor, and the optional position of substrate 10 is inclined
Gradient will not cause the flowing for the photoresistance being coated onto, and ensure the normal processing procedure of the substrate 10.
The baseplate support device 100 of the present utility model also includes telescopic control device (not shown), described to stretch
Contracting control device controls the contraction of the thimble 30.In the present embodiment, the telescopic control device is pulsometer, the pulsometer
It is connected with the perforate 22 away from described one end of supporting surface 21.The pulsometer can be toward being inflated or be evacuated in the perforate
To control the flexible of the thimble 30.When the pulsometer is inflated toward the perforate 22 is interior, the thimble 30 and the support end
The 31 relative other ends are acted on by air pressure, and now the thimble 30 extends, i.e., described support end 31 is gradually distance from the work
Make the supporting surface 21 of platform 20；When the pulsometer is evacuated out of described perforate, the thimble 30 shrinks, i.e., described support end 31
Move closer to the supporting surface 21 of the workbench 20.It is understood that the telescopic control device can also be other dresses
Put, for example, the telescopic control device can also be telescopic cylinder, another relative with the support end 31 of each thimble 30
One end is connected with a telescopic cylinder, and the flexible of the thimble 30 is controlled by the telescopic cylinder.
The baseplate support device 100 also includes keeper (not shown), and the keeper is used to control the base
Plate 10 is located at the presumptive area on the supporting surface 21.Specifically, in the present embodiment, the keeper include the first keeper and
Second keeper, first keeper and second keeper overlap in the projection of vertical direction.First keeper
Positioned at the extreme higher position that the support end 31 of the thimble 30 can extend, to control the substrate 10 to be positioned over the thimble
Presumptive area on 30 is set.Second keeper is located on the supporting surface 21, to control the substrate 10 to be positioned over institute
The presumptive area stated on supporting surface 21 is set.In the present embodiment, pass through being total to for first keeper and second keeper
Same-action controls the substrate 10 to be located at the precalculated position on the supporting surface 21, more accurately to be carried out to the substrate 10
The action such as follow-up light blockage coating, exposure.Specifically, when the thimble 30 is extended to extreme higher position, the manipulator is by described in
When substrate 10 is positioned on the thimble 30, first keeper carries out first time adjustment to the position of the substrate 10, makes
The substrate 10 is positioned over the presumptive area on the thimble 30；When the substrate 10 is laminated on the supporting surface 21, lead to
Cross the second contraposition part and second of adjustment is carried out to the substrate 10, to ensure that the substrate 10 is laminated in the supporting surface 21
Presumptive area can be located at when upper, so as to more accurate when follow-up light blockage coating or exposure etc. act.
Referring to Fig. 2, another embodiment of the present utility model, is with the difference of above-described embodiment, the substrate is supported
The support end 31 of the thimble 30 in 10 any regions exists from all same with a distance from the supporting surface 21, i.e., described substrate 10
Drop on the supporting surface 21 or away from during the supporting surface 21, the substrate 10 is flat with the supporting surface 21 all the time
OK.But the vacuum hole 23 of multiple array arrangements is additionally provided with the workbench 20.The substrate 10 is moved to the supporting surface
When on 21, the vacuum hole 23 of the vacuum hole 23 corresponding to the intermediate region of substrate 10 to the fringe region of substrate 10
Open successively.After the vacuum hole 23 is opened, the air between the substrate 10 and the supporting surface 21 is extracted, the substrate
10 are bonded with the supporting surface 21.In the present embodiment, the vacuum hole 23 corresponding to the intermediate region of substrate 10 to the base
The vacuum hole 23 of the fringe region of plate 10 is opened successively, i.e., the central area of described substrate 10 to fringe region successively with it is described
Supporting surface 31 is bonded, so as to ensure will not there is air residual between the substrate 10 and the supporting surface 31 so that the substrate
10 are bonded completely with the supporting surface 31, and then ensure that the active position of follow-up light blockage coating or exposure etc. is more accurate.
The baseplate support device 100 provided by the utility model, by controlling the substrate 10 from intermediate region to side
Edge region contacts with the supporting surface 21 successively, so that the air of the intermediate region of the substrate 10 is successively to fringe region one
Exclusion step by step, from so that realize and be bonded complete between the substrate 10 and the supporting surface 21, and then in follow-up light
It is more accurate during the action such as resistance coating or exposure.
The utility model also provides a kind of substrate board treatment, and the substrate board treatment can be exposure machine, coating machine,
The various substrate board treatments such as pre-drier.The substrate board treatment includes mechanical arm aforesaid substrate support meanss 100.The top
Pin 30 extend to the support end 31 it is farthest from the supporting surface 21 when, the substrate 10 is positioned over the top by the mechanical arm
Taken away on pin 30 or from the thimble 30.
Described above is preferred embodiment of the present utility model, it is noted that for the ordinary skill of the art
For personnel, on the premise of the utility model principle is not departed from, some improvements and modifications can also be made, these are improved and profit
Decorations are also considered as the scope of protection of the utility model.
Claims (10)
1. a kind of baseplate support device, for being supported to substrate, it is characterised in that including workbench and multiple thimbles, institute
Stating workbench includes a supporting surface and from the support towards the multiple perforates extended in the workbench, and the multiple perforate
Set perpendicular to the supporting surface, the multiple thimble corresponds with the multiple perforate, and the thimble is located at the perforate
It is interior, and in the perforate stretch along opening direction；Each thimble includes a support end；The multiple thimble stretches out
During the supporting surface, the support end of the multiple thimble supports the substrate away from the supporting surface；The multiple thimble shrinks
During in the perforate, the substrate is moved on the supporting surface, and the intermediate region of the substrate to fringe region successively
It is bonded with the supporting surface.
2. a kind of baseplate support device as claimed in claim 1, it is characterised in that the multiple thimble supports the substrate
When, support the thimble of the substrate intermediate region to the support end for the thimble for supporting the substrate edge region from the branch
The distance in support face gradually increases.
3. a kind of baseplate support device as claimed in claim 2, it is characterised in that the thimble supports the substrate, and institute
When stating base plate coating has photoresist layer, the difference in height of the adjacent thimble is less than the adjacent top for causing the photoresistance flowing
The difference in height of pin.
4. a kind of baseplate support device as claimed in claim 1, it is characterised in that the workbench also includes multiple arrays and arranged
The vacuum hole of cloth, when the substrate is moved on the supporting surface, the vacuum hole corresponding to the substrate intermediate region to institute
The vacuum hole corresponding to substrate edge region is stated to open successively.
5. a kind of baseplate support device as claimed in claim 4, it is characterised in that the multiple thimble supports the substrate
When, the support end of the multiple thimble is with the supporting surface apart from all same.
6. a kind of baseplate support device as claimed in claim 1, it is characterised in that the baseplate support device also includes positioning
Part, the position that the keeper adjusts the substrate make the presumptive area that the substrate is located on the supporting surface.
7. a kind of baseplate support device as claimed in claim 1, it is characterised in that the support end of the thimble is provided with buffering
Part.
8. a kind of baseplate support device as claimed in claim 1, it is characterised in that the baseplate support device also includes flexible
Control device, the telescopic control device control the contraction of the thimble.
A kind of 9. baseplate support device as claimed in claim 7, it is characterised in that the telescopic control device is pulsometer,
The telescopic control device is connected with the one end of the perforate away from the supporting surface, and the pulsometer is toward inflating in the perforate
When, the thimble elongation；When the pulsometer is evacuated out of described perforate, the thimble shrinks.
10. a kind of substrate board treatment, it is characterised in that including any described substrate support of mechanical arm and claim 1~9
Device, when the thimble extends farthest to a distance from from the supporting surface, the substrate is positioned over the thimble by the mechanical arm
Take away above or from the thimble.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720636937.7U CN206805049U (en) | 2017-05-31 | 2017-05-31 | Baseplate support device and substrate board treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720636937.7U CN206805049U (en) | 2017-05-31 | 2017-05-31 | Baseplate support device and substrate board treatment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206805049U true CN206805049U (en) | 2017-12-26 |
Family
ID=60744483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720636937.7U Active CN206805049U (en) | 2017-05-31 | 2017-05-31 | Baseplate support device and substrate board treatment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206805049U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019213899A1 (en) * | 2018-05-10 | 2019-11-14 | 深圳市柔宇科技有限公司 | Carrying device and vacuum drying apparatus |
| CN113532070A (en) * | 2021-07-16 | 2021-10-22 | 平显智能装备(深圳)有限责任公司 | OCR baking equipment |
-
2017
- 2017-05-31 CN CN201720636937.7U patent/CN206805049U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019213899A1 (en) * | 2018-05-10 | 2019-11-14 | 深圳市柔宇科技有限公司 | Carrying device and vacuum drying apparatus |
| CN113532070A (en) * | 2021-07-16 | 2021-10-22 | 平显智能装备(深圳)有限责任公司 | OCR baking equipment |
| CN113532070B (en) * | 2021-07-16 | 2022-07-29 | 平显智能装备(深圳)有限责任公司 | OCR baking equipment |
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