KR100931601B1 - Board Bonding Device with Alignment Unit - Google Patents

Abstract

The present invention relates to a substrate bonding apparatus having an alignment unit, the substrate bonding apparatus according to the present invention comprises: a first chamber having a first surface on which a first substrate is mounted; A second chamber spaced apart from the first chamber and having a second surface on which a second substrate bonded to the first substrate is seated; In the related art, a plurality of devices may be individually separated by having an alignment unit coupled to the second chamber and allowing the six degrees of freedom of the second chamber to be adjusted so that alignment of the two substrates may be performed by one alignment device at six degrees of freedom. Operation and operation can be made more easily than when operating by controlling, and the arrangement of the alignment unit of the substrate bonding apparatus can be configured as simply as possible, thereby increasing the manufacturing efficiency of the substrate bonding apparatus, and also the substrate bonding apparatus. And maintenance of the alignment unit is also effective to be easily performed.

Description

Apparatus for assembling substrates having alignment unit}

1 is a side cross-sectional view showing a substrate bonding apparatus according to an embodiment of the present invention.

Figure 2 is an enlarged perspective view showing a six degree of freedom chamber alignment unit installed in the substrate bonding apparatus according to an embodiment of the present invention.

3 is a view conceptually illustrating a six degree of freedom exercise state of the six degree of freedom chamber alignment unit according to an embodiment of the present invention.

Figure 4 is a side cross-sectional view showing a substrate bonding apparatus according to another embodiment of the present invention.

Figure 5 is a side cross-sectional view showing a substrate bonding apparatus according to another embodiment of the present invention.

Figure 6 is a side cross-sectional view showing a substrate bonding apparatus according to another embodiment of the present invention.

The present invention relates to a substrate bonding apparatus, and more particularly, to a substrate bonding apparatus that enables six degrees of freedom chamber alignment using a plurality of alignment actuators.

The substrate bonding apparatus is for bonding a liquid crystal display panel used in a liquid crystal display (LCD). A representative example of the liquid crystal display panel is a TFT-LCD panel. In the TFT-LCD panel, a TFT substrate in which a plurality of TFTs (Thin Film Transistor) are formed in a matrix form, and a color filter substrate in which a color filter or a light shielding film is formed are bonded to each other at intervals of several μm, and bonded together before bonding. The liquid crystal is injected and encapsulated after the polymerization or bonding, thereby producing the panel.

Substrate bonding is achieved by pressing the array substrate and the color filter substrate together using pressure. To this end, the substrate bonding apparatus adheres the substrate to two surface plates (ESCs) disposed upside down and facing each other inside a chamber consisting of an upper chamber and a lower chamber. The upper chamber is lowered while maintaining the parallelism of both plates precisely, and then the substrates are brought into close proximity to each other and then the two substrates are bonded together.

As a prior art of the substrate bonding apparatus, reference may be made to Korean Patent Publication No. 2004-0043205, "Substrate bonding apparatus for liquid crystal display device and flatness correction method using the same".

On the other hand, when the substrate is in close proximity and bonding, the two substrates must be aligned very precisely. To this end, the prior art includes a Z-axis driving unit for driving the Z-axis of the upper chamber, and uses a linear actuator for adjusting the gap between platens. In addition, a camera driving stage is provided for retrieving the alignment mark formed at a specific position of the substrate, and a cam and a UVW unit are used to align the mark of the substrate photographed by the camera.

Therefore, in the conventional substrate bonding apparatus, the control method is complicated because a plurality of devices must be individually operated or controlled to align the plurality of directions and positions. In addition, since the configuration of the substrate bonding apparatus is complicated because the plurality of alignment apparatuses are provided, the manufacturing cost of the substrate bonding apparatus is excessively required, and there is also a problem in maintaining the alignment units.

The present invention is to solve the above problems, an object of the present invention is to use the alignment unit of a plurality of actuators to realize the six degrees of freedom substrate bonding apparatus to enable the alignment of the chamber or electrostatic plate of the substrate bonding apparatus It is to provide.

A substrate bonding apparatus according to the present invention for achieving the above object comprises a first chamber having a first surface on which a first substrate is seated; A second chamber spaced apart from the first chamber and having a second surface on which a second substrate bonded to the first substrate is seated; It is coupled to the second chamber is provided with an alignment unit to enable six degrees of freedom of the second chamber.

The alignment unit is coupled to the second chamber, the pedestal and the pedestal spaced apart from the pedestal, the coupling is installed between the pedestal and the pedestal, one end is rotatably coupled to the pedestal, the other end is the pedestal It may include a plurality of actuators rotatably coupled to.

The actuators may include a first actuator, a second actuator, a third actuator, a fourth actuator, a fifth actuator, and a sixth actuator coupled to different positions so as to be interlocked with each other.

The first chamber may be an upper chamber, and the second chamber may be a lower chamber positioned below the upper chamber.

The first chamber may be a lower chamber, and the second chamber may be an upper chamber positioned above the lower chamber.

A substrate bonding apparatus according to the present invention for achieving the above object comprises a first chamber having a first surface on which a first substrate is seated; A second chamber spaced apart from the first chamber and having a second surface on which a second substrate bonded to the first substrate is seated; An alignment unit is provided to support the second surface plate and to adjust six degrees of freedom between the first substrate and the second substrate.

The alignment unit may be coupled to the second table through the second chamber.

The alignment unit is coupled to the second base plate, the pedestal and the pedestal spaced apart from the pedestal, the coupling is installed between the pedestal and the pedestal, one end is rotatably coupled to the pedestal, the other end is the pedestal It may include a plurality of actuators rotatably coupled to.

The actuators may include a first actuator, a second actuator, a third actuator, a fourth actuator, a fifth actuator, and a sixth actuator coupled to different positions so as to be interlocked with each other.

A bellows for sealing between the actuators and the through part of the second chamber may be installed around the actuators.

The first chamber may be an upper chamber, and the second chamber may be a lower chamber positioned below the upper chamber.

The first chamber may be a lower chamber, and the second chamber may be an upper chamber positioned above the lower chamber.

Hereinafter, an embodiment of a substrate bonding apparatus according to an embodiment of the present invention will be described. And the names of each component in the description of the following embodiments may be called other names in the art. However, if their functional similarity and identity, even if the modified embodiment can be seen as an equivalent configuration.

1 is a schematic cross-sectional view showing a substrate bonding apparatus according to an embodiment of the present invention. As shown in FIG. 1, the substrate bonding apparatus has a base frame 100 that forms an exterior and has an entrance 101 through which substrates S1 and S2 enter and exit. In addition, the substrate bonding apparatus includes a first chamber 110 disposed above the inner side of the base frame 100 and a second chamber 120 disposed below the first chamber 110. Between the first chamber 110 and the second chamber 120 forms a processing room 130 in which the first substrate S1 and the second substrate S2 are bonded. The substrates S1 and S2 may be TFT substrates or color filter substrates.

The first base plate 111 is installed below the center of the first chamber 110. The first surface plate 111 may be an electrostatic chuck to allow the first substrate P1 to be attached with an electrostatic force. In addition, the first chamber 110 is provided with a first lift pin 112 that suction-supports the first substrate S1 that has entered the process chamber 130. The first lift pin 112 is provided to enable vacuum suction so as to transfer the first substrate S1 to the first surface plate 111.

In addition, a second surface plate 121 is installed above the center of the second chamber 120. The second surface plate 121 may be an electrostatic chuck to allow the second substrate S2 to be attached with an electrostatic force. In addition, the second chamber 120 is provided with a second lift pin 122 that suction-supports the second substrate S2 that has entered the process chamber 130. The second lift pin 122 is provided to enable vacuum suction to transfer the second substrate S2 to the second surface plate 121.

In addition, a plurality of cameras 113 are installed on the upper portion of the first chamber 110 to measure and align the alignment state of the substrates S1 and S2. In addition, a photographing hole 114 penetrating the first chamber 110 and the first surface 111 up and down is formed to photograph the camera 113. The second chamber 120 is provided with a lighting device 123 for providing illumination for the camera 113 is photographed. In addition, an illumination hole 124 penetrating up and down is formed in the second chamber 120 so that illumination may be provided to the camera 113 side. The illumination hole 124 and the above-described photographing hole 114 communicate with each other to allow the camera 113 to photograph the alignment mark formed on the first substrate S1 and the second substrate S2.

On the other hand, the lower portion of the second chamber 120 is provided with an alignment unit 140 capable of six degrees of freedom alignment for the vertical lifting and adjustment of the second chamber 120.

2 is an enlarged perspective view illustrating the six degree of freedom chamber alignment unit 140 installed in the substrate bonding apparatus according to the embodiment of the present invention. As shown in FIG. 2, the alignment unit 140 is installed to be spaced apart from the coupling table 141 coupled to the lower side of the second chamber 120, and the coupling table 141 is seated on the base frame 100. A pedestal 142 is provided.

And a plurality of actuators 143, 144, 145, 146, the upper end is coupled to the coupling table 141, the lower end is linked to the pedestal 142 between the coupling table 141 and the pedestal 142. (147) and 148 are provided.

In another embodiment, the actuators 143, 144, 145, 146, 147, 148 may be coupled to the coupling table 141 and the pedestal 142 by a universal joint. Each of the actuators 143, 144, 145, 146, 147, 148 may also be directly coupled to the second chamber 120.

Actuators 143, 144, 145, 146, 147, 148 are first installed with a pair of first actuator 143 and second actuator 144 arranged in a "V" shape. The third actuator 145 and the fourth actuator 146 form a pair and are disposed in a “V” shape with each other. In addition, the fifth actuator 147 and the sixth actuator 148 form a pair and are disposed in a “V” shape with each other.

Hereinafter, the operation of the substrate bonding apparatus according to the embodiment of the present invention configured as described above will be described.

In order to bond the substrate in the substrate bonding apparatus according to the embodiment of the present invention, the first substrate S1 is carried into the process chamber 130 by a robot arm (not shown). The first substrate S1 is absorbed by the first lift pin 112 and then transported by the first lift pin 112 to be attached to the first surface plate 111. Next, after the second substrate S2 is loaded by the robot arm, the second substrate S2 is sucked onto the second lift pin 122. The second substrate S2 is transferred to the second surface plate 121 by the second lift pin 122 and attached to the second surface plate 121.

After that, the second chamber 120 is raised. Ascending of the second chamber 120 proceeds using the alignment unit 140. That is, all the actuators 143, 144, 145, 146, 147, 148 of the alignment unit 140 are extended. The second chamber 120 then rises. If the second chamber 120 continues to rise, the second chamber 120 and the first chamber 110 may be in close contact with each other. Accordingly, the inside of the processing chamber 130 is sealed. At this time, the rise of the second chamber 120 and the alignment state of the first chamber 110 are measured by the camera 113 and a sensor (not shown).

The camera 113 photographs the alignment marks of the first substrate S1 and the second substrate S2 to check the alignment state of the first substrate S1 and the second substrate S2. In addition, the alignment unit 140 may operate according to the alignment state to align the substrates S1 and S2. The alignment between the first substrate S1 and the second substrate S2 may be repeatedly performed a plurality of times such as pre-alignment, final alignment, and the like.

Hereinafter, the operation of the alignment unit 140 will be described in more detail. The alignment unit 140 of the substrate bonding apparatus according to the embodiment of the present invention is capable of six degrees of freedom. That is, the operation is performed in the X, Y, Z, Roll, Pitch, and Yaw axes.

3 is a view conceptually illustrating a six degree of freedom operation state of the six degree of freedom chamber alignment unit 140 according to an embodiment of the present invention. Hereinafter, an operation in each axis direction will be described with reference to FIG. 3.

Alignment in the X-axis direction is performed by varying the degree of extension of all actuators 143, 144, 145, 146, 147, 148. That is, the elongation degree of the sixth actuator 148 is made the smallest, and then the elongation degree of the first and fifth actuators 143 and 147 is made larger, and then the second and fourth actuators 144 ( When the extension of 146 is made larger, and the third actuator 145 is extended to the greatest extent, the second chamber 120 moves in the X-axis direction and is aligned. In the alignment in the -X axis direction, the movement alignment is performed by reversing the extension sizes of the actuators 143, 144, 145, 146, 147, and 148.

Roll alignment, that is, rotation about the X-axis extends the first and second actuators 143 and 144 while the third and sixth actuators 145 and 148 are fixed, and the fourth and Roll alignment is achieved by retracting the fifth actuator 146, 147 or in the opposite direction.

Next, the alignment operation in the Y-axis direction minimizes the elongation of the fourth actuator 146, and then increases the elongation of the third and fifth actuators 145 and 147. When the extension of the second and sixth actuators 144 and 148 is made larger, and the first actuator 143 is extended to the greatest extent, the second chamber 120 moves in the Y-axis direction and is aligned. In the alignment in the -Y axis direction, movement alignment is performed by reversing the extension sizes of the actuators 143, 144, 145, 146, 147, and 148.

The pitch alignment, that is, rotation about the Y axis extends the fifth and sixth actuators 147 and 148 while the first and fourth actuators 143 and 146 are fixed. Roll alignment is achieved by retracting the third actuators 144 and 145 or by operating in the opposite direction.

Z-axis alignment is the operation of raising and lowering the first chamber 110, the alignment is made by shrinking or stretching all the actuators 143, 144, 145, 146, 147, 148, yaw alignment is The operation proceeds when all the actuators 143, 144, 145, 146, 147, 148 are contracted or stretched together to a set size.

In this six degree of freedom alignment, the alignment of the second chamber 120 is more precise and quicker if a complex interlocking operation is performed in two or more alignment directions to move the chambers 110 and 120 to the correct alignment position. Alignment between (110) and (120) may proceed effectively.

On the other hand, in the substrate bonding apparatus according to the present invention, the alignment unit 140 may align the first chamber 110 located above the second chamber 120 unlike the above-described embodiment. Figure 4 is a side cross-sectional view showing a substrate bonding apparatus according to another embodiment of the present invention. As shown in FIG. 4, the second chamber 120 may be fixed to the base frame, and the alignment unit 140 may be coupled to the first chamber 110 so that the alignment may be performed by the first chamber 110. . The other components shown in FIG. 4 are the same as those of FIG. 1, and will be understood with reference to the description of the embodiment of FIG. 1. On the other hand, although not shown in the drawing as another embodiment, the first chamber 110 and the second chamber 120 may be provided with an alignment unit 140 capable of separately arranging six degrees of freedom.

Figure 5 is a side cross-sectional view showing a substrate bonding apparatus according to another embodiment of the present invention.

As shown in FIG. 5, the substrate bonding apparatus includes a base frame 200 that forms an appearance. The first chamber 210 is provided above the inner side of the base frame 200, and the second chamber 220 is provided below the first chamber 210. Between the first chamber 210 and the second chamber 220 is formed a processing chamber 230 to which the first substrate S1 and the second substrate S2 are bonded. In addition, the base frame 200 is provided with a lifting unit 250 for lifting up and down of the first chamber 210. The lifting unit 250 includes a lift shaft 251, a lift screw 252, and a lift motor 253.

The first base plate 211 is installed below the center of the first chamber 210. The first surface plate 211 may allow the first substrate S1 to be attached with an electrostatic force. In addition, the first chamber 210 is provided with a lift pin 212 for adsorbing and supporting the first substrate (S1) entered into the process chamber 230. The lift pins 212 are provided to enable vacuum suction to transfer the first substrate S1 to the first surface plate 211. In addition, a second surface plate 221 is installed above the center of the second chamber 220. The second surface plate 221 may allow the second substrate P1 to be attached with electrostatic force.

Meanwhile, a plurality of cameras 213 are installed on the first chamber 210 to align the substrates S1 and S2. In order to capture the camera 213, a photographing hole 214 penetrating the first chamber 210 and the first surface plate 211 up and down is formed, and the substrates S1 and S2 are formed in the second chamber 220. Illumination device 222 for the alignment of the is installed. The lighting device 222 provides illumination for photographing the alignment marks of the substrates S1 and S2 with the camera 213. In addition, lighting holes 223 penetrating up and down are respectively formed in the second chamber 220 so that illumination may be provided to the camera 213 side. The illumination hole 223 and the photographing hole 214 communicate with each other to allow the camera 213 to photograph the alignment mark formed on the first substrate S1 and the second substrate S2.

On the other hand, the lower portion of the second surface plate 221 of the second chamber 220 is provided with an alignment unit 240 capable of six degrees of freedom alignment for the vertical lifting and adjustment of the second surface plate 221. Since the arrangement of the alignment unit 240 may refer to FIG. 2, a detailed description thereof will be omitted.

Each actuator (not shown) of the alignment unit 240 passes through the second chamber 220 and is coupled to the second surface plate 221. In addition, a bellows 224 is installed between the periphery of the alignment unit 240 and the boundary portion of the through hole 225 of the second chamber 220. The bellows 224 is for sealing with the outside to the through-hole 225 in the lower portion of the first chamber (210). The bellows 224 may be configured to surround the entire alignment unit 240. Alternatively it may be installed separately on each actuator. When the bellows are individually installed in each actuator, it is appropriate to allow the respective actuators to penetrate through holes formed in the second chamber 220 individually.

Hereinafter will be described the operation of the substrate bonding apparatus according to another embodiment of the present invention configured as described above.

In order to bond the substrate in the substrate bonding apparatus according to the embodiment of the present invention, the first substrate S1 is loaded into the process chamber 230 by the robot arm. The first substrate S1 is absorbed by the lift pins 212 and then transported by the lift pins 212 and attached to the first surface plate S1. Next, when the second substrate S2 is carried by the robot arm, the second substrate S2 is directly seated on the second surface plate 221. In this case, the alignment unit 240 may operate the “Z” axis to drive the second surface plate 221. The second substrate S2 seated on the second surface plate 221 is bonded by the electrostatic force of the second surface plate 221.

After that, the first chamber 210 is lowered by the lifting unit 250. When the first chamber 210 continuously descends, the first chamber 210 and the second chamber 220 are in close contact with each other. As a result, the interior of the processing chamber 230 is sealed. At this time, the lowering of the first chamber 210 and the alignment state of the second surface plate 221 provided in the second chamber 220 are measured by the camera 213 and a sensor (not shown).

The camera 213 photographs the alignment marks of the first substrate S1 and the second substrate S2 to check the alignment state of the first substrate S1 and the second substrate S2. In addition, the alignment unit 240 operates according to the alignment state to align the second surface plate 221 so that the alignment between the substrates S1 and S2 is performed. The alignment between the first substrate S1 and the second substrate S2 may be repeatedly performed a plurality of times by pre-alignment, final alignment, and the like.

On the other hand, in the substrate bonding apparatus according to the present invention, the alignment unit may be installed on the first surface plate of the first chamber unlike the above-described embodiment. 6 is a configuration in which the alignment unit is installed on the first table of the first chamber according to another embodiment of the present invention.

As shown in FIG. 6, the substrate bonding apparatus includes a base frame 300 forming an appearance. The first chamber 310 is provided above the inside of the base frame 300, and the second chamber 320 is provided below the first chamber 310. Between the first chamber 310 and the second chamber 320 is formed a processing chamber 330 to which the first substrate S1 and the second substrate S2 are bonded. And the base frame 300 is provided with a lifting unit 350 for raising and lowering the first chamber (310). The lifting unit 350 includes a lift shaft 351, a lift screw 352, and a lift motor 353.

The first base plate 311 is installed below the center of the first chamber 310. In addition, a second surface plate 321 is installed above the center of the second chamber 320. The second surface plate 321 may allow the second substrate S1 to be attached by electrostatic force. In addition, the second chamber 320 is provided with a lift pin 322 for suction-supporting the second substrate (S2) entered into the process chamber 330. The lift pin 322 is provided to enable vacuum adsorption to transfer the second substrate S2 to the second surface plate 321.

Meanwhile, a plurality of cameras 312 for inspecting the alignment state of the substrates S1 and S2 are installed on the first chamber 310. In order to capture the camera 312, a photographing hole 313 penetrating the first substrate S1 up and down is formed in the first chamber 310, and the substrate S1 and S2 are formed in the second chamber 320. Lighting device 323 for the alignment of the) is installed. The lighting device 323 provides illumination for photographing the alignment marks of the substrates S1 and S2 with the camera 312. In addition, illumination holes 324 penetrating up and down are formed in the second chamber 320 so that illumination may be provided to the camera 312 side. The illumination hole 324 and the above-described photographing hole 323 communicate with each other to allow the camera 312 to photograph the alignment mark formed on the first substrate S1 and the second substrate S2.

On the other hand, the upper part of the first surface plate 311 of the first chamber 310 is provided with an alignment unit 340 capable of six degrees of freedom alignment for the vertical lifting and adjustment of the first surface plate 311. Since the arrangement of the alignment unit 340 may refer to FIG. 2, a detailed description thereof will be omitted.

Each of the actuators of the alignment unit 340 passes through the first chamber 310 and is coupled to the first surface 311. In addition, a bellows 314 is installed between the periphery of the alignment unit 340 and the through portion of the first chamber 310. The bellows 314 is for sealing with the outside to the through-hole 315 of the first chamber (310). The bellows 314 may be configured to surround the entire alignment unit 340. Alternatively it may be installed separately on each actuator. In the case of installing each actuator individually, it is appropriate to allow each actuator to penetrate through holes formed in the second chamber individually.

In another embodiment, although not shown in the drawings, an alignment unit 340 capable of aligning six degrees of freedom in both the first and second tables 311 and 321 may be installed.

Substrate bonding apparatus according to an embodiment of the present invention as described above is to use the alignment unit to enable the six degree of freedom alignment is to effect the alignment of the substrate can be carried out differently by partially modifying the installation state of the alignment unit Alternatively, each actuator of the alignment unit may be implemented by electromagnetic driving by pneumatic, hydraulic, or electromagnetic force, or by mechanical driving using a ball screw and a motor.

As described above, the substrate bonding apparatus according to the present invention allows the alignment of two substrates to be carried out by one alignment device at six degrees of freedom, thereby making the operation and operation easier than in the case of controlling a plurality of devices individually. In addition, since the configuration of the alignment unit of the substrate bonding device can be configured as simply as possible, the manufacturing efficiency of the substrate bonding device can be increased, and also the maintenance of the substrate bonding device and the alignment unit can be easily performed. It works.

Claims (12)

delete A first chamber having a first surface on which the first substrate is seated; A second chamber spaced apart from the first chamber and having a second surface on which a second substrate bonded to the first substrate is seated; And An alignment unit coupled to the second chamber and capable of adjusting six degrees of freedom of the second chamber, wherein the alignment unit includes a coupling table coupled to the second chamber, a pedestal spaced from the coupling table, And a plurality of actuators installed between the coupler and the pedestal and having one end rotatably coupled to the coupler and the other end rotatably coupled to the pedestal. The actuator of claim 2, wherein the actuators include a first actuator, a second actuator, a third actuator, a fourth actuator, a fifth actuator, and a sixth actuator that are coupled to different positions to be interlocked with each other. Board Bonding Device. 3. The substrate bonding apparatus of claim 2, wherein the first chamber is an upper chamber, and the second chamber is a lower chamber positioned below the upper chamber. 3. The substrate bonding apparatus of claim 2, wherein the first chamber is a lower chamber, and the second chamber is an upper chamber located above the lower chamber. delete delete A first chamber having a first surface on which the first substrate is seated; A second chamber spaced apart from the first chamber and having a second surface on which a second substrate bonded to the first substrate is seated; And And an alignment unit coupled to the second plate through the second chamber and configured to control six degrees of freedom between the first substrate and the second substrate. The alignment unit is coupled to the second base plate, the pedestal and the pedestal spaced apart from the pedestal, the coupling is installed between the pedestal and the pedestal, one end is rotatably coupled to the pedestal, the other end is the pedestal A substrate bonding apparatus comprising a plurality of actuators rotatably coupled to. The actuator of claim 8, wherein the actuators include a first actuator, a second actuator, a third actuator, a fourth actuator, a fifth actuator, and a sixth actuator that are coupled to different positions to be interlocked with each other. Board Bonding Device. 9. The substrate bonding apparatus of claim 8, wherein a bellows for sealing between the actuators and a through portion of the second chamber is installed around the actuators. The substrate bonding apparatus of claim 8, wherein the first chamber is an upper chamber, and the second chamber is a lower chamber positioned below the upper chamber. 9. The substrate bonding apparatus of claim 8, wherein the first chamber is a lower chamber, and the second chamber is an upper chamber located above the lower chamber.

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