TWI605946B - Adhesive device - Google Patents
Adhesive device Download PDFInfo
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- TWI605946B TWI605946B TW102126441A TW102126441A TWI605946B TW I605946 B TWI605946 B TW I605946B TW 102126441 A TW102126441 A TW 102126441A TW 102126441 A TW102126441 A TW 102126441A TW I605946 B TWI605946 B TW I605946B
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- adsorption
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- shaped member
- plate member
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
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- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
- Laminated Bodies (AREA)
- Joining Of Glass To Other Materials (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Optical Filters (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Coating Apparatus (AREA)
Description
本發明係關於一種於大氣中將一板狀構件黏貼於另一板狀構件的黏貼裝置。 The present invention relates to an adhesive device for adhering a plate member to another plate member in the atmosphere.
一般而言，於液晶顯示器、有機EL顯示器等各種顯示器裝置的製造步驟中，包含將液晶面板、有機EL面板、觸控面板等類之板狀構件與覆蓋玻璃、彩色濾光片基板等類之板狀構件黏合的步驟。於將該等2種板狀構件黏合中，極其重要的是使兩板狀構件之間無氣泡混入。氣泡之混入會導致顯示品質下降，並且造成剝落。 In general, in the manufacturing steps of various display devices such as liquid crystal displays and organic EL displays, a plate-like member such as a liquid crystal panel, an organic EL panel, or a touch panel, and a cover glass, a color filter substrate, and the like are included. The step of bonding the plate members. In the bonding of the two kinds of plate-like members, it is extremely important that no air bubbles are mixed between the two plate-like members. The incorporation of air bubbles can cause deterioration in display quality and cause peeling.
作為能防止氣泡之混入且能將兩個板狀構件中之一者(以下稱作第2板狀構件)黏貼於另一者(以下稱作第1板狀構件)的黏貼裝置，已知有於真空中進行黏貼者。於此類之黏貼裝置中，在進行黏貼之前，往真空腔室內導入第1及第2板狀構件，且進行腔室內之真空抽氣。而且，於黏貼結束之後，解除腔室內之真空，取出第1及第2板狀構件。然而，此種之黏貼裝置，除了需要大規模的真空腔室等之外，由於在每次進行黏貼時均進行真空抽氣，因此存在有生產性低的問題。 As an adhesive device capable of preventing the incorporation of air bubbles and adhering one of the two plate members (hereinafter referred to as a second plate member) to the other (hereinafter referred to as a first plate member), Adhesive in a vacuum. In such an adhesive apparatus, the first and second plate-shaped members are introduced into the vacuum chamber before the adhesion, and vacuum evacuation is performed in the chamber. Then, after the end of the bonding, the vacuum in the chamber is released, and the first and second plate-like members are taken out. However, such an adhesive device has a problem of low productivity because vacuum evacuation is performed every time the adhesive is applied, in addition to a large-scale vacuum chamber or the like.
作為已解決了上述問題的習知之黏貼裝置，例如有專利文獻1中記載者。如圖10所示，專利文獻1中之黏貼裝置30，係以如下之方式構成：對由觸控面板或液晶面板構成之第1板狀構件100於平台31的上面 進行吸附保持，並且對由覆蓋玻璃構成之第2板狀構件200的黏貼開端部200a及黏貼末端部200b分別利用枕(pillow)32及枕33支撐，限制黏貼開端部200a及黏貼末端部200b往下方向進行移動。 As a conventional pasting device which solves the above problems, for example, it is described in Patent Document 1. As shown in FIG. 10, the pasting device 30 of Patent Document 1 is configured such that the first plate member 100 composed of a touch panel or a liquid crystal panel is on the upper surface of the stage 31. Adhesive holding is performed, and the adhesive opening end portion 200a and the adhesive end portion 200b of the second plate member 200 made of the cover glass are supported by the pillow 32 and the pillow 33, respectively, and the adhesive opening end portion 200a and the adhesive end portion 200b are restricted. Move in the down direction.
黏貼裝置30中之黏貼，係藉由一邊利用黏貼輥34將第2板狀構件200壓貼於第1板狀構件100(嚴格而言，係於第1板狀構件100上所形成之接著劑層104)、一邊使黏貼輥34往圖中之箭頭方向移行而進行。另外，枕33，係在高於黏貼開端部200a的位置持續地支撐黏貼末端部200b。因此，第2板狀構件200一邊成為翹曲狀態一邊黏貼於第1板狀構件100。 The adhesion in the pasting device 30 is performed by pressing the second plate member 200 against the first plate member 100 by the bonding roller 34 (strictly speaking, the adhesive formed on the first plate member 100) The layer 104) is carried out while moving the bonding roller 34 in the direction of the arrow in the drawing. Further, the pillow 33 continuously supports the adhesive end portion 200b at a position higher than the adhesive opening end portion 200a. Therefore, the second plate member 200 is adhered to the first plate member 100 while being in a warped state.
根據該黏貼裝置30，由於一邊利用黏貼輥34壓出氣泡一邊進行黏貼，因此能防止第1板狀構件100與第2板狀構件200之間混入氣泡。此外，亦無需大規模的真空腔室等。 According to the pasting device 30, the air bubbles are pressed while being pressed by the adhesive roller 34, so that air bubbles can be prevented from entering between the first plate member 100 and the second plate member 200. In addition, there is no need for a large-scale vacuum chamber or the like.
專利文獻1：日本專利第4712886號公報 Patent Document 1: Japanese Patent No. 4712886
然而，於專利文獻1之黏貼裝置30中，在第2板狀構件200為超過20吋之大型件之情形下，第2板狀構件200會因自重而彎曲，可能會引起「提前附著」，亦即於以黏貼輥34按壓之前便黏貼於第1板狀構件100。一旦引起提前附著，則會有大量氣泡混入至第1板狀構件100與第2板狀構件200之間。 However, in the case where the second plate-shaped member 200 is a large-sized member of more than 20 inches in the pasting device 30 of the patent document 1, the second plate-shaped member 200 is bent by its own weight, and may cause "advance adhesion". That is, it is adhered to the first plate member 100 before being pressed by the adhesive roller 34. When the adhesion occurs in advance, a large amount of air bubbles are mixed between the first plate member 100 and the second plate member 200.
本發明係鑒於上述情況而完成者，其課題在於提供一種即使是在黏貼之板狀構件的尺寸較大之情形，亦能確實地防止因提前附著而導致氣泡之混入、且能於大氣中進行黏貼的黏貼裝置。 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for reliably preventing the incorporation of air bubbles due to adhesion in advance, even in the case where the size of the plate-like member to be adhered is large. Adhesive pasting device.
為了解決上述問題，本發明之黏貼裝置，係在對保持於黏貼平台之上面的第1板狀構件、與位於較第1板狀構件更上方的第2板狀構件進行位置對準之後，利用黏貼輥從上方按壓第2板狀構件，且使黏貼輥相對於第1板狀構件及第2板狀構件的相對位置在黏貼方向變化而使黏貼輥移行，藉此，將第2板狀構件黏貼於第1板狀構件；該黏貼裝置之特徵在於：具備在黏貼方向隔著間隔排列的多個吸附手段；多個吸附手段，分別包含：吸附部，係吸附保持第2板狀構件的上面；升降部，係使吸附部升降；及擺動部，係以使吸附部相對於升降部可圍繞於與黏貼輥之寬度方向平行的擺動軸而擺動之方式，連結升降部與吸附部；藉由使位於黏貼方向之下游側的吸附部在高於位於上游側之吸附部的位置吸附保持第2板狀構件，而一邊使第2板狀構件之姿勢成為既定的彎曲姿勢一邊進行黏貼；以及，藉由與黏貼輥之移行同步地控制吸附部的升降量、及吸附部相對於升降部的擺動角，而維持既定的彎曲姿勢。 In order to solve the above problems, the adhesive device of the present invention utilizes the first plate-shaped member held on the upper surface of the adhesive platform and the second plate-shaped member located above the first plate-shaped member. The adhesive roller presses the second plate-shaped member from above, and changes the relative position of the adhesive roller to the first plate-shaped member and the second plate-shaped member in the adhesive direction to move the adhesive roller, whereby the second plate-shaped member is moved. Adhesively attached to the first plate-shaped member; the adhesive device comprising: a plurality of adsorption means arranged at intervals in the direction of adhesion; and the plurality of adsorption means each including an adsorption portion for adsorbing and holding the upper surface of the second plate-shaped member The lifting portion is configured to raise and lower the adsorption portion; and the swing portion is configured to connect the lifting portion and the adsorption portion so that the adsorption portion can swing around the swing axis parallel to the width direction of the adhesive roller with respect to the lifting portion; The adsorption unit located on the downstream side in the adhesion direction adsorbs and holds the second plate-shaped member at a position higher than the adsorption unit located on the upstream side, and the posture of the second plate-shaped member is set to a predetermined bending posture. For adhesive; and, by the transitional control of the adhesive roller in synchronization with the lift amount of the adsorbing portion, and a suction portion with respect to a swing angle of the lift portion while maintaining a predetermined curved position.
根據該構成，並非如習知之黏貼裝置般支撐第2板狀構件的兩端部，而係利用多個吸附手段吸附保持第2板狀構件的上面，因此，藉由根據第2板狀構件的尺寸而增加吸附手段的數量、或調整吸附手段彼此的分離距離，而能夠確實地防止第2板狀構件因自重而彎曲。 According to this configuration, the both end portions of the second plate-shaped member are not supported as in the conventional adhesive device, and the upper surface of the second plate-shaped member is sucked and held by the plurality of adsorption means. Therefore, the second plate-shaped member is used. The size of the adsorption means is increased, or the separation distance between the adsorption means is adjusted, and the second plate-shaped member can be surely prevented from being bent by its own weight.
此外，根據該構成，不僅控制吸附部的升降量亦控制擺動角，因此，能使第2板狀構件之姿勢成為合理的自然彎曲姿勢，藉此，能防止第2板狀構件損傷。另外，第2板狀構件的彎曲姿勢，例如可基於第2板狀構件之厚度及黏貼方向的尺寸而決定。 Further, according to this configuration, not only the amount of lifting and lowering of the adsorption unit but also the swing angle is controlled. Therefore, the posture of the second plate member can be made a reasonable natural bending posture, whereby the second plate member can be prevented from being damaged. Further, the bending posture of the second plate-shaped member can be determined, for example, based on the thickness of the second plate-shaped member and the size of the bonding direction.
上述黏貼裝置較佳為：於黏貼輥之移行中，將黏貼輥之按壓 力維持成一定。 Preferably, the adhesive device is: pressing the adhesive roller during the movement of the adhesive roller The force is maintained at a certain level.
根據該構成，能防止黏貼輥之按壓力過大而損傷第2板狀構件及第1板狀構件、或按壓力過小而未充分地壓出氣泡。 According to this configuration, it is possible to prevent the pressing force of the adhesive roller from being excessively large, thereby damaging the second plate-shaped member and the first plate-shaped member, or the pressing force is too small to sufficiently press the air bubbles.
上述黏貼裝置較佳為：為了防止黏貼輥與吸附手段之干涉，而使成為黏貼輥之移行的障礙的吸附手段依序退避。 Preferably, the adhering means is configured to prevent the adsorption means which is an obstacle to the migration of the adhesive roller from being sequentially removed in order to prevent interference between the adhesive roller and the adsorption means.
上述黏貼裝置較佳為：於藉由使位於黏貼方向之下游側的吸附部在高於位於上游側之吸附部的位置吸附保持第2板狀構件，而使第2板狀構件之姿勢成為既定的彎曲姿勢之後，使多個吸附部全部等量下降，且使位於黏貼方向之上游側的第2板狀構件的黏貼開端部黏貼於第1板狀構件。 In the above-described adhesive device, the second plate-shaped member is adsorbed and held at a position higher than the suction portion on the upstream side in the adhesion direction, and the posture of the second plate-shaped member is set. After the bending posture, the plurality of adsorption portions are all lowered by the same amount, and the adhesive opening end portion of the second plate-shaped member located on the upstream side in the adhesion direction is adhered to the first plate-shaped member.
根據該構成，於黏貼開始時，能防止氣泡混入第1板狀構件與第2板狀構件之間。 According to this configuration, it is possible to prevent air bubbles from entering between the first plate member and the second plate member at the start of the adhesion.
作為第1板狀構件與第2板狀構件之組合，例如，可想到以下之組合，但組合並不限定於該等。 As a combination of the first plate-shaped member and the second plate-shaped member, for example, the following combinations are conceivable, but the combination is not limited thereto.
．組合A . Combination A
第1板狀構件：覆蓋玻璃 First plate member: cover glass
第2板狀構件：液晶面板、有機EL面板或觸控面板 Second plate member: liquid crystal panel, organic EL panel or touch panel
．組合B . Combination B
第1板狀構件：液晶面板、有機EL面板或觸控面板 First plate member: liquid crystal panel, organic EL panel or touch panel
第2板狀構件：覆蓋玻璃 2nd plate member: cover glass
．組合C . Combination C
第1板狀構件：有機EL面板 First plate member: organic EL panel
第2板狀構件：彩色濾光片基板 Second plate member: color filter substrate
．組合D . Combination D
第1板狀構件：彩色濾光片基板 First plate member: color filter substrate
第2板狀構件：有機EL面板 Second plate member: organic EL panel
根據本發明，可提供一種即使是在黏貼之板狀構件的尺寸較大之情形，亦能確實地防止因提前附著而導致氣泡之混入、且能於大氣中進行黏貼的黏貼裝置。 According to the present invention, it is possible to provide an adhesive device which can surely prevent the incorporation of air bubbles due to adhesion in advance and which can be adhered to the atmosphere even when the size of the plate-like member to be adhered is large.
1、1’‧‧‧黏貼裝置 1, 1'‧‧‧Adhesive device
2‧‧‧黏貼平台 2‧‧‧Adhesive platform
3‧‧‧吸附噴嘴 3‧‧‧Adsorption nozzle
4‧‧‧控制部 4‧‧‧Control Department
5~8‧‧‧泵 5~8‧‧‧ pump
10‧‧‧黏貼輥 10‧‧‧Adhesive roller
11‧‧‧黏貼輥升降手段 11‧‧‧Adhesive roller lifting method
12‧‧‧黏貼輥移行手段 12‧‧‧Adhesive roller migration
20a‧‧‧第1吸附手段 20a‧‧‧1st adsorption means
20b‧‧‧第2吸附手段 20b‧‧‧2nd adsorption means
20c‧‧‧第3吸附手段 20c‧‧‧3rd adsorption means
20d‧‧‧第4吸附手段 20d‧‧‧4th adsorption means
21‧‧‧吸附部 21‧‧‧Adsorption Department
22‧‧‧吸附噴嘴 22‧‧‧Adsorption nozzle
23‧‧‧擺動部 23‧‧‧Swings
24‧‧‧升降部 24‧‧‧ Lifting Department
100‧‧‧第1板狀構件 100‧‧‧1st plate member
103‧‧‧樹脂(樹脂層) 103‧‧‧Resin (resin layer)
200‧‧‧第2板狀構件 200‧‧‧2nd plate member
P‧‧‧按壓位置 P‧‧‧ Press position
圖1，係本發明之實施例之黏貼裝置的側視圖。 Figure 1 is a side elevational view of an applicator of an embodiment of the present invention.
圖2，(A)係從黏貼方向上游側觀察圖1之黏貼裝置的圖，(B)係從(A)中省略黏貼輥、黏貼輥升降手段及黏貼輥移行手段的圖。 Fig. 2(A) is a view of the sticking device of Fig. 1 as viewed from the upstream side in the direction of adhesion, and (B) is a view in which the sticking roller, the sticking roller lifting means, and the sticking roller moving means are omitted from (A).
圖3，係本發明之實施例之黏貼裝置的控制方塊圖。 Figure 3 is a control block diagram of an applicator of an embodiment of the present invention.
圖4，係塗布有硬化樹脂之第1板狀構件的(A)俯視圖、及(B)剖面圖。 Fig. 4 is a plan view (A) and a cross-sectional view (B) showing a first plate-shaped member coated with a cured resin.
圖5，係表示本發明之實施例之黏貼裝置的黏貼動作的圖。 Fig. 5 is a view showing the pasting operation of the pasting device according to the embodiment of the present invention.
圖6，係表示本發明之實施例之黏貼裝置的黏貼動作的圖。 Fig. 6 is a view showing the pasting operation of the pasting device according to the embodiment of the present invention.
圖7，係表示本發明之實施例之黏貼裝置的黏貼動作的圖。 Fig. 7 is a view showing the pasting operation of the pasting device of the embodiment of the present invention.
圖8，係利用本發明之實施例之黏貼裝置進行黏貼的放大第1板狀構件及第2板狀構件之一部分的圖。 Fig. 8 is a view showing a part of the first plate-shaped member and the second plate-like member enlarged by the sticking device of the embodiment of the present invention.
圖9，係本發明之變形例之黏貼裝置的側視圖。 Figure 9 is a side view of an adhesive device according to a modification of the present invention.
圖10，係習知的黏貼裝置的側視圖。 Figure 10 is a side view of a conventional adhesive device.
以下，參照隨附圖式，針對本發明之黏貼裝置的實施例進行說明。 Hereinafter, an embodiment of the pasting apparatus of the present invention will be described with reference to the accompanying drawings.
[裝置構成] [Device configuration]
在圖1及圖2中，表示本發明之實施例之黏貼裝置。本實施例中之黏貼裝置1，係用於在大氣中將第2板狀構件200黏貼於第1板狀構件100者。在本實施例中，第1板狀構件100為彩色濾光片基板，第2板狀構件200為有機EL面板。第1板狀構件100及第2板狀構件200，亦可為構成顯示器裝置的其他的板狀構件。 In Figs. 1 and 2, an adhesive device according to an embodiment of the present invention is shown. The sticking device 1 in the present embodiment is used to adhere the second plate member 200 to the first plate member 100 in the atmosphere. In the present embodiment, the first plate member 100 is a color filter substrate, and the second plate member 200 is an organic EL panel. The first plate member 100 and the second plate member 200 may be other plate members constituting the display device.
第1板狀構件100及第2板狀構件200的黏貼方向(長度方向)及寬度方向(短邊方向)的尺寸實質上相同。此外，於第1板狀構件100的黏貼第2板狀構件200之側的面(以下稱作上面)101，預先塗布有樹脂103。第2板狀構件200透過該樹脂103而黏貼於第1板狀構件100。 The first plate-shaped member 100 and the second plate-shaped member 200 have substantially the same dimensions in the bonding direction (longitudinal direction) and the width direction (short-side direction). In addition, the resin 103 is applied in advance to the surface (hereinafter referred to as the upper surface) 101 of the first plate member 100 on the side of the second plate member 200. The second plate member 200 is adhered to the first plate member 100 through the resin 103.
如圖4所示，樹脂103包含塗布於第1板狀構件100的上面101的外緣之紫外線硬化樹脂103a、及在由紫外線硬化樹脂103a所包圍的區域內呈梳狀地塗布之熱硬化樹脂103b。樹脂103，藉由黏貼裝置1的黏貼動作而在第1板狀構件100與第2板狀構件200之間被壓開，最終成為將第1板狀構件100與第2板狀構件200之間的空間無間隙地完全填埋的樹脂層103。另外，紫外線硬化樹脂103a及熱硬化樹脂103b之硬化係於黏貼結束之後進行。 As shown in FIG. 4, the resin 103 includes an ultraviolet curable resin 103a applied to the outer edge of the upper surface 101 of the first plate member 100, and a thermosetting resin coated in a comb shape in a region surrounded by the ultraviolet curable resin 103a. 103b. The resin 103 is pressed between the first plate-shaped member 100 and the second plate-shaped member 200 by the adhesion operation of the pasting device 1, and finally becomes between the first plate-shaped member 100 and the second plate-shaped member 200. The space is completely filled with the resin layer 103 without gaps. Further, the curing of the ultraviolet curable resin 103a and the thermosetting resin 103b is performed after the end of the bonding.
再次參照圖1及圖2。黏貼裝置1，具備有固定於底板F的黏貼平台2。黏貼平台2，具有朝向上方向的水平的吸附面2a、及設於該吸 附面2a的多個吸附噴嘴3。黏貼平台2之各吸附噴嘴3與泵5連接，藉由在控制部4的控制下泵5進行作動，而將第1板狀構件100的下面102吸附保持於吸附面2a(參照圖3)。經吸附保持的第1板狀構件100的上面101朝上。 Referring again to Figures 1 and 2 . The pasting device 1 is provided with an adhesive platform 2 fixed to the bottom plate F. The adhesive platform 2 has a horizontal adsorption surface 2a facing upward and is disposed at the suction A plurality of adsorption nozzles 3 of the surface 2a. Each of the adsorption nozzles 3 of the bonding platform 2 is connected to the pump 5, and the pump 5 is operated by the control unit 4 to adsorb and hold the lower surface 102 of the first plate-shaped member 100 on the adsorption surface 2a (see Fig. 3). The upper surface 101 of the first plate member 100 that is adsorbed and held upward faces upward.
黏貼裝置1，具備有黏貼輥10、黏貼輥升降手段11及黏貼輥移行手段12。 The pasting device 1 includes an adhesive roller 10, an adhesive roller lifting and lowering means 11, and an adhesive roller moving means 12.
黏貼輥10，係從上方對第2板狀構件200的未黏貼於第1板狀構件100之側的面(以下稱作上面)201進行按壓。黏貼輥10，安裝在由汽缸等構成的黏貼輥升降手段11的下端呈旋轉自如。此外，黏貼輥升降手段11的上端，固定於可在底板F上移行的黏貼輥移行手段12。黏貼輥移行手段12，係包含支撐黏貼輥升降手段11的頂部框架13、前腳框架14、及後腳框架15的金屬製框體。於前腳框架14及後腳框架15的下端，分別安裝有車輪。 The adhesive roller 10 presses the surface (hereinafter referred to as the upper surface) 201 of the second plate-shaped member 200 that is not adhered to the side of the first plate-shaped member 100 from above. The sticking roller 10 is rotatably attached to the lower end of the sticking roller lifting and lowering means 11 which consists of a cylinder etc.. Further, the upper end of the sticking roller lifting and lowering means 11 is fixed to the sticking roller moving means 12 which is movable on the bottom plate F. The adhesive roller moving means 12 includes a metal frame that supports the top frame 13, the front leg frame 14, and the rear leg frame 15 of the adhesive roller lifting and lowering means 11. Wheels are attached to the lower ends of the front leg frame 14 and the rear leg frame 15, respectively.
一旦在控制部4的控制下使構成黏貼輥升降手段11的汽缸伸縮，則隨之黏貼輥10亦上下移動(升降)。一旦黏貼輥10下降，則施加於第2板狀構件200之上面201的按壓力變大，其結果為，第2板狀構件200強力地按壓於第1板狀構件100。另一方面，一旦黏貼輥10上升，則施加於第2板狀構件200之上面201的按壓力變小。 When the cylinder constituting the sticking roller lifting and lowering means 11 is expanded and contracted under the control of the control unit 4, the sticking roller 10 is also moved up and down (lifting and lowering). When the adhesive roller 10 is lowered, the pressing force applied to the upper surface 201 of the second plate-shaped member 200 is increased, and as a result, the second plate-shaped member 200 is strongly pressed against the first plate-shaped member 100. On the other hand, when the bonding roller 10 rises, the pressing force applied to the upper surface 201 of the second plate member 200 becomes small.
黏貼輥升降手段11，具有檢測黏貼輥10之按壓力的未圖示的按壓力檢測感測器。控制部4，亦能一邊參照該按壓力檢測感測器所檢測出的按壓力，一邊控制黏貼輥10的升降以使該按壓力成為既定之值。另外，該既定之值，亦可為具有某種程度的範圍。也就是，控制部4，亦可控制黏 貼輥10的升降以使押壓力處於既定的下限值與上限值之間。另外，上述既定之值(或上限值及下限值)，係實驗性地決定為不會有如下之情況：按壓力過大而使第2板狀構件200及第1板狀構件100損傷、或按壓力過小而無法充分地進行氣泡之壓出。 The sticking roller lifting and lowering means 11 has a pressing force detecting sensor (not shown) for detecting the pressing force of the bonding roller 10. The control unit 4 can also control the elevation of the adhesive roller 10 with reference to the pressing force detected by the pressing force detecting sensor so that the pressing force becomes a predetermined value. In addition, the predetermined value may also have a certain range. That is, the control unit 4 can also control the stickiness The lifting and lowering of the roller 10 is such that the pressing force is between the predetermined lower limit value and the upper limit value. In addition, the predetermined value (or the upper limit value and the lower limit value) is experimentally determined so as not to damage the second plate member 200 and the first plate member 100 when the pressing force is excessively large. Or the pressing force is too small to sufficiently perform the bubble extrusion.
一旦在控制部4的控制下使黏貼輥移行手段12移行，則黏貼輥10往黏貼方向或其相反方向移行。也就是，一旦黏貼輥移行手段12移行，則黏貼輥10相對於第1板狀構件100及第2板狀構件200的相對位置進行變化。 Once the bonding roller moving means 12 is moved under the control of the control unit 4, the bonding roller 10 is moved in the bonding direction or in the opposite direction. That is, when the bonding roller moving means 12 moves, the relative position of the bonding roller 10 with respect to the 1st plate-shaped member 100 and the 2nd plate-shaped member 200 changes.
黏貼裝置1，進一步具備有在黏貼方向隔著間隔排列的3個吸附手段，亦即第1吸附手段20a、第2吸附手段20b及第3吸附手段20c。3個吸附手段20a~20c，分別包含吸附部21、擺動部23及升降部24。 The pasting device 1 further includes three adsorption means arranged at intervals in the direction of adhesion, that is, the first adsorption means 20a, the second adsorption means 20b, and the third adsorption means 20c. The three adsorption means 20a to 20c each include an adsorption portion 21, a swing portion 23, and a lifting portion 24.
吸附部21，具有朝向第2板狀構件200的平坦的吸附面21a、及設在該吸附面21a的多個吸附噴嘴22。第1吸附手段20a之吸附噴嘴22與泵6連接，藉由在控制部4的控制下使泵6進行作動，而吸附保持第2板狀構件200。同樣地，第2吸附手段20b的吸附噴嘴22與泵7連接，第3吸附手段20c的吸附噴嘴22與泵8連接，藉由使各泵7、8進行作動，而吸附保持第2板狀構件200(參照圖3)。 The adsorption unit 21 has a flat adsorption surface 21a facing the second plate member 200 and a plurality of adsorption nozzles 22 provided on the adsorption surface 21a. The adsorption nozzle 22 of the first adsorption means 20a is connected to the pump 6, and the pump 6 is actuated by the control unit 4 to adsorb and hold the second plate member 200. Similarly, the adsorption nozzle 22 of the second adsorption means 20b is connected to the pump 7, and the adsorption nozzle 22 of the third adsorption means 20c is connected to the pump 8, and the respective pumps 7 and 8 are operated to adsorb and hold the second plate-shaped member. 200 (refer to Figure 3).
升降部24係由汽缸等構成。升降部24之上端固定於頂板R。此外，擺動部23，以使吸附部21相對於升降部24可圍繞與黏貼輥10之寬度方向平行的擺動軸而擺動之方式，連結升降部24之下端與吸附部21。 The lifting portion 24 is constituted by a cylinder or the like. The upper end of the lifting portion 24 is fixed to the top plate R. Further, the swing portion 23 connects the lower end of the lift portion 24 and the adsorption portion 21 so that the suction portion 21 can swing around the swing shaft parallel to the width direction of the adhesive roller 10 with respect to the lift portion 24.
一旦在控制部4的控制下使構成升降部24之汽缸伸縮，則隨之吸附部21亦上下移動(升降)。一旦吸附部21下降，則第2板狀構件 200的保持於該吸附部21的部分往下方按壓。另一方面，一旦吸附部21上升，則第2板狀構件200的保持於該吸附部21的部分向上提升。 When the cylinder constituting the elevation unit 24 is expanded and contracted under the control of the control unit 4, the adsorption unit 21 is also moved up and down (lifting). Once the adsorption portion 21 is lowered, the second plate member The portion of the holding portion of the holding portion 21 of 200 is pressed downward. On the other hand, when the adsorption portion 21 is raised, the portion of the second plate-shaped member 200 held by the adsorption portion 21 is lifted upward.
一旦在控制部4的控制下擺動部23使吸附部21擺動，則隨之吸附部21的吸附面21a傾斜，其結果為，第2板狀構件200的保持於該吸附部21的部分亦傾斜。 When the swinging portion 21 swings the suction portion 21 under the control of the control unit 4, the suction surface 21a of the adsorption portion 21 is inclined, and as a result, the portion of the second plate-shaped member 200 held by the adsorption portion 21 is also inclined. .
控制部4，能個別地控制3個吸附手段20a~20c之升降部24。此外，控制部4，亦能個別地控制3個吸附手段20a~20c中之吸附部21的擺動。 The control unit 4 can individually control the elevating units 24 of the three adsorption means 20a to 20c. Further, the control unit 4 can individually control the swing of the adsorption unit 21 among the three adsorption means 20a to 20c.
於圖3中，表示本實施例中之黏貼裝置1的控制方塊圖。如同圖所示，控制部4，係針對(1)黏貼平台2中之對第1板狀構件100之吸附保持、(2)黏貼輥10之升降及移行、(3)第1吸附手段20a之吸附部21中之對第2板狀構件200之吸附保持、吸附部21之升降及移行、(4)第2吸附手段20b之吸附部21中之對第2板狀構件200之吸附保持、吸附部21之升降及移行、以及(5)第3吸附手段20c之吸附部21中之對第2板狀構件200之吸附保持、吸附部21之升降及移動進行控制。另外，各吸附部21的升降控制，係使該等之高度變化成作為目標之高度的高度控制，相對於此，在黏貼輥10的升降控制中，包括將按壓力維持於既定之值(或既定的範圍內之值)的壓力控制、及高度控制之2種控制。 In Fig. 3, a control block diagram of the pasting device 1 in the present embodiment is shown. As shown in the figure, the control unit 4 is for (1) adsorption holding of the first plate member 100 in the bonding platform 2, (2) lifting and moving of the bonding roller 10, and (3) first adsorption means 20a. Adsorption and retention of the second plate-shaped member 200 in the adsorption unit 21, up-and-down and migration of the adsorption unit 21, and (4) adsorption and adsorption of the second plate-shaped member 200 in the adsorption unit 21 of the second adsorption means 20b The lifting and lowering of the portion 21 and (5) the adsorption holding of the second plate member 200 in the adsorption portion 21 of the third adsorption means 20c, and the raising and lowering of the adsorption portion 21 and the movement are controlled. Further, the elevation control of each of the adsorption sections 21 is such that the height is changed to the height control of the target height, and the elevation control of the adhesive roller 10 includes maintaining the pressing force at a predetermined value (or Two types of control for pressure control and height control within a given range of values.
[黏貼動作] [sticking action]
接著，針對於本實施例中之黏貼裝置1的黏貼動作依序進行說明。 Next, the pasting operation of the pasting device 1 in the present embodiment will be described in order.
圖5(A)表示黏貼動作開始之前的初始狀態。如同圖所示，於初始狀態下，吸附保持於黏貼平台2的第1板狀構件100、與吸附保持於 3個吸附部21的第2板狀構件200係上下分離。各吸附部21之高度相同，且3個吸附部21均未擺動(擺動角=0°)，因此，第2板狀構件200相對於第1板狀構件100保持平行。此外，黏貼輥10，位於第2板狀構件200的黏貼起始側(黏貼方向上游側)的端部的正上方。 Fig. 5(A) shows the initial state before the start of the pasting operation. As shown in the figure, in the initial state, the first plate member 100 adsorbed and held by the bonding platform 2 is held by the adsorption The second plate-shaped members 200 of the three adsorption units 21 are vertically separated. Since the height of each adsorption unit 21 is the same, and the three adsorption units 21 are not swung (swing angle = 0°), the second plate-shaped member 200 is kept parallel to the first plate-shaped member 100. Further, the adhesive roller 10 is located directly above the end portion of the second plate-shaped member 200 on the adhesive start side (upstream side in the pasting direction).
另外，於成為初始狀態之前，第1板狀構件100與第2板狀構件200的面內方向的位置對準係既已完成。 Further, the positional alignment of the first plate-shaped member 100 and the in-plane direction of the second plate-shaped member 200 is completed before the initial state.
圖5(B)表示如下之狀態：從圖5(A)所示之初始狀態，使第1吸附手段20a的吸附部21、第2吸附手段20b的吸附部21及第3吸附手段20c的吸附部21分別上升ha、hb、hc，並且，使第1吸附手段20a的吸附部21、第2吸附手段20b的吸附部21及第3吸附手段20c的吸附部21分別往使吸附面21a變成非水平的方向(在圖5中為逆時針旋轉)以θ a、θ b、θ c擺動，藉此，使第2板狀構件200成為既定的彎曲姿勢。 Fig. 5(B) shows a state in which the adsorption unit 21 of the first adsorption means 20a, the adsorption unit 21 of the second adsorption means 20b, and the third adsorption means 20c are adsorbed from the initial state shown in Fig. 5(A). The portion 21 is raised by ha, hb, and hc, and the adsorption unit 21 of the first adsorption means 20a, the adsorption unit 21 of the second adsorption means 20b, and the adsorption unit 21 of the third adsorption means 20c are caused to change the adsorption surface 21a. The horizontal direction (counterclockwise rotation in FIG. 5) is swung by θ a, θ b , and θ c , whereby the second plate member 200 is brought into a predetermined bending posture.
各吸附部21之上升量，存在有ha<hb<hc的關係。因此，在該狀態下，在位於黏貼方向之下游側的吸附部21高於位於上游側之吸附部21的位置，吸附保持第2板狀構件200。具體而言，第2吸附手段20b的吸附部21，在高於第1吸附手段20a的吸附部21的位置吸附保持第2板狀構件200，第3吸附手段20c的吸附部21在高於第2吸附手段20b的吸附部21的位置吸附保持第2板狀構件200。 The amount of rise of each adsorption unit 21 has a relationship of ha < hb < hc. Therefore, in this state, the adsorption portion 21 on the downstream side in the adhesion direction is higher than the position on the upstream adsorption portion 21, and the second plate member 200 is adsorbed and held. Specifically, the adsorption unit 21 of the second adsorption means 20b adsorbs and holds the second plate-shaped member 200 at a position higher than the adsorption unit 21 of the first adsorption means 20a, and the adsorption unit 21 of the third adsorption means 20c is higher than the first The position of the adsorption unit 21 of the adsorption means 20b adsorbs and holds the second plate-shaped member 200.
各吸附部21之擺動角，存在有θ a<θ b<θ c的關係。藉由使擺動角成為如此之關係，能使第2板狀構件200之姿勢成為合理的自然彎曲姿勢。 The swing angle of each adsorption unit 21 has a relationship of θ a < θ b < θ c . By setting the swing angle in this relationship, the posture of the second plate member 200 can be made a reasonable natural bending posture.
此處，為了防止因提前附著而引起的氣泡之混入，較佳為使 第2板狀構件200大幅翹曲。換言之，較佳為使按壓位置P中的第2板狀構件200與第1板狀構件100(嚴格而言係樹脂103)所成的角度(以下稱作黏貼角θ)變大。然而，於進行厚度大且剛性高的第2板狀構件200之黏貼的情形下，一旦黏貼角θ過大，則可能會損傷第2板狀構件200。因此，關於使黏貼角θ成為何種程度，需要根據第2板狀構件200之厚度而決定。此外，即使是作為目標之黏貼角θ相同，若第2板狀構件200之黏貼方向的尺寸不同，則圖5(A)~(B)期間的各吸附部21之上升量及擺動角亦會不同。根據上述內容，在本實施例中，係基於第2板狀構件200之厚度及黏貼方向的尺寸來決定上述既定的彎曲姿勢。 Here, in order to prevent the incorporation of air bubbles due to adhesion in advance, it is preferable to make The second plate member 200 is largely warped. In other words, it is preferable that the angle formed by the second plate-shaped member 200 in the pressing position P and the first plate-shaped member 100 (strictly speaking, the resin 103) (hereinafter referred to as the adhesion angle θ) is increased. However, in the case of adhering the second plate member 200 having a large thickness and high rigidity, if the adhesion angle θ is excessively large, the second plate member 200 may be damaged. Therefore, it is necessary to determine the thickness of the second plate member 200 depending on the thickness of the second plate member 200. In addition, even if the target sticking angle θ is the same, if the size of the second plate-shaped member 200 in the sticking direction is different, the amount of lift and the swing angle of each of the adsorbing portions 21 in the periods (A) to (B) of FIG. 5 will also be different. According to the above, in the present embodiment, the predetermined bending posture is determined based on the thickness of the second plate member 200 and the size of the bonding direction.
圖5(C)係表示如下之狀態：使黏貼輥10及所有吸附手段20a~20c的吸附部21從圖5(B)所示之狀態等量下降，透過樹脂103而將第2板狀構件200的黏貼開端部黏貼於第1板狀構件100。由於黏貼輥10及所有吸附手段20a~20c的吸附部21的下降量相等，因此，第2板狀構件200之姿勢維持既定的彎曲姿勢。在本實施例中，藉由在使第2板狀構件200之姿勢成為既定的彎曲姿勢的狀態下開始黏貼，而使第2板狀構件200對第1板狀構件100(嚴格而言係樹脂103)線接觸而非面接觸，藉此，防止黏貼開始時氣泡之混入。 Fig. 5(C) shows a state in which the adsorption roller 21 of the adhesive roller 10 and all the adsorption means 20a to 20c is lowered by the same amount as shown in Fig. 5(B), and the second plate-like member is transmitted through the resin 103. The adhesive opening portion of 200 is adhered to the first plate member 100. Since the amount of drop of the adsorption portion 21 of the adhesive roller 10 and all of the adsorption means 20a to 20c is equal, the posture of the second plate-shaped member 200 maintains a predetermined bending posture. In the present embodiment, the second plate member 200 is applied to the first plate member 100 (strictly, resin) in a state in which the posture of the second plate member 200 is set to a predetermined bending posture. 103) Line contact instead of face contact, thereby preventing the incorporation of air bubbles at the beginning of the sticking.
圖6(A)係表示如下之狀態：為了一邊使黏貼輥10從圖5(C)所示之狀態往黏貼方向移行、一邊將黏貼角θ保持成一定，而使各吸附手段20a~20c的吸附部21上升，並且使吸附面21a往接近水平的方向(在圖6中為順時針旋轉)擺動。亦於此狀態下，位於黏貼方向之下游側的吸附部21，在高於位於上游側的吸附部21的位置吸附保持第2板狀構件200。 Fig. 6(A) shows a state in which the adhesion angles θ are kept constant while the adhesive roller 10 is moved from the state shown in Fig. 5(C) to the sticking direction, and the respective adsorption means 20a to 20c are provided. The adsorption portion 21 is raised, and the adsorption surface 21a is swung in a direction close to the horizontal direction (clockwise rotation in Fig. 6). In this state, the adsorption portion 21 located on the downstream side in the pasting direction adsorbs and holds the second plate member 200 at a position higher than the adsorption portion 21 located on the upstream side.
如上所述，移行中的黏貼輥10，係藉由壓力控制而以使按壓力成為既定之值(或既定的範圍內之值)之方式而控制。因此，黏貼輥10之高度於移行中可有少許變動。 As described above, the adhesive roller 10 in the traveling is controlled by pressure control so that the pressing force becomes a predetermined value (or a value within a predetermined range). Therefore, the height of the adhesive roller 10 can be slightly changed during the transition.
在本實施例中，考慮到第2板狀構件200之厚度而將作為目標之黏貼角θ設定為5°，但作為目標之黏貼角θ亦可具有某種程度的範圍。 In the present embodiment, the target adhesion angle θ is set to 5° in consideration of the thickness of the second plate member 200, but the target adhesion angle θ may have a certain range.
圖6(B)係表示如下之狀態：使黏貼輥10從圖6(A)所示之狀態進一步移行，使第1吸附手段20a的吸附部21以不會成為黏貼輥10之移行的障礙的方式往上方退避。由於至按壓位置P之前的黏貼既已完成，因此即使吸附保持第2板狀構件200之手段僅為第2吸附手段20b及第3吸附手段20c，第2板狀構件200亦不會有彎曲之情況。 6(B) shows a state in which the adhesive roller 10 is further moved from the state shown in FIG. 6(A) so that the adsorption portion 21 of the first adsorption means 20a does not become an obstacle to the migration of the adhesive roller 10. The way to retreat upwards. Since the adhesion to the pressing position P is completed, even if the means for adsorbing and holding the second plate member 200 is only the second adsorption means 20b and the third adsorption means 20c, the second plate member 200 does not bend. Happening.
於圖6(A)~(B)期間，黏貼輥10亦藉由壓力控制以使按壓力成為既定之值(或既定的範圍內之值)之方式而控制。此外，於圖6(A)~(B)期間，亦為了將黏貼角θ保持成一定(或既定的範圍內)，而與黏貼輥10之移行同步地控制各吸附手段20a~20c的吸附部21的升降及擺動。 During the period of Figs. 6(A) to (B), the adhesive roller 10 is also controlled by pressure control so that the pressing force becomes a predetermined value (or a value within a predetermined range). Further, during the period of FIGS. 6(A) to (B), in order to keep the sticking angle θ constant (or within a predetermined range), the adsorption portions of the respective adsorption means 20a to 20c are controlled in synchronization with the movement of the adhesive roller 10. 21 lifting and swinging.
在本實施例中，一旦黏貼輥10的總移行距離超過既定的閾值，則控制部4將構成第1吸附手段20a的升降部24的汽缸縮至極限，使第1吸附手段20a的吸附部21退避。使第1吸附手段20a的吸附部21退避的時機可適當地變更。 In the present embodiment, when the total travel distance of the adhesive roller 10 exceeds a predetermined threshold value, the control unit 4 reduces the cylinder of the lift unit 24 constituting the first adsorption means 20a to the limit, and causes the adsorption portion 21 of the first adsorption means 20a. Retreat. The timing at which the adsorption unit 21 of the first adsorption means 20a is retracted can be appropriately changed.
圖6(C)係表示如下之狀態：黏貼輥10從圖6(B)所示之狀態進一步移行，第2吸附手段20b的吸附部21以不會成為黏貼輥10之移行的障礙的方式往上方退避。由於至按壓位置P之前的黏貼既已完成， 因此，即使吸附保持第2板狀構件200的手段僅為第3吸附手段20c，第2板狀構件200亦不會有彎曲之情況。 Fig. 6(C) shows a state in which the adhesive roller 10 is further moved from the state shown in Fig. 6(B), and the adsorption portion 21 of the second adsorption means 20b is in a manner that does not become an obstacle to the migration of the adhesive roller 10. Retreat above. Since the pasting to the pressing position P is completed, Therefore, even if the means for adsorbing and holding the second plate-shaped member 200 is only the third adsorption means 20c, the second plate-shaped member 200 is not bent.
於圖6(B)~(C)期間，黏貼輥10亦藉由壓力控制以使按壓力成為既定之值(或既定的範圍內之值)之方式而控制。此外，於圖6(B)~(C)期間，為了使黏貼角θ保持成一定(或既定的範圍內)，而與黏貼輥10之移行同步地控制第2吸附手段20b及第3吸附手段20c的吸附部21的升降及擺動。 During the period of Figs. 6(B) to (C), the adhesive roller 10 is also controlled by pressure control so that the pressing force becomes a predetermined value (or a value within a predetermined range). In addition, in the period of (B) to (C) of FIG. 6 , in order to keep the sticking angle θ constant (or within a predetermined range), the second adsorption means 20b and the third adsorption means are controlled in synchronization with the movement of the adhesive roller 10. The lifting and swinging of the adsorption unit 21 of 20c.
在本實施例中，一旦黏貼輥10的總移行距離超過既定的閾值，則控制部4使構成第2吸附手段20b的升降部24的汽缸縮至極限，使第2吸附手段20b的吸附部21退避。使第2吸附手段20b的吸附部21退避的時機可適當地變更。 In the present embodiment, when the total travel distance of the adhesive roller 10 exceeds a predetermined threshold value, the control unit 4 reduces the cylinder of the elevating portion 24 constituting the second adsorption means 20b to the limit, and causes the adsorption portion 21 of the second adsorption means 20b. Retreat. The timing at which the adsorption unit 21 of the second adsorption means 20b is retracted can be appropriately changed.
圖7(A)係表示如下之狀態：黏貼輥10從圖6(C)所示之狀態進一步移行，第3吸附手段20c的吸附部21以不會成為黏貼輥10之移行的障礙的方式往上方退避。 Fig. 7(A) shows a state in which the adhesive roller 10 is further moved from the state shown in Fig. 6(C), and the adsorption portion 21 of the third adsorption means 20c is in a manner that does not become an obstacle to the migration of the adhesive roller 10. Retreat above.
於圖6(C)~圖7(A)期間，黏貼輥10亦藉由壓力控制以使按壓力成為既定之值(或既定的範圍內之值)之方式而控制。此外，於圖6(C)~圖7(A)期間，亦為了將黏貼角θ保持成一定(或既定的範圍內)，而與黏貼輥10之移行同步地控制第3吸附手段20c的吸附部21的升降及擺動。 During the period from Fig. 6(C) to Fig. 7(A), the adhesive roller 10 is also controlled by pressure control so that the pressing force becomes a predetermined value (or a value within a predetermined range). Further, during the period from FIG. 6(C) to FIG. 7(A), in order to keep the sticking angle θ constant (or within a predetermined range), the adsorption of the third adsorption means 20c is controlled in synchronization with the movement of the adhesive roller 10. The lifting and swinging of the portion 21.
在本實施例中，一旦黏貼輥10的總移行距離超過既定的閾值，則控制部4使構成第3吸附手段20c的升降部24的汽缸縮至極限，使第3吸附手段20c的吸附部21退避。使第3吸附手段20c的吸附部21退避 的時機可適當地變更。 In the present embodiment, when the total travel distance of the adhesive roller 10 exceeds a predetermined threshold value, the control unit 4 reduces the cylinder of the elevating portion 24 constituting the third adsorption means 20c to the limit, and causes the adsorption portion 21 of the third adsorption means 20c. Retreat. The adsorption unit 21 of the third adsorption means 20c is evacuated The timing can be changed as appropriate.
此處，亦考慮到，一旦第3吸附手段20c的吸附部21退避，則第2板狀構件200的黏貼末尾側(黏貼方向下游側)的端部成為自由端，因提前附著而引起氣泡混入。然而，當第3吸附手段20c的吸附部21退避時，如圖8所示，藉由經黏貼輥10處理之已黏貼區域的樹脂103及從初始狀態起已存在於未黏貼區域的樹脂103，將未黏貼區域中的第1板狀構件100與第2板狀構件200之間的空間幾乎無間隙地完全填埋，因此即使產生提前附著，氣泡混入之可能性亦較低。此外，即使有氣泡混入，只要為少量，則均能藉由之後的黏貼輥10之移行而將其壓出。 In this case, when the adsorption unit 21 of the third adsorption means 20c is retracted, the end of the second plate-shaped member 200 on the end side of the adhesive (the downstream side in the direction of adhesion) is a free end, and air bubbles are mixed due to adhesion in advance. . However, when the adsorption portion 21 of the third adsorption means 20c is retracted, as shown in FIG. 8, the resin 103 in the pasted region treated by the adhesive roller 10 and the resin 103 existing in the unadhered region from the initial state, Since the space between the first plate-shaped member 100 and the second plate-shaped member 200 in the non-adhered region is completely filled without any gap, even if adhesion occurs in advance, the possibility of air bubbles being mixed is low. Further, even if a small amount of air bubbles is mixed, it can be extruded by the subsequent movement of the adhesive roller 10 as long as it is a small amount.
圖7(B)係表示如下之狀態：黏貼輥10從圖7(A)所示之狀態進一步移行，黏貼輥10到達第2板狀構件200的黏貼末端部，換言之，圖7(B)係表示第2板狀構件200對第1板狀構件100的黏貼已完成的狀態。在該狀態下，藉由至此之前的黏貼輥10之移行而於第1板狀構件100及第2板狀構件200之間被壓開的樹脂103，成為將第1板狀構件100及第2板狀構件200之間的空間無間隙地完全填埋的樹脂層103。 Fig. 7(B) shows a state in which the adhesive roller 10 further moves from the state shown in Fig. 7(A), and the adhesive roller 10 reaches the adhesive end portion of the second plate member 200, in other words, Fig. 7(B) The state in which the adhesion of the second plate member 200 to the first plate member 100 is completed is shown. In this state, the resin 103 which is pressed between the first plate-shaped member 100 and the second plate-shaped member 200 by the movement of the pasting roller 10 before this becomes the first plate-shaped member 100 and the second The resin layer 103 is completely filled in the space between the plate-like members 200 without a gap.
於圖7(A)~(B)期間，黏貼輥10亦藉由壓力控制以使按壓力成為既定之值(或既定的範圍內之值)之方式而控制。 During the period of Figs. 7(A) to (B), the adhesive roller 10 is also controlled by pressure control so that the pressing force becomes a predetermined value (or a value within a predetermined range).
如以上所述，根據本實施例中之黏貼裝置1，藉由使3個吸附手段20a~20c的各吸附部21個別地升降及擺動，使第2板狀構件200之姿勢成為既定的彎曲姿勢，因此能防止因提前附著而引起的氣泡之混入。 As described above, according to the pasting device 1 of the present embodiment, the respective adsorption portions 21 of the three adsorption means 20a to 20c are individually raised and lowered and oscillated, whereby the posture of the second plate member 200 is set to a predetermined bending posture. Therefore, it is possible to prevent the incorporation of air bubbles due to early adhesion.
此外，根據本實施例中之黏貼裝置1，並非如習知的黏貼裝置30般支撐第2板狀構件200的兩端部，而是利用3個吸附手段20a~20c 吸附保持第2板狀構件200的上面201，因此能確實地防止第2板狀構件200因自重而彎曲。 Further, according to the pasting device 1 of the present embodiment, the two end portions of the second plate member 200 are not supported as in the conventional bonding device 30, but three adsorption means 20a to 20c are used. Since the upper surface 201 of the second plate-shaped member 200 is adsorbed and held, it is possible to reliably prevent the second plate-shaped member 200 from being bent by its own weight.
進一步地，根據本實施例中之黏貼裝置1，由於一邊利用以使按壓力成為既定之值(或既定的範圍內之值)之方式而受到控制的黏貼輥10壓出氣泡一邊進行黏貼，因此儘管於大氣中進行黏貼，亦能防止第1板狀構件100與第2板狀構件200之間混入氣泡。 Further, according to the pasting device 1 of the present embodiment, the adhesive roller 10 that is controlled so that the pressing force becomes a predetermined value (or a value within a predetermined range) is adhered while pressing out the air bubbles. Even if it adheres in the atmosphere, it is possible to prevent air bubbles from being mixed between the first plate member 100 and the second plate member 200.
另外，本發明之黏貼裝置並非限定於上述黏貼裝置1。 Further, the sticking device of the present invention is not limited to the above-described sticking device 1.
例如，本發明之黏貼裝置，亦可如圖9所示之黏貼裝置1’所示，具備在黏貼方向隔著間隔排列的4個吸附手段20a~20d。第4吸附手段20d，係與吸附手段20a~20c同樣地包含吸附保持第2板狀構件200的吸附部21、在控制部4的控制下使吸附部21擺動的擺動部23、及在控制部4的控制下使吸附部21升降的升降部24。根據黏貼裝置1’，能使在實施例中之黏貼裝置1中無法充分防止彎曲的大型的第2板狀構件200不彎曲地黏貼。另外，吸附手段的數量亦能根據第2板狀構件200的尺寸而設為5個以上。 For example, the adhesive device of the present invention may have four adsorption means 20a to 20d arranged at intervals in the direction of adhesion as shown in the adhesive device 1' shown in Fig. 9. Similarly to the adsorption means 20a to 20c, the fourth adsorption means 20d includes the adsorption unit 21 that adsorbs and holds the second plate-shaped member 200, the swing portion 23 that swings the adsorption unit 21 under the control of the control unit 4, and the control unit. The lifting portion 24 that raises and lowers the adsorption portion 21 under the control of 4. According to the pasting device 1', the large second plate member 200 which cannot sufficiently prevent the bending in the bonding device 1 of the embodiment can be adhered without bending. Further, the number of adsorption means can be set to five or more depending on the size of the second plate member 200.
此外，本發明之黏貼裝置，亦可具有每個吸附手段中均不同的任意形狀的吸附部21。然而，若吸附面21a的面積變小而吸附噴嘴22的數量變少，則無法獲得充分的吸附保持力，因此需要注意。 Further, the sticking device of the present invention may have an adsorption portion 21 of any shape different in each of the adsorption means. However, if the area of the adsorption surface 21a is small and the number of adsorption nozzles 22 is small, sufficient adsorption holding force cannot be obtained, so care needs to be taken.
此外，本發明之黏貼裝置，亦可並不使黏貼輥10移行，而藉由使黏貼平台2及所有吸附手段20a~20c(20d)一同往與黏貼方向相反的方向移動，使黏貼輥10相對於第1板狀構件100及第2板狀構件200的相對位置變化、進行黏貼。 In addition, the adhesive device of the present invention may not move the adhesive roller 10, but the adhesive roller 10 and the all the adsorption means 20a-20c (20d) are moved together in the opposite direction to the adhesive direction, so that the adhesive roller 10 is relatively opposed. The relative positions of the first plate-shaped member 100 and the second plate-shaped member 200 are changed and adhered.
進一步地，本發明之黏貼裝置，亦可僅透過紫外線硬化樹脂及熱硬化樹脂中之任一者、或其他樹脂而將第2板狀構件200黏貼於第1板狀構件100。此外，樹脂之塗布圖案並不限定於圖4之例示者。 Further, in the pasting device of the present invention, the second plate member 200 may be adhered to the first plate member 100 only by any of the ultraviolet curable resin and the thermosetting resin or other resin. Further, the coating pattern of the resin is not limited to the example of FIG.
1‧‧‧黏貼裝置 1‧‧‧Adhesive device
2‧‧‧黏貼平台 2‧‧‧Adhesive platform
2a‧‧‧吸附面 2a‧‧‧Adsorption surface
3‧‧‧吸附噴嘴 3‧‧‧Adsorption nozzle
10‧‧‧黏貼輥 10‧‧‧Adhesive roller
11‧‧‧黏貼輥升降手段 11‧‧‧Adhesive roller lifting method
12‧‧‧黏貼輥移行手段 12‧‧‧Adhesive roller migration
13‧‧‧頂部框架 13‧‧‧Top frame
14‧‧‧前腳框架 14‧‧‧Front foot frame
15‧‧‧後腳框架 15‧‧‧Here foot frame
20a‧‧‧第1吸附手段 20a‧‧‧1st adsorption means
20b‧‧‧第2吸附手段 20b‧‧‧2nd adsorption means
20c‧‧‧第3吸附手段 20c‧‧‧3rd adsorption means
21‧‧‧吸附部 21‧‧‧Adsorption Department
21a‧‧‧吸附面 21a‧‧‧Adsorption surface
22‧‧‧吸附噴嘴 22‧‧‧Adsorption nozzle
23‧‧‧擺動部 23‧‧‧Swings
24‧‧‧升降部 24‧‧‧ Lifting Department
100‧‧‧第1板狀構件 100‧‧‧1st plate member
101‧‧‧上面 101‧‧‧Top
102‧‧‧下面 102‧‧‧ below
103‧‧‧樹脂 103‧‧‧Resin
R‧‧‧頂板 R‧‧‧ top board
F‧‧‧底板 F‧‧‧floor
Claims (7)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013097621A JP5339393B1 (en) | 2013-05-07 | 2013-05-07 | Pasting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201442876A TW201442876A (en) | 2014-11-16 |
| TWI605946B true TWI605946B (en) | 2017-11-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102126441A TWI605946B (en) | 2013-05-07 | 2013-07-24 | Adhesive device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5339393B1 (en) |
| KR (1) | KR102041439B1 (en) |
| TW (1) | TWI605946B (en) |
Families Citing this family (4)
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|---|---|---|---|---|
| KR101651327B1 (en) * | 2014-05-30 | 2016-08-25 | 엘지전자 주식회사 | Apparatus for attaching a panel |
| JP6121384B2 (en) * | 2014-11-11 | 2017-04-26 | 平田機工株式会社 | Manufacturing apparatus and manufacturing method |
| KR102300081B1 (en) * | 2015-04-27 | 2021-09-08 | 삼성디스플레이 주식회사 | Bonding appratus and method of manufacturing curved display device using the same |
| CN111816079B (en) * | 2020-07-24 | 2022-04-26 | 昆山国显光电有限公司 | Curved surface display screen laminating device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6016839A (en) * | 1983-07-05 | 1985-01-28 | Nippon Sheet Glass Co Ltd | Device for pressing laminated glass by roll |
| JP2000263734A (en) * | 1999-03-19 | 2000-09-26 | Casio Comput Co Ltd | Film substrate bonding apparatus |
| US20020192576A1 (en) * | 2000-10-12 | 2002-12-19 | Hideki Matsuoka | Method for forming color filter, method for forming light emitting element layer, method for manufacturing color display device comprising them, or color display device |
| JP4870046B2 (en) * | 2007-08-06 | 2012-02-08 | クライムプロダクツ株式会社 | Sheet glass bonding method and apparatus |
| JP4712886B2 (en) * | 2009-09-03 | 2011-06-29 | 株式会社Ｆｕｋ | Plate member bonding equipment |
| WO2012172603A1 (en) * | 2011-06-15 | 2012-12-20 | クライムプロダクツ株式会社 | Precision workpiece gluing device and precision workpiece gluing method |
-
2013
- 2013-05-07 JP JP2013097621A patent/JP5339393B1/en not_active Expired - Fee Related
- 2013-07-24 TW TW102126441A patent/TWI605946B/en not_active IP Right Cessation
- 2013-07-30 KR KR1020130090214A patent/KR102041439B1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| TW201442876A (en) | 2014-11-16 |
| KR20140132261A (en) | 2014-11-17 |
| JP5339393B1 (en) | 2013-11-13 |
| JP2014220071A (en) | 2014-11-20 |
| KR102041439B1 (en) | 2019-11-06 |
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