CN206650102U - A kind of LED light emission device and display device - Google Patents

Abstract

The utility model discloses a kind of LED light emission device and display device.LED light emission device includes substrate, LED chip and the lens being arranged on outside LED chip are provided with substrate, the support for positioning LED chip and lens is provided between LED chip and lens, lens are provided with the groove for accommodating support, support is provided with the cavity for accommodating LED chip, and the center line of LED chip and the center line of groove coincide.LED chip is arranged in the cavity of support, support is arranged in the groove of lens, so that the center line of LED chip and the center line of groove coincide, the problem of avoiding because producing deviation when being aligned between LED chip and lens, and causing the light of LED chip distributing deflection, hot spot uniformity reduce after lens.LED light emission device of the present utility model is simple in construction, the Surface Mount yield between LED chip and lens can be achieved, and then improve the uniformity of hot spot.

Description

A kind of LED light emission device and display device

Technical field

It the utility model is related to LED technology field, more particularly to a kind of LED light emission device and display device.

Background technology

With the lifting of LED power and luminous efficiency, the LED product that energy-conserving and environment-protective, response are fast, small volume, light efficiency are high is wide The fields such as the general backlight for being applied to display product and general illumination, and occupy the increasing market space, it is considered to be The optimal light source of new generation green energy conservation illumination.At the same time, it is also increasingly prominent the shortcomings that LED heat dissipation problem and method for packing Go out.To solve heat dissipation problem, occurring the packaged type using flip-chip at present, this mode does not need the techniques such as routing, Directly using equipment such as Reflow Soldering or eutectics, chip electrode is connected with substrate circuit by Reflow Soldering, then above chip Coat or paste layer of fluorescent powder layer.The LED of this processing procedure mode is referred to as exempting to encapsulate LED or wafer-level package LED.

Exempt to encapsulate LED and apply there are two big advantages when illuminating with cooperation secondary lens in backlight module：1st, light-emitting area is smaller, Approximate spot light, is easy to optics of lens to design；2nd, because CSP technology fluorescent powder coatings are uniform, so the macula lutea in Lens Design Phenomenon is very slight.But exactly because its light-emitting area is small, the precision of SMT labelling machines is extremely difficult to desired size, meeting at present LED and lens centre is caused to produce deviation, as shown in Figure 1.Such case may result in LED light be distributed after lens there occurs Serious deformation, cause hot spot uniformity seriously to reduce, influence the subjective effect of backlight module.In addition, as shown in Fig. 2 due to CSP is that five faces are luminous at present, and four side emittings can produce many veiling glares when designing secondary lens can influence subjective effect Fruit.

Utility model content

First purpose of the present utility model be to provide a kind of LED light emission device, and it is not only simple in structure, and can also realize Surface Mount yield between LED chip and lens, and then improve the uniformity of hot spot.

Second purpose of the present utility model be to provide a kind of display device for including above-mentioned LED light emission device, its It is not only simple in structure, can also realizes the Surface Mount yield between LED chip and lens, and then improve the uniformity of hot spot.

To use following technical scheme up to first purpose, the utility model：

A kind of LED light emission device, including substrate, LED chip is provided with substrate and is arranged on saturating outside LED chip Mirror, is provided with the support for positioning LED chip and lens between LED chip and lens, lens are provided with for accommodating support Groove, support is provided with the cavity for accommodating LED chip, and the center line of LED chip and the center line of groove coincide.

By the way that LED chip is arranged in the cavity of support, support is arranged at the technological means in the groove of lens, reaches The purpose that the center line of LED chip and the center line of groove coincide, avoid and produced when being aligned between LED chip and lens Deviation, and the problem of cause the light of LED chip distributing deflection, hot spot uniformity reduce after lens.

Wherein, the section of groove is circle, and the appearance profile of support is quadrangle, and four angles of support are interior with groove Side is inconsistent, i.e., the medial surface of the groove of lens can be directly clamped among on four angles of support, it is possible to achieve LED chip and thoroughly Accurate contraposition between mirror, avoid the deviation caused by contraposition is inaccurate.

Wherein, cavity is arranged at the middle part of support, and support is provided with vacancy section in the week side of boss of cavity.The setting of vacancy section, The intensity of support can be improved so that structure is relatively reliable.

Wherein, the medial surface of cavity is provided with the reflecting layer of the light for reflecting LED chip so that the light of LED chip Line is sent from top, can be eliminated because of the luminous influence to lens flare in four sides.

Wherein, the upper surface flush of the upper surface of LED chip and cavity, the upper surface of LED chip and the upper table of cavity Face is provided with phosphor powder layer or quanta point material layer.The light that LED chip is sent can send different colours with excitated fluorescent powder layer Coloured light.

Wherein, phosphor powder layer by spray, be deposited or mode for dispensing glue be coated on LED chip upper surface and cavity it is upper Surface.

Wherein, phosphor powder layer is yellow, red or green phosphor layer.

Wherein, LED chip is the blue chip or UV chip of inverted structure.

Wherein, support is that thermosetting plastics is molded or ceramic post sintering forms, and is fixed on by glue on substrate.

To use following technical scheme up to second purpose, the utility model：

A kind of display device, including above-mentioned LED light emission device.

The beneficial effects of the utility model：By the way that LED chip is arranged in the cavity of support, support is arranged at lens Technological means in groove, the purpose that the center line of the center line and groove that have reached LED chip coincides, avoids LED core Deviation is produced when being aligned between piece and lens, and causes the light of LED chip distributing deflection, hot spot uniformity drop after lens The problem of low.By setting the technological means in reflecting layer, reach so that the purpose that the light of LED chip is sent from top, can To eliminate because of the luminous influence to lens flare in four sides.LED light emission device of the present utility model is simple in construction, and LED core can be achieved Surface Mount yield between piece and lens, and then the uniformity of hot spot is improved, the cost of product is reduced, improves the product of product Matter.

Brief description of the drawings

Fig. 1 is the LED chip of prior art and the contraposition schematic diagram of lens.

Fig. 2 is the luminous structural representation in the side of LED chip four of prior art.

Fig. 3 is the upward view (no substrate) of the LED light emission device of the utility model embodiment.

Fig. 4 is the sectional view of the LED light emission device of the utility model embodiment.

Fig. 5 is the partial enlarged drawing at A in Fig. 4.

Fig. 6 is the LED chip of the utility model embodiment and the assembling schematic diagram of support.

Fig. 7 is the dimensional structure diagram of the support of the utility model embodiment.

Fig. 8 is the dimensional structure diagram in another direction of the support of the utility model embodiment.

Reference is as follows：

1- substrates；2-LED chips；3- lens；31- grooves；4- supports；41- cavitys；42- vacancy sections；5- phosphor powder layers.

Embodiment

With reference to Fig. 3 the technical solution of the utility model is further illustrated to Fig. 8 and by specific embodiment.

As shown in Figures 3 to 8, LED light emission device includes substrate 1, is provided with LED chip 2 on substrate 1 and is arranged on Lens 3 outside LED chip 2, the support 4 for positioning LED chip 2 and lens 3 is provided between LED chip 2 and lens 3, Lens 3 are provided with the groove 31 for accommodating support 4, and support 4 is provided with the cavity 41 for accommodating LED chip 2, LED chip 2 The center line of center line and groove 31 coincide.

By the way that LED chip 2 is arranged in the cavity 41 of support 4, support 4 is arranged at the technology in the groove 31 of lens 3 Means, the purpose that the center line of the center line and groove 31 that have reached LED chip 2 coincides, avoid LED chip 2 and lens 3 Between produce deviation when aligning, and cause what the light of LED chip 2 distributing deflection, hot spot uniformity after lens 3 reduced to ask Topic.

In the present embodiment, the section of groove 31 is circle, and the appearance profile of support 4 is quadrangle, and four angles of support 4 are equal Inconsistent with the medial surface of groove 31, i.e. the medial surface of the groove 31 of lens 3 can be directly clamped among on four angles of support 4, can To realize the accurate contraposition between LED chip 2 and lens 3, the deviation caused by contraposition is inaccurate is avoided.In other embodiment In, the appearance profile of support 4 can also be circle etc..

In the present embodiment, cavity 41 is arranged at the middle part of support 4, and support 4 is provided with vacancy section 42 in the week side of boss of cavity 41. The setting of vacancy section 42, the intensity of support 4 can be improved so that structure is relatively reliable.The medial surface of cavity 41, which is provided with, to be used for Reflect the reflecting layer (not shown) of the light of LED chip 2 so that the light of LED chip 2 is sent from top, can be eliminated because of four The luminous influence to the hot spot of lens 3 in side.

In the present embodiment, the upper surface of LED chip 2 and the upper surface flush of cavity 41, the upper surface of LED chip 2 and The upper surface of cavity 41 is provided with phosphor powder layer 5.The light that LED chip 2 is sent can send different colours with excitated fluorescent powder layer 5 Coloured light.In other embodiments, also quantum can be set in the upper surface of LED chip 2 and the upper surface of cavity 41 as needed Point material layer.

In the present embodiment, phosphor powder layer 5 be coated on by way of spraying LED chip 2 upper surface and cavity 41 it is upper Surface, phosphor powder layer 5 are green phosphor layer.In other embodiments, phosphor powder layer 5 can also pass through evaporation or side for dispensing glue Formula is coated on the upper surface of LED chip 2 and the upper surface of cavity 41, and phosphor powder layer 5 can also be yellow or Red phosphor layer.

In the present embodiment, LED chip 2 is the blue chip of inverted structure, and support 4 is molded for thermosetting plastics, and Fixed on substrate 1 by glue.In other embodiments, LED chip 2 can also be the UV chip of inverted structure, prop up Frame 4 can also form for ceramic post sintering, and be fixed on substrate 1 by glue.

The utility model embodiment also provides a kind of display device, including above-mentioned LED light emission device.

LED light emission device of the present utility model and display device, the center line of its LED chip 2 and the center line of groove 31 Coincide, avoid and produce deviation when being aligned between LED chip 2 and lens 3, and cause the light of LED chip 2 to pass through lens 3 The problem of distributing deflection, hot spot uniformity reduce afterwards；The light of LED chip 2 is sent from top, can be eliminated because of luminous pair of four sides The influence of the hot spot of lens 3.LED light emission device of the present utility model and display device, are not only simple in structure, and can also realize LED core Surface Mount yield between piece 2 and lens 3, and then the uniformity of hot spot is improved, the cost of product is reduced, improves the product of product Matter.

Above content is only preferred embodiment of the present utility model, for one of ordinary skill in the art, according to this reality With new thought, there will be changes, this specification content should not be construed as in specific embodiments and applications To limitation of the present utility model.

Claims (10)

1. a kind of LED light emission device, including substrate, it is characterised in that LED chip is provided with the substrate and is arranged on institute The lens outside LED chip are stated, are provided between the LED chip and the lens for positioning the LED chip and described The support of lens, the lens are provided with the groove for accommodating the support, and the support is provided with for accommodating the LED The cavity of chip, the center line of the center line of the LED chip and the groove coincide.

2. LED light emission device according to claim 1, it is characterised in that the section of the groove is circular, the support Appearance profile be quadrangle, four angles of the support are inconsistent with the medial surface of the groove.

3. LED light emission device according to claim 1, it is characterised in that the cavity is arranged at the middle part of the support, The support is provided with vacancy section in the week side of boss of the cavity.

4. LED light emission device according to claim 1, it is characterised in that the medial surface of the cavity is provided with for anti- Penetrate the reflecting layer of the light of the LED chip.

5. LED light emission device according to claim 1, it is characterised in that the upper surface of the LED chip and the cavity Upper surface flush, the upper surface of the upper surface of the LED chip and the cavity is provided with phosphor powder layer or quantum dot Material layer.

6. LED light emission device according to claim 5, it is characterised in that the phosphor powder layer is by spraying, being deposited or point The mode of glue is coated on the upper surface of the LED chip and the upper surface of the cavity.

7. LED light emission device according to claim 5, it is characterised in that the phosphor powder layer is yellow, red or green Phosphor powder layer.

8. LED light emission device according to claim 1, it is characterised in that the LED chip is the blue light core of inverted structure Piece or UV chip.

9. LED light emission device according to claim 1, it is characterised in that the support is molded for thermosetting plastics Or ceramic post sintering forms, and fixed on the substrate by glue.

10. a kind of display device, it is characterised in that including the LED light emission device as described in any one of claim 1 to 9.