CN206595278U

CN206595278U - C.S.P flip LED encapsulating structures with box dam

Info

Publication number: CN206595278U
Application number: CN201720120189.7U
Authority: CN
Inventors: 林书弘
Original assignee: Shenzhen City Branch Yixing Optoelectronic Technology Co Ltd
Current assignee: Shenzhen City Branch Yixing Optoelectronic Technology Co Ltd
Priority date: 2017-02-09
Filing date: 2017-02-09
Publication date: 2017-10-27
Anticipated expiration: 2027-02-09

Abstract

The utility model discloses a kind of C.S.P flip LED encapsulating structures with box dam, monomer is encapsulated including LED, LED encapsulation monomers include chip, printing opacity colloid, pad and light tight colloid, the flip-chip of LED encapsulation monomers is set, printing opacity colloid is coated with chip, chip bottom is connected with the pad of tool electrode, and pad all around covers light tight colloid and form box dam type into exposed state, printing opacity colloid.Using this structure, allow C.S.P flip-chips light extraction via encapsulation monomer surrounding box dam, light beam must be strengthened to concentrate on positive luminous (i.e. the straight of chip light-emitting is appeared), to reach diminution rising angle, enhancing one side goes out luminous intensity, and it is its purpose to directive property light source requirements to use and meet market.

Description

C.S.P flip LED encapsulating structures with box dam

Technical field

The utility model is related to light emitting diode (LED) encapsulation technology, is sealed especially for C.S.P flip-chips LED Fill the improvement carried out by the structure of monomer.

Background technology

In recent years, the phenomenon of global warming is increasingly serious, therefore, and carbon reduction has turned into countries in the world in recent years and advocated Subject under discussion, therefore so that the various environment-friendly products with carbon reduction are gradually taken seriously, and light emitting diode (LED) just accord with Close the main trend of world's energy-saving and emission-reduction.

The utility model is improved primarily directed to the LED structure of C.S.P wafer-level packages (Chip Scale Package), So-called wafer-level package is the packing colloid closely chip size of chip circumference cladding, general commercially available without substrate, without branch As shown in Figure 1, 2, the chip 10 of LED encapsulation monomers is set the LED of the C.S.P flip chip packaging structures of frame for upside-down mounting, in Printing opacity colloid 20 is coated with chip 10, bottom is exposed pad 30, and the LED of such a C.S.P flip chip packaging structures is Five faces light, and belong to floodlight type light source device component, are applied however, such a floodlight type LED can not meet market for flip LED The requirement of device one side light extraction, is to there is improved necessity.

Utility model content

This creation main purpose is to be to solve the light source produced by the LED encapsulation monomer structures of presently commercially available flip-chip Floodlight kenel and the problem of market is applied can not be met.

To achieve the above object, the technical solution adopted in the utility model is：A kind of C.S.P flip LEDs envelope with box dam Assembling structure, including LED encapsulation monomers, LED encapsulation monomers include chip, printing opacity colloid, pad and light tight colloid, the LED The flip-chip for encapsulating monomer is set, and is coated with printing opacity colloid on chip, and chip bottom is connected with the pad of tool electrode, pad into Exposed state, printing opacity colloid all around covers light tight colloid and forms box dam type.

Thereby after above-mentioned technical proposal, allow C.S.P flip-chips light extraction via encapsulation monomer surrounding box dam, must strengthen Light beam concentrates on front and lighted (i.e. the straight of chip light-emitting is appeared), to reach diminution rising angle, and enhancing one side goes out luminous intensity, by To meet market to directive property light source requirements as its purpose.

Brief description of the drawings

Fig. 1 is the LED encapsulation monomer structure schematic diagrames of the flip-chip of prior art.

Fig. 2 is the LED encapsulation monomer structure profiles of the flip-chip of prior art.

Fig. 3 is the LED encapsulation monomer structure schematic diagrames of flip-chip of the present utility model.

Fig. 4 is the LED encapsulation monomer structure profiles of flip-chip of the present utility model.

Fig. 5 A to 5H are the LED encapsulation monomer processing procedure schematic diagrames of the utility model flip-chip.

Wherein：10th, chip, 20, printing opacity colloid, 30, pad, 40, light tight colloid.

Embodiment

As shown in Figures 3 and 4, the utility model provides a kind of C.S.P flip LED encapsulating structures with box dam, is institute The wafer-level package (Chip Scale Package) of meaning, LED encapsulation monomer is mainly by chip 10, printing opacity colloid 20, weldering Disk 30 and light tight colloid 40 are constituted, and the chip 10 of LED encapsulation monomers is upside-down mounting setting, in being coated with printing opacity on chip 10 Colloid 20, the bottom of chip 10 is connected with the pad 30 of tool electrode, and makes pad 30 into exposed state, in printing opacity colloid 20 all around Cover light tight colloid 40 and form box dam type.Using this structure, allow C.S.P flip-chips light extraction via encapsulation monomer surrounding Box dam, must strengthen light beam and concentrate on positive luminous (i.e. the straight of chip light-emitting is appeared), to reach diminution rising angle, strengthen one side Go out luminous intensity, it is its purpose to directive property light source requirements to use and meet market.

Fig. 5 A to 5H are the LED encapsulation monomer processing procedure schematic diagrames of this creation flip-chip, and the 1st step is to prepare a plurality of moulds Tool A and top surface are formed a plurality of storage tank B2 mould B by protrusion barricade B1, and the 2nd step is to close mould A and mould B Mould, allows mould A to insert in mould B storage tank B2, and mould A and the peripheral wall surfaces of storage tank B2 tetra- is formed B3 between an interval trough, And fill in light tight colloid 40 in B3 between groove, third step be after the solidification of light tight colloid 40, by mould B depart from and now A transmission groove 401 is formed in the middle of light tight colloid 40, with the mould C for both changing flat board and with mould A matched moulds, allow mould C to close Mould A bottom surfaces, the 4th step is to install a chip 10 in the center of transmission groove 401 of each light tight colloid 40, and the 5th step is in each Filled in the transmission groove 401 of light tight colloid 40 step of printing opacity colloid the 20, the 6th be in printing opacity colloid 20 solidification after by mould A with Mould C is separated, and the 7th step is the mould D for having plurality of bump D1 using a bottom surface, in mould D and mould A matched moulds by mould Unit disengaging is formed on tool A, the C.S.P flip LEDs encapsulation monomer finished product with box dam is obtained after the completion of blanking.

Claims

1. a kind of C.S.P flip LED encapsulating structures with box dam, including LED encapsulation monomers, LED encapsulation monomers include chip, Printing opacity colloid, pad and light tight colloid, it is characterised in that the flip-chip of LED encapsulation monomers is set, and is coated with chip Printing opacity colloid, chip bottom is connected with the pad of tool electrode, and pad all around covers light tight colloid into exposed state, printing opacity colloid And form box dam type.