CN209374477U - A kind of novel more bowls - Google Patents
A kind of novel more bowls Download PDFInfo
- Publication number
- CN209374477U CN209374477U CN201721647704.3U CN201721647704U CN209374477U CN 209374477 U CN209374477 U CN 209374477U CN 201721647704 U CN201721647704 U CN 201721647704U CN 209374477 U CN209374477 U CN 209374477U
- Authority
- CN
- China
- Prior art keywords
- glue
- support plate
- led wafer
- box dam
- bowls
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003292 glue Substances 0.000 claims abstract description 48
- 230000005540 biological transmission Effects 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 238000004806 packaging method and process Methods 0.000 claims abstract description 11
- 230000005693 optoelectronics Effects 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000004033 plastic Substances 0.000 claims abstract description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 241000218202 Coptis Species 0.000 claims description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 230000001788 irregular Effects 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 9
- 238000005266 casting Methods 0.000 abstract description 3
- 230000002708 enhancing effect Effects 0.000 abstract description 3
- 244000185238 Lophostemon confertus Species 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 4
- 241001465805 Nymphalidae Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of novel more bowls, including support plate, bowl bracket, LED wafer, it is separated between each bowl bracket by the rectangular lattice on frame, plastic packaging glue is filled between rectangular lattice on the frame and corresponding bowl bracket gap, LED wafer is provided on the multiple support plate, the LED wafer is connect with support plate by metal wire, the LED wafer top surface is provided with opto-electronic receiver area, opto-electronic receiver area surrounding edge is provided with box dam glue, is filled with light transmission glue in the box dam glue.The utility model increases bowl quantity, hidden danger caused by single intensity of the connected enhancing of bowl prevents in wire bonding process is bad, improve packaging efficiency, later period application improvement patch material casting/drop off problem, several times of patch speed of promotion is to tens speeds, the brush box dam glue around photoelectric transfer sensillary area, using wafer process, technics comparing is simple, and the process-cycle is short, and processing cost is low.
Description
Technical field
The utility model relates to LED fields, particularly relate to a kind of novel more bowls.
Background technique
Existing bracket is single bowl, and single product small rack unstable production yield in wire bonding process is low, causes material
Material has welding hidden danger；Particle is small to be easy to appear exception in patch, and production efficiency is low.
Utility model content
The purpose of this utility model is to provide a kind of novel more bowls, to solve mentioned above in the background art ask
Topic.
To achieve the above object, the utility model provides the following technical solutions: a kind of novel more bowls, including support plate, bowl
Cup bracket, LED wafer are separated between each bowl bracket, the side on the frame by the rectangular lattice on frame
Plastic packaging glue is filled between shape lattice and corresponding bowl bracket gap, is provided with LED wafer on the multiple support plate, institute
It states LED wafer and is connect with support plate by metal wire, the LED wafer top surface is provided with opto-electronic receiver area, the opto-electronic receiver area
Surrounding edge is provided with box dam glue, is filled with light transmission glue in the box dam glue, the plastic packaging glue package LED wafer, metal wire and
Box dam glue, tin ball, ultraviolet radiator are integrally provided on support plate, and the multiple ultraviolet radiator is electrically connected support plate setting by tin ball
In each bowl frame bottom, each bowl frame bottom and light transmission glue upper surface are bonded.
Preferably, the box dam glue is concordant with light transmission glue height.
Preferably, the shape of the box dam glue is round or other irregular sealing structures.
Preferably, the material of the box dam glue and light transmission glue is epoxy resin.
Preferably, the metal wire is any one in gold thread, alloy wire and copper wire.
Preferably, the frame designs punching molding by hardware mould.
Compared with prior art, the beneficial effects of the utility model are as follows:
The utility model provides a kind of novel more bowls, increases bowl quantity, and single intensity of the connected enhancing of bowl prevents
Hidden danger caused by wire bonding process is bad, improves packaging efficiency, and later period application improvement patch material casting/drop off problem promotes patch
Several times of piece speed to tens speeds, the brush box dam glue around photoelectric transfer sensillary area, using wafer process, technics comparing is simple, adds
The work period is short, and processing cost is low.
Detailed description of the invention
Fig. 1 is a kind of novel more bowl structure top views.
Fig. 2 is a kind of cross-sectional view of novel more bowls.
In figure: 1- frame, 2- plastic packaging glue, 3- bowl bracket, 4- box dam glue, 5- metal wire, 6- tin ball, 7- light transmission glue, 8 purples
Outside line lamp, 9- opto-electronic receiver area, 10-LED chip, 11- support plate.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
The utility model provides a kind of technical solution referring to FIG. 1-2: a kind of novel more bowls, including support plate 11, bowl
Bracket 3, LED wafer 10 are separated between each bowl bracket 3 by the rectangular lattice on frame 1, on the frame 1
Rectangular lattice and corresponding 3 gap of bowl bracket between fill plastic packaging glue 2, be provided on the multiple support plate 11
LED wafer 10, the LED wafer 10 are connect with support plate 11 by metal wire 5, and 10 top surface of LED wafer is provided with photoelectricity and connects
Area 9 is received, 9 surrounding edge of opto-electronic receiver area is provided with box dam glue 4, is filled with light transmission glue 7, the modeling in the box dam glue 4
Sealing 2 is wrapped up LED wafer 10, metal wire 5 and box dam glue 4, tin ball 6, ultraviolet radiator 8 and is integrally provided on support plate 11, described more
A ultraviolet radiator 8 is electrically connected support plate 11 by tin ball 6 and is arranged at each 3 bottom of bowl bracket, each 3 bottom of bowl bracket
Portion and 7 upper surface of light transmission glue bond.The box dam glue 4 is concordant with 7 height of light transmission glue.The shape of the box dam glue 4 be it is round or
Other irregular sealing structures.The material of the box dam glue 4 and light transmission glue 7 is epoxy resin.The metal wire 5 is gold thread, closes
Any one in gold thread and copper wire.The frame 1 designs punching molding by hardware mould.
Embodiment: a kind of novel more bowls, by the design of hardware mould be punched into in requisition for more bowl disjunctor frames 1,
The more bowl brackets 3 of matched design, the plastic packaging glue 2 between more bowl brackets 3 and frame 1, which is connected, reinforces bowl intensity, according to demand
Increase monomer bowl quantity to improving production efficiency, the later period is using production efficiency when can improve patch, reduction material casting/drop off not
Good, hidden danger caused by single intensity of the connected enhancing of bowl prevents in wire bonding process is bad, improves packaging efficiency, light transmission glue 7 can
The white light of saturating LED wafer 10, opto-electronic receiver area 9 can also expose, and box dam glue 4 is formed by wafer scale technique, light transmission glue 7
It can also be formed by wafer scale technique, technics comparing is simple, and the process-cycle is short, and processing cost is low.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of novel more bowls, including support plate (11), bowl bracket (3), LED wafer (10), which is characterized in that described each
It is separated between bowl bracket (3) by the rectangular lattice on frame (1), rectangular lattice on the frame (1) and corresponding
Bowl bracket (3) gap between fill plastic packaging glue (2), be provided with LED wafer (10), institute on the multiple support plate (11)
It states LED wafer (10) and is connect with support plate (11) by metal wire (5), LED wafer (10) top surface is provided with opto-electronic receiver area
(9), opto-electronic receiver area (9) surrounding edge is provided with box dam glue (4), is filled with light transmission glue (7) in the box dam glue (4),
Plastic packaging glue (2) package LED wafer (10), metal wire (5) and box dam glue (4), tin ball (6), ultraviolet radiator (8) whole installation
On support plate (11), the multiple ultraviolet radiator (8) is electrically connected support plate (11) by tin ball (6) and is arranged in each bowl bracket
(3) bottom, each bowl bracket (3) bottom and light transmission glue (7) upper surface bond.
2. the novel more bowls of one kind according to claim 1, it is characterised in that: the box dam glue (4) and light transmission glue (7) are high
Degree is concordant.
3. the novel more bowls of one kind according to claim 1 or 2, it is characterised in that: the shape of the box dam glue (4) is circle
Shape or other irregular sealing structures.
4. the novel more bowls of one kind according to claim 1 or 2, it is characterised in that: the box dam glue (4) and light transmission glue
(7) material is epoxy resin.
5. the novel more bowls of one kind according to claim 1, it is characterised in that: the metal wire (5) is gold thread, alloy wire
With any one in copper wire.
6. the novel more bowls of one kind according to claim 1, it is characterised in that: the frame (1) is designed by hardware mould
Punching molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721647704.3U CN209374477U (en) | 2017-12-01 | 2017-12-01 | A kind of novel more bowls |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721647704.3U CN209374477U (en) | 2017-12-01 | 2017-12-01 | A kind of novel more bowls |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209374477U true CN209374477U (en) | 2019-09-10 |
Family
ID=67811122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721647704.3U Expired - Fee Related CN209374477U (en) | 2017-12-01 | 2017-12-01 | A kind of novel more bowls |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209374477U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113893361A (en) * | 2021-09-29 | 2022-01-07 | 宁波安芯美半导体有限公司 | UVC LED lamp and packaging method thereof |
-
2017
- 2017-12-01 CN CN201721647704.3U patent/CN209374477U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113893361A (en) * | 2021-09-29 | 2022-01-07 | 宁波安芯美半导体有限公司 | UVC LED lamp and packaging method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2009082177A3 (en) | Light emitting diode package | |
| KR20180015051A (en) | Novel LED Support Structure | |
| CN104064656A (en) | LED bracket with good moisture-proof performance, LED device and preparation method thereof | |
| CN209374477U (en) | A kind of novel more bowls | |
| CN203967120U (en) | A kind of LED support and LED device thereof with good humidity resistance | |
| CN103872219B (en) | A kind of LED package support and LED illuminator | |
| CN214956882U (en) | Double-color LED package | |
| CN209150142U (en) | A kind of die pressing type LED structure | |
| CN207558821U (en) | A kind of LED support with overflow ducts and overflow launder | |
| CN101976720B (en) | Light emitting diode (LED) and encapsulating method thereof | |
| CN204204900U (en) | A kind of LED encapsulation structure | |
| CN203746898U (en) | LED packaging body and illumination equipment | |
| CN107833960A (en) | A kind of LED support and its manufacture method with overflow ducts and overflow launder | |
| CN202094114U (en) | Enhancement type high-reliability anti-penetration lead frame | |
| CN203787455U (en) | LED packaging bracket and LED luminous body | |
| TW201442289A (en) | Light emitting diode and mounting structure therefor | |
| CN201663159U (en) | Strong coating adhesive type plastic package lead frame | |
| CN209929341U (en) | Anti-degumming solid crystal structure | |
| CN205828419U (en) | A kind of stereoscopic circuit board encapsulation module | |
| CN203250781U (en) | LED encapsulation structure | |
| CN208797039U (en) | A kind of LED package | |
| CN208767293U (en) | A kind of QFN lead frame piece | |
| CN203721761U (en) | High-reliability light-emitting diode bracket | |
| CN206490058U (en) | One kind exempts from box dam COB light source encapsulating structure | |
| CN205177880U (en) | LED of vertical stratification encapsulation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190910 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |