CN206541847U - Cooling LED support - Google Patents
Cooling LED support Download PDFInfo
- Publication number
- CN206541847U CN206541847U CN201720090039.6U CN201720090039U CN206541847U CN 206541847 U CN206541847 U CN 206541847U CN 201720090039 U CN201720090039 U CN 201720090039U CN 206541847 U CN206541847 U CN 206541847U
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- Prior art keywords
- conductive
- insulating base
- electric conduction
- led support
- conduction electrode
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Abstract
The utility model is related to a kind of cooling LED support, including an insulating base and the first electric conduction electrode-plate being installed in the insulating base, the second electric conduction electrode-plate, conductive radiator post, first electric conduction electrode-plate includes the first conductive pin and pad, first conductive pin is stretched out outside insulating base, and the pad is located in package cavity；Second electric conduction electrode-plate includes the second conductive pin and fixed disk, and second conductive pin is stretched out outside insulating base, and the fixed disk has a snap ring；The conductive radiator post includes chassis and the cylinder being integrally formed by chassis, and the bottom surface on the chassis exposes to the bottom of insulating base, and the cylinder is stretched into package cavity, is blocked cylinder periphery by the snap ring of the second electric conduction electrode-plate and is formed conductive contact；Thereby, it is connected using conductive radiator post with the second electric conduction electrode-plate by clamping mode, the stability of contact is effectively ensured, makes assembling easier, the encapsulation of single electrode chip or vertical chip can be achieved, radiating effect can be reached again.
Description
Technical field
The utility model is related to a kind of LED support, and single electrode chip or vertical chip encapsulation can be adapted to by referring in particular to one kind
Cooling LED support.
Background technology
Traditional heat-dissipating type LED support is general to be made up of insulating base, two electric conduction electrode-plates and radiating copper ingot, wherein in radiating
Copper ingot periphery is coated with an insulating barrier or installs an insulating sheath additional, radiating copper ingot is separated with two electric conduction electrode-plates, it is to avoid mutually electric
Property conducting, this LED support is suitable only for bipolar electrode chip and uses, and multiple bonding wire is needed during encapsulation, tedious process, and cost is high, and
Production capacity can not be improved, it is clear that be not suitable for current LED growth requirements.Single electrode chip application now is more and more wider, although it can be saved
Some bonding wire processes have been gone, but traditional single electrode chip encapsulation is difficult to solve heat dissipation problem again, and often there is loose contact
Phenomenon occurs, and causes LED finished products scintillation occur, is unfavorable for industry popularization.
Utility model content
The utility model is not enough present in above-mentioned prior art, and main purpose is to provide a kind of cooling LED support,
The encapsulation of single electrode chip or vertical chip can be adapted to, radiating effect is both can reach, formedness in electrical contact is can guarantee that again.
To realize above-mentioned purpose, the utility model is adopted the following technical scheme that：
A kind of cooling LED support, including an insulating base, the insulating base are formed with the package cavity of an opening；One first
Electric conduction electrode-plate, it is installed on insulating base, and first electric conduction electrode-plate includes the first conductive pin and drawn by first conduction
The pad that pin integrally extends, first conductive pin is stretched out outside insulating base, and the pad is located in package cavity；One second conductive electrode
Piece, it is installed on insulating base, and second electric conduction electrode-plate includes the second conductive pin and by second conductive pin one
The fixed disk of extension, second conductive pin is stretched out outside insulating base, and the fixed disk has a snap ring；And a conductive radiator
Post, the conductive radiator post includes chassis and the cylinder being integrally formed by chassis, and the bottom surface on the chassis exposes to insulating base
Bottom, the cylinder is stretched into package cavity, is blocked cylinder periphery by the snap ring of the second electric conduction electrode-plate and is formed conductive contact.
Further, the root outer rim of the cylinder has a bulge loop, and the snap ring is immobilizated in bulge loop outer rim.
Further, the snap ring is annulus or C-shaped ring.
Further, the fixed disk is provided with a through hole, and the through hole is exposed in package cavity, injects conductive along along the through hole
Elargol, is electrically connected the chassis upper surface of fixed disk and conductive radiator post.
Further, the fixed disk and pad formation difference of height, the pad are higher than fixed disk position.
Further, the cylinder apical margin has a recess for supplying chip placing.
Further, the conductive radiator post is copper material or aluminium.
Further, the chassis outer rim of the conductive radiator post has the step of clamping insulating base.
Further, first conductive pin is SMT legs or DIP legs.
The utility model has clear advantage and beneficial effect compared with prior art, specifically, is dissipated using conduction
Plume is connected with the second electric conduction electrode-plate by clamping mode, and the stability of contact is effectively ensured, makes assembling easier, can be achieved
Single electrode chip or vertical chip encapsulation, can reach radiating effect again.
Brief description of the drawings
Fig. 1 is the utility model three-dimensional appearance schematic diagram；
Fig. 2 is Fig. 1 schematic top plan view；
Fig. 3 is the utility model Local Members decomposing schematic representation；
Fig. 4 is Fig. 3 assembling schematic diagram；
Drawing reference numeral explanation：
10th, insulating base 11, package cavity
20th, the first electric conduction electrode-plate 21, the first conductive pin
22nd, pad 30, the second electric conduction electrode-plate
31st, the second conductive pin 32, fixed disk
321st, snap ring 322, through hole
40th, conductive radiator post 41, chassis
411st, step 42, cylinder
421st, bulge loop 422, recess.
Embodiment
The utility model is further described with embodiment below in conjunction with the accompanying drawings.
Refer to shown in Fig. 1 to Fig. 4, a kind of cooling LED support, including insulating base 10, the first electric conduction electrode-plate 20, second
Electric conduction electrode-plate 30, conductive radiator post 40, wherein：
The insulating base 10 can be made of resistant to elevated temperatures plastic material, and its color can select black or white, herein not
Plus limitation is given, the package cavity 11 of an opening is formed with the upper end of insulating base 10.
First electric conduction electrode-plate 20, it can be fixedly installed on insulating base 10 by injection molding manner, first conductive electrode
Piece 20 includes the first conductive pin 21 and the pad 22 by the one extension of the first conductive pin 21, first conductive pin 21
Stretch out outside insulating base 10, first conductive pin 21 is the first conductive pin in the present embodiment for SMT legs or DIP legs
21 be SMT legs, and the pad 22 is located in package cavity 11.
Second electric conduction electrode-plate 30, it is also to be fixedly installed in by injection molding manner on insulating base 10, second conduction
Pole piece 30 includes the second conductive pin 31 and the fixed disk 32 by the one extension of the second conductive pin 31, and second conduction is drawn
Pin 31 is stretched out outside insulating base 10, and second conductive pin 31 is that for SMT legs or DIP legs, second is conductive in the present embodiment
Pin 31 is SMT legs.The fixed disk 32 have a snap ring 321, the snap ring 321 can above annulus or C-shaped ring structure, herein not
Plus limitation is given, the present embodiment is toroidal.The fixed disk 32 is provided with a through hole 322 injected for conductive silver glue, the through hole
322 expose in package cavity 11, are easy to subsequently inject conductive silver glue into through hole 322.The fixed disk 32 is formed with pad 22
Difference of height, it is to avoid the two produces short circuit during processing procedure and short circuit condition occurs, the present embodiment system pad 22 is higher than fixed disk
32 position.
The conductive radiator post 40, it can be made of copper material or aluminium, it is ensured that preferably heat dispersion；The conductive radiator
Post 40 includes chassis 41 and the cylinder 42 being integrally formed by chassis 41, and the bottom surface on the chassis 41 exposes to the bottom of insulating base 10
Portion, the outer rim of chassis 41 has step 411, is easy to block insulating base 10, enable conductive radiator post 40 preferably with insulation
Pedestal 10 is fixed.The cylinder 42 is stretched into package cavity 11, and the periphery of cylinder 42 is blocked by the snap ring 321 of the second electric conduction electrode-plate 30
And conductive contact is formed, enable the second electric conduction electrode-plate 30 and the firm contact of conductive radiator post 40, it is ensured that the stabilization of electric connection
Property.To make snap ring 321 and cylinder 42 more preferably contact and automatic assembling can be adapted to, one can be set in the root outer rim of cylinder 42
Bulge loop 421, makes the upper end of cylinder 42 elongated, better ensures that cylinder 42 can pass through snap ring 321, and held by snap ring 321
In the outer rim of bulge loop 421.Cylinder 42 is provided with a recess 422, chip is preferably held using the recess 422（It is not shown）And
Ensure good contact.
The present embodiment assembling is as follows：First shaping has the first electric conduction electrode-plate 20, the material strip of the second electric conduction electrode-plate 30, then will lead
Electric thermal column 40 is installed on the snap ring 321 of the second electric conduction electrode-plate 30, and insulating base is formed finally by the mode of ejection formation
10.Packaging LED chips are that the chip is installed on into the apical margin of conductive radiator post 40, and its chips negative pole is conductive by bonding wire and first
The connection conducting of pad 22 of pole piece 20, chip positive pole is turned on conductive radiator post 40, because conductive radiator post 40 is led with second
Electrode slice 30 is connected, so that chip positive pole and the formation of the second electric conduction electrode-plate 30 are turned on, to be further ensured that conductive radiator post 40
With the second electric conduction electrode-plate 30 preferably conducting contact, it can be injected along along second electric conduction electrode-plate 30 in the through hole 322 of fixed disk 32
Conductive silver glue（It is not shown）, the chassis upper surface of fixed disk 32 and conductive radiator post 40 is further electrically connected.
The utility model designing points are：It is connected using conductive radiator post with the second electric conduction electrode-plate by clamping mode,
The stability of contact is effectively ensured, makes assembling easier, realizes single electrode chip or vertical chip encapsulation, radiating can be reached again
Effect.
It is described above, only it is the utility model preferred embodiment, not technical scope of the present utility model is appointed
What is limited, therefore every any trickle amendment, equivalent variations made according to technical spirit of the present utility model to above example
With modification, in the range of still falling within technical solutions of the utility model.
Claims (10)
1. a kind of cooling LED support, it is characterised in that：Including
One insulating base, the insulating base is formed with the package cavity of an opening；
One first electric conduction electrode-plate, it is installed on insulating base, and first electric conduction electrode-plate includes the first conductive pin and by this
The pad that first conductive pin integrally extends, first conductive pin is stretched out outside insulating base, and the pad is located in package cavity；
One second electric conduction electrode-plate, it is installed on insulating base, and second electric conduction electrode-plate includes the second conductive pin and by this
The fixed disk that second conductive pin integrally extends, second conductive pin is stretched out outside insulating base, and the fixed disk has a snap ring；
And
One conductive radiator post, the conductive radiator post is included outside chassis and the cylinder being integrally formed by chassis, the bottom surface on the chassis
The bottom of insulating base is exposed to, the cylinder is stretched into package cavity, is blocked cylinder periphery by the snap ring of the second electric conduction electrode-plate and formed
Conductive contact.
2. cooling LED support according to claim 1, it is characterised in that：The root outer rim of the cylinder has a bulge loop, institute
State snap ring and be immobilizated in bulge loop outer rim.
3. cooling LED support according to claim 1, it is characterised in that：The snap ring is annulus or C-shaped ring.
4. cooling LED support according to claim 1, it is characterised in that：The fixed disk is provided with a through hole, outside the through hole
It is exposed in package cavity, conductive silver glue is injected along along the through hole, fixed disk and the chassis upper surface of conductive radiator post is formed electrically
Connection.
5. cooling LED support according to claim 1, it is characterised in that：The fixed disk and pad formation difference of height.
6. cooling LED support according to claim 5, it is characterised in that：The pad is higher than fixed disk position.
7. cooling LED support according to claim 1, it is characterised in that：The cylinder apical margin has one for chip placing
Recess.
8. cooling LED support according to claim 1, it is characterised in that：The conductive radiator post is copper material or aluminium.
9. cooling LED support according to claim 1, it is characterised in that：The chassis outer rim of the conductive radiator post has card
Hold the step of insulating base.
10. cooling LED support according to claim 1, it is characterised in that：First conductive pin and the second conductive pin
For SMT legs or DIP legs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720090039.6U CN206541847U (en) | 2017-01-24 | 2017-01-24 | Cooling LED support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720090039.6U CN206541847U (en) | 2017-01-24 | 2017-01-24 | Cooling LED support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206541847U true CN206541847U (en) | 2017-10-03 |
Family
ID=59939714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720090039.6U Active CN206541847U (en) | 2017-01-24 | 2017-01-24 | Cooling LED support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206541847U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019095543A1 (en) * | 2017-11-20 | 2019-05-23 | 湖南粤港模科实业有限公司 | Package structure for led light source |
-
2017
- 2017-01-24 CN CN201720090039.6U patent/CN206541847U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019095543A1 (en) * | 2017-11-20 | 2019-05-23 | 湖南粤港模科实业有限公司 | Package structure for led light source |
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