CN206525081U - A kind of assistant reinforcement type water-cooling radiating structure - Google Patents
A kind of assistant reinforcement type water-cooling radiating structure Download PDFInfo
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- CN206525081U CN206525081U CN201720242495.8U CN201720242495U CN206525081U CN 206525081 U CN206525081 U CN 206525081U CN 201720242495 U CN201720242495 U CN 201720242495U CN 206525081 U CN206525081 U CN 206525081U
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- China
- Prior art keywords
- heat sink
- cover plate
- pipe joint
- liquid
- chip heat
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Abstract
The utility model discloses a kind of assistant reinforcement type water-cooling radiating structure, including chip heat sink cover plate, chip heat sink, refrigeration wafer, bottom plate cover plate and the bottom heat sink from top to bottom set gradually, during work, the liquid absorbed after heat is transported to the second radiator fan by the second liquid pump, the heat carried by the second radiator fan is dispersed into air, the partially liq is set to cool, the partially liq after cooling, which is back to the second liquid storage cylinder, to be continued to absorb the heat of bottom heat sink.Another part heat of bottom heat sink, by the effect of refrigeration wafer, pass to chip heat sink, and the liquid absorption in the first liquid storage cylinder, first radiator fan is transported to by the first liquid pump, the heat carried by the first radiator fan is dispersed into air, and this partially liq is cooled, and this partially liq after cooling, which is back to the first liquid storage cylinder, to be continued to absorb the heat of chip heat sink.The heat of thermal source can be made more to distribute in time, so as to improve radiating effect.
Description
Technical field
The utility model is related to a kind of heat sink technology field, particularly a kind of assistant reinforcement type water-cooling radiating structure.
Background technology
With the development of electronic technology, the performance of electronic equipment is improved rapidly, and the dissipated power of whole system also drastically increases
Greatly.The requirement of increase and the miniaturization of dissipated power causes heat dissipation problem to become increasingly conspicuous, and if this problem can not obtain compared with
Solve well, not only have influence on the performance of equipment, can also shorten equipment life.Research shows, in influence electronic installation reliability
Many factors in, radiate it is most important.Large power semiconductor device makees produced heat, can cause the liter of chip temperature
Height, if without appropriate cooling measure, it is possible to make the temperature of chip exceed allowed maximum junction temperature, so as to cause device
The deterioration of performance is so that damage, and the effect of existing water-cooling radiating structure cooling is poor, it is difficult to meet existing radiating requirements.
Utility model content
The utility model provides a kind of assistant reinforcement type water-cooling radiating structure, it is intended to improve radiating effect.
In order to solve the above-mentioned technical problem, the utility model proposes a kind of assistant reinforcement type water-cooling radiating structure, including by
Chip heat sink cover plate, chip heat sink, refrigeration wafer, bottom plate cover plate and the bottom heat sink of setting are up to stacked gradually down,
Wherein, chip heat sink cover plate and chip heat sink are fastened by the first fastening screw, and the bottom surface of chip heat sink cover plate and
The first liquid storage cylinder is defined between the top surface of chip heat sink, the top surface of chip heat sink cover plate, which is offered, leads to the first liquid storage cylinder
The first inlet and the first liquid outlet, the first inlet and the first liquid outlet is respectively equipped with the first pipe joint and the second pipe connects
Head, the first pipe joint is connected by the first connecting tube with the liquid outlet of the first radiator fan, and the second pipe joint passes through the first liquid pump
It is connected with the second connecting tube with the inlet of the first radiator fan, the chip heat sink passes through the second fastening screw and base plate cover
Plate is connected, and between the top surface that refrigeration wafer is closely against to the basal surface of chip heat sink and bottom plate cover plate, refrigeration wafer passes through
Wire external power supply, bottom plate cover plate is connected by the 3rd fastening screw and bottom heat sink, and the bottom surface of bottom plate cover plate and bottom radiating
Define the second liquid storage cylinder between the top surface of plate, the top surface of bottom plate cover plate offer the second inlet for leading to the second liquid storage cylinder and
Second liquid outlet, the second inlet and the second liquid outlet are respectively equipped with the 3rd pipe joint and the 4th pipe joint, and the 3rd pipe joint leads to
Cross the 3rd connecting tube to be connected with the liquid outlet of the second radiator fan, the 4th pipe joint passes through the second liquid pump and the 4th connecting tube and the
The inlet connection of two radiator fans, the bottom surface of bottom heat sink is contacted with thermal source.
During utility model works, the first liquid pump, the second liquid pump, the first radiator fan, the second radiator fan and refrigeration
Chip is run, and thermal source passes to the heat of bottom heat sink, partly the liquid in the second liquid storage cylinder（Such as water）After absorption, second
The liquid absorbed after heat is transported to the second radiator fan by liquid pump, and the heat carried by the second radiator fan is dispersed into sky
In gas, the partially liq is set to cool, the partially liq after cooling, which is back to the second liquid storage cylinder, to be continued to absorb the heat of bottom heat sink
Amount, and so repeat.And on the other hand, another part heat of bottom heat sink, by the effect of refrigeration wafer, passes to chip
After heat sink, and the liquid absorption in the first liquid storage cylinder, the liquid absorption heat of the first liquid storage cylinder, it is transported to by the first liquid pump
First radiator fan, the heat carried by the first radiator fan is dispersed into air, and this partially liq is cooled, cooling
This partially liq afterwards, which is back to the first liquid storage cylinder, to be continued to absorb the heat of chip heat sink, and is so repeated.Obviously, by this
Utility model, can be such that the heat of thermal source more distributes in time, so as to improve radiating effect, and improve making for electronic equipment
Use the life-span.
Brief description of the drawings
Fig. 1 is a kind of connection diagram of assistant reinforcement type water-cooling radiating structure of the utility model；
Fig. 2 is a kind of decomposing schematic representation of assistant reinforcement type water-cooling radiating structure of the utility model；
Fig. 3 is the water of radiation flow diagram of part on a kind of assistant reinforcement type water-cooling radiating structure of the utility model；
Fig. 4 is the water of radiation flow diagram of part under a kind of assistant reinforcement type water-cooling radiating structure of the utility model.
Embodiment
Preferred embodiment of the present utility model is illustrated below in conjunction with accompanying drawing, it will be appreciated that described herein excellent
Select embodiment to be merely to illustrate and explain the utility model, be not used to limit the utility model.
In the utility model embodiment, as shown in Figures 1 to 4, the assistant reinforcement type water-cooling radiating structure, including by up to
Under stack gradually chip heat sink cover plate 6, chip heat sink 8, refrigeration wafer 11, bottom plate cover plate 13 and the bottom heat sink of setting
14, wherein, chip heat sink cover plate 6 and chip heat sink 8 are fastened by the first fastening screw 5, and chip heat sink cover plate 6
The first liquid storage cylinder is defined between the top surface of bottom surface and chip heat sink 8, the top surface of chip heat sink cover plate 6, which is offered, leads to
The first inlet and the first liquid outlet of one liquid storage cylinder, the first inlet and the first liquid outlet are respectively equipped with the He of the first pipe joint 1
Second pipe joint 2, the first pipe joint 1 is connected by the first connecting tube 100 with the liquid outlet of the first radiator fan 200, the second pipe
Joint 2 is connected by the first liquid pump 300 and the second connecting tube 400 with the inlet of the first radiator fan 200, the chip radiating
Plate 8 is connected by the second fastening screw 9 and bottom plate cover plate 13, and refrigeration wafer 11 is closely against to the basal surface of chip heat sink 8
Between the top surface of bottom plate cover plate 13, refrigeration wafer 11 passes through the 3rd fastening screw by wire external power supply, bottom plate cover plate 13
12 are connected with bottom heat sink 14, and define the second liquid storage cylinder between the bottom surface of bottom plate cover plate 13 and the top surface of bottom heat sink 14,
The top surface of bottom plate cover plate 13 offers the second inlet and the second liquid outlet for leading to the second liquid storage cylinder, the second inlet and second
Liquid outlet is respectively equipped with the 3rd pipe joint 3 and the 4th pipe joint 4, and the 3rd pipe joint 3 passes through the 3rd connecting tube 500 and the second radiating
The liquid outlet connection of fan 600, the 4th pipe joint 4 passes through the second liquid pump 700 and the 4th connecting tube 800 and the second radiator fan
600 inlet connection, the bottom heat sink 14 is fixed tightly in the presumptive area of electronic equipment by Spring screwses 15, and bottom is radiated
The bottom surface of plate 14 and thermal source（Such as central processing unit (CPU) or graphics processor (GPU), not shown) contact.During work, the first liquid
Pump 300, the second liquid pump 700, the first radiator fan 200, the second radiator fan 600 and refrigeration wafer 11 are run, thermal source transmission
To the heat of bottom heat sink 14, the partly liquid in the second liquid storage cylinder（Such as water）After absorption, the second liquid pump 700 will absorb heat
Liquid after amount is transported to the second radiator fan 600, and the heat carried by the second radiator fan 600 is dispersed into air,
The partially liq is set to cool, the partially liq after cooling, which is back to the second liquid storage cylinder, to be continued to absorb the heat of bottom heat sink 14,
And so repeat.And on the other hand, another part heat of bottom heat sink 14, by the effect of refrigeration wafer, passes to chip
It is defeated by the first liquid pump 300 after heat sink 8, and the liquid absorption in the first liquid storage cylinder, the liquid absorption heat of the first liquid storage cylinder
The first radiator fan 200 is sent to, the heat carried by the first radiator fan 200 is dispersed into air, and makes this part liquid
Body cools, and this partially liq after cooling, which is back to the first liquid storage cylinder, to be continued to absorb the heat of chip heat sink 8, and is so weighed
It is multiple.Obviously, the utility model can be such that the heat of thermal source more distributes in time, so as to improve radiating effect, and improve electricity
The service life of sub- equipment.
It should be noted that refrigeration wafer 11 is prior art, and during its energization work, bottom surface refrigeration, top surface heating, so that
Bottom heat sink in a disguised form is conducted to the heat transfer of bottom plate cover plate to chip heat sink 8.
It is provided between the bottom surface of chip heat sink cover plate 6 and the top surface of chip heat sink 8 and encloses the first liquid storage cylinder in the inner
The first water proof ring 7, to prevent fluid seepage.
First inlet and the first pipe joint, the first liquid outlet and the second pipe joint, the second inlet and the 3rd pipe joint
And second the junction of liquid outlet and the 4th pipe joint be respectively equipped with the second water proof ring 10, to prevent fluid seepage, similarly,
Between bottom plate cover plate 13 and bottom heat sink 14 also must watertight processing, to prevent the fluid seepage in the second liquid storage cylinder.
Bottom plate cover plate 13 is made with chip heat sink cover plate 6 by high intensity, corrosion resistant metal material, is used with improving
Life-span.
Finally it should be noted that：Preferred embodiment of the present utility model is the foregoing is only, this is not limited to
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it can still modify to the technical scheme described in foregoing embodiments, or to which part technical characteristic
Carry out equivalent substitution.It is all it is of the present utility model spirit and principle within, any modification, equivalent substitution and improvements made etc.,
It should be included within protection domain of the present utility model.
Claims (4)
1. a kind of assistant reinforcement type water-cooling radiating structure, it is characterised in that：Chip including from top to bottom stacking gradually setting dissipates
Hot plate cover plate（6）, chip heat sink（8）, refrigeration wafer（11）, bottom plate cover plate（13）And bottom heat sink（14）, wherein, chip
Heat sink cover plate（6）With chip heat sink（8）Pass through the first fastening screw（5）Fasten, and chip heat sink cover plate（6）Bottom surface
With chip heat sink（8）Top surface between define the first liquid storage cylinder, chip heat sink cover plate（6）Top surface offer and lead to
The first inlet and the first liquid outlet of one liquid storage cylinder, the first inlet and the first liquid outlet are respectively equipped with the first pipe joint (1)
With the second pipe joint (2), the first pipe joint (1) is connected by the liquid outlet of the first connecting tube (100) and the first radiator fan (200)
Connect, the second pipe joint (2) passes through the first liquid pump (300) and the second connecting tube (400) and the inlet of the first radiator fan (200)
Connection, the chip heat sink（8）Pass through the second fastening screw（9）With bottom plate cover plate（13）It is connected, by refrigeration wafer（11）
It is closely against chip heat sink（8）Basal surface and bottom plate cover plate（13）Top surface between, refrigeration wafer（11）It is external by wire
Power supply, bottom plate cover plate（13）Pass through the 3rd fastening screw（12）With bottom heat sink（14）It is connected, and bottom plate cover plate（13）Bottom surface
With bottom heat sink（14）Top surface between define the second liquid storage cylinder, bottom plate cover plate（13）Top surface offer and lead to the second liquid storage
The second inlet and the second liquid outlet of chamber, the second inlet and the second liquid outlet are respectively equipped with the 3rd pipe joint（3）With the 4th
Pipe joint（4）, the 3rd pipe joint（3）Pass through the 3rd connecting tube（500）With the second radiator fan（600）Liquid outlet connection, the
Four pipe joints（4）Pass through the second liquid pump（700）With the 4th connecting tube（800）It is connected with the inlet of the second radiator fan, bottom dissipates
Hot plate（14）Bottom surface contacted with thermal source.
2. assistant reinforcement type water-cooling radiating structure according to claim 1, it is characterised in that：Chip heat sink cover plate（6）
Bottom surface and chip heat sink（8）Top surface between be provided with the first liquid storage cylinder enclosed into the first water proof ring in the inner（7）.
3. assistant reinforcement type water-cooling radiating structure according to claim 1, it is characterised in that：First inlet and the first pipe
Joint, the first liquid outlet and the second pipe joint, the second inlet and the 3rd pipe joint and the second liquid outlet and the 4th pipe joint
Junction be respectively equipped with the second water proof ring（10）.
4. assistant reinforcement type water-cooling radiating structure according to claim 1, it is characterised in that：The bottom plate cover plate（13）With
The chip heat sink cover plate（6）It is made by high intensity, corrosion resistant metal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720242495.8U CN206525081U (en) | 2017-03-14 | 2017-03-14 | A kind of assistant reinforcement type water-cooling radiating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720242495.8U CN206525081U (en) | 2017-03-14 | 2017-03-14 | A kind of assistant reinforcement type water-cooling radiating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206525081U true CN206525081U (en) | 2017-09-26 |
Family
ID=59902934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720242495.8U Expired - Fee Related CN206525081U (en) | 2017-03-14 | 2017-03-14 | A kind of assistant reinforcement type water-cooling radiating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206525081U (en) |
-
2017
- 2017-03-14 CN CN201720242495.8U patent/CN206525081U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170926 Termination date: 20190314 |
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| CF01 | Termination of patent right due to non-payment of annual fee |