CN206480625U - 一种rgbled结构 - Google Patents

一种rgbled结构 Download PDF

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Publication number
CN206480625U
CN206480625U CN201720202643.3U CN201720202643U CN206480625U CN 206480625 U CN206480625 U CN 206480625U CN 201720202643 U CN201720202643 U CN 201720202643U CN 206480625 U CN206480625 U CN 206480625U
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chip
utility
model
rgbled
wire
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CN201720202643.3U
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陈官海
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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Abstract

本实用新型公开了一种RGBLED结构,包括外壳、芯片、导线、胶水层、支架引脚、极柱和导电层；所述支架引脚插设在外壳的四角位置；所述芯片设置在外壳内，且芯片通过导线连接；所述极柱固定安装在导电层上，本实用新型，产品尺寸可以做到更小，产品的可靠性增强，成本降低且减少了污染。

Description

一种RGBLED结构
技术领域
本实用新型涉及RGB灯珠技术领域，具体涉及一种RGBLED结构。
背景技术
RGB灯珠是将红、绿、蓝三种芯片通过胶水粘接在支架上，（其中由于常用红光芯片单面只有单个极性，粘接它的胶水为导电胶，除了粘接，还可用于导电；而蓝、绿跟据应用场所及需求的变化，绝缘胶和导电胶均可能使用，然后通过引线连接芯片的电极与支架，最后在支架中注入胶水保护芯片及引线。
现有技术中，RGBLED结构存在以下不足：
1：生产周期长；
2：设备成本高；
3：产品小型化后成本较高；
4：支架的生产流程会产生电镀污染；
5：可靠性相对较差（造成灯珠失效的主要原因为焊线导致的不良）；
6：单个流程自动化程度非常高，但无法实现自动化连线。
因此，设计以一种结构简单，且降低成本减少污染的RGB灯珠是现有技术需要解决的技术问题。
发明内容
本实用新型的目的在于提供一种RGBLED结构，它产品尺寸可以做到更小，产品的可靠性增强，成本降低且减少了污染。
为实现上述目的，本实用新型提供如下技术方案：一种RGBLED结构,包括外壳、芯片、导线、胶水层、支架引脚、极柱和导电层；所述支架引脚插设在外壳的四角位置；所述芯片设置在外壳内，且芯片通过导线连接；所述极柱固定安装在导电层上。
进一步，所述导线共设有5根。
进一步，芯片包括两个半透明色芯片和一个棕色芯片。
与现有技术相比，本实用新型的有益效果是：本实用新型，产品尺寸可以做到更小，产品的可靠性增强，成本降低且减少了污染。
附图说明
图1为本实用新型的内部结构示意图；
图2为本实用新型的外部结构示意图；
图3为本实用新型的爆炸图。
具体实施方式
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本实用新型一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本实用新型保护的范围。
请参阅图1-3，本实用新型提供一种技术方案：一种RGBLED结构,包括外壳1、芯片2、导线3、胶水层4、支架引脚5、极柱6和导电层7；所述支架引脚5插设在外壳1的四角位置；所述芯片2设置在外壳1内，且芯片2通过导线3连接；所述极柱6固定安装在导电层7上。
进一步，所述导线3共设有5根。
进一步，芯片2包括两个半透明色芯片和一个棕色芯片。
作为本实用新型的进一步技术方案，所述的步骤一中，新增的用于红光芯片的底部与蓝、绿芯片同性电极的连接。
尽管已经示出和描述了本实用新型的实施例，对于本领域的普通技术人员而言，可以理解在不脱离本实用新型的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型，本实用新型的范围由所附权利要求及其等同物限定。

Claims (3)

1.一种RGBLED结构,包括外壳、芯片、导线、胶水层、支架引脚、极柱和导电层；所述支架引脚插设在外壳的四角位置；所述芯片设置在外壳内，且芯片通过导线连接；所述极柱固定安装在导电层上。
2.根据权利要求1所述的一种RGBLED结构，其特征在于：所述导线共设有5根。
3.根据权利要求1所述的一种RGBLED结构，其特征在于：芯片包括两个半透明色芯片和一个棕色芯片。
CN201720202643.3U 2017-03-03 2017-03-03 一种rgbled结构 Active CN206480625U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106684077A (zh) * 2017-03-03 2017-05-17 陈官海 一种rgbled结构及制备工艺

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106684077A (zh) * 2017-03-03 2017-05-17 陈官海 一种rgbled结构及制备工艺

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