CN206460975U

CN206460975U - A kind of LED encapsulation structure

Info

Publication number: CN206460975U
Application number: CN201720090180.6U
Authority: CN
Inventors: 高洋
Original assignee: BYD Co Ltd
Current assignee: BYD Semiconductor Co Ltd
Priority date: 2017-01-23
Filing date: 2017-01-23
Publication date: 2017-09-01
Anticipated expiration: 2027-01-23

Abstract

The utility model provides a kind of LED encapsulation structure, including substrate, LED chip, fluorescent film and encapsulated layer, the LED chip is set on the substrate, the fluorescent film is arranged on the LED chip surface, LED chip and substrate of the encapsulated layer covering with fluorescent film, the fluorescent film is regular shape, and the LED chip surface is provided with electrode, and the electrode is regular shape and is located at the fluorescent film side.The LED encapsulation structure, by fluorescent film and chip electrode that regular shape is set on LED chip surface, it is ensured that the uniformity of luminance of LED chip, it is to avoid impacted to the luminous intensity distribution of application end.

Description

A kind of LED encapsulation structure

Technical field

The utility model belongs to LED technology field, more particularly to a kind of LED encapsulation structure.

Background technology

LED product has been carried out scale of mass production, extensive utilization for normal lighting.Due to LED product be related to optics, Calorifics, electricity, mechanical multiple fields, causing also to run into during use many technical problems needs solution, and wherein LED lights face Color is uneven, uneven color hot spot is FAQs.As shown in figure 1, LED chip surface is provided with electrode, it is powered for connecting, The general electrode is located at two corners of LED chip so that the fluorescent film shape in LED chip is also irregular, is led Cause chip light emitting uneven, the luminous intensity distribution of application end is impacted, there is shade defect.The fluorescent film cutting of irregular shape simultaneously It is not easy, and because the position of electrode is in corner, causes to paste flourescent sheet difficulty on chip.

Utility model content

The utility model is solves one of above-mentioned technical problem there is provided a kind of LED encapsulation structure, and the LED encapsulation structure is adopted With the fluorescent film and chip electrode of regular shape, it is ensured that the uniformity of luminance of LED chip.

The utility model provides a kind of LED encapsulation structure, including substrate, LED chip, fluorescent film and encapsulated layer, the LED Chip is set on the substrate, and the fluorescent film is arranged on the LED chip surface, and the encapsulated layer covering has fluorescent film LED chip and substrate, the fluorescent film is regular shape, and the LED chip surface is provided with electrode, and the electrode is regular shape Shape and positioned at the fluorescent film side.

Further, the fluorescent film is rectangle, and the electrode is bar shaped and is located at the fluorescent film side.

Further, the electrode on the LED chip surface is connected by gold thread with the corresponding pad on substrate.

Further, the electrode for being arranged on LED chip surface is positive electrode or negative electrode.

Further, the electrode for being arranged on LED chip surface includes positive electrode and negative electrode.

Further, the electrode welding on the LED chip surface has many gold threads, and is connected with the corresponding pad on substrate Connect.

Further, in addition to positioned at the die bond layer of substrate surface, the LED chip is fixed on substrate by die bond layer On.

Further, the die bond layer is resin, elargol or tin cream.

Further, the encapsulated layer is resin.

Further, the substrate is ceramic substrate or metal substrate.

The LED encapsulation structure that the utility model is provided, by fluorescent film and core that regular shape is set on LED chip surface Plate electrode, it is ensured that the uniformity of luminance of LED chip, it is to avoid impacted to the luminous intensity distribution of application end.Moreover, regular shape is glimmering The processing cutting of light film is easy, in LED chip paste position it is less demanding, technique is simple, has saved cost.

Brief description of the drawings

Fig. 1 is the LED chip structure that prior art is provided；

Fig. 2 is the structural representation for the LED core chip package that the utility model embodiment is provided；

Fig. 3 is the top view for the LED core chip package that the utility model embodiment is provided.

Embodiment

Embodiment of the present utility model is described below in detail, the example of the embodiment is shown in the drawings.Below by The embodiment being described with reference to the drawings is exemplary, it is intended to for explaining the utility model, and it is not intended that new to this practicality The limitation of type.

In description of the present utility model, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width Degree ", " thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outer ", " suitable The orientation or position relationship of the instruction such as hour hands ", " counterclockwise ", " axial direction ", " radial direction ", " circumference " are based on orientation shown in the drawings Or position relationship, be for only for ease of description the utility model and simplify and describe, rather than indicate or imply signified device or Element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to limit of the present utility model System.

In addition, term " first ", " second " are only used for describing purpose, and it is not intended that indicating or implying relative importance Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or Implicitly include at least one this feature.In description of the present utility model, " multiple " are meant that at least two, such as two It is individual, three etc., unless otherwise specifically defined.

In the utility model, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " Gu It is fixed " etc. term should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integrally；Can be Mechanically connect or electrically connect or can communicate each other；Can be joined directly together, the indirect phase of intermediary can also be passed through Even, can be two element internals connection or two elements interaction relationship, unless otherwise clear and definite restriction.For this For the those of ordinary skill in field, concrete meaning of the above-mentioned term in the utility model can be understood as the case may be.

As shown in Figures 2 and 3, the utility model provides a kind of LED encapsulation structure, including substrate 10, LED chip 20, glimmering Light film 30 and encapsulated layer 40, the LED chip 20 are arranged on the substrate 10, and the fluorescent film 30 is arranged on the LED core The surface of piece 20, LED chip 20 and substrate 10 of the covering of encapsulated layer 40 with fluorescent film 30, the fluorescent film 30 is regular shape Shape, the surface of LED chip 20 is provided with electrode 50, and the electrode 50 is regular shape and is located at the side of fluorescent film 30.

In the utility model embodiment, the fluorescent film 30 and electrode 50 set on the surface of LED chip 20 is regular shape Shape, it is preferred that the fluorescent film 30 is rectangle, covers the light-emitting area of LED chip 20；The electrode 50 is bar shaped, positioned at described The side of the fluorescent film 30 of rectangle, and close to the edge of LED chip 20.

The LED chip 20 is vertical stratification, and the electrode 50 on LED chip surface can be positive electrode or negative electrode, and with Another corresponding electrode of LED chip surface electrode is located at LED chip bottom, when LED chip 20 is fixed on the substrate 10, with Corresponding pad 52 is electrically connected on substrate 10.The LED encapsulation structure that the utility model is provided also includes die bond layer 60, die bond layer 60 Positioned at the surface of substrate 10, the LED chip 20 is fixed on the substrate 10 by die bond layer 60.Die bond layer 60 be resin, elargol or The materials such as person's tin cream, so that LED chip can be fixed on substrate.

In another embodiment, LED chip 20 can be horizontal structure, the electrode on LED chip surface include positive electrode and Negative electrode, is the edge of bar shaped and close LED chip.

In the utility model embodiment, the electrode 50 on LED chip surface passes through gold thread 51 and the corresponding pad on substrate 52 connections, because the electrode 50 is bar shaped, can weld many gold threads 51, and weldering corresponding with substrate 10 on electrode 50 Disk 52 is connected, and can so reduce the risk of broken string, lifts the energization reliability of product.And the pad of traditional LED chip Positioned at corner, a gold thread can only be welded, easily broken string failure.

The encapsulated layer 40 of the LED encapsulation structure is resin, and the substrate 10 can be ceramic substrate or metal substrate.

A kind of preparation method of LED encapsulation structure is provided below according to above-mentioned LED encapsulation structure, is comprised the following steps：

Step S10 smears die bond material in base plate bottom, is then placed on LED chip 20 there is provided clean substrate 10 On substrate, make die bond material that LED chip is firmly fixed on substrate by heating.

Step S20, the pad 52 corresponding with substrate of strip electrode 50 on the surface of LED chip 20 is connected with gold thread 51, Many gold thread welding can be carried out.

S30, is placed on chip surface, by being heating and curing in the surface smear binding agent of LED chip 20, then by fluorescent film 30 Binding agent makes fluorescent film 30 be pasted onto chip surface.

S40, using injection or dispensing mode, resin is covered LED chip and substrate formation encapsulation with fluorescent film Layer 40, to protect the structures such as chip, fluorescent film and gold thread.

In summary, the LED encapsulation structure that the utility model is provided, by setting regular shape on LED chip surface Fluorescent film and chip electrode, it is ensured that the uniformity of luminance of LED chip, it is to avoid impacted to the luminous intensity distribution of application end.Moreover, rule Then the fluorescent film processing cutting of shape is easy, in LED chip paste position it is less demanding, technique is simple, has saved cost.

In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show The description of example " or " some examples " etc. means to combine specific features, structure, material or the spy that the embodiment or example are described Point is contained at least one embodiment of the present utility model or example.In this manual, to the schematic table of above-mentioned term State and be necessarily directed to identical embodiment or example.Moreover, specific features, structure, material or the feature of description can be with Combined in an appropriate manner in any one or more embodiments or example.In addition, in the case of not conflicting, this area Technical staff the not be the same as Example or the feature of example and non-be the same as Example or example described in this specification can be entered Row is combined and combined.

Although embodiment of the present utility model has been shown and described above, it is to be understood that above-described embodiment is Exemplary, it is impossible to it is interpreted as to limitation of the present utility model, one of ordinary skill in the art is in scope of the present utility model It is interior above-described embodiment to be changed, changed, replaced and modification.

Claims

1. a kind of LED encapsulation structure, including substrate, LED chip, fluorescent film and encapsulated layer, the LED chip are arranged on the base On plate, the fluorescent film is arranged on the LED chip surface, and the encapsulated layer covering has the LED chip and substrate of fluorescent film, Characterized in that, the fluorescent film be regular shape, the LED chip surface be provided with electrode, the electrode be regular shape and Positioned at the fluorescent film side.

2. LED encapsulation structure as claimed in claim 1, it is characterised in that the fluorescent film is rectangle, the electrode is bar shaped And positioned at the fluorescent film side.

3. LED encapsulation structure as claimed in claim 2, it is characterised in that the electrode on the LED chip surface by gold thread with Corresponding pad connection on substrate.

4. LED encapsulation structure as claimed in claim 2, it is characterised in that the electrode for being arranged on LED chip surface is just Electrode or negative electrode.

5. LED encapsulation structure as claimed in claim 2, it is characterised in that the electrode for being arranged on LED chip surface includes Positive electrode and negative electrode.

6. LED encapsulation structure as claimed in claim 3, it is characterised in that the electrode welding on the LED chip surface has many Gold thread, and be connected with the corresponding pad on substrate.

7. LED encapsulation structure as claimed in claim 1, it is characterised in that described also including the die bond layer positioned at substrate surface LED chip is fixed on substrate by die bond layer.

8. LED encapsulation structure as claimed in claim 7, it is characterised in that the die bond layer is resin, elargol or tin cream.

9. LED encapsulation structure as claimed in claim 1, it is characterised in that the encapsulated layer is resin.

10. LED encapsulation structure as claimed in claim 1, it is characterised in that the substrate is ceramic substrate or metal substrate.