CN206412377U - A kind of LED producing device - Google Patents
A kind of LED producing device Download PDFInfo
- Publication number
- CN206412377U CN206412377U CN201720020644.6U CN201720020644U CN206412377U CN 206412377 U CN206412377 U CN 206412377U CN 201720020644 U CN201720020644 U CN 201720020644U CN 206412377 U CN206412377 U CN 206412377U
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- CN
- China
- Prior art keywords
- component
- bonding wire
- producing device
- automatic
- line
- Prior art date
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- 238000012360 testing method Methods 0.000 claims abstract description 6
- 230000005540 biological transmission Effects 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 7
- 238000005259 measurement Methods 0.000 claims 1
- 239000007771 core particle Substances 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 29
- 230000002159 abnormal effect Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The utility model is related to a kind of LED producing device, at least include automatic bonding wire component and pick line component automatically, when carrying out routing and thrust test to wafer, coordinated by alignment system and mechanical arm, wafer passes sequentially through automatic bonding wire component and picks line component automatically, realize seek point location, bonding wire operation, thrust test function it is integrated, effectively reduce scratch or dirty exception in LED core particle manufacturing process.
Description
Technical field
The utility model is related to a kind of LED producing device, applies detection/monitoring field in LED chip.
Background technology
There are 2 processes to carry out electrode adhesiveness test in LED chip procedure for producing, one is front procedure temperature riddler
Wafer can be carried out after the completion of sequence（Chip）Routing.This process such as find film source exist routing power down pole, do not glue, pit-hole
It is abnormal, front procedure problem can be investigated in time, by abnormal piece numerical control system at least.And abnormal film source or Wafer pieces, so also
Preceding road can be arranged to do over again operation in time, improve electrode adhesiveness Hou Zaisonghou road operations；An also Ge Shihou roads sliver process
After the completion of can extract core particles carry out Chip routings, this process such as find film source exist routing power down pole, do not glue, pit-hole extremely
When, the abnormal piece number being related to will be a lot.Now film source has been Chip core particles, can not be done over again, can only by abnormal film source every
From downshifting or scrap processing.To accomplish the abnormal early processing of early discovery, the checking operation of Wafer routing links is just extremely important.
At present, carry out carrying out chip routing and pick line often through manual in the industry, there is that required operating personnel are more, efficiency
It is low, and weldering is wrong, is partially welded, scrapes and injure dirty etc. abnormal take place frequently.It is manually operated to also require that larger operating space.
The content of the invention
The purpose of this utility model is that the deficiency for overcoming prior art, can be abundant there is provided a kind of LED producing device
Using being integrated with automatic bonding wire component and picking the advantage of line component automatically, reduction production is abnormal, reduces the bad shadow of manual operation
Ring.
The utility model solves the technical scheme that its technical problem used：A kind of LED producing device, at least includes
Transmission assembly, identification and pick line component at positioning component, automatic bonding wire component automatically, by transmission assembly by chip in automatic bonding wire
Component picks the transmission of line inter-module with automatic, wherein automatic bonding wire component possesses the function that metal wire is broken to chip Top electrode, automatically
The function that line component possesses the metal wire and test thrust rejected on chip is picked, identification positioning component is transmission assembly, automatic welding
Line component and pick automatically each unit in line component movement, work there is provided positioning.
It is preferred that, the automatic bonding wire component and the automatic line component that picks all include identification load bearing unit and working cell.
It is preferred that, the working cell of the automatic bonding wire component is routing unit.
It is preferred that, the automatic working cell for picking line component includes push broach.
It is preferred that, the transmission assembly includes guide rail and mechanical arm.
It is preferred that, the routing unit includes soldering tip.
The beneficial effects of the utility model include：
The utility model is the making dress that a kind of automation is proposed based on traditional manual bonding wire and the work defect for picking line
Put, due to by bonding wire and picking the automatic board of line and be integrated together, reduce production cost, significantly reduce the abnormal hair of scratch
It is raw, and improve operating efficiency.
The utility model is described in further detail below in conjunction with drawings and Examples；But one kind of the present utility model
LED producing device is not limited to embodiment.
Brief description of the drawings
Fig. 1 is a kind of overall schematic of LED of the present utility model producing device.
Fig. 2 is routing of the present utility model, push away line schematic flow sheet.
It is designated in figure：1st, feed collet；2nd, magazine；3rd, guide rail；4th, automatic bonding wire component；41st, soldering tip；5th, positioning group is recognized
Part；6th, line component is picked automatically；61st, push broach.
Embodiment
Embodiment
Referring to Fig. 1 and Fig. 2, a kind of LED producing device of the present utility model, for carrying out routing and thrust inspection to chip
Survey, at least including transmission assembly, automatic bonding wire component 4, identification positioning component 5 and pick line component 6 automatically, will by transmission assembly
Chip picks transmission between line component 6 in automatic bonding wire component 4 with automatic, is beaten wherein automatic bonding wire component 4 possesses to chip Top electrode
The function of metal wire, picks the function that line component 6 possesses the metal wire and test thrust rejected on chip, recognizes positioning component automatically
5 be transmission assembly, automatic bonding wire component 4 and the automatic movement for picking each unit in line component 6, work provide positioning, identification positioning
Component 5 includes ccd scanner and data processor.
Automatic bonding wire component 4 and the automatic line component 6 that picks all include identification load bearing unit and working cell, and load bearing unit can be with
It is slide glass dish.The working cell of automatic bonding wire component 4 is routing unit, and routing unit includes soldering tip 41.Automatically line component 6 is picked
Working cell includes push broach 61.Transmission assembly can include guide rail 3 and mechanical arm.
Embodiment provides a kind of method of operation, LED wafer is put into feed collet 1 first, each feed collet 1 at least carries two panels
Wafer, feed collet 1 is put into magazine 2, and each magazine 2 can place multiple feed collets 1.Magazine 2 is placed on the utility model by operator
Charging window, afterwards the mechanical arm of the present embodiment first feed collet 1 is captured to guide rail 3 by the clamping jaw of mechanical arm, and will
First wafer of first feed collet 1 moves on to the operating position of automatic bonding wire component 4, and identification positioning component 5 searches wafer automatically
On index point complete positioning, after the completion of carrying out pointwise bonding wire, bonding wire to the electrode of the first wafer by routing unit, machinery
First wafer is moved back to feed collet 1 by arm, then the first wafer is transferred into the automatic operating position for picking line component 6, similar weldering
Line flow, by recognizing after the identification positioning of positioning component 5, rejected, led to by the bonding wire of 61 pair of first wafer of push broach
Thrust magnitude when bonding wire is rejected under overwriting.While the first wafer carries out picking Wiring technology, the second wafer repeats first
The bonding wire craft of wafer.First wafer is completed to pick after Wiring technology, and first feed collet 1 is transferred back to by transmission assembly, and the
Two wafers repeat the first wafer and pick Wiring technology, while the wafer of second in magazine 2 feed collet 1 starts to repeat first
The bonding wire craft of feed collet wafer.So as to make full use of board, the idle hours of workplace is reduced, board work effect is effectively improved
Rate.
Specifically, wafer routing, which picks line, can at least be divided into three kinds of technical schemes.The first technical scheme is to make piecewise
Industry, soldering tip 41 first treats that routing electrode carries out bonding wire operation to all on wafer, and wafer is transferred into the lower section of push broach 61 after finishing,
Carry out picking line to all bonding wires on wafer by push broach 61, survey thrust magnitude, operating efficiency is high piecewise.Second of technical scheme is electrode
Batch job, first to treating in certain area on wafer, routing electrode carries out bonding wire operation to soldering tip 41, shifts wafer after finishing
To the lower section of push broach 61, by push broach 61 in the wafer region, all bonding wires carry out picking line, survey thrust magnitude, then another to wafer again
The electrode in one region carries out routing and picks line, can targetedly complete routing, pick Wiring technology.The third technical scheme is made for by-line
Industry.It is divided into a weldering and two welderings per metal line, soldering tip 41 is moved to the next position again after first completing two solder joints of first line
Article 2 line is welded, line is picked while push broach 61 is moved to progress at the weldering and two welderings of first line and surveys thrust magnitude.So follow
Ring, completes all routing positions of full wafer wafer.
It is described above, only the utility model preferred embodiment, therefore the utility model implementation can not be limited according to this
Scope, i.e., the equivalent changes and modifications made according to the utility model the scope of the claims and description all should still belong to this practicality new
In the range of type covers.
Claims (6)
1. a kind of LED producing device, for carrying out routing and thrust measurement to chip, it is characterised in that：At least include transmission
Component, identification and pick line component at positioning component, automatic bonding wire component automatically, by transmission assembly by chip in automatic bonding wire component
The transmission of line inter-module is picked with automatic, wherein automatic bonding wire component possesses the function that metal wire is broken to chip Top electrode, line is picked automatically
Component possesses the function of the metal wire and test thrust rejected on chip, and identification positioning component is transmission assembly, automatic bonding wire group
Part and the action offer positioning for picking line component automatically.
2. a kind of LED according to claim 1 producing device, it is characterised in that：The automatic bonding wire component and automatic
Picking line component all includes identification load bearing unit and working cell.
3. a kind of LED according to claim 2 producing device, it is characterised in that：The work of the automatic bonding wire component
Unit is routing unit.
4. a kind of LED according to claim 2 producing device, it is characterised in that：The automatic work for picking line component
Unit includes push broach.
5. a kind of LED according to claim 1 producing device, it is characterised in that：The transmission assembly include guide rail and
Mechanical arm.
6. a kind of LED according to claim 3 producing device, it is characterised in that：The routing unit includes soldering tip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720020644.6U CN206412377U (en) | 2017-01-09 | 2017-01-09 | A kind of LED producing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720020644.6U CN206412377U (en) | 2017-01-09 | 2017-01-09 | A kind of LED producing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206412377U true CN206412377U (en) | 2017-08-15 |
Family
ID=59553996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720020644.6U Active CN206412377U (en) | 2017-01-09 | 2017-01-09 | A kind of LED producing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206412377U (en) |
-
2017
- 2017-01-09 CN CN201720020644.6U patent/CN206412377U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |