CN206322690U - Chip is shielded using the radiating of low temperature liquid metal coating - Google Patents
Chip is shielded using the radiating of low temperature liquid metal coating Download PDFInfo
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- CN206322690U CN206322690U CN201621321911.5U CN201621321911U CN206322690U CN 206322690 U CN206322690 U CN 206322690U CN 201621321911 U CN201621321911 U CN 201621321911U CN 206322690 U CN206322690 U CN 206322690U
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- chip
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- depression
- radiating
- metal coating
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Abstract
The utility model is related to electronic applications, and in particular to chip.Chip is shielded using the radiating of low temperature liquid metal coating, including IC chip, IC chip includes an encapsulating housing being made of plastics, the top of encapsulating housing is provided with the depression of opening upwards, liquid metal coating is filled with radiator window to be recessed as IC chip, depression, the thickness of liquid-metal layer is not less than 0.3mm, the depth of depression is more than the thickness of liquid-metal layer, and the depth of depression is not less than 0.5mm.The utility model, which optimizes traditional die, to be needed to rely on heat dissipating layer progress radiating and cooling, directly liquid-metal layer is filled on the encapsulating housing of IC chip, liquid metal is liquid, when needing to radiate to chip at high temperature (such as more than 40 degree), complete liquid conversion, the mobility of liquid, under upper and lower temperature difference effect, can produce convection current, thermal diffusivity is far longer than solid metallic, and metal level can also realize the function of electromagnetic shielding.
Description
Technical field
The utility model is related to electronic applications, and in particular to chip.
Background technology
Traditional electronic product generally requires to realize by the heat abstractor in electronic product packaging housing when in use
To electronic product radiating, such radiating not only increases the weight of electronic product, also increases manufacturing cost.
Electronic chip in electronic product of today does not have the effect for carrying heat abstractor.
Utility model content
The purpose of this utility model is there is provided chip is shielded using the radiating of low temperature liquid metal coating, with solution
The problem of face.
The technical problem that the utility model is solved can be realized using following technical scheme：
Chip, including an IC chip, the ic core are shielded using the radiating of low temperature liquid metal coating
Piece includes an encapsulating housing being made of plastics, it is characterised in that the top of the encapsulating housing is recessed provided with an opening upwards
Fall into, using the depression as the radiator window of IC chip, liquid metal coating be filled with the depression,
The thickness of the liquid-metal layer is not less than 0.3mm, and the depth of the depression is more than the thickness of the liquid-metal layer
Degree, the depth of the depression is not less than 0.5mm.
The utility model, which optimizes traditional die, to be needed to rely on heat dissipating layer progress radiating and cooling, directly fills out liquid-metal layer
Fill on the encapsulating housing of IC chip, liquid metal at high temperature (such as more than 40 degree), is liquid, needed to chip
When being radiated, liquid conversion is completed, the mobility of liquid under upper and lower temperature difference effect, can produce convection current, thermal diffusivity is much big
In solid metallic, and metal level can also realize the function of electromagnetic shielding.
A steel lid is stamped in the depression, the upper surface of the steel lid connects the radiating fin of at least three steels
Piece, using the radiating fin as radiator, the lower surface connection at least three of the steel lid is used to insert liquid metal
The plates of the steel of layer, heat exchanger is used as using the plates.
Plates are inserted liquid-metal layer and can realized by the utility model fully to be contacted with liquid-metal layer, is easy to lead
Heat, then realizes radiating by radiating fin.This patent is by the heat loss through convection of liquid metal, and the radiating that solid metallic is made
Device is combined, and both ensure that the heat exchange performance of liquid metal intensity, the sealing to liquid metal is realized again, it is ensured that circuit
Security.
The fusing point of the liquid-metal layer is not more than 60 °.The relatively low interface temperature that disclosure satisfy that thermal source and radiating element of fusing point
Degree, improves radiating effect.
The encapsulating housing is connected at least eight pins, the encapsulating housing and led provided with the outer wall with the encapsulating housing
At least eight logical through holes, one end of at least eight through hole is equipped with internal thread, one end of the pin be provided with it is described
The external screw thread that internal thread matches, the pin is detachably connected by internal thread with external screw thread with through hole.
The utility model can be applied to different environment by the pin being detachably connected, without re-replacing chip,
And helicitic texture can make the connection of stitch more firmly not easy to break.
The other end of at least eight through hole is provided with the communication interface of the IC chip.When pin is located at through hole
When interior, pin contacts connection with the communication interface, realizes the signal transmission of IC chip.
The spacing of two neighboring through hole is not less than 1mm.
The spacing that the utility model is limited between through hole can be easy to the insertion of pin.
The depth of the through hole is not less than 1.5cm.The firmness of pin can be improved.
The liquid-metal layer is the liquid-metal layer being made up of aluminum gallium alloy.
Liquid metal is liquid at high temperature (such as more than 40 degree), when needing to radiate to chip, completes liquid and turns
Change, the mobility of liquid, under upper and lower temperature difference effect, convection current can be produced, thermal diffusivity is far longer than solid metallic.
Brief description of the drawings
Fig. 1 is a kind of part-structure schematic diagram of the present utility model.
Embodiment
In order that technological means, creation characteristic, reached purpose and effect that the utility model is realized are easy to understand, under
Face, which combines to be specifically illustrating, is expanded on further the utility model.
Referring to Fig. 1, chip, including an IC chip 5, integrated electricity are shielded using the radiating of low temperature liquid metal coating
Road chip includes an encapsulating housing 1 being made of plastics, and the top of encapsulating housing is provided with the depression 2 of an opening upwards, to be recessed
As the radiator window of IC chip, liquid metal coating 3 is filled with depression, the thickness of liquid-metal layer is not less than
0.3mm, the depth of depression is more than the thickness of liquid-metal layer, and the depth of depression is not less than 0.5mm.The utility model optimizes biography
System chip is needed to rely on heat dissipating layer progress radiating and cooling, and liquid-metal layer is directly filled in the encapsulating housing of IC chip
On, liquid metal is liquid at high temperature (such as more than 40 degree), when needing to radiate to chip, completes liquid conversion, liquid
The mobility of state, under upper and lower temperature difference effect, can produce convection current, thermal diffusivity is far longer than solid metallic, and metal level also can
Realize the function of electromagnetic shielding.
A steel lid 8 is stamped in depression, the upper surface of steel lid connects the radiating fin 9 of at least three steels, with
Radiating fin is as radiator, and the lower surface connection at least three of steel lid is used for the sheet for inserting the steel of liquid-metal layer
Body 10, heat exchanger is used as using plates.The utility model can realize plates insertion liquid-metal layer and liquid-metal layer
Abundant contact, be easy to heat conduction, radiating then realized by radiating fin.This patent by the heat loss through convection of liquid metal, and
The radiator that solid metallic is made is combined, and both ensure that the heat exchange performance of liquid metal intensity, is realized again to liquid gold
The sealing of category, it is ensured that the security of circuit.Allow liquid metal produce above and below on the premise of convection current, also allow left and right or
Front and rear convection current, heat exchange is carried out beneficial to overall.Steel lid covers depression, realizes sealing.The utility model passes through steel lid
Avoid the dissolved corrosion of same phase metal.
The fusing point of liquid-metal layer is not more than 60 °.The relatively low interface temperature that disclosure satisfy that thermal source and radiating element of fusing point, is carried
High radiating effect.Encapsulating housing connects at least eight pins 6, and the interior outer wall conducting being provided with encapsulating housing of encapsulating housing is at least
Eight through holes 7, one end of at least eight through holes is equipped with internal thread, and one end of pin is provided with the outer spiral shell matched with internal thread
Line, pin is detachably connected by internal thread with external screw thread with through hole.The utility model can by the pin being detachably connected
Suitable for different environment, without re-replacing chip, and helicitic texture can make the connection of stitch more firmly not easily broken
Split.The other end of at least eight through holes is provided with the communication interface of IC chip.When pin is located in through hole, pin is with leading to
Believe interface contact connection, realize the signal transmission of IC chip.The spacing of two neighboring through hole is not less than 1mm.This reality
It can be easy to the insertion of pin with the new spacing limited between through hole.The depth of through hole is not less than 1.5cm.It can improve and draw
The firmness of pin.
General principle of the present utility model and principal character and advantage of the present utility model has been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the utility model is not restricted to the described embodiments, described in above-described embodiment and specification
Simply illustrate principle of the present utility model, on the premise of the utility model spirit and scope are not departed from, the utility model is also
Various changes and modifications are had, these changes and improvements are both fallen within the range of claimed the utility model.The utility model
Claimed scope is by appending claims and its equivalent thereof.
Claims (5)
1. using the radiating shielding chip of low temperature liquid metal coating, including an IC chip, the IC chip
Including an encapsulating housing being made of plastics, it is characterised in that the top of the encapsulating housing is provided with the depression of an opening upwards,
Using the depression as the radiator window of IC chip, liquid metal coating is filled with the depression,
The thickness of the liquid-metal layer is not less than 0.3mm, and the depth of the depression is more than the thickness of the liquid-metal layer, institute
The depth for stating depression is not less than 0.5mm.
2. the radiating shielding chip of use low temperature liquid metal coating according to claim 1, it is characterised in that：It is described recessed
A steel lid is stamped on falling into, the upper surface of the steel lid connects the radiating fin of at least three steels, with the radiating
Fin is as radiator, and the lower surface connection at least three of the steel lid is used for the sheet for inserting the steel of liquid-metal layer
Body, heat exchanger is used as using the plates.
3. the radiating shielding chip of use low temperature liquid metal coating according to claim 1, it is characterised in that：The liquid
The fusing point of state metal level is not more than 60 °.
4. the radiating shielding chip of use low temperature liquid metal coating according to claim 1, it is characterised in that：The envelope
Fill housing and connect to be provided with least eight pins, the encapsulating housing and lead to at least eight of the outer wall conducting of the encapsulating housing
Hole, one end of at least eight through hole is equipped with internal thread, and one end of the pin is provided with what is matched with the internal thread
External screw thread, the pin is detachably connected by internal thread with external screw thread with through hole.
5. the radiating shielding chip of use low temperature liquid metal coating according to claim 4, it is characterised in that：It is described extremely
The other end of few eight through holes is provided with the communication interface of the IC chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621321911.5U CN206322690U (en) | 2016-12-05 | 2016-12-05 | Chip is shielded using the radiating of low temperature liquid metal coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621321911.5U CN206322690U (en) | 2016-12-05 | 2016-12-05 | Chip is shielded using the radiating of low temperature liquid metal coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206322690U true CN206322690U (en) | 2017-07-11 |
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ID=59264585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621321911.5U Active CN206322690U (en) | 2016-12-05 | 2016-12-05 | Chip is shielded using the radiating of low temperature liquid metal coating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206322690U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109952011A (en) * | 2019-02-25 | 2019-06-28 | 中国科学院理化技术研究所 | Production method, electromagnetic shielding system and the chip detecting equipment of electromagnetic shielding system |
-
2016
- 2016-12-05 CN CN201621321911.5U patent/CN206322690U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109952011A (en) * | 2019-02-25 | 2019-06-28 | 中国科学院理化技术研究所 | Production method, electromagnetic shielding system and the chip detecting equipment of electromagnetic shielding system |
| CN109952011B (en) * | 2019-02-25 | 2020-07-14 | 中国科学院理化技术研究所 | Manufacturing method of electromagnetic shielding system, electromagnetic shielding system and chip detection equipment |
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