CN206314069U - A kind of high density interconnection build-up multilayer multi-layer sheet - Google Patents
A kind of high density interconnection build-up multilayer multi-layer sheet Download PDFInfo
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- CN206314069U CN206314069U CN201720007168.4U CN201720007168U CN206314069U CN 206314069 U CN206314069 U CN 206314069U CN 201720007168 U CN201720007168 U CN 201720007168U CN 206314069 U CN206314069 U CN 206314069U
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Abstract
The utility model is related to a kind of high density interconnection build-up multilayer multi-layer sheet,Including aluminium base,The aluminium base top and bottom is equipped with alumina ceramic plate,The alumina ceramic plate is provided with away from aluminium base side and is attached with intermediate layer,The intermediate layer is made up of some insulated ceramic plates with printed circuit board wiring,It is electrically connected with by buried via hole between the intermediate layer,The intermediate layer is provided with bus plane away from alumina ceramic plate side,Bus plane is provided with organic resin plate away from intermediate layer side,Organic resin plate top is provided with plug-in unit groove,By setting special bus plane and ground plane,In high-frequency circuit design,Power supply designs general better than with the form design of bus in the form of layer,Loop can always be walked along the minimum path of impedance,Bus plane is also that all generations on PCB and the signal for receiving provide a signal circuit,Signal circuit can be minimized,Reduce noise,Setting plug-in unit groove can efficiently separate the distance of electronic component.
Description
Technical field
The utility model is related to a kind of high density interconnection build-up multilayer multi-layer sheet, belongs to wiring board art.
Background technology
The printed circuit lines of printed substrate setting member hole and fixing hole and the various component holes of connection generally on plate body,
When using, corresponding various electronic components are inserted into solid welding in the component hole of printed substrate, form corresponding control electricity
Road, then printed substrate is fixed with fixing hole thereon with corresponding casing for electric appliances, form various electronic equipments, some electronics
Equipment complex circuit, be difficult on a sandwich circuit board distribution required for printed circuit lines, generally require multilayer circuit board carry out it is whole
Printed circuit lines between body configuration, but each layer generally all carry out corresponding connection on periphery, cause overall printing circuit
Layout is complicated, and electronic component distribution is chaotic, and wiring board is usually with some fairly simple fixing devices, sometimes because of
Location comparison is crowded, causes wiring board to produce substantial amounts of heat in use, and these heats can not be distributed in time, right
Certain damage can be caused in the smaller electronic device of some heat resistances, or even can be directly burned, it is continuous with technology
Development, wiring board is less and less, and electronic component is more and more intensive, accordingly, it would be desirable to further improve.
Utility model content
The technical problems to be solved in the utility model overcomes existing defect, there is provided a kind of high density interconnection build-up multilayer multilayer
Plate, by setting special bus plane and ground plane, in high-frequency circuit design, power supply designs general than with total in the form of layer
The form design of line will get well, and such loop can always be walked along the minimum path of impedance, additionally, bus plane is also own on PCB
The signal for producing and receiving provides a signal circuit, can so minimize signal circuit, so as to reduce noise, sets plug-in unit
Groove can efficiently separate the distance of electronic component, and not by the elements affect that temperature is higher when using, support protrusion is in circuit board
Can easily go to put when using, the density of wiring can be strengthened using intermediate layer, setting fin can be by the heat in wiring board
Amount sheds in time, in can effectively solving the problems, such as background technology.
In order to solve the above-mentioned technical problem, the utility model provides following technical scheme：
A kind of high density interconnection build-up multilayer multi-layer sheet, including aluminium base, the aluminium base top and bottom are equipped with aluminum oxide
Ceramic wafer, the alumina ceramic plate is provided with away from aluminium base side and is attached with intermediate layer, and the intermediate layer is printed by some bands
The insulated ceramic plates composition of brush wiring, is electrically connected between the intermediate layer by buried via hole, and the intermediate layer is away from oxidation
Aluminium ceramic wafer side is provided with bus plane, and the bus plane is provided with organic resin plate, the organic resin plate away from intermediate layer side
Top is provided with plug-in unit groove, and the plug-in unit groove intracavity bottom is provided with plug-in unit anode Interface Terminal and plug-in unit negative electrode Interface Terminal,
The intermediate layer is provided with ground plane away from alumina ceramic plate side, and the ground plane bottom is provided with fin.
Preferably, between the bus plane and intermediate layer, between the intermediate layer and ground plane electrically connected by blind hole
Connect.
Preferably, blue glue-line is scribbled between the ground plane and the fin.
Preferably, the ground plane bottom is formed around support protrusion, and the number of the support protrusion is provided with four.
Preferably, the plug-in unit anode Interface Terminal is electrically connected with plug-in unit negative electrode Interface Terminal with intermediate layer, described
Intermediate layer is electrically connected with bus plane, ground plane respectively, and it is defeated with wiring board that the bus plane side is additionally provided with plant-grid connection port
Go out end.
The utility model beneficial effect：By setting special bus plane and ground plane, in high-frequency circuit design, power supply
Design general better than with the form design of bus in the form of layer, such loop can always be walked along the minimum path of impedance,
Additionally, bus plane is also all generations on PCB and the signal for receiving provides a signal circuit, can so minimize signal and return
Road, so as to reduce noise, setting plug-in unit groove can efficiently separate the distance of electronic component, not by the unit that temperature is higher when using
Part is influenceed, and support protrusion can go to put easily when circuit board is used, and the density of wiring can be strengthened using intermediate layer, is set and is dissipated
Backing can in time shed the heat in wiring board, practical.
Brief description of the drawings
Accompanying drawing is used for providing being further understood to of the present utility model, and constitutes a part for specification, with this practicality
New embodiment is used to explain the utility model together, does not constitute to limitation of the present utility model.
Fig. 1 is a kind of high density interconnection build-up multilayer multi-layer sheet sectional view of the utility model.
Fig. 2 is a kind of high density interconnection build-up multilayer Multilayer Structure figure of the utility model.
Label in figure：1st, aluminium base；2nd, alumina ceramic plate；3rd, intermediate layer；4th, buried via hole；5th, bus plane；6th, organic resin
Plate；7th, plug-in unit groove；8th, plug-in unit anode Interface Terminal；9th, plug-in unit negative electrode Interface Terminal；10th, ground plane；11st, fin；12nd, it is blind
Hole；13rd, blue glue-line；14th, support protrusion；15th, plant-grid connection port；16th, wiring board output end.
Specific embodiment
Preferred embodiment of the present utility model is illustrated below in conjunction with accompanying drawing, it will be appreciated that described herein excellent
Select embodiment to be merely to illustrate and explain the utility model, be not used to limit the utility model.
As Figure 1-Figure 2, a kind of high density interconnection build-up multilayer multi-layer sheet, including aluminium base 1, the top of the aluminium base 1 with
Bottom is equipped with alumina ceramic plate 2, and the alumina ceramic plate 2 is provided with away from the side of aluminium base 1 and be attached with intermediate layer 3,
The intermediate layer 3 is made up of some insulated ceramic plates with printed circuit board wiring, electrical by buried via hole 4 between the intermediate layer 3
Connection, the intermediate layer 3 is provided with bus plane 5 away from the side of alumina ceramic plate 2, and the bus plane 5 sets away from the side of intermediate layer 3
There is organic resin plate 6, the top of the organic resin plate 6 is provided with plug-in unit groove 7, and the intracavity bottom of plug-in unit groove 7 is provided with plug-in unit
Anode Interface Terminal 8 and plug-in unit negative electrode Interface Terminal 9, the intermediate layer 3 is provided with ground plane away from the side of alumina ceramic plate 2
10, the bottom of the ground plane 10 is provided with fin 11.
Electrically connected by blind hole 12 between the bus plane 5 and intermediate layer 3, between the intermediate layer 3 and ground plane 10
Connect, by the filling conductive material in the blind hole 12, make to be electrically connected with each other between each layer, the ground plane 10 and the fin
Blue glue-line 13 is scribbled between 11, can effectively prevent circuit from welding the damage to wiring board, the ground plane 10 by blue glue-line 13
Bottom is formed around support protrusion 14, and the number of the support protrusion 14 is provided with four, convenient to circuit by support protrusion 14
Plate picking and placeing and supporting, and the plug-in unit anode Interface Terminal 8 is electrically connected with plug-in unit negative electrode Interface Terminal 9 with intermediate layer 3, institute
Intermediate layer 3 is stated to be electrically connected with bus plane 5, ground plane 10 respectively, the side of the bus plane 5 be additionally provided with plant-grid connection port 15 with
Wiring board output end 16, is switched on power by plant-grid connection port 15, is connected by wiring board output end 16 and loaded.
Utility model works principle：When needing to use the wiring board, beat easily and be placed on desktop, the energy of support protrusion 14
It is enough that wiring board is supported fixation well, different plug-in units such as resistance, electric capacity are placed in plug-in unit groove 7, due to
Resistance, electric capacity are connected by anode terminal and cathode terminal, and the corresponding plug-in unit anode being inserted into plug-in unit groove 7 connects
Mouth terminal 8 and plug-in unit negative electrode Interface Terminal 8, are now powered, and pass through by the plant-grid connection port 15 of bus plane 5
The connection load of wiring board output end 16, power supply designs general, such loop better than with the form design of bus in the form of layer
Can always be walked along the minimum path of impedance, additionally, bus plane 5 is also all generations on PCB and the signal for receiving provides one
Signal circuit, can so minimize signal circuit, so as to reduce noise, the heat in wiring board can be timely by fin 11
Shed.
It is above the utility model preferably implementation method, the utility model those skilled in the art can also be to upper
Implementation method is stated to be changed and changed, therefore, the utility model is not limited to above-mentioned specific embodiment, every ability
Field technique personnel made on the basis of the utility model it is any conspicuously improved, replace or modification belong to this practicality
New protection domain.
Claims (5)
1. a kind of high density interconnection build-up multilayer multi-layer sheet, including aluminium base (1), it is characterised in that aluminium base (1) top and bottom
Portion is equipped with alumina ceramic plate (2), and the alumina ceramic plate (2) is provided with away from aluminium base (1) side and is attached with centre
Layer (3), the intermediate layer (3) is made up of some insulated ceramic plates with printed circuit board wiring, passes through between the intermediate layer (3)
Buried via hole (4) is electrically connected with, and the intermediate layer (3) is provided with bus plane (5), the bus plane away from alumina ceramic plate (2) side
(5) organic resin plate (6) is provided with away from intermediate layer (3) side, organic resin plate (6) top is provided with plug-in unit groove (7), institute
State plug-in unit groove (7) intracavity bottom and be provided with plug-in unit anode Interface Terminal (8) and plug-in unit negative electrode Interface Terminal (9), the intermediate layer
(3) ground plane (10) is provided with away from alumina ceramic plate (2) side, ground plane (10) bottom is provided with fin (11).
2. a kind of high density interconnection build-up multilayer multi-layer sheet according to claim 1, it is characterised in that：The bus plane (5) is with
It is electrically connected with by blind hole (12) between interbed (3), between the intermediate layer (3) and ground plane (10).
3. a kind of high density interconnection build-up multilayer multi-layer sheet according to claim 1, it is characterised in that：The ground plane (10) and institute
State and scribble blue glue-line (13) between fin (11).
4. a kind of high density interconnection build-up multilayer multi-layer sheet according to claim 1, it is characterised in that：Ground plane (10) bottom
Support protrusion (14) is formed around, the number of the support protrusion (14) is provided with four.
5. a kind of high density interconnection build-up multilayer multi-layer sheet according to claim 1, it is characterised in that：The plug-in unit anode interface end
Sub (8) are electrically connected with plug-in unit negative electrode Interface Terminal (9) with intermediate layer (3), the intermediate layer (3) respectively with bus plane (5),
Ground plane (10) is electrically connected with, and bus plane (5) side is additionally provided with plant-grid connection port (15) and wiring board output end (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720007168.4U CN206314069U (en) | 2017-01-04 | 2017-01-04 | A kind of high density interconnection build-up multilayer multi-layer sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720007168.4U CN206314069U (en) | 2017-01-04 | 2017-01-04 | A kind of high density interconnection build-up multilayer multi-layer sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206314069U true CN206314069U (en) | 2017-07-07 |
Family
ID=59248657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720007168.4U Active CN206314069U (en) | 2017-01-04 | 2017-01-04 | A kind of high density interconnection build-up multilayer multi-layer sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206314069U (en) |
-
2017
- 2017-01-04 CN CN201720007168.4U patent/CN206314069U/en active Active
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