CN206225407U - 一种耐高温防死灯的led封装结构 - Google Patents

一种耐高温防死灯的led封装结构 Download PDF

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CN206225407U
CN206225407U CN201621388670.6U CN201621388670U CN206225407U CN 206225407 U CN206225407 U CN 206225407U CN 201621388670 U CN201621388670 U CN 201621388670U CN 206225407 U CN206225407 U CN 206225407U
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王容
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Dongguan Blue Photoelectric Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/85051—Forming additional members, e.g. for "wedge-on-ball", "ball-on-wedge", "ball-on-ball" connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/85951—Forming additional members, e.g. for reinforcing

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Abstract

一种耐高温防死灯的LED封装结构，本实用新型涉及LED封装技术领域；环氧树脂透镜的内部设有负极支架和正极支架，负极支架的底部设有负极引脚，且负极支架和负极引脚为一体式结构，正极支架的底部设有正极引脚，且正极支架和正极引脚为一体式结构，正极支架的上端设有LED支架灯杯，LED支架灯杯的中部设有LED芯片；所述的黄金导线的一端与LED芯片焊接连接，形成第一焊点，黄金导线的另一端与正极支架的上端面焊接连接，形成第二焊点；所述的第二焊点上焊接有金线球。其大大增强抗拉扯力，耐高温性能强，大大避免LED死灯现象的发生，实用性更强。

Description

一种耐高温防死灯的LED封装结构
技术领域
本实用新型涉及LED封装技术领域，具体涉及一种耐高温防死灯的LED封装结构。
背景技术
一般LED生产工艺中第二焊点处理是在LED支架导电极直接焊接导线，与LED芯片电极导通，如图1所示。此类方式生产的LED产品容易产生死灯现象，且死灯风险性很高(因为LED结构由支架、保护胶体、芯片、导线组成)，在LED应用端生产时需采用高温(260°以上)焊接或者结构变形处理，在此过程中LED保护胶体、支架受热胀原理影响，导致焊点与支架导电极脱离死灯，在LED变形弯曲加工程中，LED焊点同样受很强的外应力影响导致LED死灯，亟待改进。
实用新型内容
本实用新型的目的在于针对现有技术的缺陷和不足，提供一种结构简单，设计合理、使用方便的耐高温防死灯的LED封装结构，其大大增强抗拉扯力，耐高温性能强，大大避免LED死灯现象的发生，实用性更强。
为实现上述目的，本实用新型采用的技术方案是：它包含环氧树脂透镜、负极支架、正极支架、负极引脚、正极引脚、LED支架灯杯、LED芯片、黄金导线；环氧树脂透镜的内部设有负极支架和正极支架，负极支架的底部设有负极引脚，且负极支架和负极引脚为一体式结构，正极支架的底部设有正极引脚，且正极支架和正极引脚为一体式结构，正极支架的上端设有LED支架灯杯，LED支架灯杯的中部设有LED芯片；所述的黄金导线的一端与LED芯片焊接连接，形成第一焊点，黄金导线的另一端与正极支架的上端面焊接连接，形成第二焊点；所述的第二焊点上焊接有金线球。
进一步地，所述的金线球焊接在黄金导线的一端上部；其制作方法如下：基于一般正常工艺焊接LED导线之后，在第二焊点处加压一金线球压住第二焊点，可以增强抗拉扯力和耐温性能。
进一步地，所述的金线球焊接在黄金导线的一端与正极支架的上表面之间；其制作方法如下：基于一般正常工艺焊接LED导线之前，首先在正极支架的上表面焊接金线球，然后再将黄金导线焊接在金线球的上部，可以缓冲外部拉扯力，同时增加抗机械能力。
采用上述结构后，本实用新型有益效果为：本实用新型所述的一种耐高温防死灯的LED封装结构，其大大增强抗拉扯力，耐高温性能强，大大避免LED死灯现象的发生，实用性更强，本实用新型具有结构简单，设置合理，制作成本低等优点。
附图说明
为了更清楚地说明本实用新型实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本实用新型的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1是本实用新型的背景技术中第二焊点的结构示意图。
图2是本实用新型的结构示意图。
图3是本实用新型的俯视图。
图4是实施例一的第二焊点处的结构示意图。
图5是实施例二的第二焊点处的结构示意图。
附图标记说明：
环氧树脂透镜1、负极支架2、正极支架3、负极引脚4、正极引脚5、LED支架灯杯6、LED芯片7、黄金导线8、第一焊点9、第二焊点10、金线球11。
具体实施方式
下面结合附图对本实用新型作进一步的说明。
参看如图2-图3，本具体实施方式采用的技术方案是：它包含环氧树脂透镜1、负极支架2、正极支架3、负极引脚4、正极引脚5、LED支架灯杯6、LED芯片7、黄金导线8；环氧树脂透镜1的内部设有负极支架2和正极支架3，负极支架2的底部设有负极引脚4，且负极支架2和负极引脚4为一体式结构，正极支架3的底部设有正极引脚5，且正极支架3和正极引脚5为一体式结构，正极支架3的上端设有LED支架灯杯6，LED支架灯杯6的中部设有LED芯片7；所述的黄金导线8的一端与LED芯片7焊接连接，形成第一焊点9，黄金导线8的另一端与正极支架3的上端面焊接连接，形成第二焊点10；所述的第二焊点10上焊接有金线球11。
采用上述结构后，本实用新型有益效果为：本实用新型所述的一种耐高温防死灯的LED封装结构，其大大增强抗拉扯力，耐高温性能强，大大避免LED死灯现象的发生，实用性更强，本实用新型具有结构简单，设置合理，制作成本低等优点。
实施例一：
参看图4，本实施例中所述的金线球11焊接在黄金导线8的一端上部；其制作方法如下：基于一般正常工艺焊接LED导线之后，在第二焊点10处加压一金线球11压住第二焊点10，可以增强抗拉扯力和耐温性能。
实施例二：
参看图5，本实施例中所述的金线球11焊接在黄金导线8的一端与正极支架3的上表面之间；其制作方法如下：基于一般正常工艺焊接LED导线之前，首先在正极支架3的上表面焊接金线球11，然后再将黄金导线8焊接在金线球11的上部，可以缓冲外部拉扯力，同时增加抗机械能力。
以上所述，仅用以说明本实用新型的技术方案而非限制，本领域普通技术人员对本实用新型的技术方案所做的其它修改或者等同替换，只要不脱离本实用新型技术方案的精神和范围，均应涵盖在本实用新型的权利要求范围当中。

Claims (3)

1.一种耐高温防死灯的LED封装结构，它包含环氧树脂透镜、负极支架、正极支架、负极引脚、正极引脚、LED支架灯杯、LED芯片、黄金导线；环氧树脂透镜的内部设有负极支架和正极支架，负极支架的底部设有负极引脚，且负极支架和负极引脚为一体式结构，正极支架的底部设有正极引脚，且正极支架和正极引脚为一体式结构，正极支架的上端设有LED支架灯杯，LED支架灯杯的中部设有LED芯片；所述的黄金导线的一端与LED芯片焊接连接，形成第一焊点，黄金导线的另一端与正极支架的上端面焊接连接，形成第二焊点；其特征在于：所述的第二焊点上焊接有金线球。
2.根据权利要求1所述的一种耐高温防死灯的LED封装结构，其特征在于：所述的金线球焊接在黄金导线的一端上部。
3.根据权利要求1所述的一种耐高温防死灯的LED封装结构，其特征在于：所述的金线球焊接在黄金导线的一端与正极支架的上表面之间。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106449946A (zh) * 2016-12-18 2017-02-22 东莞市蓝晋光电有限公司 一种耐高温防死灯的led封装结构

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106449946A (zh) * 2016-12-18 2017-02-22 东莞市蓝晋光电有限公司 一种耐高温防死灯的led封装结构

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