CN206149585U - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN206149585U CN206149585U CN201621163068.2U CN201621163068U CN206149585U CN 206149585 U CN206149585 U CN 206149585U CN 201621163068 U CN201621163068 U CN 201621163068U CN 206149585 U CN206149585 U CN 206149585U
- Authority
- CN
- China
- Prior art keywords
- base material
- circuit board
- circuit
- implant
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The utility model discloses a circuit board, etching metallic circuit on substrate and substrate is equipped with the through -hole on the substrate, through -hole substrate bottom inside and that be located between two through -holes is equipped with conducting coating, and the conducting coating periphery is provided with the backplate layer, forms the space that holds conducting coating between backplate layer and the substrate, is full of the filler that has antioxidant function in the space, and the through -hole intussuseption is filled with this filler, and etching metallic circuit top is provided with the one deck and prevents the layer. The utility model discloses a circuit board makes the part inseparabler with the combination of this substrate, can not drop easily.
Description
Technical field
This utility model is related to electronic technology field, more particularly to a kind of circuit board.
Background technology
Industry takes much count of for the protection of part on circuit board, and major embodiment is in the following areas：One, prevent part leg oxygen
Change, increase part life；Two, soft board is combined with part even closer, make part not drop because external force is acted on.
Traditional circuit board is typically made by printing silver wire in substrate surface, prints the fraction defective of silver wire formation circuit very
Height, complex manufacturing, and made by circuit board waterproof ability it is poor, it is relatively costly；Meanwhile, traditional circuit board is by silver
Line circuit surface puts up a bridge to form wire jumper, is also easy to produce that the phenomenons such as short circuit and part leg are oxidized and part is easy to come off asks
Topic.
Utility model content
The technical problems to be solved in the utility model is to provide one kind can prevent part from coming off, and will not produce the phenomenons such as short circuit
Circuit board.
In order to solve above-mentioned technical problem, scheme of the present utility model is：
A kind of circuit board, including base material and the etching metallic circuit above base material, the base material is provided with multipair logical
Hole, the through hole inside and the base material bottom between two through hole are provided with conductive coating, the base material and the etch gold
Category circuit forms the closed-loop path of conducting, and the conductive coating periphery is provided with backplate layer, the backplate layer and the base material it
Between form the space for accommodating the conductive coating, full of the implant with anti-oxidation function, the implant in the space in
It is seamlessly connected between the base material, backplate layer, the base material, implant, backplate layer jointly completely wrap the conductive coating
Cover；The implant is filled with the through hole, the etching metallic circuit top is provided with one layer of welding resisting layer.
Further, the implant is resin or silica gel or ink solidification thing.
Further, the conductive coating is metal coating or carbon coating.
Further, the metal coating is aluminized coating or copper coating.
Further, the etching metallic circuit is etching copper foil circuit or etching aluminium foil circuit.
Further, the base material is hard substrate, and the hard substrate is glass, rubber, acrylic, plastics, glass
Fiber, fibre board or ceramic one or more of which mixing.
Compared with prior art, the beneficial effects of the utility model are：
Circuit board of the present utility model due to being provided with backplate layer in conductive coating periphery, and between backplate layer and base material
The implant of anti-oxidation function, and the implant and the base material, backplate layer are filled in the space of the receiving conductive coating of formation
Between formed be seamlessly connected so that the combination of part and the base material is even closer, will not drop easily.
The circuit that on printing on substrates silver wire road formed traditional using etching metal circuitry instead is arranged above base material,
And by drilling to base material, in through hole and base material bottom sets conductive coating, base material forms closed-loop path with etching metallic circuit,
Existing wire jumper is replaced with the closed-loop path of the conducting, production process is reduced, technology difficulty is reduced, production is significantly saved
Cost；Meanwhile, etching metallic circuit causes conducting wire compactly to concentrate on the metal layer, and circuit when reducing printing occurs not
Good probability.
Description of the drawings
Fig. 1 is the structural representation of the circuit board of this utility model embodiment；
Fig. 2 is the schematic diagram of the closed-loop path that base material is formed with etching metallic circuit in circuit board.
Specific embodiment
Specific embodiment of the present utility model is described further below in conjunction with the accompanying drawings.Here it should be noted that
For the explanation of these embodiments is used to help understand this utility model, but do not constitute to restriction of the present utility model.This
Outward, as long as technical characteristic involved in this utility model disclosed below each embodiment does not constitute each other conflict
Just can be mutually combined.
Fig. 1 Fig. 2 is refer to, wherein Fig. 2 is the signal of the closed-loop path that base material is formed with etching metallic circuit in circuit board
Figure, the direction of arrow is circuit turn-on direction in figure.Circuit board of the present utility model, including base material 1 and positioned at the top of base material 1
Etching metallic circuit 2, the base material 1 is provided with multipair through hole 3, and the inside of through hole 3 and the base material bottom between two through hole set
There is conductive coating 4, base material 1 forms the closed-loop path of conducting with etching metallic circuit 2（Circuit turn-on direction is as shown in Figure 2）.Lead
The periphery of electrocoat 4 is provided with backplate layer 5, and the space for accommodating conductive coating is formed between backplate layer 5 and base material 1, is full of in space
Implant with anti-oxidation function, is seamlessly connected between implant and base material 1, backplate layer 5.Base material 1, implant, backplate layer 5
Conductive coating 4 is coated completely jointly.Implant is also filled with through hole 3, implant is resin or silica gel or ink solidification thing.
The top of etching metallic circuit 2 is provided with one layer of welding resisting layer 6.
Circuit board of the present utility model due to being provided with backplate layer 5 in the periphery of conductive coating 4, and in backplate layer 5 and base material 1
Between in the space of receiving conductive coating that formed filling anti-oxidation function implant, and the implant and base material 1, backplate layer
Formed between 5 and be seamlessly connected so that the combination of part and the base material is even closer, will not drop easily.
In order to have good electric conductivity, conductive coating 4 is metal coating or carbon coating, and metal coating is aluminized coating or copper
Coating.
Etching metallic circuit 2 can be etching copper foil circuit, etching aluminium foil circuit or other etching metallic circuits.When from erosion
When carving aluminium foil circuit, can be in its surface addition welding resisting layer 6, when circuit is welded, fine the protects zero on circuit board
Part.And, compared with etching copper foil circuit, etching aluminium foil circuit can further reduces cost.
Base material 1 can be glass, rubber, acrylic, plastics, glass fibre, fibre board, ceramic one or more of which mixing
Or other hard substrates, by forming circuit board on different base materials, circuit board can be made to be widely used in every field.
To sum up, circuit board of the present utility model is in conductive coating periphery due to being provided with backplate layer, and in backplate layer and base
The implant of anti-oxidation function, and the implant and base material, backplate are filled in the space of the receiving conductive coating formed between material
Formed between layer and be seamlessly connected so that the combination of part and the base material is even closer, will not drop easily.
The circuit that on printing on substrates silver wire road formed traditional using etching metal circuitry instead is arranged above base material,
And by drilling to base material, in through hole and base material bottom sets conductive coating, base material forms closed-loop path with etching metallic circuit,
Existing wire jumper is replaced with the closed-loop path of the conducting, production process is reduced, technology difficulty is reduced, production is significantly saved
Cost；Meanwhile, etching metallic circuit causes conducting wire compactly to concentrate on the metal layer, and circuit when reducing printing occurs not
Good probability.
Embodiment of the present utility model is explained in detail above in association with accompanying drawing, but this utility model is not limited to be retouched
The embodiment stated.For a person skilled in the art, it is right in the case of without departing from this utility model principle and spirit
These embodiments carry out various changes, modification, replacement and modification, still fall within protection domain of the present utility model.
Claims (6)
1. a kind of circuit board, it is characterised in that：Etching metallic circuit including base material and above base material, sets on the base material
There is multipair through hole, the through hole inside and the base material bottom between two through hole are provided with conductive coating, the base material and institute
The closed-loop path that etching metallic circuit forms conducting is stated, the conductive coating periphery is provided with backplate layer, the backplate layer and institute
State and the space for accommodating the conductive coating is formed between base material, full of the implant with anti-oxidation function, institute in the space
State and be seamlessly connected between implant and the base material, backplate layer, the base material, implant, backplate layer are jointly by the conductive painting
Layer is coated completely；The implant is filled with the through hole, the etching metallic circuit top is provided with one layer of welding resisting layer.
2. circuit board according to claim 1, it is characterised in that：The implant is resin or silica gel or ink solidification
Thing.
3. circuit board according to claim 1, it is characterised in that：The conductive coating is metal coating or carbon coating.
4. circuit board according to claim 3, it is characterised in that：The metal coating is aluminized coating or copper coating.
5. circuit board according to claim 1, it is characterised in that：The etching metallic circuit is etching copper foil circuit or erosion
Carve aluminium foil circuit.
6. circuit board according to claim 1, it is characterised in that：The base material is hard substrate, and the hard substrate is
Glass, rubber, acrylic, plastics, glass fibre, fibre board or ceramic one or more of which mixing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621163068.2U CN206149585U (en) | 2016-11-01 | 2016-11-01 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621163068.2U CN206149585U (en) | 2016-11-01 | 2016-11-01 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206149585U true CN206149585U (en) | 2017-05-03 |
Family
ID=58622532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621163068.2U Expired - Fee Related CN206149585U (en) | 2016-11-01 | 2016-11-01 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206149585U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110831421A (en) * | 2019-11-14 | 2020-02-21 | 刘轶鸣 | Omnibearing conductive waterproof silica gel |
-
2016
- 2016-11-01 CN CN201621163068.2U patent/CN206149585U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110831421A (en) * | 2019-11-14 | 2020-02-21 | 刘轶鸣 | Omnibearing conductive waterproof silica gel |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170503 Termination date: 20201101 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |