CN109496065B - Impedance manufacturing method - Google Patents

Impedance manufacturing method Download PDF

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Publication number
CN109496065B
CN109496065B CN201811649406.7A CN201811649406A CN109496065B CN 109496065 B CN109496065 B CN 109496065B CN 201811649406 A CN201811649406 A CN 201811649406A CN 109496065 B CN109496065 B CN 109496065B
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impedance
sawtooth
line
tooth
width
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CN109496065A (en
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傅宝林
杜红兵
刘梦茹
纪成光
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Shengyi Electronics Co Ltd
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Shengyi Electronics Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09281—Layout details of a single conductor

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention relates to the technical field of circuit board production and discloses a manufacturing method of impedance. The manufacturing method of the impedance comprises the following steps: s1, providing a plurality of core boards, and manufacturing circuit patterns on the core boards; and S2, manufacturing sawtooth-shaped impedance lines with certain resistance values among the circuit patterns, wherein the resistance values of the sawtooth-shaped impedance lines are determined by the linear line widths of the sawtooth-shaped impedance lines, the tooth heights of the sawteeth and/or the tooth widths of the sawteeth. The manufacturing method of the impedance can meet the requirements of manufacturing of sawtooth type impedance lines of different types, has universality, analyzes the influence of the linear line width of the sawtooth type impedance line, the tooth height of the sawtooth and the tooth width of the sawtooth on the impedance value of the sawtooth type impedance line on the premise of not influencing the design of dense holes and dense lines, and makes a targeted and effective manufacturing method so that the sawtooth type impedance line meets the design requirements.

Description

Impedance manufacturing method
Technical Field
The invention relates to the technical field of circuit board production, in particular to a manufacturing method of impedance.
Background
Impedance is an important indicator in high speed PCB products, and conventional impedance designs are typically smooth single or differential lines. With the gradual development of electronic products into miniaturization, multifunction, high density and high integration, the smooth circuit design can not meet the development requirements of the products, and the saw-tooth circuit produced at this moment can greatly meet the design requirements. Meanwhile, the sawtooth impedance is greatly different from the common impedance, and the sawtooth impedance comprises impedance influence parameters, an impedance model and the like. In the prior art, different manufacturing methods are required for manufacturing different types of sawtooth-shaped impedances, and the universality is not high.
Disclosure of Invention
The invention aims to provide a manufacturing method of impedance, which can meet the requirements of manufacturing different types of sawtooth-shaped impedance and has universality.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method for manufacturing an impedance comprises the following steps:
s1, providing a plurality of core boards, and manufacturing circuit patterns on the core boards;
and S2, manufacturing sawtooth type impedance lines with certain resistance values among the circuit patterns, wherein the resistance values of the sawtooth type impedance lines are determined by the linear line widths of the sawtooth type impedance lines, the tooth heights of the sawteeth and/or the tooth widths of the sawteeth.
Specifically, the circuit patterns comprise bonding pads, signal holes, circuit diagrams and the like, and the sawtooth-shaped impedance lines are distributed among the circuit patterns, so that the impedance value of the sawtooth-shaped impedance lines is ensured to meet the requirement, and the design requirements of high density and high integration are also ensured. The manufacturing method has universality, can meet the manufacturing of the sawtooth type impedance lines of different types, and analyzes the influence of different parameters on the sawtooth type impedance lines on the premise of not influencing the design of dense holes and dense lines, so as to formulate a targeted and effective manufacturing method, and enable the sawtooth type impedance lines to meet the design requirements.
As a preferable technical solution, when setting the resistance value of the sawtooth-shaped impedance line, the linear line width of the sawtooth-shaped impedance line is adjusted first, the change of the linear line width changes the impedance value of the sawtooth-shaped impedance line, and the tooth height and/or the tooth width of the sawtooth is adjusted according to the change of the impedance value, so that the impedance value of the sawtooth-shaped impedance line is not changed.
Specifically, since the adjustment of the line width of the straight line needs to be within a given tolerance range, the line width of the sawtooth-type impedance line is preferentially adjusted, the adjustment of the line width of the straight line can increase or decrease the impedance value of the sawtooth-type impedance line, and the increased or decreased impedance value is compensated by adjusting the tooth height and/or the tooth width of the sawtooth, so that the impedance value of the sawtooth-type impedance line is ensured to be unchanged.
Preferably, the step S2 includes the following steps:
s21, if the gaps between the circuit patterns are large, reducing the linear line width of the sawtooth-shaped impedance line, and then adjusting the tooth height and/or the tooth width of the sawtooth-shaped impedance line to enable the impedance value of the sawtooth-shaped impedance line to be unchanged;
and S22, if the gaps between the circuit patterns are small, increasing the linear line width of the sawtooth-shaped impedance line, and then adjusting the tooth height and/or the tooth width of the sawtooth-shaped impedance line to enable the impedance value of the sawtooth-shaped impedance line to be unchanged.
Specifically, the sizes of the gaps between the circuit patterns are different, and the ways of adjusting the sawtooth-shaped impedance lines are different. Under the premise of ensuring high density and high integration, the sawtooth-shaped impedance line matched with the circuit pattern is manufactured according to the size of the circuit pattern, and the design has pertinence.
Preferably, the impedance change value affected by the adjustment of the line width of the straight line, the impedance change value affected by the adjustment of the tooth height of the saw tooth, and the impedance change value affected by the adjustment of the tooth width of the saw tooth are different for different core boards.
Specifically, the adjustment of the line width of the straight line, the adjustment of the height of the saw tooth, and the adjustment of the width of the saw tooth all affect the impedance value of the saw-tooth type impedance line. Under the condition of ensuring that the whole impedance value is not changed, the line width of a straight line, the tooth height and the tooth width of the sawtooth are accurately adjusted, and the sawtooth type impedance line is effectively manufactured.
As a preferred technical scheme, the linear line width is set to be X1The impedance value is Y, then the line width of the straight line is X1The function relation between the impedance value Y and the impedance value Y is that Y is aX1And + b, a takes the value of-1 to-6, and b takes the value of 32 to 80.
Specifically, taking one of the core boards as an example, a takes the value-4.1449, b takes the value 65.445, and Y takes the value-4.1449X1+65.445. When the line width of the straight line changes by 1mil, the impedance value of the sawtooth-shaped impedance line changes by about 4 omega. The linear line width is increased by 1mil, the impedance value is reduced by about 4 omega, the linear line width is reduced by 1mil, and the impedance value is increased by about 4 omega.
Preferably, the tooth height of the saw teeth is set to X2Then tooth height X2The function relation between the impedance value Y and the impedance value Y is that Y is mX2And n, m ranges from-1 to-6, and n ranges from 32 to 80.
Specifically, for the same core plate, m takes the value of-3.0036, and n takes the value of 60.879，Y＝-3.0036X2+60.879. The impedance value of the sawtooth-shaped impedance line changes by about 3 omega every time the height of the sawtooth changes by 1 mil. The height of the sawtooth is increased by 1mil, the impedance value is reduced by about 3 omega, the height of the sawtooth is reduced by 1mil, and the impedance value is increased by about 3 omega.
Preferably, the width of the saw teeth is set to X3Then tooth width X3The function relation between the impedance value Y and the impedance value is that Y is pX3And q, p ranges from-1 to-6, and q ranges from 32 to 80.
Specifically, for the same core plate, p takes the value of-2.0114, q takes the value of 65.891, and Y takes the value of-2.0114X3+65.891. The impedance value of the sawtooth-shaped impedance line changes by about 2 omega every time the size of the tooth width of the sawtooth changes by 1 mil. The width of the sawtooth is increased by 1mil, the resistance value is reduced by about 2 omega, the height of the sawtooth is reduced by 1mil, and the resistance value is increased by about 2 omega.
The coefficients a, b, m, n, p and q of the above functional relationships can all be determined experimentally.
As a preferred technical solution, the impedance value of the sawtooth-shaped impedance line is determined according to a dielectric thickness and/or a dielectric constant and/or a copper thickness and/or a surface treatment process of the core board.
As a preferable technical solution, after the step S2, the method further includes: step S3: and overlapping a plurality of the core plates, pressing the core plates to form a mother plate, and drilling and copper deposition electroplating on the mother plate.
As a preferable technical solution, after the step S3, the method further includes: step S4: and manufacturing the sawtooth-shaped impedance line on the outer layer graph of the motherboard, and then carrying out surface treatment on the motherboard to form the PCB.
The invention has the beneficial effects that: the manufacturing method of the impedance can meet the requirements of manufacturing of sawtooth type impedance lines of different types, has universality, analyzes the influence of the linear line width of the sawtooth type impedance line, the tooth height of the sawtooth and the tooth width of the sawtooth on the impedance value of the sawtooth type impedance line on the premise of not influencing the design of dense holes and dense lines, and makes a targeted and effective manufacturing method so that the sawtooth type impedance line meets the design requirements.
Drawings
FIG. 1 is a flow chart of the main steps of a method for manufacturing an impedance according to an embodiment of the present invention;
FIG. 2 is a flow chart illustrating the detailed steps of a method for manufacturing an impedance according to an embodiment of the present invention;
FIG. 3 is a linear relationship diagram of the line width and the impedance value of the sawtooth-shaped impedance line according to the embodiment of the present invention;
FIG. 4 is a graph of the linear relationship between the height of the saw tooth of the saw-tooth-shaped impedance line and the impedance line according to the embodiment of the present invention;
FIG. 5 is a graph of the linear relationship between the tooth width of the sawtooth-shaped impedance line and the impedance line according to the embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a sawtooth impedance line formed for a large circuit pattern according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a saw-tooth-shaped impedance line manufactured for a small circuit pattern according to an embodiment of the present invention.
In the figure:
1. an impedance line; 11. a straight line; 12. saw teeth; 2. and (6) a circuit pattern.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the elements associated with the present invention are shown in the drawings.
As shown in fig. 1, the present embodiment provides a method for manufacturing an impedance, including the following steps:
s1, providing a plurality of core boards, and manufacturing a circuit pattern 2 on each core board;
s2, manufacturing sawtooth type impedance lines 1 with certain resistance values among the circuit patterns 2, wherein the resistance values of the sawtooth type impedance lines 1 are determined by the line width of straight lines 11 of the sawtooth type impedance lines 1, the tooth height of sawteeth 12 and/or the tooth width of the sawteeth 12.
The sawtooth 12 described in this embodiment may be rectangular, trapezoidal, or triangular, the tooth height of the sawtooth 12 is the height of the rectangle, trapezoid, or triangle, and the tooth width of the sawtooth 12 is the width of the rectangle, the bottom width of the trapezoid, or the bottom width of the triangle.
The sawtooth-shaped impedance lines 1 are distributed among the circuit patterns 2, so that the impedance value of the sawtooth-shaped impedance lines 1 is ensured to meet the requirement, and the design requirements of high density and high integration are also ensured. And manufacturing sawtooth type impedance lines 1 among the circuit patterns 2, wherein the resistance value of the sawtooth type impedance lines 1 is determined by the line width of straight lines 11 of the sawtooth type impedance lines 1, the tooth height of sawteeth 12 and/or the tooth width of the sawteeth 12. The method comprises the steps of setting a model of the sawtooth type impedance line 1 with the initial impedance meeting the requirements, wherein the model comprises the preset line width 11 of a straight line, the tooth height and the tooth width of a sawtooth 12, adjusting the line width 11 of the straight line of the sawtooth type impedance line 1, the tooth height of the sawtooth 12 and/or the tooth width of the sawtooth 12 on the basis, and enabling the impedance value of the sawtooth type impedance line 1 to be unchanged. When the face width of the saw teeth 12 is adjusted, the upper face width and the lower face width of the saw teeth 12 are adjusted at the same time.
Fig. 2 is a flowchart illustrating the detailed steps of the method for manufacturing the impedance according to the present invention, and the method for manufacturing the impedance according to the present invention is described in detail with reference to fig. 2. The manufacturing method of the impedance comprises the following steps:
step one, providing a plurality of core boards, and manufacturing a circuit pattern 2 on the core boards.
Specifically, according to requirements, a circuit pattern 2 is manufactured on two layers of copper foils of the core board, and the circuit pattern 2 comprises a bonding pad, a signal hole, a circuit diagram and the like.
And step two, manufacturing sawtooth type impedance lines 1 with certain resistance values among the circuit graphs 2, wherein the resistance values of the sawtooth type impedance lines 1 are determined by the line widths of straight lines 11 of the sawtooth type impedance lines 1, the tooth heights of the sawteeth 12 and/or the tooth widths of the sawteeth 12.
Specifically, sawtooth-shaped impedance lines 1 are manufactured among the circuit patterns 2, the impedance lines 1 have certain impedance values, and the impedance values are determined according to parameters such as the dielectric thickness and/or the dielectric constant of the core board and/or the copper thickness and/or the surface treatment process.
Preferably, since the line width of the straight line 11 needs to be within a given tolerance range, the line width of the straight line 11 of the saw-tooth type impedance line 1 is adjusted, the change of the line width of the straight line 11 changes the impedance value of the saw-tooth type impedance line 1, and the tooth height and/or the tooth width of the saw tooth 12 is adjusted according to the change of the impedance value to compensate, so as to ensure that the impedance value of the saw-tooth type impedance line 1 is not changed.
In the present embodiment, how to adjust the line width of the straight line 11 and the height and/or width of the saw-tooth 12 is determined according to the size of the gap between the line patterns 2 so that the impedance value set for the saw-tooth type impedance line 1 is not changed. The adjustment method of the sawtooth-shaped impedance line 1 is as follows:
the size of the gap is determined based on the diameter of the pseudo-circle of the wiring pattern 2 or the diameters of the pad and the signal hole, and for example, if the diameter of the pseudo-circle is larger than 1mm, the gap is determined to be large, otherwise, the gap is determined to be small.
If the gap between the line patterns 2 is large, the pattern density can be increased by increasing the tooth height and/or the tooth width of the saw teeth 12; since the line width of the straight line 11 needs to be set within a given tolerance range, the line width of the straight line 11 of the sawtooth type impedance line 1 needs to be reduced within the given tolerance range, and then the tooth height and the tooth width of the sawtooth 12 of the sawtooth type impedance line 1 need to be adjusted, so that the impedance value of the sawtooth type impedance line 1 is not changed, and the density is increased. Fig. 6 is a schematic diagram showing the structure of a zigzag impedance line 1 formed for a large wiring pattern 2.
If the gap between the wiring patterns 2 is small, the tooth height and the tooth width of the saw teeth 12 will be limited; when the saw teeth 12 are all around the circuit pattern 2, a gap is reserved between the saw teeth 12 to prevent the impedance lines from being affected with each other, so that the line width of the straight line 11 of the saw-tooth type impedance line 1 needs to be increased within a given tolerance range, and then the tooth height and the tooth width of the saw teeth 12 of the saw-tooth type impedance line 1 need to be adjusted to make the impedance value of the saw-tooth type impedance line 1 unchanged. Fig. 7 is a schematic diagram showing the structure of a saw-tooth-type impedance line 1 formed for a small wiring pattern 2.
On the premise of ensuring high density and high integration, the sawtooth-shaped impedance line 1 matched with the line pattern 2 is manufactured according to the size of the gap between the line patterns 2, and the design has pertinence.
Adjusting one or more of the line width of the straight line 11, the tooth height of the saw tooth 12 and the tooth width causes a change in the impedance value. In the present embodiment, the line width of the straight line 11, the height of the saw tooth 12, and/or the width of the saw tooth are adjusted according to the size of the gap between the line patterns 2, and the impedance value is ensured to be constant.
In the present embodiment, the line width of the straight line 11, the height of the saw tooth 12, and the width of the saw tooth 12 are all linearly related to the impedance value of the saw-tooth type impedance line 1.
Setting the impedance value as Y and the line width of the straight line 11 as X1Then, taking one of the core boards as an example, the line width X of the straight line 11 can be obtained through experiments1Linear relation with the impedance value Y, as shown in FIG. 3, line 11 has a line width X1The function relation with the impedance value Y is-4.1449X1+65.445。
The height of the saw tooth 12 is set to X2Then, for the same core plate as described above, the tooth height X of the saw tooth 12 can be obtained by experiment as well2Linear relationship with resistance value Y, as shown in FIG. 4, tooth height X2The function relation with the impedance value Y is-3.0036X2+60.879。
Similarly, the width of the saw tooth 12 is set to X3The tooth width X of the saw tooth 12 can be obtained3Linear relationship with the resistance value Y, as shown in FIG. 5, the tooth width X3The function relation with the impedance value Y is-2.0114X3+65.891。
According to the principle of adjusting the line width of the straight line 11 first and then adjusting the tooth height and the tooth width of the saw teeth 12, when the gap between the line patterns 2 is small, the line width of the straight line 11 increases by 2mil, Δ X1The change amount Δ Y of the impedance value obtained is 4.1449 × 2 8.2898 Ω. To ensure that the required resistance value remains the same, the resistance value needs to be increased by decreasing the height of the serrations 12 and/or the width of the serrations 12. If the tooth height is selected to be decreased, Δ Y is 3.0036 Δ X2To obtain a compensation value DeltaX for reducing the tooth height22.76; if the reduction of the tooth width is selected, Δ Y is 2.0114 Δ X3To obtain the compensation value DeltaX of the reduction of the small waist of the tooth width34.12; similarly, the tooth height and the tooth width can be simultaneously adjusted, and Δ Y is 3.0036 Δ X2+2.0114ΔX3Allocating X according to actual demand2And X3The value of (c). Specifically, the adjustment range of the tooth height and the tooth width may be determined by measuring the gap between the line patterns 2, and then one or both of the tooth height and the tooth width may be selectively adjusted.
When the gap between the line patterns 2 is large, the calculation method is the same as the above, and is not described in detail herein.
And step three, overlapping a plurality of core plates and pressing to form a mother plate, and drilling and copper deposition electroplating are carried out on the mother plate.
And step four, if necessary, manufacturing a sawtooth-shaped impedance line 1 on the outer layer graph of the motherboard, and then carrying out surface treatment on the motherboard to form the PCB.
The method for forming the saw-tooth type resistance line 1 on the outer layer pattern of the motherboard is the same as the method for forming the saw-tooth type resistance line 1 on the inner layer pattern, and will not be described in detail.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (7)

1. A method for manufacturing impedance is characterized by comprising the following steps:
s1, providing a plurality of core boards, and manufacturing circuit patterns on the core boards;
s2, manufacturing a sawtooth-shaped impedance line with a certain impedance value among the circuit patterns, wherein the impedance value of the sawtooth-shaped impedance line is determined by the linear line width of the sawtooth-shaped impedance line, the tooth height of the sawtooth and/or the tooth width of the sawtooth;
when setting the impedance value of the sawtooth-shaped impedance line, firstly adjusting the linear line width of the sawtooth-shaped impedance line, changing the impedance value of the sawtooth-shaped impedance line by the change of the linear line width, and then adjusting the tooth height and/or the tooth width of the sawtooth according to the change of the impedance value to ensure that the impedance value of the sawtooth-shaped impedance line is not changed;
the step S2 includes the steps of:
s21, if the gaps between the circuit patterns are large, reducing the linear line width of the sawtooth-shaped impedance line, and then adjusting the tooth height and/or the tooth width of the sawtooth-shaped impedance line to enable the impedance value of the sawtooth-shaped impedance line to be unchanged;
and S22, if the gaps between the circuit patterns are small, increasing the linear line width of the sawtooth-shaped impedance line, and then adjusting the tooth height and/or the tooth width of the sawtooth-shaped impedance line to enable the impedance value of the sawtooth-shaped impedance line to be unchanged.
2. The method of claim 1, wherein the linear line width is X1The impedance value is Y, then the line width of the straight line is X1The function relation between the impedance value Y and the impedance value Y is that Y is aX1And + b, a takes the value of-1 to-6, and b takes the value of 32 to 80.
3. The method of claim 2, wherein the height of the saw-tooth is set to X2Then tooth height X2The function relation with the impedance value Y is that Y is m X2And n, m ranges from-1 to-6, and n ranges from 32 to 80.
4. The method of claim 3, wherein the width of the saw tooth is set to X3Then tooth width X3The function relation with the impedance value Y is that Y is p X3And q, p ranges from-1 to-6, and q ranges from 32 to 80.
5. The method for manufacturing impedance of claim 1, wherein the impedance value of the sawtooth-shaped impedance line is determined according to a dielectric thickness and/or a dielectric constant and/or a copper thickness and/or a surface treatment process of the core board.
6. The method for manufacturing an impedance of claim 1, further comprising, after the step S2: step S3: and overlapping a plurality of the core plates, pressing the core plates to form a mother plate, and drilling and copper deposition electroplating on the mother plate.
7. The method for manufacturing an impedance of claim 6, further comprising, after the step S3: step S4: and manufacturing the sawtooth-shaped impedance line on the outer layer graph of the motherboard, and then carrying out surface treatment on the motherboard to form the PCB.
CN201811649406.7A 2018-12-30 2018-12-30 Impedance manufacturing method Active CN109496065B (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1541045A (en) * 2003-10-27 2004-10-27 威盛电子股份有限公司 Structure of signal transferring
CN201657492U (en) * 2010-04-20 2010-11-24 英业达股份有限公司 Printed circuit board
CN203896579U (en) * 2014-03-31 2014-10-22 深圳市兴森快捷电路科技股份有限公司 Difference line structure for optimizing impedance
CN206559716U (en) * 2017-01-23 2017-10-13 深圳市一博科技有限公司 A kind of Wiring structure for optimizing coiling signal quality

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1541045A (en) * 2003-10-27 2004-10-27 威盛电子股份有限公司 Structure of signal transferring
CN201657492U (en) * 2010-04-20 2010-11-24 英业达股份有限公司 Printed circuit board
CN203896579U (en) * 2014-03-31 2014-10-22 深圳市兴森快捷电路科技股份有限公司 Difference line structure for optimizing impedance
CN206559716U (en) * 2017-01-23 2017-10-13 深圳市一博科技有限公司 A kind of Wiring structure for optimizing coiling signal quality

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