CN105430908A - Linewidth compensation method for manufacturing printed circuit board - Google Patents
Linewidth compensation method for manufacturing printed circuit board Download PDFInfo
- Publication number
- CN105430908A CN105430908A CN201510724308.5A CN201510724308A CN105430908A CN 105430908 A CN105430908 A CN 105430908A CN 201510724308 A CN201510724308 A CN 201510724308A CN 105430908 A CN105430908 A CN 105430908A
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- CN
- China
- Prior art keywords
- width
- compensation
- circuit
- printed substrate
- line areas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention provides a linewidth compensation method for manufacturing a printed circuit board, comprising: providing a printed circuit board to be etched, which comprises a developing dense line zone and a sparse line zone; designing linewidth compensation: increasing a preset compensation width to the line of the sparse line zone, pasting the copper pouring zone corresponding to the preset compensation width to a dry film, and then performing exposure and development process treatment; and etching: performing etching treatment on the printed circuit board to be etched after a linewidth compensation design step, allowing the copper foil width of the sparse line zone after etching to be equal with the copper foil width of the dense line zone. Compared with the prior art, through the linewidth compensation method for manufacturing a printed circuit board, the linewidth of the dense line zone after printed circuit board etching is the same with the linewidth of the sparse line zone, and the reliability of the printed circuit is improved.
Description
Technical field
The present invention relates to printed substrate manufacture technology field, refer more particularly to the live width compensation method that a kind of printed substrate makes.
Background technology
Along with the high speed development of electronic technology, the circuit degree that becomes more meticulous of printed substrate progressively turns to the micron order size of microcosmic, and the precision requirement of circuit is more and more higher.
In printed substrate layout designs, in usual inside and outside sandwich circuit, there is dense wire in some regions, in correlation technique, the compensation of circuit live width is all carry out unified compensation according to the thickness of end copper, when circuit etching, because etching solution is in the difference of flowability of various wirings density area, cause the etching solution activity difference of various wirings density area, the live width of the sparse line areas of printed substrate can be caused to compare the live width in dense wire district less than normal, or the circuit burr in dense wire district are excessive, erosion plate is unclear, cause the quality of wiring board bad or scrap.
Therefore, be necessary that the live width compensation method providing a kind of new printed substrate to make solves the problems referred to above.
Summary of the invention
The technical issues that need to address of the present invention are to provide a kind of live width compensation method that the live width in the dense wire district of the printed substrate printed substrate consistent with the live width of rare comb line areas is made.
For solving the problems of the technologies described above, the invention provides the live width compensation method that a kind of printed substrate makes, comprising:
There is provided printed substrate to be etched, it comprises the dense wire district of development formation and sparse line areas;
Live width Compensation Design, determines the required predesigned compensation width increased of the circuit of described sparse line areas, is sticked after dry film and carries out exposure and developing process process in corresponding for described predesigned compensation width copper region of covering;
Etching, carries out etch processes by the printed substrate described to be etched after the process of described live width Compensation Design, makes the width of the circuit of the rare comb line areas after etching equal the width of the circuit in described dense wire district.
Preferably, described predesigned compensation width is 10 microns.
Preferably, after the circuit of described sparse line areas increases described predesigned compensation width, during spacing between adjacent two circuits that the spacing between two adjacent circuits is less than or equal to described dense wire district, only at the one-sided increase predesigned compensation width of described sparse line areas circuit.
Preferably, after the circuit of described sparse line areas increases described predesigned compensation width, during spacing between adjacent two circuits that the spacing between two adjacent circuits is greater than described dense wire district, increase predesigned compensation width in the both sides of described sparse line areas circuit simultaneously.
Compared to correlation technique, the beneficial effect of the live width compensation method that printed substrate of the present invention makes is: in printed substrate makes, by carrying out precompensation to the live width of line areas sparse in printed substrate, make the width of the circuit Copper Foil of the described sparse line areas after etching equal the width of the circuit Copper Foil in dense wire district, thus improve the product quality of circuit making.
Accompanying drawing explanation
Fig. 1 is the flow chart of the live width compensation method that printed substrate of the present invention makes;
Fig. 2 is circuit distribution schematic diagram in printed substrate of the present invention.
Embodiment
Below in conjunction with drawings and embodiments, the invention will be further described.
Incorporated by reference to seeing figures.1.and.2, wherein, Fig. 1 is the flow chart of the live width compensation method that printed substrate of the present invention makes, and Fig. 2 is circuit distribution schematic diagram in printed substrate of the present invention.The live width compensation method that described printed substrate makes, comprising:
Step S1, provides printed substrate to be etched, and it comprises dense wire district 12 and the sparse line areas 13 of development;
In step sl, the printed substrate to be etched of copper thickness of the default end is provided.Particularly, copper thickness of the described end is 23um, and described dense wire district 12 is the region that adjacent Copper Foil 11 spacing is less than or equal to 0.075mm, and described sparse line areas 13 is the region that adjacent Copper Foil 11 spacing is greater than 0.075mm.It should be noted that, in present embodiment, the described Copper Foil 11 i.e. circuit of described dense wire district 12 or described sparse line areas 13.
Step S2, determines the required predesigned compensation width increased of the circuit of described sparse line areas 13, is sticked after dry film and carries out exposure and developing process process in corresponding for described predesigned compensation width copper region of covering;
Preferably, described predesigned compensation width is 10 microns.
In step s 2, during spacing between adjacent two circuits that the spacing between adjacent two circuits after the live width of the circuit of described sparse line areas 13 increases described predesigned compensation width is less than or equal to described dense wire district 12, minimum spacing between the adjacent Copper Foil 11 of described predesigned compensation widths affect, now the two adjacent lines appearances of a street easily cause short circuit, and affect the normal distribution of printed substrate circuit, therefore, the one-sided increase predesigned compensation width of the circuit only in described sparse line areas 13, particularly, at the one-sided of circuit of described sparse line areas 13, live width is increased by 10 microns.
During spacing between adjacent two circuits that the spacing between adjacent two circuits after the live width of the circuit of described sparse line areas 13 increases described predesigned compensation width is greater than described dense wire district 12, described predesigned compensation width does not affect the minimum spacing between adjacent Copper Foil 11, now two adjacent lines are security setting, therefore, increase predesigned compensation width in the both sides of the circuit of described sparse line areas 13 simultaneously, particularly, live width is increased by 10 microns in the both sides of the circuit of described sparse line areas 13 simultaneously.
Step S3, carries out etch processes by the printed substrate described to be etched after described live width Compensation Design step process, makes the width of the circuit of the rare comb line areas 13 after etching equal the width of the circuit in described dense wire district 12;
The circuit of described printed substrate is after described step S2 live width Compensation Design, the live width of described sparse line areas 13 is made to be greater than the live width in described dense wire district 12, and when etch processes, the flow velocity of described etching solution in described sparse line areas 13 and activity degree are greater than its flow velocity in described dense wire district 12 and activity, therefore the etching speed in described dense wire district 12 is greater than at the etching speed of described sparse line areas 13, the width of the described sparse line areas 13 after finally making described printed substrate etch and the Copper Foil 11 in described dense wire district 12 is equal, improve the stability of described printed substrate.
Compared with correlation technique, in the live width compensation method that printed substrate of the present invention makes, increased by the live width of the sparse line areas 13 to printed substrate and compensate width, after making etching, the width of the Copper Foil 11 of described sparse line areas 13 equals the width of the Copper Foil 11 in dense wire district 12, thus improves the product reliability of printed substrate making.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (4)
1. a live width compensation method for printed substrate circuit making, is characterized in that, comprising:
There is provided printed substrate to be etched, it comprises the dense wire district of development formation and sparse line areas;
Live width Compensation Design, determines the required predesigned compensation width increased of the circuit of described sparse line areas, is sticked after dry film and carries out exposure and developing process process in corresponding for described predesigned compensation width copper region of covering;
Etching, carries out etch processes by the printed substrate described to be etched after the process of described live width Compensation Design, makes the width of the circuit of the rare comb line areas after etching equal the width of the circuit in described dense wire district.
2. the live width compensation method of printed substrate circuit making according to claim 1, it is characterized in that, described predesigned compensation width is 10 microns.
3. the live width compensation method of printed substrate circuit making according to claim 2, it is characterized in that, after the circuit of described sparse line areas increases described predesigned compensation width, during spacing between adjacent two circuits that the spacing between two adjacent circuits is less than or equal to described dense wire district, only at the one-sided increase predesigned compensation width of described sparse line areas circuit.
4. the live width compensation method of printed substrate circuit making according to claim 2, it is characterized in that, after the circuit of described sparse line areas increases described predesigned compensation width, during spacing between adjacent two circuits that the spacing between two adjacent circuits is greater than described dense wire district, increase predesigned compensation width in the both sides of described sparse line areas circuit simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510724308.5A CN105430908A (en) | 2015-10-29 | 2015-10-29 | Linewidth compensation method for manufacturing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510724308.5A CN105430908A (en) | 2015-10-29 | 2015-10-29 | Linewidth compensation method for manufacturing printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105430908A true CN105430908A (en) | 2016-03-23 |
Family
ID=55508755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510724308.5A Pending CN105430908A (en) | 2015-10-29 | 2015-10-29 | Linewidth compensation method for manufacturing printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105430908A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109168266A (en) * | 2018-07-25 | 2019-01-08 | 江苏博敏电子有限公司 | A kind of printed wiring board circuitous pattern etching parameter appraisal procedure |
| CN110753452A (en) * | 2019-10-30 | 2020-02-04 | 江苏上达电子有限公司 | External etching compensation method for precise circuit |
| CN112861467A (en) * | 2021-02-03 | 2021-05-28 | 深圳华大九天科技有限公司 | Line width compensation method and device, server and storage medium |
| CN113392618A (en) * | 2021-04-23 | 2021-09-14 | 武汉大学 | Method for predicting mask line width compensation quantity of printed circuit board |
| CN116033663A (en) * | 2023-03-31 | 2023-04-28 | 苏州东山精密制造股份有限公司 | Fine flexible circuit board and circuit etching compensation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102573309A (en) * | 2012-01-13 | 2012-07-11 | 东莞生益电子有限公司 | Method for improving graphic precision of substractive process printed circuit board (PCB) by adopting dynamic etching compensation method |
| CN104010445A (en) * | 2014-05-09 | 2014-08-27 | 东莞市五株电子科技有限公司 | Dynamic compensation manufacturing method for fine circuit |
| CN104684264A (en) * | 2015-02-14 | 2015-06-03 | 深圳市五株科技股份有限公司 | Etching method for inner-layer core board of printed circuit board |
-
2015
- 2015-10-29 CN CN201510724308.5A patent/CN105430908A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102573309A (en) * | 2012-01-13 | 2012-07-11 | 东莞生益电子有限公司 | Method for improving graphic precision of substractive process printed circuit board (PCB) by adopting dynamic etching compensation method |
| CN104010445A (en) * | 2014-05-09 | 2014-08-27 | 东莞市五株电子科技有限公司 | Dynamic compensation manufacturing method for fine circuit |
| CN104684264A (en) * | 2015-02-14 | 2015-06-03 | 深圳市五株科技股份有限公司 | Etching method for inner-layer core board of printed circuit board |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109168266A (en) * | 2018-07-25 | 2019-01-08 | 江苏博敏电子有限公司 | A kind of printed wiring board circuitous pattern etching parameter appraisal procedure |
| CN109168266B (en) * | 2018-07-25 | 2019-12-03 | 江苏博敏电子有限公司 | A kind of printed wiring board circuitous pattern etching parameter appraisal procedure |
| CN110753452A (en) * | 2019-10-30 | 2020-02-04 | 江苏上达电子有限公司 | External etching compensation method for precise circuit |
| CN112861467A (en) * | 2021-02-03 | 2021-05-28 | 深圳华大九天科技有限公司 | Line width compensation method and device, server and storage medium |
| CN113392618A (en) * | 2021-04-23 | 2021-09-14 | 武汉大学 | Method for predicting mask line width compensation quantity of printed circuit board |
| CN113392618B (en) * | 2021-04-23 | 2022-07-05 | 武汉大学 | Method for predicting mask line width compensation quantity of printed circuit board |
| CN116033663A (en) * | 2023-03-31 | 2023-04-28 | 苏州东山精密制造股份有限公司 | Fine flexible circuit board and circuit etching compensation method thereof |
| CN116033663B (en) * | 2023-03-31 | 2023-08-11 | 苏州东山精密制造股份有限公司 | Fine flexible circuit board and circuit etching compensation method thereof |
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Application publication date: 20160323 |