CN206149582U - Circuit board heat dissipation structure - Google Patents
Circuit board heat dissipation structure Download PDFInfo
- Publication number
- CN206149582U CN206149582U CN201621066878.6U CN201621066878U CN206149582U CN 206149582 U CN206149582 U CN 206149582U CN 201621066878 U CN201621066878 U CN 201621066878U CN 206149582 U CN206149582 U CN 206149582U
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- China
- Prior art keywords
- internal diameter
- layer
- circuit board
- hole
- epoxy resin
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Abstract
The utility model provides a circuit board heat dissipation structure, which comprises a plate body, the plate body is including the first conducting wire layer that from top to bottom sets gradually, an epoxy layer, the metal core, the 2nd epoxy layer and second conducting wire layer, circuit board heat dissipation structure is still including the through -hole that link up the plate body, the internal diameter of locating corresponding to the metal core of through -hole is first internal diameter, the through -hole corresponding to first conducting wire layer, an epoxy layer, the internal diameter of the 2nd epoxy layer and second conducting wire layer department is the second internal diameter, thereby first internal diameter is greater than the second internal diameter forms an annular, be provided with insulating ring type filling in the annular, and the internal diameter of insulating ring type filling equals the second internal diameter, first conducting wire layer, an epoxy layer, insulating ring type filling, the inner wall department that lies in the through -hole on the 2nd epoxy layer and second conducting wire layer all is provided with the conducting layer. The utility model discloses a metal core, transfer heat has better improved the reliability of circuit board.
Description
Technical field
The utility model is related to circuit board manufacturing area, more particularly to a kind of circuit board cooling structure.
Background technology
With electronic information high speed development, components and parts require more and more higher for heat dissipation for circuit board, but for some
Work circuit board in the presence of a harsh environment, or for high-power circuit plate, its heat dissipation problem is a key issue all the time, due to
The radiating effect of circuit board of the prior art is poor, frequently result in components and parts on circuit board cannot normal work, so as to affect
The stability of circuit board.
Utility model content
The utility model provide a kind of circuit board cooling structure, to solve prior art in circuit board radiating effect
Difference, thus the components and parts on circuit board cannot normal work, so as to have impact on the problem of circuit board stability.
To solve the above problems, as one side of the present utility model, there is provided a kind of circuit board cooling structure, including
Plate body, plate body includes the first conductive circuit layer, the first epoxy resin layer, metal core board, the second ring for from top to bottom setting gradually
Oxygen tree lipid layer and the second conductive circuit layer, circuit board cooling structure also including insertion plate body through hole, through hole corresponding to metal
Internal diameter at central layer be the first internal diameter, through hole corresponding to the first conductive circuit layer, the first epoxy resin layer, the second epoxy resin
Internal diameter at layer and the second conductive circuit layer is the second internal diameter, and the first internal diameter is more than the second internal diameter so as to form an annular groove, ring
Insulation filling ring is provided with groove, and the internal diameter of insulation filling ring is equal to the second internal diameter, the first conductive circuit layer, the first asphalt mixtures modified by epoxy resin
Conduction is provided with the inwall positioned at through hole of lipid layer, insulation filling ring, the second epoxy resin layer and the second conductive circuit layer
Layer.
Preferably, first internal diameter is more than 0.8 millimeter of second internal diameter.
Because the utility model middle part employs metal core board, therefore can preferably transmit heat.Additionally, metal-cored
The through hole of plate is also provided with one layer of insulation filling ring, hence in so that also can be carried out using through hole using the circuit board of metal core board
Conduction, so as to solve the heat dissipation problem of circuit board, improves the service life of the components and parts on circuit board, improves circuit board
Reliability.
Description of the drawings
Fig. 1 schematically shows structural representation of the present utility model.
Reference in figure：1st, the first conductive circuit layer；2nd, the first epoxy resin layer；3rd, metal core board；4th, the second epoxy
Resin bed；5th, the second conductive circuit layer；6th, through hole；7th, insulation filling ring；8th, conductive layer.
Specific embodiment
Embodiment of the present utility model is described in detail below in conjunction with accompanying drawing, but the utility model can be by right
It is required that the multitude of different ways for limiting and covering is implemented.
The utility model provides a kind of circuit board cooling structure, including plate body, and plate body includes from top to bottom setting gradually
The first conductive circuit layer 1, the first epoxy resin layer 2, metal core board 3, the second epoxy resin layer 4 and the second conductive circuit layer 5,
Also including the through hole 6 of insertion plate body, through hole 6 is the first internal diameter corresponding to the internal diameter at metal core board 3 to circuit board cooling structure,
Through hole 6 corresponding to the first conductive circuit layer 1, the first epoxy resin layer 2, the second epoxy resin layer 4 and the second conductive circuit layer 5
The internal diameter at place is the second internal diameter, and the first internal diameter, so as to form an annular groove, is provided with insulation filling more than the second internal diameter in annular groove
Ring 7, and the internal diameter of insulation filling ring 7 is equal to the second internal diameter, the first conductive circuit layer 1, the first epoxy resin layer 2, insulation filling
Ring 7, the second epoxy resin layer 4 and the second conductive circuit layer 5 are provided with conductive layer 8 at the inwall of through hole 6.
Preferably, the first internal diameter is more than 0.8 millimeter of the second internal diameter.
Because the utility model middle part employs metal core board, therefore can preferably transmit heat.Additionally, metal-cored
The through hole of plate is also provided with one layer of insulation filling ring, hence in so that also can be carried out using through hole using the circuit board of metal core board
Conduction, so as to solve the heat dissipation problem of circuit board, improves the service life of the components and parts on circuit board, improves circuit board
Reliability.
Preferred embodiment of the present utility model is the foregoing is only, the utility model is not limited to, for this
For the technical staff in field, the utility model can have various modifications and variations.It is all it is of the present utility model spirit and principle
Within, any modification, equivalent substitution and improvements made etc. should be included within protection domain of the present utility model.
Claims (2)
1. a kind of circuit board cooling structure, it is characterised in that including plate body, the plate body include from top to bottom setting gradually the
One conductive circuit layer (1), the first epoxy resin layer (2), metal core board (3), the second epoxy resin layer (4) and the second conducting wire
Layer (5), the circuit board cooling structure also including plate body described in insertion through hole (6), the through hole (6) corresponding to the gold
Category central layer (3) place internal diameter be the first internal diameter, the through hole (6) corresponding to first conductive circuit layer (1), the first epoxy
The internal diameter of resin bed (2), the second epoxy resin layer (4) and the second conductive circuit layer (5) place be the second internal diameter, first internal diameter
More than second internal diameter so as to form an annular groove, insulation filling ring (7), and the insulation filling are provided with the annular groove
The internal diameter of ring (7) is equal to second internal diameter, first conductive circuit layer (1), the first epoxy resin layer (2), insulation filling
Ring (7), the second epoxy resin layer (4) and being provided with the inwall of the through hole (6) for the second conductive circuit layer (5) are led
Electric layer (8).
2. circuit board cooling structure according to claim 1, it is characterised in that first internal diameter more than described second in
0.8 millimeter of footpath.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621066878.6U CN206149582U (en) | 2016-09-20 | 2016-09-20 | Circuit board heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621066878.6U CN206149582U (en) | 2016-09-20 | 2016-09-20 | Circuit board heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206149582U true CN206149582U (en) | 2017-05-03 |
Family
ID=58619674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621066878.6U Active CN206149582U (en) | 2016-09-20 | 2016-09-20 | Circuit board heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206149582U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111565507A (en) * | 2020-05-18 | 2020-08-21 | 龙宇电子(深圳)有限公司 | PCB pressfitting lamination structure |
-
2016
- 2016-09-20 CN CN201621066878.6U patent/CN206149582U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111565507A (en) * | 2020-05-18 | 2020-08-21 | 龙宇电子(深圳)有限公司 | PCB pressfitting lamination structure |
| CN111565507B (en) * | 2020-05-18 | 2022-02-01 | 龙宇电子(深圳)有限公司 | PCB pressfitting lamination structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |