CN111565507B - PCB pressfitting lamination structure - Google Patents
PCB pressfitting lamination structure Download PDFInfo
- Publication number
- CN111565507B CN111565507B CN202010421750.1A CN202010421750A CN111565507B CN 111565507 B CN111565507 B CN 111565507B CN 202010421750 A CN202010421750 A CN 202010421750A CN 111565507 B CN111565507 B CN 111565507B
- Authority
- CN
- China
- Prior art keywords
- pcb
- heat dissipation
- core
- insulating medium
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003475 lamination Methods 0.000 title description 4
- 230000017525 heat dissipation Effects 0.000 claims abstract description 37
- 239000002184 metal Substances 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000011889 copper foil Substances 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 10
- 230000007246 mechanism Effects 0.000 claims abstract description 10
- 238000007747 plating Methods 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 28
- 229910001374 Invar Inorganic materials 0.000 claims description 14
- 238000010030 laminating Methods 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 abstract description 2
- 239000011162 core material Substances 0.000 description 31
- 238000004381 surface treatment Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention relates to a PCB pressing laminated board structure, which comprises a multi-layer PCB board body; the PCB body is provided with an insulating medium layer and a core plate; the insulating medium layer and the core plate are provided with through holes and connected with copper foils, and the insulating medium layer is provided with a groove body; a metal heat dissipation core is arranged in the groove body; the metal radiating core is provided with a conducting hole; copper plating is carried out on the inner side wall of the through hole; the copper foil penetrates through the conducting hole; semi-cured insulating media are filled between the copper foil and the via hole; the periphery of the PCB body is provided with a heat conducting seat; the heat conducting seat is connected with the metal radiating core. According to the invention, the metal heat dissipation core is arranged in the insulating medium layer of the PCB body, so that the heat dissipation efficiency of the PCB is greatly improved, the temperature of the PCB in the use process is effectively controlled, and the service life and the reliability of the PCB are improved. The matched locking mechanism can correspond to the PCB, and the normal use of the PCB cannot be realized while aiming at the metal heat dissipation core.
Description
Technical Field
The invention relates to a laminated plate structure, in particular to a PCB laminating structure, and belongs to the technical field of PCB processing.
Background
Because the PCB is rapidly moved to signal conductor high-density, signal transmission high-frequency and high-speed digitalization, larger conductive loss, dielectric loss and the like are brought, and the inner part (dielectric layer) of the PCB is heated and heated. Because the heat conductivity coefficient of the traditional PCB dielectric layer is only about 0.24W/m.K, the heat conducting and radiating performance is very poor, the temperature rise of the PCB dielectric layer is increased rapidly, the working temperature of the PCB is increased from less than or equal to 70 ℃ to 100 ℃ and even reaches 130 ℃, and under the high temperature, the PCB and components are brought: (1) various performances can change along with temperature rise, such as thermal stress caused by larger size difference due to different CTE values, larger conductive loss and dielectric loss in the PCB, and the like; (2) the physical form (state) will change, such as changing the external dimension, bending, twisting, etc. of the PCB. These performance and morphology changes will seriously threaten the electrical performance, safety, reliability and lifetime of PCBs and components.
Disclosure of Invention
In view of the above, the present invention is directed to overcome the defects in the prior art, and provides a PCB lamination structure, which reduces the loss of the PCB, prolongs the service life, and improves the electrical performance and safety.
The PCB laminating structure designed for achieving the purpose comprises a multi-layer PCB body; the PCB body is provided with an insulating medium layer and a core plate; the insulating medium layer and the core plate are provided with through holes and connected with copper foils, and the insulating medium layer is provided with a groove body; a metal heat dissipation core is arranged in the groove body; the metal radiating core is provided with a conducting hole; copper plating is carried out on the inner side wall of the through hole to form a copper foil; the copper foil penetrates through the conducting hole; semi-cured insulating media are filled between the copper foil and the via hole; the periphery of the PCB body is provided with a heat conducting seat; the heat conducting seat is connected with the metal radiating core.
Preferably, the metal heat dissipation core is an invar heat dissipation core plate; the groove body is arranged in a strip shape; the groove bodies are arranged in the insulating medium layers at symmetrical positions; the heat conducting seat comprises an upper cover, a lower cover, an end cover and a side wall.
Preferably, the surface of the invar heat dissipation chip is plated with a film layer; browning the invar heat dissipation core plate; the metal radiating core is pre-positioned with the insulating medium layer through the pin.
Preferably, the end covers are arranged at the left end and the right end of the PCB body; a heat dissipation column is arranged in the end cover; the end part of the metal radiating core is connected in the end cover.
Preferably, the heat dissipation column is a copper column; the radiating strip is externally connected with radiating fins; the end cover and the side wall are integrally formed.
Preferably, the upper side and the lower side of the side wall are provided with locking mechanisms; the inner side of the end cover is provided with a heat dissipation surface; the number of the end covers corresponds to that of the PCB body.
Preferably, the heat dissipation surface layer is distributed on the inner side of the end cover in a corrugated manner.
Preferably, the locking mechanism comprises guide rods positioned on the upper side and the lower side of the side wall; the guide rod is provided with a fixed lantern ring; the fixed lantern ring is connected between the guide rods of the upper adjacent side wall and the lower adjacent side wall.
Preferably, the fixed lantern ring consists of two connecting rods; the connecting rods are hinged with each other; the other end of the connecting rod is fixed on the guide rod through a nut.
According to the invention, the metal heat dissipation core is arranged in the insulating medium layer of the PCB body, so that the heat dissipation efficiency of the PCB is greatly improved, the temperature of the PCB in the use process is effectively controlled, and the service life and the reliability of the PCB are improved. The matched locking mechanism can correspond to the PCB, and the normal use of the PCB cannot be realized while aiming at the metal heat dissipation core.
Drawings
Fig. 1 is a schematic structural view of a PCB board according to the present invention.
Fig. 2 is a schematic sectional structure view of the locking mechanism.
In the figure, 1 is a PCB body, 2 is an insulating medium layer, 3 is a core plate, 4 is a via hole, 5 is a groove body, 6 is a metal heat dissipation core, 6.1 is a via hole, 7 is an end cover, 8 is a heat dissipation column, 9 is a guide rod, 10 is a fixing collar, and 11 is a connecting rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Terms used herein, including technical and scientific terms, have the same meaning as terms commonly understood by one of ordinary skill in the art, unless otherwise defined. It will be understood that terms defined in commonly used dictionaries have meanings that are consistent with their meanings in the prior art.
Referring to fig. 1-2, a PCB lamination stack structure includes a multi-layer PCB body 1; the PCB body 1 is provided with an insulating medium layer 2 and a core plate 3; the insulating medium layer 2 and the core plate 3 are provided with through holes 4 and connected with copper foils, and the insulating medium layer 2 is provided with a groove body 5; a metal radiating core 6 is arranged in the groove body; the metal radiating core 6 is provided with a conducting hole 6.1; copper plating is carried out on the inner side wall of the through hole 4 to form a copper foil; the copper foil penetrates through the conducting hole; semi-cured insulating media are filled between the copper foil and the via hole; the periphery of the PCB body is provided with a heat conducting seat; the heat conducting seat is connected with the metal radiating core.
Furthermore, the metal heat dissipation core 6 is an invar heat dissipation core plate; the groove body 5 is arranged in a strip shape; the groove bodies 5 are arranged in the insulating medium layers 2 at symmetrical positions; the heat conducting seat comprises an upper cover, a lower cover, an end cover 7 and a side wall.
In this example, invar is an iron-nickel alloy (containing 36% nickel, 63.8% iron, and 0.02% carbon). The thermal conductivity is small, and is almost the same as that of a metal substrate (1.5W/mK to 6.0W/mK). However, since the CTE of invar is smaller than that of the component, the solder interface 'pull' stress of CTE formed by dimensional elongation caused by temperature rise can be obviously reduced, namely, the thermal stress in the PCB can be greatly reduced. The disadvantage is that the bond between invar and the medium (prepreg) is poor and the interlayer bond is prone to cracking or separation. Meanwhile, the thermal conductivity coefficient is not large enough, and the thermal conductivity metal core is not ideal, so that the thin copper (double-sided copper plating) is plated on an invar, and then the invar is subjected to browning treatment and then laminated, the thermal conductivity coefficient is close to that of copper, the CTE is close to that of a chip, the problem of thermal conductivity can be solved, the CTE matching problem can be solved, and the bonding force with a dielectric layer can be improved.
Furthermore, the surface of the invar heat dissipation chip is plated with a thin film layer; browning the invar heat dissipation core plate; the metal radiating core is pre-positioned with the insulating medium layer through the pin.
Furthermore, the end covers 7 are arranged at the left end and the right end of the PCB body; a heat dissipation column 8 is arranged in the end cover 7; the end of the metal radiating core 6 is connected in the end cover.
In this embodiment, since the metal core material is an electrical conductor, if it is used only for heat conduction or for dimensional stability (e.g., deformation prevention), the metal core substrate must be processed into an insulating isolation hole. At the same time, surface treatment (cleaning treatment, treatment for improving bonding force, etc.) is also required for pressing into the dielectric layer. Therefore, the metal core is mainly manufactured by drilling (punching) holes to form insulating isolation holes and then carrying out surface cleaning and surface treatment for improving the bonding force.
Furthermore, the heat dissipation column 8 is a copper column; the radiating column is externally connected with radiating fins; the end cover 7 and the side wall are integrally formed.
Specifically, in this embodiment, the thickness of the metal heat dissipation core is mostly 0.1-0.5 mm, cutting and processing (such as positioning holes or positioning marks) are performed according to the dimension of the PCB during manufacturing, then "insulating holes" and surface treatment are performed, and finally the PCB is laminated during manufacturing and subjected to subsequent processing steps to form the metal PCB.
Furthermore, the upper side and the lower side of the end cover are provided with locking mechanisms; the inner side of the end cover is provided with a heat dissipation surface; the number of the end covers corresponds to the number of the metal radiating cores 6.
In this embodiment, the locking mechanism can provide a good heat conducting channel for the metal heat dissipation core, and can also clamp the adjacent PCB body on the upper and lower sides to maintain the contact tightness.
Furthermore, the heat dissipation surface layer is distributed on the inner side of the end cover in a corrugated manner.
Furthermore, the locking mechanism comprises guide rods 9 positioned on the upper side and the lower side of the end cover 7; a fixed lantern ring 10 is arranged on the guide rod 9; the fixed lantern ring is connected between the guide rods 9 of the upper adjacent side wall and the lower adjacent side wall.
Furthermore, the fixed lantern ring consists of two sections of connecting rods; the connecting rods are hinged with each other; the other end of the connecting rod is fixed on the guide rod through a nut.
Specifically, in this embodiment, after the two end caps are installed, the fixing collars are screwed inwards along the guide rods, and in the process of inward movement of the fixing collars, the connecting rod between the two fixing collars is gradually tensioned, so that the upper and lower adjacent end caps are tensioned by the tensioned connecting rod.
Finally, although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (2)
1. A PCB laminating structure comprises a multi-layer PCB body (1); the PCB body (1) is provided with an insulating medium layer (2) and a core plate (3); insulating medium layer (2) and core (3) on seted up via hole (4), be connected with the copper foil, its characterized in that: the insulating medium layer (2) is provided with a groove body (5); a metal radiating core (6) is arranged in the groove body; the metal heat dissipation core (6) is provided with a via hole (6.1); copper plating is carried out on the inner side wall of the through hole (4) to form a copper foil; the copper foil penetrates through the conducting hole; semi-cured insulating media are filled between the copper foil and the via hole; the periphery of the PCB body is provided with a heat conducting seat; the heat conducting seat is connected with the metal radiating core;
the metal heat dissipation core (6) is an invar heat dissipation core plate; the groove body (5) is arranged in a strip shape; the groove bodies (5) are arranged in the insulating medium layers (2) at symmetrical positions; the heat conducting seat comprises an upper cover, a lower cover, an end cover (7) and a side wall;
the surface of the invar heat dissipation chip is plated with a thin film layer; browning the invar heat dissipation core plate; the metal radiating core is pre-positioned with the insulating medium layer through a pin;
the end covers (7) are arranged at the left end and the right end of the PCB body; a heat dissipation column (8) is arranged in the end cover (7); the end part of the metal radiating core (6) is connected into the end cover;
the heat dissipation column (8) is a copper column; the radiating column is externally connected with radiating fins; the end cover (7) and the side wall are integrally formed;
locking mechanisms are arranged on the upper side and the lower side of the end cover; the inner side of the end cover is provided with a heat dissipation surface; the number of the end covers corresponds to that of the metal radiating cores (6);
the heat dissipation surface layer is distributed on the inner side of the end cover in a corrugated manner;
the locking mechanism comprises guide rods (9) positioned on the upper side and the lower side of the end cover (7); a fixed lantern ring (10) is arranged on the guide rod (9); the fixed lantern ring is connected between the guide rods (9) of the upper adjacent side wall and the lower adjacent side wall.
2. A PCB stitching stack arrangement according to claim 1, wherein: the fixed lantern ring consists of two sections of connecting rods (11); the connecting rods are hinged with each other; the other end of the connecting rod is fixed on the guide rod through a nut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010421750.1A CN111565507B (en) | 2020-05-18 | 2020-05-18 | PCB pressfitting lamination structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010421750.1A CN111565507B (en) | 2020-05-18 | 2020-05-18 | PCB pressfitting lamination structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111565507A CN111565507A (en) | 2020-08-21 |
| CN111565507B true CN111565507B (en) | 2022-02-01 |
Family
ID=72072165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010421750.1A Active CN111565507B (en) | 2020-05-18 | 2020-05-18 | PCB pressfitting lamination structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111565507B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1063319A (en) * | 1991-01-15 | 1992-08-05 | 机械电子工业部第十五研究所 | Preparation method of thin copper-clad invar sheets |
| CN205266017U (en) * | 2015-12-29 | 2016-05-25 | 苏州市迪飞特电子有限公司 | Novel multilayer PCB board |
| CN206149582U (en) * | 2016-09-20 | 2017-05-03 | 深圳市迅捷兴科技股份有限公司 | Circuit board heat dissipation structure |
| CN207491307U (en) * | 2017-11-05 | 2018-06-12 | 惠州市聚真电路板有限公司 | A kind of PBC circuit boards |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140048564A (en) * | 2012-10-16 | 2014-04-24 | 삼성전기주식회사 | Structure of heat dissipation substrate having thermal channel and manufacturing method thereof |
-
2020
- 2020-05-18 CN CN202010421750.1A patent/CN111565507B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1063319A (en) * | 1991-01-15 | 1992-08-05 | 机械电子工业部第十五研究所 | Preparation method of thin copper-clad invar sheets |
| CN205266017U (en) * | 2015-12-29 | 2016-05-25 | 苏州市迪飞特电子有限公司 | Novel multilayer PCB board |
| CN206149582U (en) * | 2016-09-20 | 2017-05-03 | 深圳市迅捷兴科技股份有限公司 | Circuit board heat dissipation structure |
| CN207491307U (en) * | 2017-11-05 | 2018-06-12 | 惠州市聚真电路板有限公司 | A kind of PBC circuit boards |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111565507A (en) | 2020-08-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6832436B2 (en) | Method for forming a substructure of a multilayered laminate | |
| US5628852A (en) | Method for manufacturing a polyimide multilayer wiring substrate | |
| US9282626B2 (en) | Printed circuit board and method for manufacturing the same | |
| KR100260347B1 (en) | Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing | |
| JP5404668B2 (en) | Manufacturing method of semiconductor device | |
| US8704100B2 (en) | Heat dissipating substrate and method of manufacturing the same | |
| US20120273116A1 (en) | Heat disspiating substrate and method of manufacturing the same | |
| US20140060896A1 (en) | Printed circuit board | |
| US11699671B2 (en) | Packaged circuit structure including circuit strcutre with antenna | |
| US20210267051A1 (en) | Resin multilayer substrate and electronic apparatus | |
| CN111132476A (en) | Preparation method of double-sided circuit radiating substrate | |
| US20140102766A1 (en) | Multi-layer type coreless substrate and method of manufacturing the same | |
| CN110636690B (en) | Heat dissipation substrate structure and manufacturing method thereof | |
| CN111565507B (en) | PCB pressfitting lamination structure | |
| KR20090094983A (en) | A metal core package and a multilayer printed circuit board including the metal core package and a fabricating method of the same | |
| KR101136396B1 (en) | PCB within cavity and Fabricaring method of the same | |
| KR101824001B1 (en) | Radiating durable printed circuit board and method for manufacturing the same | |
| KR101854626B1 (en) | Method for manufacturing pcb and pcb manufactured using the same | |
| US9801275B2 (en) | Printed circuit board and method of manufacturing the same | |
| KR101414987B1 (en) | Manufacturing method of the multilayered chip inductor | |
| RU60296U1 (en) | FLAT TRANSFORMER | |
| KR100734244B1 (en) | Multilayer printed circuit board and fabricating method thereof | |
| KR101942732B1 (en) | Inductor and manufacturing method of the same | |
| JPH0786711A (en) | Printed wiring board | |
| US20220151072A1 (en) | Composite printed wiring board and method of manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240116 Address after: 519100 Zhuhai Longyu Science and Technology Industrial Park Office Building, Chancheng 1st Road, Qianwu Town, Doumen District, Zhuhai City, Guangdong Province Patentee after: Zhuhai Longyu Technology Co.,Ltd. Address before: 518000 2 / F, 1 / F, 3 / F, No.208, Shangnan East Road, Huangpu village, Shajing Town, Bao'an District, Shenzhen City, Guangdong Province Patentee before: LONGYU ELECTRONICS (SHENZHEN) CO.,LTD. |