CN206048935U - A kind of aluminum-based copper-clad plate with installing hole - Google Patents
A kind of aluminum-based copper-clad plate with installing hole Download PDFInfo
- Publication number
- CN206048935U CN206048935U CN201620839255.1U CN201620839255U CN206048935U CN 206048935 U CN206048935 U CN 206048935U CN 201620839255 U CN201620839255 U CN 201620839255U CN 206048935 U CN206048935 U CN 206048935U
- Authority
- CN
- China
- Prior art keywords
- aluminium base
- copper
- aluminum
- clad plate
- installing hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 41
- 239000004411 aluminium Substances 0.000 claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000011889 copper foil Substances 0.000 claims abstract description 14
- 230000004888 barrier function Effects 0.000 claims abstract description 11
- 239000003822 epoxy resin Substances 0.000 claims abstract description 11
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 11
- 239000003292 glue Substances 0.000 claims abstract description 10
- 238000009434 installation Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 235000010210 aluminium Nutrition 0.000 abstract description 37
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000005452 bending Methods 0.000 abstract description 4
- 239000006185 dispersion Substances 0.000 abstract description 3
- 238000012797 qualification Methods 0.000 abstract description 2
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model discloses a kind of aluminum-based copper-clad plate with installing hole, including copper foil plate, wherein：The aluminum-based copper-clad plate also includes aluminium base and the insulating barrier being arranged between the aluminium base and copper foil plate, wherein, the aluminium base is provided with several installing holes, and the installing hole and is provided with soft epoxy resin glue.This utility model is effectively improved work efficiency, and is reduced production cost, improves the qualification rate of product using the aluminium base with installing hole.In addition, copper foil plate and aluminium base are bonded together by this utility model using soft epoxy resin glue, give the higher heat dispersion of copper-clad plate and pliability, and the aluminium base is using 1060 higher H22 type aluminiums of pliability, improve the higher pliability of copper-clad plate, so which still can ensure that copper foil layer, aluminum base layer and insulating barrier do not rupture after bending 360 °, excellent buckle resistance energy is shown.
Description
Technical field
This utility model is related to a kind of aluminum-based copper-clad plate with installing hole.
Background technology
Stock one of of the copper-clad plate as PCB, which is supporting material to be soaked with resin, and one or both sides are coated with copper
Paper tinsel, a kind of board-like material of Jing hot pressing act primarily as interconnection, insulation and the effect for supporting to pcb board.In lamp lighting
Field, with the fast development of the LED lamp of energy-conserving and environment-protective, also increasingly increases to the demand of copper-clad plate.However, existing cover copper
Plate, in the fabrication process, is required for greatly first being stamped out on insulation board after single cup dolly with model, then plug arrives chassis one by one
In, process is complicated, and production efficiency is low.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, there is provided a kind of simple structure, operating efficiency are high
Aluminum-based copper-clad plate with installing hole.
For achieving the above object, this utility model is employed the following technical solutions：
A kind of aluminum-based copper-clad plate with installing hole, including copper foil plate, wherein：The aluminum-based copper-clad plate also includes aluminium base
And the insulating barrier being arranged between the aluminium base and copper foil plate, wherein, the aluminium base is provided with several installing holes, and
Soft epoxy resin glue is provided with the installing hole.
Preferably：The aluminium base is 1060-H22 type aluminium bases.
Preferably：The insulating barrier is soft epoxy resin glue-line.
Preferably：The thickness of the insulating barrier is 30 μm -80 μm.
The beneficial effects of the utility model are that first laminating completes whole copper-clad plate punching shape again relative in prior art
Into the mode of installing hole, this utility model is effectively improved work efficiency, and is reduced using the aluminium base with installing hole
Production cost, the qualification rate that improve product.Additionally, this utility model adopts soft epoxy resin glue by copper foil plate and aluminium base
It is bonded together, gives the higher heat dispersion of copper-clad plate and pliability, and the aluminium base is using the higher 1060- of pliability
H22 type aluminiums, improve the higher pliability of copper-clad plate so that its still can ensure that copper foil layer, aluminum base layer after 360 ° of bending with
And insulating barrier does not rupture, excellent buckle resistance energy is shown.
Description of the drawings
Fig. 1 shows the structural representation of the aluminum-based copper-clad plate with installing hole described in the utility model.
Specific embodiment
Below in conjunction with the accompanying drawings specific embodiment of the present utility model is described further.
As shown in Figure 1, aluminum-based copper-clad plate described in the utility model, including copper foil plate 1 and it is cascadingly set on
The insulating barrier 2 and aluminium base 3 of 1 lower surface of the copper foil layer, wherein, there are on the aluminium base 3 several to be applied to and install
The installing hole 31 of corresponding components and parts, the installing hole 31 can be formed for example, by the mode of heat stamping and shaping, and the installing hole
Soft epoxy resin glue is filled with 31, further, the aluminum base layer 3 is made using 1060-H22 type aluminiums, the insulation
Layer 2 is formed using the coating of soft epoxy resin glue, and its coating thickness is 30 μm -80 μm.In this utility model, installing hole 31
Middle filled soft epoxy resin glue can using with the soft oxygen resin glue of 2 identical ring of insulating barrier.
This utility model aluminum-based copper-clad plate as above, using the aluminium base with installing hole, it is to avoid entirely covering
It is punched out after the completion of copper coin laminating, effectively improves work efficiency, and reduce production cost, improve the qualified of product
Rate.Additionally, copper foil plate and aluminium base are bonded together by this utility model using soft epoxy resin glue, can give copper-clad plate compared with
High heat dispersion, and the aluminium base is using the higher 1060-H22 type aluminiums of pliability, improves higher flexible of copper-clad plate
Property so which still can ensure that copper foil layer, aluminum base layer and insulating barrier do not rupture after bending 360 °, show excellent bending resistance
Folding endurance energy.
It is only this utility model preferred embodiment in sum, not for limiting practical range of the present utility model.
Equivalence changes and modification that i.e. all contents according to this utility model claim are made, should all belong to skill of the present utility model
Art category.
Claims (1)
1. a kind of aluminum-based copper-clad plate with installing hole, including copper foil plate, it is characterised in that：The aluminum-based copper-clad plate also includes aluminum
Substrate and the insulating barrier being arranged between the aluminium base and copper foil plate, wherein, the aluminium base is provided with several installations
Soft epoxy resin glue is provided with hole, and the installing hole；The aluminium base is 1060-H22 type aluminium bases；The insulating barrier is
Soft epoxy resin glue-line, and its thickness is 30 μm -80 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620839255.1U CN206048935U (en) | 2016-08-03 | 2016-08-03 | A kind of aluminum-based copper-clad plate with installing hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620839255.1U CN206048935U (en) | 2016-08-03 | 2016-08-03 | A kind of aluminum-based copper-clad plate with installing hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206048935U true CN206048935U (en) | 2017-03-29 |
Family
ID=58379998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620839255.1U Expired - Fee Related CN206048935U (en) | 2016-08-03 | 2016-08-03 | A kind of aluminum-based copper-clad plate with installing hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206048935U (en) |
-
2016
- 2016-08-03 CN CN201620839255.1U patent/CN206048935U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190515 Address after: 513000 North of Jinzhu Avenue, Tsinghua Garden, Yinghua Teahouse, Donghua Town, Yingde City, Qingyuan City, Guangdong Province (Block 4) Patentee after: Qingyuan Puno Photoelectric Technology Co.,Ltd. Address before: 510000 New Area of Huashan First Industrial Zone, Huadu District, Guangzhou City, Guangdong Province Patentee before: GUANGZHOU PUNUO TECHNOLOGY CO.,LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170329 |