CN206041944U - Higher harmonics restraines SHF wave band power amplifier module - Google Patents
Higher harmonics restraines SHF wave band power amplifier module Download PDFInfo
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- CN206041944U CN206041944U CN201620969764.6U CN201620969764U CN206041944U CN 206041944 U CN206041944 U CN 206041944U CN 201620969764 U CN201620969764 U CN 201620969764U CN 206041944 U CN206041944 U CN 206041944U
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- closed stub
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- filter
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Abstract
The utility model discloses a higher harmonics restraines SHF wave band power amplifier module belongs to amplifier technical field, including outside paster power amplifier PA module and inside wave filter filter, but have easy debugging, light in weight, small, the reliability is high, the electrical property good, temperature stability is good, electrical property advantages such as good, the mass production with low costs of uniformity in batches, the communication, satellite communication etc. That are applicable to corresponding microwave frequencies have in harsh occasion that requires and the corresponding system volume, electrical property, temperature stability and reliability.
Description
Technical field
The utility model is related to amplifier technique field, and particularly a kind of higher harmonics suppresses SHF band power amplifiers moulds
Block.
Background technology
In recent years, as the miniaturization of mobile communication, satellite communication and Defensive Avionics System is developed rapidly, high-performance,
Low cost and miniaturization have become the developing direction of microwave current/RF application, the performance, chi to microwave power amplifier
Very little, reliability and cost are put forward higher requirement.Describe this component capabilities refer mainly to indicate：Operating frequency range,
Power output gain, gain noise index, input and output OIP3, voltage standing wave ratio etc..
LTCC is a kind of Electronic Encapsulating Technology, using multi-layer ceramics technology, can be built in passive element
Inside medium substrate, while active component can also be mounted on substrate surface makes passive/active integrated functional module.
LTCC technology is in cost, integration packaging, wiring live width and distance between centers of tracks, low impedance metal, design diversity and flexibility and height
The aspects such as frequency performance all show many merits, it has also become the mainstream technology of passive integration.Which has high q-factor, is easy to embedded nothing
Source device, thermal diffusivity are good, and reliability is high, high temperature resistant, rush the advantages of shaking, using LTCC technology, can be very good to process size
Little, high precision, tight type are good, and little microwave device is lost.
Utility model content
The purpose of this utility model is to provide a kind of higher harmonics to suppress SHF band power amplifiers modules, realizes one
The LTCC microwave modules for being integrated with wave filter and miniature power amplifier are planted, it is high, electrical with small volume, lightweight, reliability
The advantages of excellent, easy to use, the applied widely, high yield rate of energy, good batch uniformity, low cost.
For achieving the above object, the utility model is employed the following technical solutions：
A kind of higher harmonics suppresses SHF band power amplifiers modules, including outside paster power amplifier PA modules and internal filtering
Device Filter, outside paster power amplifier PA modules are located at the upper surface of filters internal Filter, a left side of filters internal Filter
Side is provided with signal input part P1 and signal output part P2, the trailing flank of filters internal Filter be provided with power input P4 and
The leading flank of earth terminal P3, filters internal Filter is provided with earth terminal P5 and earth terminal P6, the right side of filters internal Filter
Side is provided with free end P7 and free end P8, and the left side of the outside paster power amplifier PA modules is provided with amplifier in input,
The back of the outside paster power amplifier PA modules is provided with amplifier feeder ear VDD, the right of the outside paster power amplifier PA modules
Amplifier out output is provided with, the front of the outside paster power amplifier PA modules is provided with amplifier ground GND；
Filters internal Filter include earth plate shield1, the first resonant layer, the second resonant layer, zigzag configuration layer,
Lower earth plate shield2, through hole Via1, through hole Via2, through hole Via3 and through hole Via4, upper earth plate shield1, the first resonance
, for setting gradually from top to bottom, through hole Via1 is located at internal filter for layer, the second resonant layer, zigzag configuration layer and lower earth plate shield2
The left side of ripple device Filter, through hole Via2 are located at filters internal located at the back of filters internal Filter, through hole Via3
The front of Filter, through hole Via1 is located at the right of filters internal Filter；
First resonant layer includes closed stub L5, closed stub L6, closed stub L7, closed stub L8, company
Wiring L-connet, outputting inductance Lout and input inductance Lin, closed stub L5, closed stub L6, closed stub L7
Be interval setting successively from left to right with closed stub L8, closed stub L5, closed stub L6, closed stub L7 and
The rear end of closed stub L8 connects the upper earth plate shield1 by through hole Via2, and the left side of closed stub L5 sets
There are outputting inductance Lout, outputting inductance Lout to be connected with closed stub L5, the back of outputting inductance Lout is provided with input inductance
Lin, input inductance Lin connect amplifier in input by through hole Via1, and input inductance Lin is also connected with signal input part
P1, is provided with connecting line L-connet, connecting line L-connet connection closed stub L8, connecting line on the right of closed stub L8
L-connet also connects amplifier out output by through hole Via4；
Second resonant layer includes closed stub L1, closed stub L2, closed stub L3 and closed stub L4, short
Short out transversal L1, closed stub L2, closed stub L3 and closed stub L4 are interval setting successively from left to right, short circuit
, located at the underface of closed stub L5, located at the underface of closed stub L6, short circuit is short for closed stub L2 for stub L1
, located at the underface of closed stub L7, closed stub L4 is located at the underface of closed stub L8, short-circuit cutting back for transversal L3
The front end of line L1, closed stub L2, closed stub L3 and closed stub L4 is by the lower earth plate of through hole Via3 connections
shield2；
Zigzag configuration layer includes that zigzag configuration Z-type, earth terminal P3 connect earth terminal P6 by zigzag configuration Z-type.
It is the signal input part P1, the signal output part P2, the power input P4, the earth terminal P3, described
Earth terminal P5, the earth terminal P6, the free end P7 and the free end P8 are external package leads.
It is the signal input part P1, the signal output part P2, the power input P4, the earth terminal P3, described
The upper end of earth terminal P5, the earth terminal P6, the free end P7 and the free end P8 is equipped with internally wave filter
The bending part that the side of Filter upper surfaces extends, the signal input part P1, the signal output part P2, the power input
End P4, the earth terminal P3, the earth terminal P5, the earth terminal P6, the lower end of the free end P7 and free end P8
It is equipped with the bending part that the side of internally wave filter Filter lower surfaces extends.
Outside both the paster power amplifier PA modules and the filters internal Filter are to be realized by LTCC technology
Integral packaging structure.
A kind of higher harmonics suppresses SHF band power amplifiers module to make using LTCC techniques.
Model WFD027035-P27 of the outside paster power amplifier PA modules.
The closed stub L1 and the closed stub L5 constitute the first resonator, the closed stub L2 and
Closed stub L6 constitutes the second resonator, and the closed stub L3 and closed stub L7 constitute the 3rd resonator,
The closed stub L4 and closed stub L8 constitute the 4th resonator.
A kind of higher harmonics described in the utility model suppresses SHF band power amplifiers modules, realizes one kind and is integrated with
The LTCC microwave modules of wave filter and miniature power amplifier, with small volume, high lightweight, reliability, excellent electrical property, make
The advantages of with convenient, applied widely, high yield rate, good batch uniformity, low cost.
Description of the drawings
Fig. 1 is schematic diagram block diagram of the present utility model；
Fig. 2 is external structure schematic diagram of the present utility model；
Fig. 3 is the internal structure schematic diagram of filters internal Filte of the present utility model.
Specific embodiment
A kind of higher harmonics as Figure 1-3 suppresses SHF band power amplifiers modules, including outside paster power amplifier PA moulds
Block and filters internal Filter, outside paster power amplifier PA modules are located at the upper surface of filters internal Filter, internal to filter
The left surface of device Filter is provided with signal input part P1 and signal output part P2, and the trailing flank of filters internal Filter is provided with electricity
Source input P4 and earth terminal P3, the leading flank of filters internal Filter are provided with earth terminal P5 and earth terminal P6, internal filtering
The right flank of device Filter is provided with free end P7 and free end P8, and the left side of the outside paster power amplifier PA modules is provided with amplifier
Input input, the back of the outside paster power amplifier PA modules are provided with amplifier feeder ear VDD, the outside paster power amplifier
Amplifier out output is provided with the right of PA modules, and the front of the outside paster power amplifier PA modules is provided with amplifier ground
End GND；
Filters internal Filter include earth plate shield1, the first resonant layer, the second resonant layer, zigzag configuration layer,
Lower earth plate shield2, through hole Via1, through hole Via2, through hole Via3 and through hole Via4, upper earth plate shield1, the first resonance
, for setting gradually from top to bottom, through hole Via1 is located at internal filter for layer, the second resonant layer, zigzag configuration layer and lower earth plate shield2
The left side of ripple device Filter, through hole Via2 are located at filters internal located at the back of filters internal Filter, through hole Via3
The front of Filter, through hole Via1 is located at the right of filters internal Filter；
First resonant layer includes closed stub L5, closed stub L6, closed stub L7, closed stub L8, company
Wiring L-connet, outputting inductance Lout and input inductance Lin, closed stub L5, closed stub L6, closed stub L7
Be interval setting successively from left to right with closed stub L8, closed stub L5, closed stub L6, closed stub L7 and
The rear end of closed stub L8 connects the upper earth plate shield1 by through hole Via2, and the left side of closed stub L5 sets
There are outputting inductance Lout, outputting inductance Lout to be connected with closed stub L5, the back of outputting inductance Lout is provided with input inductance
Lin, input inductance Lin connect amplifier in input by through hole Via1, and input inductance Lin is also connected with signal input part
P1, is provided with connecting line L-connet, connecting line L-connet connection closed stub L8, connecting line on the right of closed stub L8
L-connet also connects amplifier out output by through hole Via4；
Second resonant layer includes closed stub L1, closed stub L2, closed stub L3 and closed stub L4, short
Short out transversal L1, closed stub L2, closed stub L3 and closed stub L4 are interval setting successively from left to right, short circuit
, located at the underface of closed stub L5, located at the underface of closed stub L6, short circuit is short for closed stub L2 for stub L1
, located at the underface of closed stub L7, closed stub L4 is located at the underface of closed stub L8, short-circuit cutting back for transversal L3
The front end of line L1, closed stub L2, closed stub L3 and closed stub L4 is by the lower earth plate of through hole Via3 connections
shield2；
Zigzag configuration layer includes that zigzag configuration Z-type, earth terminal P3 connect earth terminal P6 by zigzag configuration Z-type.
It is the signal input part P1, the signal output part P2, the power input P4, the earth terminal P3, described
Earth terminal P5, the earth terminal P6, the free end P7 and the free end P8 are external package leads.
It is the signal input part P1, the signal output part P2, the power input P4, the earth terminal P3, described
The upper end of earth terminal P5, the earth terminal P6, the free end P7 and the free end P8 is equipped with internally wave filter
The bending part that the side of Filter upper surfaces extends, the signal input part P1, the signal output part P2, the power input
End P4, the earth terminal P3, the earth terminal P5, the earth terminal P6, the lower end of the free end P7 and free end P8
It is equipped with the bending part that the side of internally wave filter Filter lower surfaces extends.
Outside both the paster power amplifier PA modules and the filters internal Filter are to be realized by LTCC technology
Integral packaging structure.
A kind of higher harmonics suppresses SHF band power amplifiers module to make using LTCC techniques.
Model WFD027035-P27 of the outside paster power amplifier PA modules.
The closed stub L1 and the closed stub L5 constitute the first resonator, the closed stub L2 and
Closed stub L6 constitutes the second resonator, and the closed stub L3 and closed stub L7 constitute the 3rd resonator,
The closed stub L4 and closed stub L8 constitute the 4th resonator.
The outside paster power amplifier PA modules are WFD027035-P27 cake cores, are a 2.7-3.5GHz drive amplifications
Device, is fabricated by using GaAs heterojunction transistor (HFET) technique of 0.5um coral length.The chip single supply works, work
Voltage VDs=9V, can provide the power output of 27.5dBm, linear gain 27dB, exemplary currents 350mA in 2.7-3.5GHz.
The chip is mainly used in microwave transmitting and receiving component, radio communication etc..
A kind of higher harmonics of the utility model suppresses SHF band power amplifiers modules, and its working frequency range is 3.1-3.4GHz,
Size is only 3.4mm*4.1mm*1.5mm.
A kind of higher harmonics described in the utility model suppresses SHF band power amplifiers modules, realizes one kind and is integrated with
The LTCC microwave modules of wave filter and miniature power amplifier, with small volume, high lightweight, reliability, excellent electrical property, make
The advantages of with convenient, applied widely, high yield rate, good batch uniformity, low cost.The utility model has easily debugging, weight
Amount is light, small volume, reliability height, good electrical property, good temperature stability, good electrical property batch uniformity, low cost, can be in high volume
The advantages of production, it is adaptable to which the communication of corresponding microwave frequency band, satellite communication etc. are to volume, electrical property, temperature stability and reliability
During property has the occasion and corresponding system of rigors.
Claims (7)
1. a kind of higher harmonics suppresses SHF band power amplifiers modules, it is characterised in that：Including outside paster power amplifier PA modules and
Filters internal Filter, outside paster power amplifier PA modules are located at the upper surface of filters internal Filter, filters internal
The left surface of Filter is provided with signal input part P1 and signal output part P2, and the trailing flank of filters internal Filter is provided with power supply
The leading flank of input P4 and earth terminal P3, filters internal Filter is provided with earth terminal P5 and earth terminal P6, filters internal
The right flank of Filter is provided with free end P7 and free end P8, and it is defeated that the left side of the outside paster power amplifier PA modules is provided with amplifier
Enter and hold input, the back of the outside paster power amplifier PA modules is provided with amplifier feeder ear VDD, the outside paster power amplifier PA
Amplifier out output is provided with the right of module, and the front of the outside paster power amplifier PA modules is provided with amplifier ground
GND；
Filters internal Filter include earth plate shield1, the first resonant layer, the second resonant layer, zigzag configuration layer, under connect
Floor shield2, through hole Via1, through hole Via2, through hole Via3 and through hole Via4, upper earth plate shield1, the first resonant layer,
, for setting gradually from top to bottom, through hole Via1 is located at internal filtering for second resonant layer, zigzag configuration layer and lower earth plate shield2
The left side of device Filter, through hole Via2 are located at filters internal located at the back of filters internal Filter, through hole Via3
The front of Filter, through hole Via1 is located at the right of filters internal Filter；
First resonant layer includes closed stub L5, closed stub L6, closed stub L7, closed stub L8, connecting line
L-connet, outputting inductance Lout and input inductance Lin, closed stub L5, closed stub L6, closed stub L7 and short
Short out transversal L8 is interval setting successively from left to right, closed stub L5, closed stub L6, closed stub L7 and short circuit
The rear end of stub L8 connects the upper earth plate shield1 by through hole Via2, and the left side of closed stub L5 is provided with defeated
Go out inductance Lout, outputting inductance Lout is connected with closed stub L5, the back of outputting inductance Lout is provided with input inductance Lin,
Input inductance Lin connects amplifier in input by through hole Via1, and input inductance Lin is also connected with signal input part P1, short
Connecting line L-connet, connecting line L-connet connection closed stub L8, connecting line L- is provided with the right of short out transversal L8
Connet also connects amplifier out output by through hole Via4；
Second resonant layer includes closed stub L1, closed stub L2, closed stub L3 and closed stub L4, and short circuit is short
Transversal L1, closed stub L2, closed stub L3 and closed stub L4 are interval setting successively from left to right, short-circuit cutting back
, located at the underface of closed stub L5, closed stub L2 is located at the underface of closed stub L6, closed stub for line L1
L3 located at closed stub L7 underface, closed stub L4 located at closed stub L8 underface, closed stub L1,
The front end of closed stub L2, closed stub L3 and closed stub L4 is by the lower earth plate of through hole Via3 connections
shield2；
Zigzag configuration layer includes that zigzag configuration Z-type, earth terminal P3 connect earth terminal P6 by zigzag configuration Z-type.
2. a kind of higher harmonics as claimed in claim 1 suppresses SHF band power amplifiers modules, it is characterised in that：The letter
Number input P1, the signal output part P2, the power input P4, the earth terminal P3, the earth terminal P5, described connect
Ground terminal P6, the free end P7 and the free end P8 are external package leads.
3. a kind of higher harmonics as claimed in claim 1 suppresses SHF band power amplifiers modules, it is characterised in that：The letter
Number input P1, the signal output part P2, the power input P4, the earth terminal P3, the earth terminal P5, described connect
The upper end of ground terminal P6, the free end P7 and the free end P8 is equipped with the side of internally wave filter Filter upper surfaces and prolongs
The bending part stretched, the signal input part P1, the signal output part P2, the power input P4, the earth terminal P3, institute
The lower end for stating earth terminal P5, the earth terminal P6, the free end P7 and the free end P8 is equipped with internally wave filter
The bending part that the side of Filter lower surfaces extends.
4. a kind of higher harmonics as claimed in claim 1 suppresses SHF band power amplifiers modules, it is characterised in that：It is described outer
Both portion's paster power amplifier PA modules and the filters internal Filter are the integral packaging structure realized by LTCC technology.
5. a kind of higher harmonics as claimed in claim 1 suppresses SHF band power amplifiers modules, it is characterised in that：Described one
Planting higher harmonics suppresses SHF band power amplifiers module to make using LTCC techniques.
6. a kind of higher harmonics as claimed in claim 1 suppresses SHF band power amplifiers modules, it is characterised in that：It is described outer
Model WFD027035-P27 of portion's paster power amplifier PA modules.
7. a kind of higher harmonics as claimed in claim 1 suppresses SHF band power amplifiers modules, it is characterised in that：It is described short
Short out transversal L1 and the closed stub L5 constitute the first resonator, the closed stub L2 and closed stub L6 structures
Into the second resonator, the closed stub L3 and closed stub L7 constitutes the 3rd resonator, the closed stub
L4 and closed stub L8 constitute the 4th resonator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620969764.6U CN206041944U (en) | 2016-08-28 | 2016-08-28 | Higher harmonics restraines SHF wave band power amplifier module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620969764.6U CN206041944U (en) | 2016-08-28 | 2016-08-28 | Higher harmonics restraines SHF wave band power amplifier module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206041944U true CN206041944U (en) | 2017-03-22 |
Family
ID=58301608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620969764.6U Withdrawn - After Issue CN206041944U (en) | 2016-08-28 | 2016-08-28 | Higher harmonics restraines SHF wave band power amplifier module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206041944U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106230396A (en) * | 2016-08-28 | 2016-12-14 | 戴永胜 | A kind of higher harmonics suppression SHF band power amplifiers module |
-
2016
- 2016-08-28 CN CN201620969764.6U patent/CN206041944U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106230396A (en) * | 2016-08-28 | 2016-12-14 | 戴永胜 | A kind of higher harmonics suppression SHF band power amplifiers module |
| CN106230396B (en) * | 2016-08-28 | 2019-05-03 | 深圳波而特电子科技有限公司 | A kind of higher harmonics inhibition SHF band power amplifiers module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170512 Address after: Two road 518101 Guangdong city of Shenzhen province Baoan District Shiyan Street Shilong Industrial community aucan Industrial Park No. 1 Building 8 Building 5 floor Patentee after: Shenzhen wonder Electronic Technology Co., Ltd. Address before: Tangshan street Yee Road Nanjing city Jiangsu province 210094 No. 588 kylin villa 28 unit 602 Co-patentee before: Chen Xiangzhi Patentee before: Dai Yongsheng Co-patentee before: Yang Maoya |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20170322 Effective date of abandoning: 20190503 |