CN205564930U - Miniature pair of pass filter of SHF wave band - Google Patents
Miniature pair of pass filter of SHF wave band Download PDFInfo
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Abstract
The utility model discloses a miniature pair of pass filter of SHF wave band relates to a two pass filter, including T type matching circuit, a microwave filter and the 2nd microwave filter, T type matching circuit comprises folding strip line, and microwave filter includes the output port of 50 ohm of characteristic impedances of surface mounting and the resonance unit that constitutes with the interdigital line of electric capacity loading, and above -mentioned structure all adopts multilayer low temperature to burn ceramic technology altogether and realizes. The utility model has the advantages of easy debugging, light in weight, small, but the reliability is high, the electrical property good, temperature stability is good, electrical property good, the with low costs mass production of uniformity in batches, the communication, satellite communication etc. That are applicable to corresponding microwave frequencies have in harsh occasion that requires and the corresponding system volume, electrical property, temperature stability and reliability.
Description
Technical field
This utility model relates to a kind of double-passband filter, particularly a kind of SHF wave band miniature dual-passband filtering
Device.
Background technology
In recent years, along with the developing rapidly of miniaturization of mobile communication, satellite communication and Defensive Avionics System,
High-performance, low cost and miniaturization have become as the developing direction of microwave current/RF application, to duplexer
Performance, size, reliability and cost are all had higher requirement.Referring mainly to of this component capabilities is described
Indicate: operating frequency, isolation, insertion loss, degree of stability etc..The wave filter of different frequency is passed through T
Type knot coupling parallel connection, it is possible to achieve double-passband filter.
LTCC is a kind of Electronic Encapsulating Technology, uses multi-layer ceramics technology, it is possible to by passive element
Being built in inside medium substrate, active component can also be mounted on substrate surface makes passive/active collection simultaneously
The functional module become.LTCC technology is at cost, integration packaging, wiring live width and distance between centers of tracks, low impedance metal
Change, design diversity and the aspect such as motility and high frequency performance all show many merits, it has also become passive collection
The mainstream technology become.It has high q-factor, it is simple to embedded passive device, and thermal diffusivity is good, and reliability is high, resistance to
High temperature, rushes the advantages such as shake, utilizes LTCC technology, can well process size little, and precision is high, closely
Type is good, and little microwave device is lost.Owing to LTCC technology has the integrated advantage of 3 D stereo, at microwave frequency band
It is widely used for manufacturing various microwave passive components, it is achieved passive element highly integrated.Based on LTCC technique
Stack technology, it is possible to achieve three-dimensionally integrated so that various micro microwave filter have size little, weight
Amount is light, performance is excellent, reliability is high, batch production performance concordance is good and the plurality of advantages such as low cost, utilization
Its three-dimensionally integrated construction features, a kind of SHF wave band miniature double-passband filter.
Utility model content
The purpose of this utility model is to provide a kind of SHF wave band miniature double-passband filter, uses LTCC technology
Two microwave filters are linked together, it is achieved volume is little, lightweight, reliability is high, excellent electrical property,
Easy to use, applied widely, yield rate is high, concordance is good in batches, cost is low, temperature performance is stable
Miniature double-passband filter.
For achieving the above object, this utility model is by the following technical solutions:
A kind of SHF wave band miniature double-passband filter, it includes T-shaped match circuit, the first microwave filter
With the second microwave filter；
The T-shaped structure strip line that T-shaped match circuit is formed by strip transmission line, T-shaped match circuit includes
T-port1 port, T-port2 port and Input port, T-port1 port is with first input port P1 even
Connecing, T-port2 and the second input port P3 connects；
The electrical length of described T-port1 port is:
1/4λ2；
λ 2 is the wavelength corresponding to the second microwave filter mid frequency；
Characteristic impedance is 50 ohm；
The electrical length of described T-port2 port is:
1/4λ1；
λ 1 is the wavelength corresponding to the first microwave filter mid frequency；
From impedance transformation formula Zin=Z02/Zin=Z02/ZL, at the stopband of wave filter 1, ZL1 → 0,
Then Zin1 → infinity, now wave filter 1 approximation open circuit, be preferably minimized wave filter 2 impact, wave filter
2 analyze method is similar to.
First microwave filter includes that first input port P1, the first input inductance Lin1, first order parallel connection are humorous
Shake unit, second level parallel resonance unit, third level parallel resonance unit, fourth stage parallel resonance unit,
Level V parallel resonance unit, the first outputting inductance Lout1, the first Z-shaped interstage coupling strip line Z-shape1,
First output port P2 and earth terminal；First input port P1 and the first output port P2 are respectively arranged on first
The left and right sides of microwave filter；
First order parallel resonance unit includes main resonance level L1, metal column Via1 and loading capacitance C1 over the ground,
Main resonance level L1 connects loading capacitance C1 over the ground by metal column Via1, and loading capacitance C1 is located at main humorous over the ground
Shake the top of grade L1；
Second level parallel resonance unit includes main resonance level L2, metal column Via2 and loading capacitance C2 over the ground,
Main resonance level L2 connects loading capacitance C2 over the ground by metal column Via2, and loading capacitance C2 is located at main humorous over the ground
Shake the lower section of grade L2；
Third level parallel resonance unit includes main resonance level L3, metal column Via3 and loading capacitance C3 over the ground,
Main resonance level L3 connects loading capacitance C3 over the ground by metal column Via3, and loading capacitance C3 is located at main humorous over the ground
Shake the top of grade L3；
Fourth stage parallel resonance unit includes main resonance level L4, metal column Via4 and loading capacitance C4 over the ground,
Main resonance level L4 connects loading capacitance C4 over the ground by metal column Via4, and loading capacitance C4 is located at main humorous over the ground
Shake the top of grade L4；
Level V parallel resonance unit includes main resonance level L5, metal column Via5 and loading capacitance C5 over the ground,
Main resonance level L5 connects loading capacitance C5 over the ground by metal column Via5, and loading capacitance C5 is positioned at main humorous over the ground
Shake the top of grade L5；
Main resonance level L1, main resonance level L3 and main resonance level L5 are front end ground connection, main resonance level L2 and master
Resonance level L4 is rear end ground connection；
Z-type cross-couplings line is located at main resonance level L1, main resonance level L2, main resonance level L3, main resonance level L4
With the underface of main resonance level L5, the equal ground connection in two ends of described Z-type cross-couplings line；
First input inductance Lin1 is connected with first input port P1, the first outputting inductance Lout1 and first
Output port P2 connects；
Second microwave filter F2 include the second input port P3, second input inductance Lin2, the 6th grade also
Connection resonant element, the 7th grade of parallel resonance unit, the 8th grade of parallel resonance unit, the 9th grade of parallel resonance list
Unit, the tenth grade of parallel resonance unit, the tenth one-level parallel resonance unit, the second outputting inductance Lout2, second
Z-shaped interstage coupling strip line Z-shape2, the second output port P4 and earth terminal；Described first output port
P2 is connected with described second output port P4；
6th grade of parallel resonance unit includes main resonance level L6, metal column Via6 and loading capacitance C6 over the ground,
Main resonance level L6 connects loading capacitance 6 over the ground by metal column Via6, and loading capacitance C6 is located at main humorous over the ground
Shake the top of grade L6；
7th grade of parallel resonance unit includes main resonance level L7, metal column Via7 and loading capacitance C7 over the ground,
Main resonance level L7 connects loading capacitance 7 over the ground by metal column Via7, and loading capacitance C7 is located at main humorous over the ground
Shake the lower section of grade L7；
8th grade of parallel resonance unit includes main resonance level L8, metal column Via8 and loading capacitance C8 over the ground,
Main resonance level L8 connects loading capacitance 8 over the ground by metal column Via8, and loading capacitance C8 is located at main humorous over the ground
Shake the top of grade L8；
9th grade of parallel resonance unit includes main resonance level L9, metal column Via9 and loading capacitance C9 over the ground,
Main resonance level L9 connects loading capacitance 9 over the ground by metal column Via9, and loading capacitance C9 is located at main humorous over the ground
Shake the top of grade L9；
Tenth grade of parallel resonance unit includes main resonance level L10, metal column Via10 and loading capacitance C10 over the ground,
Main resonance level L10 connects loading capacitance 10 over the ground by metal column Via10, and loading capacitance C10 is located at over the ground
The top of main resonance level L10；
Tenth one-level parallel resonance unit includes main resonance level L11, metal column Via11 and loading capacitance over the ground
C11, main resonance level L11 connects loading capacitance 11 over the ground, over the ground loading capacitance C11 by metal column Via11
It is located at the top of main resonance level L11；
Main resonance level L6, main resonance level L8 and main resonance level L10 be front end ground connection, main resonance level L7,
Main resonance level L9 and main resonance level L11 are rear end ground connection；Z-type cross-couplings line be located at main resonance level L6,
Main resonance level L7, main resonance level L8, main resonance level L9, main resonance level L10 and main resonance level L11 just under
Side, the equal ground connection in Z-type cross-couplings line two ends；
Second input inductance Lin2 and the second input port P3 connects, the first outputting inductance Lout2 and second
Output port P4 connects.
Described a kind of SHF wave band miniature double-passband filter uses multilamellar LTCC technique to make.
First input port P1, the second input port P3 connection, the first output port P2 and the second outfan
Mouth P4 is surface-pasted 50 ohmage ports.
A kind of SHF wave band miniature double-passband filter described in the utility model, uses LTCC technology by two
Microwave filter links together, it is achieved volume is little, lightweight, reliability is high, excellent electrical property, use
Convenient, applied widely, that yield rate is high, concordance is good in batches, cost is low, temperature performance is stable is miniature
Double-passband filter；This utility model uses low-loss low-temperature co-burning ceramic material and 3 D stereo integrated, institute
The remarkable advantage brought is: smooth in (1) band；(2) signal waveform that different frequency is identical can be produced；
(3) volume is little, lightweight, reliability is high；(4) excellent electrical property；(5) circuit realiration simple in construction,
Can realize producing in enormous quantities；(6) low cost.
Accompanying drawing explanation
Fig. 1 is the contour structures schematic diagram of this utility model a kind of SHF wave band miniature double-passband filter；
In Fig. 2 this utility model a kind of SHF wave band miniature double-passband filter outside the first microwave filter
Shape and internal structure schematic diagram；
In Fig. 3 this utility model a kind of SHF wave band miniature double-passband filter outside the second microwave filter
Shape and internal structure schematic diagram；
Fig. 4 is this utility model one SHF wave band miniature double-passband filter output port amplitude frequency curve figure；
Fig. 5 is this utility model one SHF wave band miniature double-passband filter input port return loss plot
Figure.
Detailed description of the invention
A kind of SHF wave band miniature double-passband filter as shown in Figure 1, it include T-shaped match circuit,
One microwave filter and the second microwave filter；
The T-shaped structure strip line that T-shaped match circuit is formed by strip transmission line, T-shaped match circuit includes
T-port1 port, T-port2 port and Input port, T-port1 port is with first input port P1 even
Connecing, T-port2 and the second input port P3 connects；
The electrical length of described T-port1 port is:
1/4λ2；
λ 2 is the wavelength corresponding to the second microwave filter mid frequency；
Characteristic impedance is 50 ohm；
The electrical length of described T-port2 port is:
1/4λ1；
λ 1 is the wavelength corresponding to the first microwave filter mid frequency；
From impedance transformation formula Zin=Z02/Zin=Z02/ZL, at the stopband of wave filter 1, ZL1 → 0,
Then Zin1 → infinity, now wave filter 1 approximation open circuit, be preferably minimized wave filter 2 impact, wave filter
2 analyze method is similar to.
The first microwave filter as shown in Figure 2 include first input port P1, first input inductance Lin1,
First order parallel resonance unit, second level parallel resonance unit, third level parallel resonance unit, the fourth stage are also
Connection resonant element, level V parallel resonance unit, the first outputting inductance Lout1, the first Z-shaped interstage coupling band
Shape line Z-shape1, the first output port P2 and earth terminal；First input port P1 and the first output port
P2 is respectively arranged on the left and right sides of the first microwave filter；
First order parallel resonance unit includes main resonance level L1, metal column Via1 and loading capacitance C1 over the ground,
Main resonance level L1 connects loading capacitance C1 over the ground by metal column Via1, and loading capacitance C1 is located at main humorous over the ground
Shake the top of grade L1；
Second level parallel resonance unit includes main resonance level L2, metal column Via2 and loading capacitance C2 over the ground,
Main resonance level L2 connects loading capacitance C2 over the ground by metal column Via2, and loading capacitance C2 is located at main humorous over the ground
Shake the lower section of grade L2；
Third level parallel resonance unit includes main resonance level L3, metal column Via3 and loading capacitance C3 over the ground,
Main resonance level L3 connects loading capacitance C3 over the ground by metal column Via3, and loading capacitance C3 is located at main humorous over the ground
Shake the top of grade L3；
Fourth stage parallel resonance unit includes main resonance level L4, metal column Via4 and loading capacitance C4 over the ground,
Main resonance level L4 connects loading capacitance C4 over the ground by metal column Via4, and loading capacitance C4 is located at main humorous over the ground
Shake the top of grade L4；
Level V parallel resonance unit includes main resonance level L5, metal column Via5 and loading capacitance C5 over the ground,
Main resonance level L5 connects loading capacitance C5 over the ground by metal column Via5, and loading capacitance C5 is positioned at main humorous over the ground
Shake the top of grade L5；
Main resonance level L1, main resonance level L3 and main resonance level L5 are front end ground connection, main resonance level L2 and master
Resonance level L4 is rear end ground connection；
Z-type cross-couplings line is located at main resonance level L1, main resonance level L2, main resonance level L3, main resonance level L4
With the underface of main resonance level L5, the equal ground connection in two ends of described Z-type cross-couplings line；
First input inductance Lin1 is connected with first input port P1, the first outputting inductance Lout1 outfan
Mouth P2 connects；
The second microwave filter F2 as shown in Figure 3 include the second input port P3, second input inductance Lin2,
6th grade of parallel resonance unit, the 7th grade of parallel resonance unit, the 8th grade of parallel resonance unit, the 9th grade also
Connection resonant element, the tenth grade of parallel resonance unit, the tenth one-level parallel resonance unit, the second outputting inductance
Lout2, the second Z-shaped interstage coupling strip line Z-shape2, the second output port P4 and earth terminal；Described
First output port P2 is connected with described second output port P4；
6th grade of parallel resonance unit includes main resonance level L6, metal column Via6 and loading capacitance C6 over the ground,
Main resonance level L6 connects loading capacitance 6 over the ground by metal column Via6, and loading capacitance C6 is located at main humorous over the ground
Shake the top of grade L6；
7th grade of parallel resonance unit includes main resonance level L7, metal column Via7 and loading capacitance C7 over the ground,
Main resonance level L7 connects loading capacitance 7 over the ground by metal column Via7, and loading capacitance C7 is located at main humorous over the ground
Shake the lower section of grade L7；
8th grade of parallel resonance unit includes main resonance level L8, metal column Via8 and loading capacitance C8 over the ground,
Main resonance level L8 connects loading capacitance 8 over the ground by metal column Via8, and loading capacitance C8 is located at main humorous over the ground
Shake the top of grade L8；
9th grade of parallel resonance unit includes main resonance level L9, metal column Via9 and loading capacitance C9 over the ground,
Main resonance level L9 connects loading capacitance 9 over the ground by metal column Via9, and loading capacitance C9 is located at main humorous over the ground
Shake the top of grade L9；
Tenth grade of parallel resonance unit includes main resonance level L10, metal column Via10 and loading capacitance C10 over the ground,
Main resonance level L10 connects loading capacitance 10 over the ground by metal column Via10, and loading capacitance C10 is located at over the ground
The top of main resonance level L10；
Tenth one-level parallel resonance unit includes main resonance level L11, metal column Via11 and loading capacitance over the ground
C11, main resonance level L11 connects loading capacitance 11 over the ground, over the ground loading capacitance C11 by metal column Via11
It is located at the top of main resonance level L11；
Main resonance level L6, main resonance level L8 and main resonance level L10 be front end ground connection, main resonance level L7,
Main resonance level L9 and main resonance level L11 are rear end ground connection；Z-type cross-couplings line be located at main resonance level L6,
Main resonance level L7, main resonance level L8, main resonance level L9, main resonance level L10 and main resonance level L11 just under
Side, the equal ground connection in Z-type cross-couplings line two ends；
Second input inductance Lin2 and the second input port P3 connects, the first outputting inductance Lout2 and second
Output port P4 connects.
Described a kind of SHF wave band miniature double-passband filter uses multilamellar LTCC technique to make.
First input port P1, the second input port P3 connection, the first output port P2 and the second outfan
Mouth P4 is surface-pasted 50 ohmage ports.
A kind of SHF wave band miniature double-passband filter shown in this utility model, owing to being employing multilamellar low temperature
Common burning porcelain technique realize, its low-temperature co-burning ceramic material and metallic pattern sinter at a temperature of about 900 DEG C and
Become, so having extreme high reliability and temperature stability, owing to structure uses 3 D stereo integrated and many
Layer foldable structure and outer surface metallic shield are grounded and encapsulate, so that volume significantly reduces.
This utility model one SHF wave band miniature double-passband filter, the size of two microwave filters is
3.2mm×2.5mm×1.2mm.As shown in Figure 4 and Figure 5, passband is distributed as 3GHz～4.8GHz its performance
With 7.5GHz～10GHz, input port return loss is better than 15dB, and output port insertion loss is better than 1.6dB.
Claims (3)
1. a SHF wave band miniature double-passband filter, it is characterised in that: it includes T-shaped match circuit, the first microwave filtering
Device and the second microwave filter；
The T-shaped structure strip line that T-shaped match circuit is formed by strip transmission line, T-shaped match circuit include T-port1 port,
T-port2 port and Input port, T-port1 port is connected with first input port P1, T-port2 and the second input port P3
Connect；
The electrical length of described T-port1 port is:
1/4λ2；
λ 2 is the wavelength corresponding to the second microwave filter mid frequency；
Characteristic impedance is 50 ohm；
The electrical length of described T-port2 port is:
1/4λ1；
λ 1 is the wavelength corresponding to the first microwave filter mid frequency；
First microwave filter include first input port P1, first input inductance Lin1, first order parallel resonance unit, second
Level parallel resonance unit, third level parallel resonance unit, fourth stage parallel resonance unit, level V parallel resonance unit, first
Outputting inductance Lout1, the first Z-shaped interstage coupling strip line Z-shape1, the first output port P2 and earth terminal；First input
Port P1 and the first output port P2 is respectively arranged on the left and right sides of the first microwave filter；
First order parallel resonance unit includes main resonance level L1, metal column Via1 and loading capacitance C1, main resonance level L1 over the ground
Connecting loading capacitance C1 over the ground by metal column Via1, loading capacitance C1 is located at the top of main resonance level L1 over the ground；
Second level parallel resonance unit includes main resonance level L2, metal column Via2 and loading capacitance C2, main resonance level L2 over the ground
Connecting loading capacitance C2 over the ground by metal column Via2, loading capacitance C2 is located at the lower section of main resonance level L2 over the ground；
Third level parallel resonance unit includes main resonance level L3, metal column Via3 and loading capacitance C3, main resonance level L3 over the ground
Connecting loading capacitance C3 over the ground by metal column Via3, loading capacitance C3 is located at the top of main resonance level L3 over the ground；
Fourth stage parallel resonance unit includes main resonance level L4, metal column Via4 and loading capacitance C4, main resonance level L4 over the ground
Connecting loading capacitance C4 over the ground by metal column Via4, loading capacitance C4 is located at the top of main resonance level L4 over the ground；
Level V parallel resonance unit includes main resonance level L5, metal column Via5 and loading capacitance C5, main resonance level L5 over the ground
Connecting loading capacitance C5 over the ground by metal column Via5, loading capacitance C5 is positioned at the top of main resonance level L5 over the ground；
Main resonance level L1, main resonance level L3 and main resonance level L5 are front end ground connection, main resonance level L2 and main resonance level L4
It is rear end ground connection；
Z-type cross-couplings line is located at main resonance level L1, main resonance level L2, main resonance level L3, main resonance level L4 and main resonance level
The underface of L5, the equal ground connection in two ends of described Z-type cross-couplings line；
First input inductance Lin1 is connected with first input port P1, and the first outputting inductance Lout1 and the first output port P2 is even
Connect；
Second microwave filter F2 include the second input port P3, the second input inductance Lin2, the 6th grade of parallel resonance unit,
7th grade of parallel resonance unit, the 8th grade of parallel resonance unit, the 9th grade of parallel resonance unit, the tenth grade of parallel resonance unit,
Tenth one-level parallel resonance unit, the second outputting inductance Lout2, the second Z-shaped interstage coupling strip line Z-shape2, second defeated
Go out port P4 and earth terminal；Described first output port P2 is connected with described second output port P4；
6th grade of parallel resonance unit includes main resonance level L6, metal column Via6 and loading capacitance C6, main resonance level L6 over the ground
Connecting loading capacitance 6 over the ground by metal column Via6, loading capacitance C6 is located at the top of main resonance level L6 over the ground；
7th grade of parallel resonance unit includes main resonance level L7, metal column Via7 and loading capacitance C7, main resonance level L7 over the ground
Connecting loading capacitance 7 over the ground by metal column Via7, loading capacitance C7 is located at the lower section of main resonance level L7 over the ground；
8th grade of parallel resonance unit includes main resonance level L8, metal column Via8 and loading capacitance C8, main resonance level L8 over the ground
Connecting loading capacitance 8 over the ground by metal column Via8, loading capacitance C8 is located at the top of main resonance level L8 over the ground；
9th grade of parallel resonance unit includes main resonance level L9, metal column Via9 and loading capacitance C9, main resonance level L9 over the ground
Connecting loading capacitance 9 over the ground by metal column Via9, loading capacitance C9 is located at the top of main resonance level L9 over the ground；
Tenth grade of parallel resonance unit includes main resonance level L10, metal column Via10 and loading capacitance C10, main resonance level over the ground
L10 connects loading capacitance 10 over the ground by metal column Via10, and loading capacitance C10 is located at the top of main resonance level L10 over the ground；
Tenth one-level parallel resonance unit includes main resonance level L11, metal column Via11 and loading capacitance C11, main resonance level over the ground
L11 connects loading capacitance 11 over the ground by metal column Via11, and loading capacitance C11 is located at the top of main resonance level L11 over the ground；
Main resonance level L6, main resonance level L8 and main resonance level L10 be front end ground connection, main resonance level L7, main resonance level
L9 and main resonance level L11 are rear end ground connection；Z-type cross-couplings line is located at main resonance level L6, main resonance level L7, main resonance
Level L8, main resonance level L9, main resonance level L10 and the underface of main resonance level L11, the equal ground connection in Z-type cross-couplings line two ends；
Second input inductance Lin2 and the second input port P3 connects, and the first outputting inductance Lout2 and the second output port P4 is even
Connect.
2. a kind of SHF wave band miniature double-passband filter as claimed in claim 1, it is characterised in that: described a kind of SHF ripple
The miniature double-passband filter of section uses multilamellar LTCC technique to make.
3. a kind of SHF wave band miniature double-passband filter as claimed in claim 1, it is characterised in that: first input port P1,
Second input port P3 connects, the first output port P2 and the second output port P4 is surface-pasted 50 ohmage ends
Mouthful.
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| CN201620329276.9U CN205564930U (en) | 2016-04-19 | 2016-04-19 | Miniature pair of pass filter of SHF wave band |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105762467A (en) * | 2016-04-19 | 2016-07-13 | 戴永胜 | SHF waveband micro dual-bandpass filter |
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2016
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105762467A (en) * | 2016-04-19 | 2016-07-13 | 戴永胜 | SHF waveband micro dual-bandpass filter |
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Effective date of registration: 20170510 Address after: building 401, building 3, building 8, Yongfeng Road, Qinhuai District, Nanjing, Jiangsu, China 210000 Patentee after: NANJING BOERTE ELECTRONIC TECHNOLOGY CO., LTD. Address before: 200 School of electro-optic engineering, Nanjing University of Science and Technology, Xuanwu District, Xiaolingwei, Nanjing 210094, Jiangsu Co-patentee before: Chen Xiangzhi Patentee before: Dai Yongsheng |
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Effective date of registration: 20190902 Address after: 518101 Hui Industrial Park, No. 1 Industrial Road, Shilong Community, Shiyan Street, Baoan District, Shenzhen City, Guangdong Province, 8 buildings and 5 floors Patentee after: Shenzhen wonder Electronic Technology Co., Ltd. Address before: , building 401, building 3, building 8, Yongfeng Road, Qinhuai District, Nanjing, Jiangsu, China 210000 Patentee before: NANJING BOERTE ELECTRONIC TECHNOLOGY CO., LTD. |