CN205670184U - Keyset and burn-in board - Google Patents
Keyset and burn-in board Download PDFInfo
- Publication number
- CN205670184U CN205670184U CN201620541928.5U CN201620541928U CN205670184U CN 205670184 U CN205670184 U CN 205670184U CN 201620541928 U CN201620541928 U CN 201620541928U CN 205670184 U CN205670184 U CN 205670184U
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- Prior art keywords
- keyset
- burn
- board
- mainboard
- interface device
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Abstract
This utility model provides a kind of keyset, described keyset includes plate body and is arranged at the signal probe on described plate body, element interface device and electric component group, described signal probe is connected with described element interface device by signal wire jumper, and described element interface device is connected with the part or all of electronic component in described electric component group by element wire jumper.This utility model also provides for a kind of burn-in board, and described burn-in board includes mainboard and described keyset, and described keyset is connected with described mainboard.This utility model provides a kind of keyset and burn-in board, the signal probe of described keyset realizes the selection to system signal by signal wire jumper, and described element interface device realizes the selection to electronic component by element wire jumper, meet the test needs between different chip, make the regulation of electrical circuit simpler, improve the adaptability of burn-in board, reach to be changed without the purpose of keyset, reduce the risk brought in Renewal process.
Description
Technical field
This utility model relates to technical field of manufacturing semiconductors, particularly to a kind of keyset and burn-in board.
Background technology
In order to reach the qualification rate of satisfaction, almost all of product will carry out burn-in test before dispatching from the factory.Produce with other
Product are the same, and chip is likely to break down because of a variety of causes at any time.Burn-in test is to be crossed by burn-in board to treat
Surveying the system signal that chip provides necessary, the duty of analog chip, at the situation of high temperature or speed-up chip in the case of other
Electric fault, within a period of time, obtain the fault rate of chip, allow chip work under given load condition and make its lack
Fall into and occur in the short period of time, thus obtain chip in life cycle fault rate substantially, it is to avoid re-use occur in early days therefore
Barrier.
Burn-in board of the prior art generally includes mainboard and is arranged on removable keyset on mainboard, passes through
Different keysets is set to test different chips, the chip of every kind of required test of keyset all one_to_one corresponding, work as test
It is accomplished by redesigning new keyset during different chip, meanwhile, changes keyset frequently and also mainboard or keyset can be made
Become damage, cause loose contact or breakage occurs, affecting the result of chip testing.
When new product is carried out burn-in test, existing keyset cannot meet requirement, needs again to make, system
Making new keyset and on the one hand time-consumingly consume money, being on the other hand manually welded to connect line can labor intensive resource.Therefore, how to provide
A kind of keysets of satisfied different test needs, thus reducing replacing is that those skilled in the art's technology urgently to be resolved hurrily is asked
Topic.
Utility model content
The purpose of this utility model is to provide a kind of keyset and burn-in board, to solve existing keyset needs
The problem often changed.
For solving above-mentioned technical problem, this utility model provides a kind of keyset, and described keyset includes plate body and setting
Signal probe, element interface device and electric component group on described plate body, described signal probe passes through signal wire jumper and institute
Stating element interface device to connect, described element interface device is by part or all of with described electric component group of element wire jumper
Electronic component connects.
Preferably, in described keyset, described signal probe for being connected with mainboard, described electric component group be used for
Test chip connects.
Preferably, in described keyset, described signal probe is pricking with needle.
Preferably, in described keyset, described element interface device is three pin pulling and inserting type joints.
Preferably, in described keyset, described electronic component includes electric capacity and/or resistance.
Preferably, in described keyset, described electric capacity is by can plug mode be arranged on described plate body.
Preferably, in described keyset, described resistance is by can plug mode be arranged on described plate body.
Preferably, in described keyset, described resistance is adjustable resistance.
This utility model also provides for a kind of burn-in board, and described burn-in board includes mainboard and described keyset,
Described keyset is connected with described mainboard.
Preferably, in described burn-in board, described burn-in board also includes the chip being arranged on described mainboard
Placement unit.
Preferably, in described burn-in board, described chip placement unit is DIP test bench, SOP test bench, QFN survey
One or more in examination seat, BGA test bench.
In the keyset and burn-in board of this utility model offer, the signal probe of described keyset is jumped by signal
Line realizes the selection to system signal, and the element interface device of described keyset is realized electronic component by element wire jumper
Selection, it is possible to meet the test needs between different chips, energy on the basis of described keyset not being replaced
Enough electronic components selecting flexibly to use when system signal and test, so that the regulation of electrical circuit is simpler, improve aging
The adaptability of test board, reaches to be changed without the purpose of keyset, reduces the risk brought in Renewal process, and then improves production
Efficiency, decreases waste.
Accompanying drawing explanation
Fig. 1 is the sectional structure chart of the keyset of this utility model embodiment；
Fig. 2 is the circuit diagram of the keyset of this utility model embodiment；
Fig. 3 is the front view of the burn-in board of this utility model embodiment；
Wherein, 10-plate body, 20-signal probe, 30-element interface device, 40-electric component group, 50-chip is even
Connect end, 100-mainboard, 200-keyset, 300-chip placement unit.
Detailed description of the invention
Below in conjunction with schematic diagram, keyset of the present utility model and burn-in board are described in more detail, wherein
Illustrate preferred embodiment of the present utility model, it should be appreciated that it is new that those skilled in the art can revise described here practicality
Type, and still realize advantageous effects of the present utility model.In order to clear, whole features of practical embodiments are not described.Following
In description, it is not described in detail known function and structure, because they can make this utility model mix due to unnecessary details
Disorderly.According to following explanation and claims, advantage of the present utility model and feature will be apparent from.It should be noted that, accompanying drawing is equal
Use the form simplified very much and all use non-ratio accurately, only real in order to aid in illustrating this utility model conveniently, lucidly
Execute the purpose of example.
Core concept of the present utility model is, is realized being by the signal probe being arranged on the plate body of keyset
The selection of system signal, and realize the selection to electronic component by the element interface device being arranged on plate body, not to institute
State the test needs met on the basis of keyset is replaced between different chip, it is possible to select system signal and survey flexibly
The electronic component used during examination, makes the regulation of electrical circuit simpler.
In the present embodiment, as it is shown in figure 1, keyset includes that a plate body 10 and the signal being arranged on described plate body 10 are visited
Pin 20, element interface device 30 and electric component group 40, described signal probe 20 is filled with described element interface by signal wire jumper
Putting 30 connections, described element interface device 30 is by element wire jumper and the part or all of electronics unit in described electric component group 40
Part connects.
As in figure 2 it is shown, described signal probe 20 is pricking with needle (Pin Header), described signal probe 20 is for mainboard even
Connecing, described signal probe 20 is connected with described element interface device 30 by signal wire jumper, thus realizes carrying out system signal
Select.Described signal wire jumper be can the signal wire jumper of plug, described signal wire jumper plays the effect that wire connects.
In the present embodiment, described element interface device 30 is three pin pulling and inserting type joints, and described element interface device 30 leads to
Cross element wire jumper to be connected with the part or all of electronic component in described electric component group 40.Preferably, described electronic package
Including electric capacity and/or resistance, electric capacity and resistance is the electronic component using and testing chip pin function frequently, in the present embodiment
Using more conventional electric capacity and resistance continuous cropping is selection mode.Described element wire jumper is the twoport type wire jumper of standard
(Jumper), select to access electric capacity or resistance by the twoport type wire jumper of standard.Certainly this utility model is not restricted, described
Electronic component is it is also possible that inductance or operational amplifier etc., and described electronic component is also not necessarily limited to simple and connects relation, permissible
Need to design more complicated circuit by test, such as: series winding between the series winding of multiple resistance, electric capacity and resistance or and connect.
Further, described electric capacity is by can plug mode be arranged on described mainboard, by can the electric capacity of plug mode
Easily electric capacity can be replaced.Further, described resistance, by can plug mode be arranged on described mainboard, passes through
The resistance of plug mode can easily resistance can be replaced.In preferred version, described resistance can also is that adjustable resistance,
Easily resistance value is adjusted by adjustable resistance.
The present embodiment also provides for a kind of burn-in board, as it is shown on figure 3, described burn-in board includes mainboard 100 and upper
Stating keyset 200, described keyset 200 is arranged on described mainboard 100.
Preferably, described burn-in board also includes the chip placement unit 300 being arranged on described mainboard 100, described
Chip placement unit 300 can realize chip placement easily.Preferably, described chip placement unit 300 is DIP (Double
In-line Package) survey seat, SOP (Small Out-Line Package) survey seat, DFN (Dual Flat Package) survey
Seat, QFN (Quad Flat No-lead Package) survey seat, BGA (Ball Grid Array) surveys the one in seat or many
Kind, the survey seat needed is selected according to the packing forms of chip.
With continued reference to Fig. 2 and Fig. 3, in the embodiment of the present application, described signal probe 20 is connected on mainboard 100, described
Signal probe 20 is connected on described element interface device 30 by signal wire jumper, system signal by described signal probe 20 from
Mainboard 100 arrives element interface device 30, and it is described that described element interface device 30 uses when selecting to test by element wire jumper
Part or all of electronic component in electric component group 40, described electric component group 40 connects arrival chip and connects end 50, i.e. institute
State chip connection end 50 to be connected with chip to be measured.When changing the chip of required test, it is only necessary to selected by signal wire jumper
The electronic component used when selecting system signal and select to test by element wire jumper, it is possible to provide more for chip testing and select
Mode, is replaced from without to described keyset.In concrete scheme, described keyset and described mainboard by contact pin with
The mode of socket connects, and makes system signal be connected to the chip in chip placement unit by described keyset.The application's
In other embodiments, it is also possible to use other the most described keyset of connected mode to be also welded direct on described mainboard, real
Existing circuit connecting relation, therefore not to repeat here.
In the keyset and burn-in board of this utility model offer, the signal probe of described keyset is jumped by signal
Line realizes the selection to system signal, and the element interface device of described keyset is realized electronic component by element wire jumper
Selection, it is possible to meet the test needs between different chips, energy on the basis of described keyset not being replaced
Enough electronic components selecting flexibly to use when system signal and test, so that the regulation of electrical circuit is simpler, improve aging
The adaptability of test board, reaches to be changed without the purpose of keyset, reduces the risk brought in Renewal process, and then improves production
Efficiency, decreases waste.
The connected mode mentioned in this utility model all can be realized by prior aries such as the wirings of circuit, in this area
Technical staff is all understood that, is not illustrated by for sake of simplicity, the circuit between electronic component connects, and electricity in embodiment
Quantity and the layout of sub-element are not limitation of the utility model, and those skilled in the art all can be by rational layout
Model and quantity to electronic component select.
Foregoing description is only the description to this utility model preferred embodiment, not any limit to this utility model scope
Fixed, any change that the those of ordinary skill in this utility model field does according to the disclosure above content, modification, belong to right and want
Seek the protection domain of book.
Claims (11)
1. a keyset, it is characterised in that described keyset includes plate body and is arranged at the signal probe on described plate body, unit
Part interface arrangement and electric component group, described signal probe is connected with described element interface device by signal wire jumper, described unit
Part interface arrangement is connected with the part or all of electronic component in described electric component group by element wire jumper.
2. keyset as claimed in claim 1, it is characterised in that described signal probe is used for being connected with mainboard, described electronics
Element group is for being connected with test chip.
3. keyset as claimed in claim 1, it is characterised in that described signal probe is pricking with needle.
4. keyset as claimed in claim 1, it is characterised in that described element interface device is three pin pulling and inserting type joints.
5. keyset as claimed in claim 1, it is characterised in that described electronic component includes electric capacity and/or resistance.
6. keyset as claimed in claim 5, it is characterised in that described electric capacity is by plug mode being arranged on described plate body
On.
7. keyset as claimed in claim 5, it is characterised in that described resistance is by plug mode being arranged on described plate body
On.
8. keyset as claimed in claim 5, it is characterised in that described resistance is adjustable resistance.
9. a burn-in board, it is characterised in that described burn-in board includes mainboard and as appointed in claim 1-8
Anticipating a described keyset, described keyset is connected with described mainboard.
10. burn-in board as claimed in claim 9, it is characterised in that described burn-in board also includes being arranged on described
Chip placement unit on mainboard.
11. burn-in boards as claimed in claim 10, it is characterised in that described chip placement unit be DIP test bench,
One or more in SOP test bench, QFN test bench, BGA test bench.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620541928.5U CN205670184U (en) | 2016-06-02 | 2016-06-02 | Keyset and burn-in board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620541928.5U CN205670184U (en) | 2016-06-02 | 2016-06-02 | Keyset and burn-in board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205670184U true CN205670184U (en) | 2016-11-02 |
Family
ID=57190979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620541928.5U Expired - Fee Related CN205670184U (en) | 2016-06-02 | 2016-06-02 | Keyset and burn-in board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205670184U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107202667A (en) * | 2017-03-17 | 2017-09-26 | 南京高华科技股份有限公司 | A kind of core body compensating test automation equipment |
| CN108761256A (en) * | 2018-07-27 | 2018-11-06 | 南斗六星系统集成有限公司 | A kind of test cabinet |
| CN110907849A (en) * | 2019-12-24 | 2020-03-24 | 贵州航天计量测试技术研究所 | Test tool for power module test system |
| CN111222182A (en) * | 2020-01-19 | 2020-06-02 | 北京智芯微电子科技有限公司 | Chip test switching device and chip test equipment |
| CN111722079A (en) * | 2020-04-30 | 2020-09-29 | 西安太乙电子有限公司 | Function verification device for integrated circuit aging scheme |
-
2016
- 2016-06-02 CN CN201620541928.5U patent/CN205670184U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107202667A (en) * | 2017-03-17 | 2017-09-26 | 南京高华科技股份有限公司 | A kind of core body compensating test automation equipment |
| CN108761256A (en) * | 2018-07-27 | 2018-11-06 | 南斗六星系统集成有限公司 | A kind of test cabinet |
| CN110907849A (en) * | 2019-12-24 | 2020-03-24 | 贵州航天计量测试技术研究所 | Test tool for power module test system |
| CN111222182A (en) * | 2020-01-19 | 2020-06-02 | 北京智芯微电子科技有限公司 | Chip test switching device and chip test equipment |
| CN111222182B (en) * | 2020-01-19 | 2022-01-14 | 北京智芯微电子科技有限公司 | Chip test switching device and chip test equipment |
| CN111722079A (en) * | 2020-04-30 | 2020-09-29 | 西安太乙电子有限公司 | Function verification device for integrated circuit aging scheme |
| CN111722079B (en) * | 2020-04-30 | 2023-02-24 | 西安太乙电子有限公司 | Function verification device for integrated circuit aging scheme |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161102 Termination date: 20190602 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |