CN205648178U - Circuit board of high heat conduction of high power - Google Patents
Circuit board of high heat conduction of high power Download PDFInfo
- Publication number
- CN205648178U CN205648178U CN201620359459.5U CN201620359459U CN205648178U CN 205648178 U CN205648178 U CN 205648178U CN 201620359459 U CN201620359459 U CN 201620359459U CN 205648178 U CN205648178 U CN 205648178U
- Authority
- CN
- China
- Prior art keywords
- base plate
- substrate
- circuit board
- heat conduction
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a circuit board of high heat conduction of high power including the base plate and set up the heat -conducting plate on the base plate face, is provided with the film between base plate and the heat -conducting plate, the base plate includes first base plate and second base plate, is equipped with the connecting piece between first base plate and the second base plate, the connecting piece all is provided with the sucking disc including straight -bar, straight -bar both ends, and the sucking disc differential adsorption at straight -bar both ends is fixed in on first base plate and the second base plate, the through -hole of first base plate passes through the copper line connection with the through -hole of second base plate. Aluminium system heat -conducting plate through setting up can reach very good radiating effect, more than the thick control 70UM of copper of first base plate, can bear great power, it is disconnected can not lead to the wire to melt, film through high heat conduction glues timely the distributing away to the aluminium system heat -conducting plate with, the heat transfer that can be effectual produces the base plate at work.
Description
Technical field
This utility model relates to PCB field, the circuit board of a kind of high power height heat conduction.
Background technology
The title of circuit board has: wiring board, pcb board, aluminium base, high frequency plate, thick copper coin, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board, printing (copper lithographic technique) circuit board etc..Circuit board makes circuit miniaturization, intuitively changes, and batch production and optimization electrical appliance layout for permanent circuit play an important role.Circuit board can be described as printed substrate or printed circuit board (PCB), and English name is PCB.
After electronic equipment uses circuit board, concordance due to homogeneous circuit plate, thus avoid the mistake of artificial wiring, and the automatic plug-in mounting of electronic devices and components or attachment, automatic tin soldering can be realized, automatically detect, ensure that the quality of electronic equipment, improve labor productivity, reduce cost, and be easy to maintenance.
Summary of the invention
This utility model mainly solves the technical problem that the circuit board being to provide a kind of high power height heat conduction.
This utility model is that the technical scheme solving the employing of above-mentioned technical problem is:
The circuit board of a kind of high power height heat conduction, includes substrate and the heat-conducting plate being arranged on substrate surface, is provided with film between described substrate and heat-conducting plate；
Described substrate includes first substrate and second substrate, is provided with connector between described first substrate and second substrate；Described connector includes straight-bar, and described straight-bar two ends are provided with sucker, and the sucker at straight-bar two ends adsorbs respectively and is fixed on first substrate and second substrate；
The through hole of described first substrate is connected by copper cash with the through hole of second substrate.
Further, described heat-conducting plate material is aluminum material.
Further, described film material is high heat conductive material.
Further, the copper thickness of described substrate is more than 70um.
Further, described sucker includes sucker body and sucker hoop, and described sucker body offers opening, and described opening is provided with lid.
The beneficial effects of the utility model are:
1., by the aluminum heat-conducting plate arranged, extraordinary radiating effect can be reached；The copper thickness of first substrate controls more than 70UM, can bear bigger power, be not result in that wire melts disconnected；Viscous by the film of high heat conduction and, can effectively be delivered to the heat that substrate produces at work on aluminum heat-conducting plate distribute timely.
2. this utility model is by the connector arranged, it is achieved first substrate and the connection of second substrate, what the sucker on connector can be highly stable achieves a fixed connection with substrate.By arranging lid on sucker body, directly lid can be taken off when sucker is taken off by needs, can easily sucker be taken off.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of detailed description of the invention of this utility model.
Fig. 2 is heat-conducting plate and the structural representation of film in a kind of detailed description of the invention of this utility model.
In figure: 1 is first substrate, 2 is second substrate, and 31 is sucker, and 32 is sucker, and 4 is straight-bar, and 5 is film, and 6 is heat-conducting plate.
Detailed description of the invention
Refer to Fig. 1, for this utility model one detailed description of the invention.
The circuit board of a kind of high power height heat conduction, includes first substrate and the second heat-conducting plate, film, and second substrate 2 is bonded with heat-conducting plate 6 by circuit board by film 5.
Substrate includes first substrate 1 and second substrate 2, is provided with connector between first substrate and second substrate；Connector includes straight-bar 4, and straight-bar two ends are provided with sucker 31 and sucker 32, the sucker at straight-bar two ends adsorb respectively be fixed on first substrate with on second substrate；
The through hole of first substrate is connected by copper cash with the through hole of second substrate.
Heat-conducting plate material is aluminum material.Film material is high heat conductive material.The copper thickness of substrate is more than 70um.Sucker includes sucker body and sucker hoop, and described sucker body offers opening, and described opening is provided with lid.
By the aluminum heat-conducting plate arranged, extraordinary radiating effect can be reached；The copper thickness of first substrate controls more than 70UM, can bear bigger power, be not result in that wire melts disconnected；Viscous by the film of high heat conduction and, can effectively be delivered to the heat that substrate produces at work on aluminum heat-conducting plate distribute timely.
This utility model is by the connector arranged, it is achieved first substrate and the connection of second substrate, what the sucker on connector can be highly stable achieves a fixed connection with substrate.By arranging lid on sucker body, directly lid can be taken off when sucker is taken off by needs, can easily sucker be taken off.
Claims (5)
1. the circuit board of a high power height heat conduction, it is characterised in that: include substrate and the heat-conducting plate being arranged on substrate surface, between described substrate and heat-conducting plate, be provided with film；
Described substrate includes first substrate and second substrate, is provided with connector between described first substrate and second substrate；Described connector includes straight-bar, and described straight-bar two ends are provided with sucker, and the sucker at straight-bar two ends adsorbs respectively and is fixed on first substrate and second substrate；
The through hole of described first substrate is connected by copper cash with the through hole of second substrate.
The circuit board of high power height heat conduction the most according to claim 1, it is characterised in that: described heat-conducting plate material is aluminum material.
The circuit board of high power height heat conduction the most according to claim 1, it is characterised in that: described film material is Heat Conduction Material.
The circuit board of high power height heat conduction the most according to claim 1, it is characterised in that: the copper thickness of described substrate is more than 70um.
The circuit board of high power height heat conduction the most according to claim 1, it is characterised in that: described sucker includes sucker body and sucker hoop, and described sucker body offers opening, and described opening is provided with lid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620359459.5U CN205648178U (en) | 2016-04-25 | 2016-04-25 | Circuit board of high heat conduction of high power |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620359459.5U CN205648178U (en) | 2016-04-25 | 2016-04-25 | Circuit board of high heat conduction of high power |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205648178U true CN205648178U (en) | 2016-10-12 |
Family
ID=57062463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620359459.5U Expired - Fee Related CN205648178U (en) | 2016-04-25 | 2016-04-25 | Circuit board of high heat conduction of high power |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205648178U (en) |
-
2016
- 2016-04-25 CN CN201620359459.5U patent/CN205648178U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161012 Termination date: 20210425 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |