CN208273351U - Frequency-conversion microwave oven power control board and micro-wave oven - Google Patents
Frequency-conversion microwave oven power control board and micro-wave oven Download PDFInfo
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- CN208273351U CN208273351U CN201820562072.9U CN201820562072U CN208273351U CN 208273351 U CN208273351 U CN 208273351U CN 201820562072 U CN201820562072 U CN 201820562072U CN 208273351 U CN208273351 U CN 208273351U
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Abstract
The utility model discloses a kind of frequency-conversion microwave oven power control board and micro-wave ovens, belong to micro-wave oven technical field, the substrate of power control board is the glass-fiber-fabric substrate containing epoxy resin dipping, the power control board double-sided copper-clad, double-sided wiring, the wherein one side setting electronic component of the power control board；The electronic component and the power control board are welded to connect using tin cream.The utility model realizes the miniaturization of frequency-conversion microwave oven power control board, highly integrated, intensity further enhances, technique simplifies, and also improves the quality stability of micro-wave oven.
Description
Technical field
The utility model relates to micro-wave oven technical field more particularly to frequency-conversion microwave oven power control boards and micro-wave oven.
Background technique
The frequency-conversion microwave oven power control board of mainstream, such as Panasonic, the change that beautiful, Glanz producer uses on the market at present
Frequency microwave oven supply power controller adopts the single fillet welded manufacturing process of 1.6 ± 0.5mm thickness CEM-1 substrate.Substrate --- -- is again
Name copper-clad plate, supporting material is soaked with resin, one or both sides are coated with copper foil, through a kind of board-like material made of hot pressing, referred to as
Copper-clad laminate.The substrate of CEM-1 is unable to double-sided copper-clad, this is because substrate tape dust structure cannot sink copper, so can only
Single sided board is done, to need to increase the size of power control board；In addition, based on CEM-1 substrate in heat resistance, thermal expansion system
The poor characteristic of number, dimensional stability is only suitable for single side and covers copper SMD components, is both needed to use red adhesive process wave soldering again, this
Sample has considerable restraint to components' placement, it is desirable that need to increase as far as possible power control board covers copper face product to adapt to power supply control
The demand of board component cabling, layout.If market mainstream micro-wave oven variable-frequency power sources size is all in 100*170mm or more, 1.6 ±
0.5mm thickness.
Therefore, the prior art is asked using the single fillet welded manufacturing process of CEM11.6 ± 0.5mm thickness substrate there are following
Topic:
1.PCBA device layout is limited, it is desirable that power control board size is larger, is not easy to power-supply controller of electric lightweight, small-sized
Change, is integrated；
2. due to using CEM-1 substrate fabrication process, component power control board cabling needs use a large amount of wire jumper, increasing
Add production process and cost；
3. due to using CEM-1 substrate fabrication process, the mechanical strength of solder joint is all poor；CEM-1 substrate power control board
It needs using wave soldering, this production technology need to finish AI process (sleeping to insert and stand slotting process) and reuse again after red adhesive process
Copper mesh or spot gluing equipment carry out dispensing, due to the molding relationship of AI process pin bent angle be easy to top to copper mesh cause excessive glue or
The reason of person's copper mesh plug-hole, causes lower glue on the low side, and will appear the not upper tin of wave soldering in this way influences electric property, while using red
Adhesive process, which be easy to cause rear process production process turnover to fall part, influences production consistency, while also bringing very big insecure
Hidden danger of quality；
4.CEM-1 substrate keeps power control board heat resistance and moisture resistance sex expression poor；
It is poor that 5.CEM-1 substrate shows power control board mechanical performance and dielectric properties.
Summary of the invention
In view of this, the present invention provides a kind of frequency-conversion microwave oven power control board and micro-wave ovens, existing micro- to solve
The problem that wave furnace power control board area is excessive, processing quality is unstable, performance is poor.
It is as follows that the utility model solves technical solution used by above-mentioned technical problem:
A kind of frequency-conversion microwave oven power control board, the substrate of power control board are the glass-fiber-fabric substrate containing epoxy resin dipping,
The power control board double-sided copper-clad, double-sided wiring, the wherein one side setting electronic component of the power control board；The electricity
Sub- component and the power control board are welded to connect using tin cream.
Further, the size dimension of the power control board is 100*122mm, with a thickness of 1.2 ± 0.5mm.
Further, it is provided with multiple via holes on the power control board, is inserted into electronic component pin in the via hole
And it is welded and fixed.
Further, the electronic component includes transformer, capacitor.
And a kind of micro-wave oven is also provided, the micro-wave oven includes any one of the above frequency-conversion microwave oven power control board.
Frequency-conversion microwave oven power control board and micro-wave oven of the utility model, realize the small-sized of power control board
Change, is integrated, having saved raw material and cost of labor, the complexity that reduces product manufacturing, moisture resistivity, the machinery for improving product
Performance, electric property.
Detailed description of the invention
Fig. 1 is the frequency-conversion microwave oven power control board structural schematic diagram that the utility model embodiment one provides.
Specific embodiment
In order to be clearer and more clear technical problem to be solved in the utility model, technical solution and beneficial effect, with
Under in conjunction with the accompanying drawings and embodiments, the present invention will be further described in detail.It should be appreciated that specific reality described herein
It applies example to be only used to explain the utility model, is not used to limit the utility model.
Embodiment one
The utility model first embodiment provides a kind of frequency-conversion microwave oven power control board, as shown in Figure 1, power control board
1 substrate is the glass-fiber-fabric substrate containing epoxy resin dipping, i.e. FR-4 substrate.The power control board double-sided copper-clad, double-sided wiring,
The wherein one side setting electronic component of the power control board 1, as shown in Figure 1, electronic component is all disposed within power supply control
The upper surface of plate side；The electronic component and the power control board are welded to connect using tin cream, component cabling, layout
It can be substantially reduced in this way power control board size with double-side operation, the size dimension of the power control board of the utility model can contract
For as low as 100*122mm, FR-4 substrate since flexing resistance is fine, power control board is also able to satisfy machinery with a thickness of 1.2 ± 0.5mm
Intensity and matching requirements, the power control board size in the prior art that compares are all thick in 100*170mm or more, 1.6 ± 0.5mm
Degree, this realizes the lightweight of product significantly.The flexibility that solder reflow process increases technique can be done simultaneously；FR-4 substrate electricity
Source control panel directlys adopt the welding of tin cream technique, and SMD components do not need wave soldering, so eliminating these hidden danger, improving
The consistency of production.Multiple via holes are provided on the power control board, for some biggish components, the mistake
It is inserted into electronic component pin in hole and is welded and fixed, fixed effect can be made more firm.Further, the electronic component
Include transformer 2 as shown in Figure 1, capacitor 3.
The frequency-conversion microwave oven power control board that the present embodiment is realized, substrate use the glass-fiber-fabric substrate containing epoxy resin dipping,
Double-sided copper-clad, double-sided wiring, electronic component are welded using tin cream, and biggish component is fixed by via hole mode with control panel
Connection；Compared with prior art, the area of power control board greatly reduces, and realizes the miniaturization, integrated of power control board,
Simplify process flow, saved raw material and cost of labor, reduce product manufacturing complexity, improve the moisture resistance of product
Property, mechanical performance, electric property.
Embodiment two
The utility model second embodiment provides a kind of micro-wave oven, and the micro-wave oven includes the frequency-conversion microwave oven of embodiment one
Power control board, specific structure are the same as example 1, and details are not described herein.
Above by reference to the preferred embodiment of Detailed description of the invention the utility model, not thereby limit to the right of the utility model
Range.Those skilled in the art do not depart from made any modification, equivalent replacement in the scope of the utility model and essence and change
Into should all be within the interest field of the utility model.
Claims (5)
1. a kind of frequency-conversion microwave oven power control board, it is characterised in that: the substrate of power control board is the glass containing epoxy resin dipping
Fine cloth substrate, the power control board double-sided copper-clad, double-sided wiring, the wherein one side setting electronics member device of the power control board
Part；The electronic component and the power control board are welded to connect using tin cream.
2. frequency-conversion microwave oven power control board according to claim 1, it is characterised in that: the size of the power control board
Having a size of 100*122mm, with a thickness of 1.2 ± 0.5mm.
3. frequency-conversion microwave oven power control board according to claim 1, it is characterised in that: be arranged on the power control board
Multiple via holes, the interior insertion electronic component pin of the via hole are simultaneously welded and fixed.
4. frequency-conversion microwave oven power control board according to claim 3, it is characterised in that: the electronic component includes to become
Depressor, capacitor.
5. a kind of micro-wave oven, it is characterised in that: the micro-wave oven includes any one frequency-conversion microwave oven power supply control of claim 1-4
Making sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820562072.9U CN208273351U (en) | 2018-04-19 | 2018-04-19 | Frequency-conversion microwave oven power control board and micro-wave oven |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820562072.9U CN208273351U (en) | 2018-04-19 | 2018-04-19 | Frequency-conversion microwave oven power control board and micro-wave oven |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208273351U true CN208273351U (en) | 2018-12-21 |
Family
ID=64680473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820562072.9U Active CN208273351U (en) | 2018-04-19 | 2018-04-19 | Frequency-conversion microwave oven power control board and micro-wave oven |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208273351U (en) |
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2018
- 2018-04-19 CN CN201820562072.9U patent/CN208273351U/en active Active
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