CN205546374U - Electron device's scattered heat recombination membrane structure of samming - Google Patents
Electron device's scattered heat recombination membrane structure of samming Download PDFInfo
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- CN205546374U CN205546374U CN201620131397.2U CN201620131397U CN205546374U CN 205546374 U CN205546374 U CN 205546374U CN 201620131397 U CN201620131397 U CN 201620131397U CN 205546374 U CN205546374 U CN 205546374U
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- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides an electron device's scattered heat recombination membrane structure of samming, to be the samming heat recombination membrane that looses, and install and be close to the position of heat source or directly install on the heat source in that an electron device is inside, the structure of the scattered heat recombination membrane of this samming, from bottom to top pile up according to the preface and contain: a metal level comprises one deck heat conductivity metal at least, is thickness 3um 150um's thin plate structure, metal level have an upper surface and a lower surface, a hypolimnion to the coating that the lamellar structure packed and prepares has, is the coating 3um at the upper surface of metal level, thickness 100um's samming heat conduction coating, an and heat dissipation layer to nanometer or micron thermal coatings coating are at the upper surface of hypolimnion, is thickness 3um 100um's heat radiation and heat conduction coating. The utility model discloses have the reliability and the life that keep electron device, can promote the efficiency of overall structure intensity again.
Description
Technical field
This utility model is the temperature uniforming heat radiation structure of composite membrane about a kind of electronic installation, and a kind of combination heat radiation, samming and three kinds of functions of heat conduction are in the composite molding structure of one.
Background technology
Smart mobile phone, tablet PC, mobile computer, guiding aircraft or the electronic installation such as portable, it has been developed into the process chip of the highest operation frequency by double-core, four cores, eight cores etc.；And the development of electronic apparatus is with short and small frivolous as designer trends, therefore for reaching high operation efficiency and short and small frivolous double requirements, the radiating efficiency of electronic apparatus is the most important.
Secondary person, the radiating mode of electronic apparatus at present, mainly by modes such as simple perforate, heat conduction, thermal convection currents, but those radiating modes are with cannot heat energy produced by the most high-effect chip of load, therefore the problem having accumulated heat, heat energy cannot uniformly dispersing, cause reducing radiating efficiency within electronic apparatus.
Again, generally the chip of electronic equipment is operationally main heating source, dispel the heat not only for reduction chip own temperature to ensure that it normally can work within the temperature range of requiring, housing hot-spot can not be caused during heat radiation to be taken into account, cause bad experience to consumer.
Be with, No. 496156 patent of the novel M of TaiWan, China, disclose a kind of electronic apparatus radiator structure, it includes a fore shell support 11, LCD MODULE 12 and bonnet 16 and a heat-conductive assembly 15, this LCD MODULE 12 side is provided with a substrate 14, at least one electronic building brick 141 it is provided with on this substrate 14, this bonnet 16 has an accommodation space 161, this LCD MODULE 12 side is sticked a center 13, this substrate 14 is embedded on this center 13, this heat-conductive assembly 15 is arranged between described electronic building brick 141 and bonnet 16, this heat-conductive assembly 15 side correspondence contacts described electronic building brick 141, opposite side correspondence contacts described bonnet 16；Accumulated heat is not produced so as to helping the uniform thermal power of this electronic building brick 121 to spread.But looking into, after it manufactures with bonnet 16 respectively as the heat-conductive assembly 15 dispelled the heat, then binded by heat-conductive assembly 15 at bonnet 16 inner edge surface, therefore its radiating efficiency still has weak point, the most still has and improves space.
Therefore solve the problems referred to above point of tradition electronic apparatus, for major subjects of the present utility model.
Utility model content
Technical problem underlying to be solved in the utility model is, overcome the drawbacks described above that prior art exists, and the temperature uniforming heat radiation structure of composite membrane of a kind of electronic installation is provided, it stacks the temperature uniforming heat radiation composite membrane constituted with sandwich kenel, in conjunction with heat radiation, samming and three kinds of merits of heat conduction for one, there is the reliability that can keep electronic apparatus, effect that again can be cost-effective；Its metal level can by MULTILAYER COMPOSITE institute constitute, to constitute the complex metal layer of a high intensity and high conductivity, except heat conduction function can be promoted, more can the overall construction intensity of strengthening electronic device.
This utility model solves its technical problem and be the technical scheme is that
The temperature uniforming heat radiation structure of composite membrane of a kind of electronic installation, comprises: a metal level, is at least made up of one layer of conductive metal, and two dimension that thickness is 3um-150um or three dimensional structure, and this metal level has a upper surface and a lower surface；One hypolimnion, to have stratiform or stratiform and the coating prepared by stereochemical structure filler, is coated with the upper surface being laid in this metal level, and the samming heat conducting coating that thickness is 3um-100um；And a heat dissipating layer, the upper surface of this hypolimnion it is coated on nanometer or micron heat radiation coating, and heat radiation that thickness is 3um-100um and heat conducting coating；Accordingly, the temperature uniforming heat radiation composite membrane of three-layer composite structure is formed.
According to front taking off feature, this metal level includes for single metal level or complex metal layer.
According to front taking off feature, this single metal level includes: copper, aluminum, titanium, silver, gold, copper alloy, aluminium alloy, silver alloy, titanium alloy or rustless steel.
According to front taking off feature, this complex metal layer is two layers or three layers, and by copper, aluminum, titanium, silver, gold, copper alloy, aluminium alloy, silver alloy, titanium alloy or rustless steel, the most wantonly two kinds or three kinds of metals are constituted according to stacking.
Take off technological means, temperature uniforming heat radiation structure of composite membrane of the present utility model on by, in conjunction with heat radiation, samming and three kinds of merits of heat conduction for one, can keep reliability and the service life of electronic installation, can reach again conveniently to use, and cost-saved effect.Furthermore, may make up the complex metal layer of a high intensity and high-termal conductivity further, except heat conduction function can be promoted, more can the overall construction intensity of strengthening electronic device.
The beneficial effects of the utility model are, it stacks, with sandwich kenel, the temperature uniforming heat radiation composite membrane that constituted, combine heat radiation, samming and three kinds of merits of heat conduction for integrally, having the reliability that can keep electronic apparatus, effect that again can be cost-effective；Its metal level can by MULTILAYER COMPOSITE institute constitute, to constitute the complex metal layer of a high intensity and high conductivity, except heat conduction function can be promoted, more can the overall construction intensity of strengthening electronic device.
Accompanying drawing explanation
With embodiment, this utility model is further illustrated below in conjunction with the accompanying drawings.
Figure 1A is the exploded perspective view of existing a kind of electronic apparatus heat radiation construction.
Figure 1B is the combination stereogram of existing a kind of electronic apparatus heat radiation construction.
Fig. 1 C is the sectional view of existing a kind of electronic apparatus heat radiation construction.
Fig. 1 D is the enlarged drawing shown in 1D in Fig. 1 C.
Fig. 2 is the stereoscopic figure of this utility model temperature uniforming heat radiation composite membrane.
Fig. 3 is the part amplification stereogram shown in 3 in Fig. 2.
Fig. 4 A is the sectional view of this utility model the first possible embodiments.
Fig. 4 B is the sectional view of this utility model the second possible embodiments.
Fig. 4 C is the sectional view of this utility model the 3rd possible embodiments.
Fig. 5 is the exploded perspective view that this utility model one uses state reference map.
Fig. 6 is the combination stereogram that this utility model one uses state reference map.
Fig. 7 is the sectional view that this utility model one uses state reference map.
Label declaration in figure:
20 panels
21 mesochite supports
30 LCD MODULE
40 circuit boards
41 electronic chips
50 batteries
60 bonnets
61 accommodation spaces
70 temperature uniforming heat radiation composite membranes
71 metal levels
711 upper surfaces
712 lower surfaces
71a ground floor
The 71b second layer
71c third layer
72 hypolimnions
73 heat dissipating layers
80 electronic installations
Detailed description of the invention
First, refer to shown in Fig. 2～Fig. 7, the temperature uniforming heat radiation composite membrane 70 of the electronic installation disclosed by this utility model, its inside being mainly installed in electronic installation 80 or housing near the position of thermal source or are installed directly on thermal source, it is used as heat radiation, alleged electronic installation 80 of the present utility model includes: smart mobile phone, tablet PC, mobile computer, guiding aircraft etc., and following electronic installation 80 is to be demonstration example according to mobile phone, but is not limited to this；The structure of this temperature uniforming heat radiation composite membrane 70, its first possible embodiments, as shown in Fig. 3 and Fig. 4 A, comprises: a metal level 71, is at least made up of one layer of conductive metal, and the thin-slab structure of thickness 3um-150um, and it can include two dimension or three dimensional structure.This metal level 71 has a upper surface 711 and a lower surface 712；In the present embodiment, this metal level 70 is a single metal level, and it is selected from including: copper, aluminum, titanium, silver, gold, copper alloy, aluminium alloy, silver alloy, titanium alloy or rustless steel.Metal level major function is tool heat conduction, heat sinking function and structure function, and its composition can be divided into single metal level or complex metal layer, and single metal level can be copper or aluminum or titanium is silver-colored or golden or copper alloy or aluminium alloy or silver alloy or titanium alloy or rustless steel.The single metal that complex metal layer can be above-mentioned select its two or select it and three form according to stack manner, its stack manner is compact texture physically or chemically, has heat conduction, heat radiation and structure function.
One hypolimnion 72, is by having layer structure, or stratiform and the coating prepared by stereochemical structure filler, is coated with the upper surface 711 being laid in this metal level 71, and the samming heat conducting coating that thickness is 3um-100um.In the present embodiment, this hypolimnion 72 major function, hypolimnion major function is tool samming and heat conduction function, the possible embodiments that this coating is constituted includes but does not limits: is dissolved in mixed solvent as base material according to different proportion mixing etc. with fluorocarbon resin or fluororesin or acryl resin or Polyurethane or polyureas ester or polyurethane or silicones or both the above or three kinds, and then obtains base material mixed liquor；Separately by weight ratio be this base material 0.1 to 10 times there is layer structure or layer structure adds stereochemical structure or two kinds of fillers added according to different proportion add in mixed solvent, and obtain filler mixed liquor；And base material mixed liquor after filtering is uniformly mixed with filler mixed liquor.Whereby, use this base material and mix there is layer structure filler prepared by the coating of samming heat conduction function, there is the good and superior samming heat conductivility of resistance tocrocking.In another possible embodiments, this hypolimnion 72 includes: filler uses and is mainly composed of the most all types of graphite of layered inorganic material, graphene microchip, Graphene, nitridation, Muscovitum；Accessory ingredient can be a following bamboo charcoal, carbon pipe, carbon ball, aluminium nitride, Muscovitum, silicon dioxide, carborundum, zinc oxide, germanium oxide, carbon fiber or titanium dioxide, the composition of this filler is with neccessary composition or neccessary composition plus the combination of accessory ingredient, and its main constituent or accessory ingredient can be that one of them or its composition form；This base material another is selected from thinner, ethyl acetate, dehydrated alcohol, alcohols, ketone, esters or distilled water or the combination of aforementioned mixed solvent with the mixed solvent of this filler；This base material is 0.9 to 1.4 times with the weight ratio of mixed solvent, and this filler is 0.3 to 10 times with the weight ratio of mixed solvent.In addition, 120g fluorocarbon resin can be dissolved in 200g ethyl acetate and obtain base material mixed liquor, another being dissolved in 300g distilled water by 200g nano-graphene obtains filler mixed liquor, and carry out filtering this base material mixed liquor and this filler mixed liquor with 350 eye mesh screens, then this base material mixed liquor of emulsification pretreatment machine high-speed stirred and this filler mixed liquor are used 10 minutes, and mix homogeneously is samming heat-conductive coating, to spray or to be coated with or to be impregnated with via different drying modes, its dry film total thickness is 3um to 100um.But, the preparation method of this hypolimnion coating, by separate case application patent of invention, hold and do not repeat.
And a heat dissipating layer 73, the upper surface 712 of this metal level 71 it is coated on nanometer or micron heat radiation coating, and heat radiation that thickness is 3um-100um and heat conducting coating；Accordingly, the temperature uniforming heat radiation composite membrane 70 of three-layer composite structure is formed.In the present embodiment, ground floor heat radiation coating major function is that conduction of heat has thermal radiation function concurrently, the possible embodiments that this heat dissipating layer coating is constituted includes but does not limits: with fluorocarbon resin or fluororesin or acryl resin or Polyurethane or polyureas ester or polyurethane or silicones or both the above or ginseng kind according to different proportion mixing etc. as base material, it is dissolved in mixed solvent, and then obtains base material mixed liquor；And be there is pore structure or not having hole or two kinds and add in mixed solvent according to the fillers of different proportion of this base material 0.1 to 10 times by weight ratio, and obtain filler mixed liquor；Again this base material mixed liquor is filtered with above-mentioned filler mixed liquor；And base material mixed liquor after filtering is uniformly mixed with filler mixed liquor；Whereby, use this base material and mix there is pore structure filler prepared by nanometer heat radiation coating, have that resistance tocrocking is good and effect of high-cooling property.In addition, in another possible embodiments, the coating composition of this heat dissipating layer 73 includes: filler can be bamboo charcoal, carbon pipe, all types of graphite, graphene microchip, Graphene, carbon ball, carbon fiber, nitridation, aluminium nitride, Muscovitum, two gasification silicon, titanium dioxide, carborundum, zinc oxide, germanium oxide, the combinations of aforementioned filler；This base material is selected from thinner, ethyl acetate, dehydrated alcohol, alcohols, ketone, esters or distilled water or the combination of aforementioned mixed solvent with the mixed solvent of this filler；This base material is 0.9 to 1.4 times with the weight ratio of mixed solvent, and this filler is 0.3 to 10 times with the weight ratio of mixed solvent.In addition, 120g fluorocarbon resin can be dissolved in 100g ethyl acetate and obtain base material mixed liquor, another being dissolved in 70g distilled water by 30g bamboo charcoal nano obtains filler mixed liquor, and carry out filtering this base material mixed liquor and this filler mixed liquor with 350 eye mesh screens, then use this base material mixed liquor of emulsification pretreatment machine high-speed stirred and this filler mixed liquor 10 minutes, and mix homogeneously is nanometer heat radiation coating.But, the above-mentioned heat dissipating layer i.e. preparation method of coating composition, by separate case application patent of invention, it is not described in detail in this.
It it is this utility model the second possible embodiments shown in Fig. 4 B, its structure being same as first embodiment represents with same reference numbers, its difference is only that: this metal level 71 is a complex metal layer, include the different metal level of upper and lower two layers of 71a, 71b, complex metal layer 71a, 71b are selected from they including: copper, aluminum, titanium, silver, gold, copper alloy, aluminium alloy, silver alloy, titanium alloy or rustless steel, and the most wantonly two kinds of metal stacked on top are constituted.
It it is this utility model the 3rd possible embodiments shown in Fig. 4 C, its structure being same as first and second embodiment represents with same reference numbers, its difference is only that: this complex metal layer is three layers of 71a, 71b, 71c, it is selected from including: copper, aluminum, titanium, silver, gold, copper alloy, aluminium alloy, silver alloy, titanium alloy or rustless steel, and the most wantonly three kinds of metals are that sandwich kenel stacking is constituted.In the present embodiment, this complex metal layer is three layers, and preferable, to constitute the complex metal layer of a high intensity and high-termal conductivity with intermediate layer 71b for rustless steel.
Shown in Fig. 5～Fig. 7, show temperature uniforming heat radiation composite membrane 70 of the present utility model, be installed in a use state reference map of this electronic installation 80.This electronic installation 80 generally comprises: a panel 20；One LCD MODULE 30, is located at the lower section of this transparency carrier 20；One mesochite support 21, is located at the lower section of this LCD MODULE 30；One circuit board 40, is located at the lower section of this mesochite support 21, at least provided with an electronic chip 41 on it；One battery 50, is located at the lower section of this mesochite support 21；And a bonnet 60, relatively it being combined in this mesochite support 21 root edge, it has an accommodation space 61, in order to receive aforesaid component；But, above take off component and belong to prior art (Prior Art), non-patent purpose of the present utility model, hold and do not repeat.
Of the present utility model it is characterized mainly in that: by this temperature uniforming heat radiation composite membrane 70, help inside or the housing heat radiation of this electronic installation 80, such as: by this temperature uniforming heat radiation composite membrane 70, mesochite support 21 or the shape of bonnet 60 according to this electronic installation 80, cut into appropriate size, then dress is attached on this mesochite support 21 or bonnet 60, also or with this mesochite support 21 or bonnet 60 etc. on the component of thermal source, or be installed directly on thermal source, Unitary injection formed, in order to the heat of this electronic chip 41 is transmitted the most up or down, the heat of this electronic chip 41 output is passed, heat transversely horizontal dispersion is made to go out, then by this temperature uniforming heat radiation composite membrane 70, reach Homogeneouslly-radiating；Whereby, this utility model stacks, with sandwich kenel, the temperature uniforming heat radiation composite membrane 70 that constituted, has combination heat radiation, samming and three kinds of merits of heat conduction for one, both can keep the reliability of electronic apparatus, effect that again can be cost-effective.Furthermore, its metal level can be constituted by MULTILAYER COMPOSITE, to constitute the complex metal layer of a high intensity and high conductivity, except heat conduction function can be promoted, and more can the overall construction intensity of strengthening electronic device.
The above, it it is only preferred embodiment of the present utility model, not this utility model is made any pro forma restriction, every any simple modification, equivalent variations and modification made above example according to technical spirit of the present utility model, all still falls within the range of technical solutions of the utility model.
In sum, this utility model designs in structure, uses in practicality and cost benefit, needed for complying fully with industry development, and disclosed structure is also to have unprecedented innovative structure, there is novelty, creativeness, practicality, meet the regulation about new patent important document, therefore mention application in accordance with the law.
Claims (7)
1. the temperature uniforming heat radiation structure of composite membrane of an electronic installation, it is characterized in that: by a temperature uniforming heat radiation composite membrane, being installed in the internal position near thermal source of an electronic installation or be installed directly on thermal source, the structure of this temperature uniforming heat radiation composite membrane the most sequentially stacks and includes:
One metal level, is at least made up of one layer of conductive metal, and thickness is the thin-slab structure of 3um-150um, and this metal level has a upper surface and a lower surface；
One hypolimnion, to have the coating prepared by layer structure filler, is coated on the upper surface of this metal level, and the samming heat conducting coating that thickness is 3um-100um；And
One heat dissipating layer, is coated on the upper surface of this hypolimnion with heat radiation coating, and heat radiation that thickness is 3um-100um and heat conducting coating；Accordingly, the temperature uniforming heat radiation composite membrane of three-layer composite structure is formed.
The temperature uniforming heat radiation structure of composite membrane of electronic installation the most according to claim 1, it is characterised in that described metal level is single metal level or complex metal layer.
The temperature uniforming heat radiation structure of composite membrane of electronic installation the most according to claim 2, it is characterised in that described single metal level includes: copper, aluminum, titanium, silver, gold, copper alloy, aluminium alloy, silver alloy, titanium alloy or rustless steel.
The temperature uniforming heat radiation structure of composite membrane of electronic installation the most according to claim 2, it is characterized in that, described complex metal layer is two layers or three layers, and by copper, aluminum, titanium, silver, gold, copper alloy, aluminium alloy, silver alloy, titanium alloy or rustless steel, the most wantonly two kinds or three kinds of metals are constituted.
The temperature uniforming heat radiation structure of composite membrane of electronic installation the most according to claim 4, it is characterised in that described complex metal layer is three layers, and intermediate layer is rustless steel, to constitute the complex metal layer of a high intensity and high-termal conductivity.
The temperature uniforming heat radiation structure of composite membrane of electronic installation the most according to claim 2, it is characterised in that described metal level includes two dimension or three dimensional structure.
The temperature uniforming heat radiation structure of composite membrane of electronic installation the most according to claim 2, it is characterised in that described hypolimnion also includes with the coating prepared by stratiform and stereochemical structure filler.
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| CN201620131397.2U CN205546374U (en) | 2016-02-19 | 2016-02-19 | Electron device's scattered heat recombination membrane structure of samming |
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| CN201620131397.2U CN205546374U (en) | 2016-02-19 | 2016-02-19 | Electron device's scattered heat recombination membrane structure of samming |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN107979943A (en) * | 2016-10-21 | 2018-05-01 | 东莞爵士先进电子应用材料有限公司 | The composite support radiator structure of portable electronic devices |
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| CN108463090B (en) * | 2017-02-21 | 2023-12-29 | 东莞钱锋特殊胶粘制品有限公司 | Light-weight three-dimensional composite uniform temperature material |
| CN109005607A (en) * | 2017-06-06 | 2018-12-14 | 山东圣泉新材料股份有限公司 | A kind of graphene Electric radiant Heating Film and its preparation method and application and the equipment containing graphene Electric radiant Heating Film |
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| CN109714916A (en) * | 2017-10-25 | 2019-05-03 | 日进材料股份有限公司 | Impact absorbing composite sheet |
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