CN205546375U - Electron device's scattered heat recombination membrane structure of samming - Google Patents
Electron device's scattered heat recombination membrane structure of samming Download PDFInfo
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- CN205546375U CN205546375U CN201620131414.2U CN201620131414U CN205546375U CN 205546375 U CN205546375 U CN 205546375U CN 201620131414 U CN201620131414 U CN 201620131414U CN 205546375 U CN205546375 U CN 205546375U
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- heat radiation
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- composite membrane
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Abstract
The utility model provides an electron device's scattered heat recombination membrane structure of samming, installs the scattered heat recombination membrane of a samming to be close to the position of heat source or directly to install on the heat source inside an electron device, and the structure that this samming looses the heat recombination membrane contains: is a metal level comprise one deck heat conductivity metal at least, and thickness 3um 150um's thin plate structure, metal level have a first and second surface, a hypolimnion is in order having the stratiform, or the coating prepared of stratiform and spatial structure's filler, is the coating 3um at the first surface of metal level, thickness 100um's samming heat conduction coating, and a heat dissipation layer, be that thickness is 3um with nanometer or the micron thermal coatings coating second surface at the metal level 100um's heat radiation and heat conduction coating. The utility model discloses have the reliability and the life that keep electron device, promote the efficiency of overall structure intensity.
Description
Technical field
This utility model is the temperature uniforming heat radiation structure of composite membrane about a kind of electronic installation, and espespecially a kind of combination is dispelled the heat, led
Heat and three kinds of functions of samming are in the composite molding structure of one.
Background technology
Smart mobile phone, tablet PC, mobile computer, guiding aircraft or the electronic installation such as portable, it is by double
Core, four cores, eight cores etc. develop into the process chip of the highest operation frequency；And the development of electronic apparatus is
With short and small frivolous as designer trends, therefore for high operation efficiency and short and small frivolous double requirements, electronic apparatus can be reached
Radiating efficiency the most important.
Secondary person, the radiating mode of current electronic apparatus, mainly by sides such as simple perforate, heat conduction, thermal convection currents
Formula, but those radiating modes cannot heat energy produced by the most high-effect chip of load, the problem therefore having accumulated heat, heat energy
Cannot uniformly dispersing, cause reducing radiating efficiency within electronic apparatus.
Also, the chip of usual electronic equipment is operationally main heating source, dispel the heat not only for reducing chip self temperature
Degree, to ensure that it normally can work within the temperature range of requiring, can not cause housing local mistake during heat radiation to be taken into account
Heat, causes bad experience to consumer.
Therefore No. 496156 patent of the novel M of TaiWan, China, disclosing a kind of electronic apparatus radiator structure, it includes
One fore shell support 11, LCD MODULE 12 and bonnet 16 and a heat-conductive assembly 15, this LCD MODULE 12 side is provided with
One substrate 14, this substrate 14 is provided with at least one electronic building brick 141, and this bonnet 16 has an accommodation space 161, this liquid crystal
Showing that module 12 side is sticked a center 13, this substrate 14 is embedded on this center 13, and this heat-conductive assembly 15 is arranged at described electronics
Between assembly 141 and bonnet 16, this heat-conductive assembly 15 side correspondence contacts described electronic building brick 141, and opposite side correspondence contacts institute
State bonnet 16；Accumulated heat is not produced so as to helping the uniform thermal power of this electronic building brick 121 to spread.But looking into, it is as the heat conduction of heat radiation
After assembly 15 and bonnet 16 manufacture respectively, then binding heat-conductive assembly 15 at bonnet 16 inner edge surface, therefore its radiating efficiency still has
Weak point, the most still has and improves space.
Therefore solve the problems referred to above point of tradition electronic apparatus, for major subjects of the present utility model.
Utility model content
Technical problem underlying to be solved in the utility model is, overcomes the drawbacks described above that prior art exists, and carries
For the temperature uniforming heat radiation structure of composite membrane of a kind of electronic installation, it stacks the temperature uniforming heat radiation composite membrane constituted, knot with sandwich kenel
Close heat radiation, heat conduction and three kinds of merits of samming and be used for one, there is the reliability that can keep electronic apparatus, again can be cost-effective
Effect；Its metal level can be that MULTILAYER COMPOSITE is constituted, to constitute the complex metal layer of a high intensity and high-termal conductivity, except increasing
Enter heat conduction function, more can the overall construction intensity of strengthening electronic device.
This utility model solves its technical problem and be the technical scheme is that
The temperature uniforming heat radiation structure of composite membrane of a kind of electronic installation, comprises: a metal level, at least by one layer of conductive metal structure
Becoming, and thickness is the thin-slab structure of 3um-150um, this metal level has a first surface and a second surface；One hypolimnion, with
There is the coating prepared by layer structure filler, be coated with the first surface being laid in this metal level, and thickness is the equal of 3um-100um
Temperature heat conducting coating；And a heat dissipating layer, it is coated on the second surface of this metal level with nanometer or micron heat radiation coating, and thickness is
The heat radiation of 3um-100um and heat conducting coating；Accordingly, the temperature uniforming heat radiation composite membrane of three-layer composite structure is formed.
According to front taking off feature, this metal level includes single metal level or complex metal layer.
According to front taking off feature, this single metal level includes: copper, aluminum, titanium, silver, gold, copper alloy, aluminium alloy, silver alloy, titanium
Alloy or rustless steel, any of which metal is constituted.
According to front taking off feature, this complex metal layer is two layers or three layers, including: copper, aluminum, titanium, silver, gold, copper alloy, aluminum close
Gold, silver alloy, titanium alloy or rustless steel, the most wantonly two kinds or three kinds of metals are constituted according to stacking.
According to front taking off feature, the thin-slab structure of this metal level, it may include present: two dimension or three dimensional structure.
According to front taking off feature, this hypolimnion also includes with the coating prepared by stratiform and stereochemical structure filler.
Technological means is taken off on by, of the present utility model with temperature uniforming heat radiation structure of composite membrane, in conjunction with heat radiation, heat conduction and samming
Three kinds of merits, for one, can keep reliability and the service life of electronic installation, can reach again conveniently to use, and cost-saved
Effect.Furthermore, may make up the complex metal layer of a high intensity and high-termal conductivity further, except heat conduction function can be promoted, also
Can the overall construction intensity of strengthening electronic device.
The beneficial effects of the utility model are, it stacks the temperature uniforming heat radiation composite membrane constituted with sandwich kenel, in conjunction with dissipating
Heat, heat conduction and three kinds of merits of samming, for one, have the reliability that can keep electronic apparatus, merit that again can be cost-effective
Effect；Its metal level can be that MULTILAYER COMPOSITE is constituted, and to constitute the complex metal layer of a high intensity and high-termal conductivity, leads except promoting
Hot merit energy, more can the overall construction intensity of strengthening electronic device.
Accompanying drawing explanation
With embodiment, this utility model is further illustrated below in conjunction with the accompanying drawings.
Figure 1A is the exploded perspective view of existing a kind of electronic apparatus heat radiation construction.
Figure 1B is the combination stereogram of existing a kind of electronic apparatus heat radiation construction.
Fig. 1 C is the sectional view of existing a kind of electronic apparatus heat radiation construction.
Fig. 1 D is the enlarged drawing shown in 1D in Fig. 1 C.
Fig. 2 is the stereoscopic figure of this utility model temperature uniforming heat radiation composite membrane.
Fig. 3 is the part amplification stereogram shown in 3 in Fig. 2.
Fig. 4 A is the sectional view of this utility model the first possible embodiments.
Fig. 4 B is the sectional view of this utility model the second possible embodiments.
Fig. 4 C is the sectional view of this utility model the 3rd possible embodiments.
Fig. 5 is the exploded perspective view that this utility model one uses state reference map.
Fig. 6 is the combination stereogram that this utility model one uses state reference map.
Fig. 7 is the sectional view that this utility model one uses state reference map.
Label declaration in figure:
20 panels
21 mesochite supports
30 LCD MODULE
40 circuit boards
41 electronic chips
50 batteries
60 bonnets
61 accommodation spaces
70 temperature uniforming heat radiation composite membranes
71 metal levels
711 first surfaces
712 second surfaces
71a ground floor
The 71b second layer
71c third layer
72 hypolimnions
73 heat dissipating layers
80 electronic installations
Detailed description of the invention
First, refer to shown in Fig. 2～Fig. 7, the temperature uniforming heat radiation composite membrane 70 of the electronic installation disclosed by this utility model,
Its inside being mainly installed in electronic installation 80 or housing near the position of thermal source or are installed directly on thermal source, as heat radiation
Being used, alleged electronic installation 80 of the present utility model includes: smart mobile phone, tablet PC, mobile computer, guiding aircraft
Deng, and following electronic installation 80 is to be demonstration example according to mobile phone, but it is not limited to this；The structure of this temperature uniforming heat radiation composite membrane 70,
Its first possible embodiments, as shown in Fig. 3 and Fig. 4 A, comprises: a metal level 71, is at least made up of one layer of conductive metal, and thick
The thin-slab structure of degree 3um-150um, it can include in two dimension or three dimensional structure.This metal level 71 have a first surface 711 and
One second surface 712；In the present embodiment, this metal level 70 is a single metal level, and it is selected from including: copper, aluminum, titanium, silver,
Gold, copper alloy, aluminium alloy, silver alloy, titanium alloy or rustless steel, any of which metal is constituted.Metal level major function is tool
Heat conduction, heat sinking function and structure function, its composition can be divided into single metal level or complex metal layer, single metal level can be copper or
Aluminum or titanium is silver-colored or golden or copper alloy or aluminium alloy or silver alloy or titanium alloy or rustless steel.Complex metal layer can be above-mentioned list
One metal select its two or select it and three form according to stack manner, its stack manner is fine and close knot physically or chemically
Structure, has heat conduction, heat radiation and structure function.
One hypolimnion 72, is by having layer structure, or stratiform and the coating prepared by stereochemical structure filler, and painting is laid in
The first surface 711 of this metal level 71, and the samming heat conducting coating that thickness is 3um-100um.In the present embodiment, this hypolimnion 72
Major function, hypolimnion major function is tool samming and heat conduction function, and the possible embodiments that this coating is constituted includes but do not limits
Fixed: with fluorocarbon resin or fluororesin or acryl resin or Polyurethane or polyureas ester or polyurethane or silicones or above two
Kind or three kinds be dissolved in mixed solvent as base material according to different proportion mixing etc., and then obtain base material mixed liquor；Another by weight ratio
For this base material 0.1 to 10 times have layer structure or layer structure filler add stereochemical structure or two kinds add according to different proportion
Filler add in mixed solvent, and obtain filler mixed liquor；And base material mixed liquor after filtering is stirred with filler mixed liquor
Mix mix homogeneously.Whereby, use this base material and mix there is layer structure filler prepared by the coating of samming heat conduction function,
There is the good and superior samming heat conductivility of resistance tocrocking.In another possible embodiments, this hypolimnion 72 includes: filler uses main
Wanting composition is the most all types of graphite of layered inorganic material, graphene microchip, Graphene, nitridation, Muscovitum；Accessory ingredient can be following
A bamboo charcoal, carbon pipe, carbon ball, aluminium nitride, Muscovitum, silicon dioxide, carborundum, zinc oxide, germanium oxide, carbon fiber or titanium dioxide
Titanium, with necessary composition or necessary composition, the composition of this filler adds that the combination of secondary composition, its main composition or secondary composition can be wherein
One of or its composition form；The mixed solvent of this base material another and this filler selected from thinner, ethyl acetate, dehydrated alcohol, alcohols,
Ketone, esters or distilled water or the combination of aforementioned mixed solvent；This base material is 0.9 to 1.4 times with the weight ratio of mixed solvent, should
Filler is 0.3 to 10 times with the weight ratio of mixed solvent.Obtain additionally, 120g fluorocarbon resin can be dissolved in 200g ethyl acetate
Base material mixed liquor, is separately dissolved in 200g nano-graphene in 300g distilled water and obtains filler mixed liquor, and carry out with 350 eye mesh screens
Filter this base material mixed liquor and this filler mixed liquor, then mix with this filler with this base material mixed liquor of emulsification pretreatment machine high-speed stirred
Close liquid 10 minutes, and mix homogeneously is samming heat-conductive coating, to spray or to be coated with or to be impregnated with via different drying modes, its dry film
Total thickness is 3um to 100um.But, the preparation method of this hypolimnion coating, by separate case application patent of invention, hold and do not repeat.
And a heat dissipating layer 73, it is the second surface 712 being coated on this metal level 71 with nanometer or micron heat radiation coating, and
Thickness is heat radiation and the heat conducting coating of 3um-100um；Accordingly, the temperature uniforming heat radiation composite membrane 70 of three-layer composite structure is formed.This
In embodiment, ground floor heat radiation coating major function is that conduction of heat has thermal radiation function concurrently, and the one of this heat dissipating layer coating composition can
Row embodiment includes but does not limits: with fluorocarbon resin or fluororesin or acryl resin or Polyurethane or polyureas ester or unsaturated poly-
Ester or silicones or both the above or three kinds as base material according to different proportion mixing etc., are dissolved in mixed solvent, and then obtain base
Material mixed liquor；And be there is pore structure or not having hole or two kinds according to different proportion of this base material 0.1 to 10 times by weight ratio
Filler add in mixed solvent, and obtain filler mixed liquor；Again this base material mixed liquor and above-mentioned filler mixed liquor were carried out
Filter；And base material mixed liquor after filtering is uniformly mixed with filler mixed liquor；Whereby, this base material is used to mix and have
Nanometer heat radiation coating prepared by the filler of pore structure, has that resistance tocrocking is good and effect of high-cooling property.Additionally, at another
In possible embodiments, the coating of this heat dissipating layer 73 constitutes and includes: filler can be that bamboo charcoal, carbon pipe, all types of graphite, Graphene are micro-
Sheet, Graphene, carbon ball, carbon fiber, nitridation, aluminium nitride, Muscovitum, silicon dioxide, titanium dioxide, carborundum, zinc oxide, oxidation
Germanium, the combination of aforementioned filler；The mixed solvent of this base material and this filler selected from thinner, ethyl acetate, dehydrated alcohol, alcohols,
Ketone, esters or distilled water or the combination of aforementioned mixed solvent；This base material is 0.9 to 1.4 times with the weight ratio of mixed solvent, should
Filler is 0.3 to 10 times with the weight ratio of mixed solvent.Obtain additionally, 120g fluorocarbon resin can be dissolved in 100g ethyl acetate
Base material mixed liquor, is separately dissolved in 30g bamboo charcoal nano in 70g distilled water and obtains filler mixed liquor, and filter with 350 eye mesh screens
This base material mixed liquor and this filler mixed liquor, then with this base material mixed liquor of emulsification pretreatment machine high-speed stirred and this filler mixed liquor
10 minutes, and mix homogeneously is nanometer heat radiation coating.But, the above-mentioned heat dissipating layer i.e. preparation method of coating composition, separate case application is sent out
Bright patent, is not described in detail in this.
Being this utility model the second possible embodiments shown in Fig. 4 B, it is same as the structure of first embodiment with same reference numbers
Representing, its difference is only that: this metal level 71 is a complex metal layer, includes the different metal level of upper and lower two layers of 71a, 71b,
Complex metal layer 71a, 71b are selected from they including: copper, aluminum, titanium, silver, gold, copper alloy, aluminium alloy, silver alloy, titanium alloy or not
Rust steel, the most wantonly two kinds of metal stacked on top are constituted.
Being this utility model the 3rd possible embodiments shown in Fig. 4 C, it is same as the structure of first and second embodiment with identical
Figure number represents, its difference is only that: this complex metal layer is three layers of 71a, 71b, 71c, and it is selected from including: copper, aluminum, titanium, silver,
Gold, copper alloy, aluminium alloy, silver alloy, titanium alloy or rustless steel, the most wantonly three kinds of metals are that sandwich kenel stacking is constituted.This
In embodiment, this complex metal layer is three layers, and preferable, to constitute a high intensity and high heat conduction with intermediate layer 71b for rustless steel
The complex metal layer of property.
Shown in Fig. 5～Fig. 7, it is to show temperature uniforming heat radiation composite membrane 70 of the present utility model, is installed in this electronic installation 80
One uses state reference map.This electronic installation 80 generally comprises: a panel 20；One LCD MODULE 30, is located at this transparent
The lower section of substrate 20；One mesochite support 21, is located at the lower section of this LCD MODULE 30；One circuit board 40, is located at this mesochite and props up
The lower section of frame 21, at least provided with an electronic chip 41 on it；One battery 50, is located at the lower section of this mesochite support 21；And after one
Lid 60, is combined in this mesochite support 21 root edge relatively, and it has an accommodation space 61, in order to receive aforesaid component；But, above take off
Component belongs to prior art (Prior Art), non-patent purpose of the present utility model, holds and does not repeats.
Of the present utility model it is characterized mainly in that: by this temperature uniforming heat radiation composite membrane 70, help the interior of this electronic installation 80
Portion or housing heat radiation, such as: by this temperature uniforming heat radiation composite membrane 70, according to mesochite support 21 or the shape of bonnet 60 of this electronic installation 80
Shape, cuts into appropriate size, then dress be attached on this mesochite support 21 or bonnet 60, also or with this mesochite support 21 or bonnet 60
On component Deng close thermal source, or it is installed directly on thermal source, Unitary injection formed, in order to by the heat edge of this electronic chip 41
Vertical direction is transmitted up or down, is passed by the heat of this electronic chip 41 output, makes heat transversely horizontal dispersion
Go out, then by this temperature uniforming heat radiation composite membrane 70, reach Homogeneouslly-radiating；Whereby, this utility model sandwich kenel stacking structure
The temperature uniforming heat radiation composite membrane become, has combination heat radiation, heat conduction and three kinds of merits of samming for one, mobile electron both can have been kept to fill
The reliability put, effect that again can be cost-effective.Furthermore, its metal level can be MULTILAYER COMPOSITE constitute, with constitute a high intensity and
The complex metal layer of high conductivity, except heat conduction function can be promoted, more can the overall construction intensity of strengthening electronic device.
The above, be only preferred embodiment of the present utility model, not this utility model is made any in form
Restriction, every according to technical spirit of the present utility model, above example is made any simple modification, equivalent variations with
Modify, all still fall within the range of technical solutions of the utility model.
In sum, this utility model designs in structure, uses in practicality and cost benefit, complies fully with industry development
Required, and disclosed structure is also to have unprecedented innovative structure, has novelty, creativeness, practicality, meets and have
Close the regulation of new patent important document, therefore mention application in accordance with the law.
Claims (7)
1. the temperature uniforming heat radiation structure of composite membrane of an electronic installation, it is characterised in that: by a temperature uniforming heat radiation composite membrane, it is installed in one
Electronic installation inside near the position of thermal source or is installed directly on thermal source, and the structure of this temperature uniforming heat radiation composite membrane bag contains:
One metal level, is at least made up of one layer of conductive metal, and thickness is the thin-slab structure of 3um-150um, and this metal level has
There are a first surface and a second surface；
One hypolimnion, is the coating prepared by the filler with layer structure, is coated with the first surface being laid in this metal level, and
Thickness is the samming heat conducting coating of 3um-100um；And
One heat dissipating layer, is the second surface being coated on this metal level with heat radiation coating, and the heat radiation that thickness is 3um-100um with
Heat conducting coating；Accordingly, the temperature uniforming heat radiation composite membrane of three-layer composite structure is formed.
The temperature uniforming heat radiation structure of composite membrane of electronic installation the most according to claim 1, it is characterised in that described metal level bag
Include single metal level or complex metal layer.
The temperature uniforming heat radiation structure of composite membrane of electronic installation the most according to claim 2, it is characterised in that described single metal
Layer includes: copper, aluminum, titanium, silver, copper alloy, aluminium alloy, silver alloy, titanium alloy or rustless steel.
The temperature uniforming heat radiation structure of composite membrane of electronic installation the most according to claim 2, it is characterised in that described composition metal
Layer is two layers or three layers, including: copper, aluminum, titanium, silver, gold, copper alloy, aluminium alloy, silver alloy, titanium alloy or rustless steel, Qi Zhongren
Two kinds or three kinds of metals compositions.
The temperature uniforming heat radiation structure of composite membrane of electronic installation the most according to claim 4, it is characterised in that described composition metal
Layer is three layers, and intermediate layer is rustless steel, to constitute the complex metal layer of a high intensity and high conductivity.
The temperature uniforming heat radiation structure of composite membrane of electronic installation the most according to claim 2, it is characterised in that described metal level bag
Include two dimension or three dimensional structure.
The temperature uniforming heat radiation structure of composite membrane of electronic installation the most according to claim 2, it is characterised in that described hypolimnion is also
Including with the coating prepared by stratiform and stereochemical structure filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620131414.2U CN205546375U (en) | 2016-02-19 | 2016-02-19 | Electron device's scattered heat recombination membrane structure of samming |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620131414.2U CN205546375U (en) | 2016-02-19 | 2016-02-19 | Electron device's scattered heat recombination membrane structure of samming |
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| CN205546375U true CN205546375U (en) | 2016-08-31 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793710A (en) * | 2017-01-22 | 2017-05-31 | 东莞钱锋特殊胶粘制品有限公司 | A kind of portable electronic device soaking radiator structure and technique |
| CN107979942A (en) * | 2016-10-21 | 2018-05-01 | 东莞爵士先进电子应用材料有限公司 | The thermal dispersant coatings structure of portable electronic devices |
| CN107979943A (en) * | 2016-10-21 | 2018-05-01 | 东莞爵士先进电子应用材料有限公司 | The composite support radiator structure of portable electronic devices |
| CN109429444A (en) * | 2017-07-13 | 2019-03-05 | 东莞市普威玛精密工业有限公司 | The shell of portable electronic devices transfers thermal dispersant coatings structure |
| CN109499825A (en) * | 2017-09-15 | 2019-03-22 | 湖北高宏通电子科技有限公司 | The manufacturing method of the ink-absorbing material composite membrane of thermostable heat-conductive heat dissipation |
| CN109640588A (en) * | 2018-10-15 | 2019-04-16 | 华为技术有限公司 | Terminal device |
| CN112996346A (en) * | 2020-01-14 | 2021-06-18 | 荣耀终端有限公司 | High-strength vapor chamber, preparation method thereof and electronic equipment |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107979942A (en) * | 2016-10-21 | 2018-05-01 | 东莞爵士先进电子应用材料有限公司 | The thermal dispersant coatings structure of portable electronic devices |
| CN107979943A (en) * | 2016-10-21 | 2018-05-01 | 东莞爵士先进电子应用材料有限公司 | The composite support radiator structure of portable electronic devices |
| CN107979943B (en) * | 2016-10-21 | 2022-04-19 | 深圳市为什新材料科技有限公司 | Composite support heat radiation structure capable of carrying electronic device |
| CN106793710A (en) * | 2017-01-22 | 2017-05-31 | 东莞钱锋特殊胶粘制品有限公司 | A kind of portable electronic device soaking radiator structure and technique |
| CN109429444A (en) * | 2017-07-13 | 2019-03-05 | 东莞市普威玛精密工业有限公司 | The shell of portable electronic devices transfers thermal dispersant coatings structure |
| CN109499825A (en) * | 2017-09-15 | 2019-03-22 | 湖北高宏通电子科技有限公司 | The manufacturing method of the ink-absorbing material composite membrane of thermostable heat-conductive heat dissipation |
| CN109640588A (en) * | 2018-10-15 | 2019-04-16 | 华为技术有限公司 | Terminal device |
| CN112996346A (en) * | 2020-01-14 | 2021-06-18 | 荣耀终端有限公司 | High-strength vapor chamber, preparation method thereof and electronic equipment |
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