CN205451097U - Fingerprint identification module and electronic equipment - Google Patents
Fingerprint identification module and electronic equipment Download PDFInfo
- Publication number
- CN205451097U CN205451097U CN201521081967.3U CN201521081967U CN205451097U CN 205451097 U CN205451097 U CN 205451097U CN 201521081967 U CN201521081967 U CN 201521081967U CN 205451097 U CN205451097 U CN 205451097U
- Authority
- CN
- China
- Prior art keywords
- fingerprint recognition
- fingerprint identification
- connecting line
- cover plate
- recognition chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 18
- 229920006305 unsaturated polyester Polymers 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 229910021365 Al-Mg-Si alloy Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 241000218202 Coptis Species 0.000 claims description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 229920000058 polyacrylate Polymers 0.000 claims description 3
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 230000035945 sensitivity Effects 0.000 abstract description 4
- 238000001514 detection method Methods 0.000 abstract description 3
- 244000062793 Sorghum vulgare Species 0.000 abstract 1
- 238000003556 assay Methods 0.000 abstract 1
- 235000019713 millet Nutrition 0.000 abstract 1
- 239000000463 material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Landscapes
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The utility model discloses a fingerprint identification module and electronic equipment, the fingerprint identification module includes fingerprint identification chip, base plate, connecting wire and apron. The side of fingerprint identification chip is equipped with the link, and the fingerprint identification chip sets up on the base plate. The one end and the link looks electric connection of connecting wire, the base plate is connected to the other end of connecting wire. Fingerprint identification module and connecting clamp are located between base plate and the apron. So, because the link of fingerprint identification chip side is connected to the connecting wire for the connecting wire can not bulge the upper surface of fingerprint identification chip, has reduced the distance between fingerprint identification chip and the apron, has improved the spine on the finger surface on the fingerprint identification chip assay apron and the capacitance value between millet and the fingerprint identification chip, has reduced electric capacity detection accuracy, thereby has improved the sensitivity of fingerprint identification chip.
Description
Technical field
This utility model relates to fingerprint recognition field, especially relates to a kind of fingerprint recognition module and a kind of electronic equipment.
Background technology
Connecting line one end of existing fingerprint recognition module is connected to substrate, the connecting line other end is connected to the upper surface of fingerprint recognition chip, connecting line and fingerprint recognition chip gripper are located between substrate and cover plate, owing to metal wire is bending and top protrusion fingerprint recognition chip upper surface, cause the distance between fingerprint recognition chip and cover plate bigger, capacitance between ridge and paddy and the fingerprint chip of the finger surface above fingerprint recognition chip detection cover plate, capacitance detecting accuracy can be reduced, thus affect the sensitivity of fingerprint recognition chip.
Utility model content
This utility model is intended at least to solve one of technical problem present in prior art.To this end, this utility model needs to provide a kind of fingerprint recognition module.
This utility model it is also required to provide a kind of electronic equipment.
The fingerprint recognition module of this utility model embodiment, including fingerprint recognition chip, substrate, connecting line and cover plate.The side of described fingerprint recognition chip is provided with connection end, and described fingerprint recognition chip is arranged on the substrate.One end of described connecting line is electrically connected with mutually with the described end that is connected, and the other end of described connecting line connects described substrate.Described fingerprint recognition chip and described connecting line are located between described substrate and described cover plate.
The fingerprint recognition module of this utility model embodiment, owing to connecting line connects the connection end of fingerprint recognition chip sides, connecting line can be made will not to protrude the upper surface of fingerprint recognition chip, reduce the distance between fingerprint recognition chip and cover plate, improve the accuracy of capacitance between ridge and paddy and the fingerprint recognition chip that fingerprint recognition chip detection finger on the cover board shows, thus improve the sensitivity of fingerprint recognition chip, it is ensured that the resolution of the fingerprint image collected.
In some embodiments, described fingerprint recognition chip and described connecting line are coated with encapsulated layer, and described cover plate is located on described encapsulated layer.
In some embodiments, described encapsulated layer is epoxy resin, polyacrylate, epoxy acrylate, urethane acrylate, unsaturated polyester (UP) or polymercaptan.
In some embodiments, the thickness of described encapsulated layer is more than or equal to the height of described fingerprint recognition chip.
In some embodiments, described cover plate glueds joint on described encapsulated layer.
In some embodiments, described cover plate is ceramic cover plate or glass cover-plate.
In some embodiments, described connecting line is gold thread, aluminum steel, copper cash, al-mg-si alloy line or Al-zn-mg-cu alloy line.
In some embodiments, the camber of described connecting line is less than the height of described fingerprint recognition chip.
The electronic equipment of this utility model embodiment, including the fingerprint recognition module described in any of the above-described embodiment.
Additional aspect of the present utility model and advantage will part be given in the following description, and part will become apparent from the description below, or is recognized by practice of the present utility model.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present utility model and advantage will be apparent from easy to understand, wherein from combining the accompanying drawings below description to embodiment:
Fig. 1 is the structural representation of the fingerprint recognition module according to this utility model embodiment.
Detailed description of the invention
Of the present utility model embodiment is described below in detail, and the example of described embodiment is shown in the drawings, and the most same or similar label represents same or similar element or has the element of same or like function.The embodiment described below with reference to accompanying drawing is exemplary, is only used for explaining this utility model, and it is not intended that to restriction of the present utility model.
In description of the present utility model, it will be appreciated that, term " " center ", " longitudinally ", " laterally ", " length ", " width ", " thickness ", on " ", D score, " front ", " afterwards ", " left ", " right ", " vertically ", " level ", " push up ", " end ", " interior ", " outward ", " clockwise ", orientation or the position relationship of the instruction such as " counterclockwise " are based on orientation shown in the drawings or position relationship, it is for only for ease of description this utility model and simplifies description, rather than indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to restriction of the present utility model.Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or implicitly include one or more described features.In description of the present utility model, " multiple " are meant that two or more, unless otherwise expressly limited specifically.
In description of the present utility model, it should be noted that unless otherwise clearly defined and limited, term " is installed ", " being connected ", " connection " should be interpreted broadly, and connects for example, it may be fixing, it is also possible to be to removably connect, or be integrally connected.Can be to be mechanically connected, it is also possible to be electrical connection.Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill in the art, above-mentioned term concrete meaning in this utility model can be understood as the case may be.
In this utility model, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score can include that the first and second features directly contact, it is also possible to include that the first and second features are not directly contact but by the other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above " include that fisrt feature directly over second feature and oblique upper, or is merely representative of fisrt feature level height higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " include that fisrt feature directly over second feature and oblique upper, or is merely representative of fisrt feature level height less than second feature.
Following disclosure provides many different embodiments or example for realizing different structure of the present utility model.In order to simplify disclosure of the present utility model, hereinafter parts and setting to specific examples are described.Certainly, they are the most merely illustrative, and are not intended to limit this utility model.Additionally, this utility model can in different examples repeat reference numerals and/or reference letter, this repetition is for purposes of simplicity and clarity, itself does not indicate the relation between discussed various embodiment and/or setting.Additionally, the various specific technique that provides of this utility model and the example of material, but those of ordinary skill in the art are it can be appreciated that the application of other techniques and/or the use of other materials.
Referring to Fig. 1, the fingerprint recognition module 10 of this utility model embodiment, including fingerprint recognition chip 12, substrate 14, connecting line 16 and cover plate 18.Fingerprint recognition chip 12 is arranged on the substrate 14.The side 126 of fingerprint recognition chip 12 is provided with connection end 120, and one end of connecting line 16 is electrically connected with being connected end 120 phase, and the other end of connecting line 16 is electrically connected with substrate 14.Fingerprint recognition chip 12 and connecting line 16 are located between substrate 14 and cover plate 18.
In the present embodiment, connect end 120 and be specially weld pad.
The fingerprint recognition module 10 of this utility model embodiment, the connection end 120 of the side 126 of fingerprint recognition chip 12 is connected due to connecting line 16, connecting line 16 can be made will not to protrude the upper surface 122 of fingerprint recognition chip 12, reduce the distance between fingerprint recognition chip 12 and cover plate 18, improve fingerprint recognition chip 12 and detect the accuracy of the capacitance between ridge and paddy and the fingerprint recognition chip 12 of the finger surface on cover plate 18, thus improve fingerprint recognition chip 12 sensitivity.
In the present embodiment, fingerprint recognition chip 12 and connecting line 16 are coated with encapsulated layer 20, and cover plate 18 is located on encapsulated layer 20.
So, encapsulated layer 20 encapsulates fingerprint recognition chip 12 and connecting line 16, thus fingerprint recognition module 10 is carried out insulation blocking.
Specifically, fingerprint recognition chip 12 includes upper surface 122 lower surface 124 opposing with upper surface 122 and is connected the side 126 of upper surface 122 and lower surface 124.Fingerprint recognition chip 12 arranges on the substrate 14, lower surface 124 towards and fit on the substrate 14.Upper surface 122 is towards cover plate 18.Encapsulated layer 20 it is filled with between substrate 14 and cover plate 18.Two sides 126 of fingerprint recognition chip 12 are provided with connection end 120, and connecting line 16 is connected on two sides 126 of fingerprint recognition chip 12.
Substrate 14 is circuit board, is coupled together with the circuit of electronic equipment by the circuit of fingerprint recognition chip 12, can be specifically FPC circuit board or PCB.
In the present embodiment, encapsulated layer 20 is epoxy resin.
So, epoxy resin has fast setting, and thermostability, electrical insulating property are preferable, and advantage with low cost.
Certainly, encapsulated layer 20 is not limited to epoxy resin, it is also possible to for other encapsulating materials, such as polyacrylate, epoxy acrylate, urethane acrylate, unsaturated polyester (UP), polymercaptan etc..As long as the support strength after encapsulated layer 20 solidification is high, heat-resist and electrical insulating property is good, it is possible to increase the signal conducting effect of fingerprint recognition chip 12.
In the present embodiment, the thickness of encapsulated layer 20 is more than or equal to the height of fingerprint recognition chip 12.
So, encapsulated layer 20 can be completely covered connecting line 16 and fingerprint recognition chip 12.
In the present embodiment, cover plate 18 glueds joint on encapsulated layer 20.Specifically, cover plate 18 is adhered to encapsulated layer 20 surface by glue or glued membrane.
So, cover plate 18 is assembled on encapsulated layer 20 by bonding mode, easy installation and removal.
In the present embodiment, cover plate 18 is ceramic cover plate or glass cover-plate.
So, the sense of touch of cover plate 18 is preferably and signal conducting effect is preferable.
The fingerprint recognition chip 12 of this utility model embodiment offer and the connected mode of connecting line 16, the camber of connecting line 16 is less, and the thickness of corresponding encapsulated layer 20 can be thinning, the thickness of the most thinning fingerprint recognition module 10.
In the present embodiment, connecting line 16 is gold thread, aluminum steel, copper cash, al-mg-si alloy line or Al-zn-mg-cu alloy line.Certainly connecting line 16 is not limited to the kind enumerating out, and those skilled in the art can select other kinds of metal wire the most flexibly.
In the present embodiment, the camber of connecting line 16 is less than the height of fingerprint recognition chip 12.
So, the camber of connecting line 16 is less than the height of fingerprint recognition chip 12, it is possible to reduce the thickness of encapsulated layer 20, reduces penetration range between fingerprint recognition chip 12 and cover plate 18.
The electronic equipment of this utility model embodiment, including the fingerprint recognition module 10 described in above-mentioned embodiment.
So, electronic equipment is owing to using the fingerprint recognition module 10 of this utility model embodiment, and the image resolution ratio gathering fingerprint is higher, reacts sensitiveer, better user experience.
It should be noted that above-mentioned fingerprint recognition module 10 so feature and advantage are all applicable to this electronic equipment, this is no longer going to repeat them.
The electronic equipment of this utility model embodiment can be mobile phone, computer, panel computer, electronic lock or other electronic equipments needing to gather fingerprint image.
In the description of this specification, the description of reference term " embodiment ", " some embodiments ", " exemplary embodiment ", " example ", " concrete example " or " some examples " etc. means that the specific features, structure, material or the feature that combine embodiment or example description are contained at least one embodiment of the present utility model or example.In this manual, the schematic representation to above-mentioned term is not necessarily referring to identical embodiment or example.And, the specific features of description, structure, material or feature can combine in any one or more embodiments or example in an appropriate manner.
Embodiment the most of the present utility model, it will be understood by those skilled in the art that: these embodiments can carry out in the case of without departing from principle of the present utility model and objective multiple change, revise, replace and modification, scope of the present utility model is limited by claim and equivalent thereof.
Claims (9)
1. a fingerprint recognition module, it is characterised in that including:
Fingerprint recognition chip, the side of described fingerprint recognition chip is provided with connection end；
Substrate, described fingerprint recognition chip is arranged on the substrate；
Connecting line, one end of described connecting line is electrically connected with mutually with the described end that is connected, and the other end of described connecting line connects described substrate；And
Cover plate, described fingerprint recognition chip and described connecting line are located between described substrate and described cover plate.
Fingerprint recognition module the most according to claim 1, it is characterised in that described fingerprint recognition chip and described connecting line are coated with encapsulated layer, and described cover plate is located on described encapsulated layer.
Fingerprint recognition module the most according to claim 2, it is characterised in that described encapsulated layer is epoxy resin, polyacrylate, epoxy acrylate, urethane acrylate, unsaturated polyester (UP) or polymercaptan.
Fingerprint recognition module the most according to claim 2, it is characterised in that the thickness of described encapsulated layer is more than or equal to the height of described fingerprint recognition chip.
Fingerprint recognition module the most according to claim 2, it is characterised in that described cover plate glueds joint on described encapsulated layer.
Fingerprint recognition module the most according to claim 1, it is characterised in that described cover plate is ceramic cover plate or glass cover-plate.
Fingerprint recognition module the most according to claim 1, it is characterised in that described connecting line is gold thread, aluminum steel, copper cash, al-mg-si alloy line or Al-zn-mg-cu alloy line.
8. according to the fingerprint recognition module described in claim 1～7 any one, it is characterised in that the camber of described connecting line is less than the height of described fingerprint recognition chip.
9. an electronic equipment, it is characterised in that include the fingerprint recognition module described in claim 1～8 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521081967.3U CN205451097U (en) | 2015-12-18 | 2015-12-18 | Fingerprint identification module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521081967.3U CN205451097U (en) | 2015-12-18 | 2015-12-18 | Fingerprint identification module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205451097U true CN205451097U (en) | 2016-08-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521081967.3U Expired - Fee Related CN205451097U (en) | 2015-12-18 | 2015-12-18 | Fingerprint identification module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205451097U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107066949A (en) * | 2017-03-13 | 2017-08-18 | 广东欧珀移动通信有限公司 | fingerprint module, display screen and mobile terminal |
| CN109697384A (en) * | 2017-10-20 | 2019-04-30 | 南昌欧菲生物识别技术有限公司 | Manufacturing method, fingerprint recognition mould group and the electronic device of fingerprint recognition mould group |
-
2015
- 2015-12-18 CN CN201521081967.3U patent/CN205451097U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107066949A (en) * | 2017-03-13 | 2017-08-18 | 广东欧珀移动通信有限公司 | fingerprint module, display screen and mobile terminal |
| CN109697384A (en) * | 2017-10-20 | 2019-04-30 | 南昌欧菲生物识别技术有限公司 | Manufacturing method, fingerprint recognition mould group and the electronic device of fingerprint recognition mould group |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 330013 no.1189 Jingdong Avenue, high tech Zone, Nanchang City, Jiangxi Province Patentee after: OFilm Microelectronics Technology Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: OFilm Tech Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013 no.1189 Jingdong Avenue, high tech Zone, Nanchang City, Jiangxi Province Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Shenzhen OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP03 | Change of name, title or address |
Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: Ophiguang Group Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013 no.1189 Jingdong Avenue, high tech Zone, Nanchang City, Jiangxi Province Patentee before: OFilm Microelectronics Technology Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210611 Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: Jiangxi OMS Microelectronics Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Ophiguang Group Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160810 |
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| CF01 | Termination of patent right due to non-payment of annual fee |