CN205248300U - Six luminous LED light structures - Google Patents

Six luminous LED light structures Download PDF

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Publication number
CN205248300U
CN205248300U CN201521083906.0U CN201521083906U CN205248300U CN 205248300 U CN205248300 U CN 205248300U CN 201521083906 U CN201521083906 U CN 201521083906U CN 205248300 U CN205248300 U CN 205248300U
Authority
CN
China
Prior art keywords
led
translucent
transparent material
luminous
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201521083906.0U
Other languages
Chinese (zh)
Inventor
徐文发
张宏德
谢进艳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lianyungang Guangding Electronics Co., Ltd.
Original Assignee
PARA LIGHT NANJING ELECTRONICS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PARA LIGHT NANJING ELECTRONICS CO Ltd filed Critical PARA LIGHT NANJING ELECTRONICS CO Ltd
Priority to CN201521083906.0U priority Critical patent/CN205248300U/en
Application granted granted Critical
Publication of CN205248300U publication Critical patent/CN205248300U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)

Abstract

The utility model discloses a six luminous LED light source packaging structure, its structure includes LED wafer 1, translucent or transparent material's base plate 2, epoxy or silica gel encapsulation glue 3, gold thread or wire 4, heat conduction wafer fixing glue 5, wherein LED wafer 1 is fixed on translucent or transparent material's base plate 2 through heat conduction wafer fixing glue 5, LED wafer 1 corresponds through gold thread or wire 4 on the positive negative pole circuit on the base plate 2 that is connected to translucent or transparent material, cover to LED wafer 1 and gold thread region that to seal what glue epoxy or silica gel 3. The advantage: six luminous LED light sources use base plate translucent or transparent material to encapsulate, and light can see through the bottom substrate and launch out to realize that six LED are luminous, can maximumly utilize LED's luminous efficacy.

Description

Six luminous LED light source structures
Technical field
The utility model relates to a kind of six luminous LED light source structures, belong to LED light source technical field.
Background technology
Tradition LED light source mostly uses the substrate of light tight material to encapsulate, thus LED light source can realize at most five luminous. This has brought significant limitation to use.
Summary of the invention
The utility model proposes a kind of six luminous LED light source structures, its object is intended to overcome existing
The existing above-mentioned defect of technology, LED light source uses substrate translucent or transparent material to encapsulate, and light can see through bottom substrate and emit, thus it is luminous to realize six of LED, can farthest utilize the luminous efficiency of LED.
Technical solution of the present utility model: six luminous LED light source structures, its structure is substrate 2, epoxy or silica gel packaging glue 3, gold thread or wire 4, the heat conduction crystal-bonding adhesive 5 that comprises LED wafer 1, translucent or transparent material, wherein LED wafer 1 is fixed on by heat conduction crystal-bonding adhesive 5 on the substrate 2 of translucent or transparent material, LED wafer 1 is connected to by gold thread or wire 4 correspondences on the positive and negative electrode circuit on the substrate 2 of translucent or transparent material, and what LED wafer 1 and gold thread region were covered to sealing is epoxy or silica gel 3.
Advantage of the present utility model: six luminous LED light sources use substrate translucent or transparent material to encapsulate, and light can see through bottom substrate and emit, thereby it is luminous to realize six of LED, can farthest utilize the luminous efficiency of LED.
Brief description of the drawings
Fig. 1 is six luminous LED light source structure charts.
Detailed description of the invention
As shown in Figure 1, six luminous LED light source structures, its structure comprises substrate 2, epoxy or silica gel packaging glue 3, gold thread or wire 4, the heat conduction crystal-bonding adhesive 5 of LED wafer 1, translucent or transparent material, wherein LED wafer 1 is fixed on by heat conduction crystal-bonding adhesive 5 on the substrate 2 of translucent or transparent material, LED wafer 1 is connected to by gold thread or wire 4 correspondences on the positive and negative electrode circuit on the substrate 2 of translucent or transparent material, and what LED wafer 1 and gold thread region were covered to sealing is epoxy or silica gel 3.
When enforcement; use heat conduction crystal-bonding adhesive to be fixed on the substrate of translucent or transparent material LED wafer; re-using gold thread or wire connects wafer to be conducting on positive and negative electrode circuit corresponding on substrate; finally use epoxy or silica gel or other glue Like material covers sealing to wafer and gold thread region, to protect gold thread or the wire of wafer and conduction use.
The preparation method of six luminous LED light source structures, comprises the steps:
1) LED wafer uses heat conduction crystal-bonding adhesive to be fixed on the substrate of translucent or transparent material;
2) use gold thread or wire that wafer is connected and is conducting on positive and negative electrode circuit corresponding on substrate;
3) use epoxy or silica gel or other glue Like material covers sealing to wafer and gold thread region, with
Gold thread or the wire of protection wafer and conduction use.

Claims (1)

1. six luminous LED light source structures, it is characterized in that comprising substrate, epoxy or silica gel packaging glue, gold thread or wire, the heat conduction crystal-bonding adhesive of LED wafer, translucent or transparent material, wherein LED wafer is fixed on by heat conduction crystal-bonding adhesive on the substrate of translucent or transparent material, LED wafer is connected to by gold thread or wire correspondence on the positive and negative electrode circuit on the substrate of translucent or transparent material, and what LED wafer and gold thread region covered sealing is epoxy or silica gel.
CN201521083906.0U 2015-12-23 2015-12-23 Six luminous LED light structures Active CN205248300U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201521083906.0U CN205248300U (en) 2015-12-23 2015-12-23 Six luminous LED light structures

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201521083906.0U CN205248300U (en) 2015-12-23 2015-12-23 Six luminous LED light structures

Publications (1)

Publication Number Publication Date
CN205248300U true CN205248300U (en) 2016-05-18

Family

ID=55947377

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201521083906.0U Active CN205248300U (en) 2015-12-23 2015-12-23 Six luminous LED light structures

Country Status (1)

Country Link
CN (1) CN205248300U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20190201

Address after: 223500 Weihai Road, Guannan Economic Development Zone, Lianyungang City, Jiangsu Province

Patentee after: Lianyungang Guangding Electronics Co., Ltd.

Address before: 211131 No. 1 Tangquan West Road, Tangshan Street, Jiangning District, Nanjing City, Jiangsu Province

Patentee before: Para Light Nanjing Electronics Co., Ltd.

TR01 Transfer of patent right