CN205237802U - Gasbag formula wafer bonds and helps pressure handle - Google Patents
Gasbag formula wafer bonds and helps pressure handle Download PDFInfo
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- CN205237802U CN205237802U CN201521114038.8U CN201521114038U CN205237802U CN 205237802 U CN205237802 U CN 205237802U CN 201521114038 U CN201521114038 U CN 201521114038U CN 205237802 U CN205237802 U CN 205237802U
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- wafer bonding
- pressing aid
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Abstract
The utility model provides a gasbag formula wafer bonds and helps pressure handle, include: built -in vent pipe's grab handle, can loading and unloading install in the gasbag of the top end of grab handle, with locate the last pneumatic valve of vent pipe, vent pipe's one end with the gasbag intercommunication, vent pipe's the other end and air feed unit are linked together. The utility model is used for extrude the bubble after the wafer bonds, press according to leveling.
Description
Technical field
The utility model belongs to the smooth application of semiconductor wafer polishing field, particularly, relates to a kind of for pressing and make its smooth wafer bonding of gasbag-type closely pressing aid handle that bonds to obtain by wafer after wafer bonding.
Background technology
Semiconductor wafer is the base material of preparation modern optoelectronic devices, the face shape parameter on their surfaces directly has influence on the yield rate of subsequent device preparation section and the performance of device as total thickness deviation (TotalThicknessVariation, TTV), flexibility (Bow), angularity (Warp) etc. First semiconductor wafer is cut into boule wafer by complete brilliant pyridine, and then these boule wafer, through the processing of the operations such as surperficial grinding, polishing, cleaning, finally could be used for the preparation of opto-electronic device. Conventionally, the face shape parameter TTV difference of the boule wafer after cutting obviously, Bow and Warp performance significantly, and wafer surface roughness is large, poor flatness, so must just can reach through grinding and polishing operation the requirement of subsequent device preparation section.
Grinding and polishing operation refer to by chemically mechanical polishing (Chemicalmechanicalpolishing, CMP) method is ground and polishing operation the surface of boule wafer, eliminate the thickness of wafer and the deviation of flatness, and further make wafer surface reach the flatness of atom magnitude. Having wax polishing technology is a kind of effective technology of semiconductor wafer processing, is particularly suitable for that size is large, the sample of thin thickness. Employing have the polishing of wax polishing technology obtain wafer surface smooth, damage little. There is wax polishing technique normally to utilize paraffin to be bonded on sample tray the wafer of well cutting, then sample tray is positioned on CMP workbench. Sample tray and polished land relatively rotate under the drive of mechanical force, in polished land, spray abrasive material simultaneously, and on sample tray, bonding wafer is realized the object of grinding and polishing under the effect of polished land frictional force and abrasive material like this.
In actual production, because the processing between each wafer there are differences, the parameters such as their thickness, TTV, Bow, Warp can not be in full accord, and even difference is very large each other for thickness, and the multi-disc wafer that needs to bond on a common sample tray. With this, wafer on sample tray, bond whether smooth meeting have influence on the final effect of polishing. The mode using is at present after bonding wafer, paraffin is uncolled condense before successively with soft cloth, brush and module press by, squeeze out the bubble at back, make wafer leveling.
Wafer is in the process of bonding, although adopt soft cloth and brush to press by position and the angle that can marginally adjust wafer, but its dynamics is less, is conventionally difficult to make wafer to flatten completely, cannot get rid of the bubble in paraffin adhesive segment. Although and it is larger to adopt module to press by dynamics, but easily make wafer pressure break. Meanwhile, along with the development of modern semiconductor technology, the wafer of large scale, minimal thickness more and more becomes trend, and the use of soft cloth, brush and module that conventional wafer bonding pressing aid uses is also more and more restricted.
Utility model content
In view of the problem of above existence, it is a kind of for extruding bubble after wafer bonding, pressing by smooth gasbag-type wafer bonding pressing aid handle that technical problem to be solved in the utility model is to provide.
In order to solve the problems of the technologies described above, gasbag-type wafer bonding pressing aid handle provided by the utility model, comprising: the lever of built-in breather line; Can be installed on to handling the air bag of the top end of described lever; With the air valve of being located on described breather line; One end of described breather line is communicated with described air bag, and the other end of described breather line is connected with air supply unit.
Adopt gasbag-type wafer bonding pressing aid handle of the present utility model, can there is open and close function for the air valve of inflation, the air bag at the top end place that is releasably installed on lever is inflated via breather line by air supply unit, utilize the air bag after inflation to press by operation wafer, the bubble existing in wafer bonding face after bonding is extruded, thereby made wafer bonding smooth, tight. The utility model can be applicable to the smooth application of semiconductor wafer polishing field.
Gasbag-type wafer bonding pressing aid handle of the present utility model, both can ensure that wafer surface was stressed evenly, can reach again the needed dynamics of wafer that flattens. Meanwhile, because air bag is respectively to stressed uniform characteristic, can eliminate to greatest extent the bubble in paraffin adhesive segment, make wafer bonding smooth, tight.
Again, in the utility model, can be also, described lever be formed as T-shaped lever.
According to the utility model, lever is formed as T-shaped lever, the personnel that are convenient to operation grip, be conducive to bonding after wafer press by.
Again, in the utility model, can be also, described air bag be installed on the bottom of described T-shaped lever, and described breather line connects and stretches out to any one end on Bing Cong top, top from the bottom of described T-shaped lever.
According to the utility model, can in T-shaped lever, effectively arrange the breather line that air bag is inflated, be convenient to realize the air bag utilizing after inflation wafer is pressed by operation.
Again, in the utility model, can be also, described air valve be located at the part of the extended described breather line of described T-shaped lever.
According to the utility model, this air valve cuts off breather line that T-shaped lever includes and the access from the extraneous gas of air supply unit, and that realizes gas by the open and close of air valve fills, puts operation.
Again, in the utility model, can be also, described air bag possesses the connecting portion being connected with the top end of described lever.
According to the utility model, be releasably installed on the top end of lever by this connecting portion air bag, facilitate the replacing of air bag. Thus, can change as required the air bag of different size.
Again, in the utility model, can be also, described connecting portion be connected by helicitic texture with described top end.
According to the utility model, make to connect portion by helicitic texture and be connected with top end, can realize easily the dismounting and change of air bag.
Again, in the utility model, can be also, described air bag be made up of fire resistant latex.
According to the utility model, adopt fire resistant latex to make air bag, can be in hot environment, do not destroy wafer surface in the situation that to the wafer after bonding carry out smooth, press by operation.
According to following detailed description of the invention and with reference to accompanying drawing, will understand better foregoing of the present utility model and other objects, features and advantages.
Brief description of the drawings
Fig. 1 shows according to the structural representation of the gasbag-type wafer bonding pressing aid handle of the utility model one example;
Fig. 2 shows the air bag schematic diagram of the wafer bonding of gasbag-type shown in Fig. 1 pressing aid handle under unaerated state;
Fig. 3 shows the wafer bonding of gasbag-type shown in Fig. 1 pressing aid handle, after inflation, bond wafer is pressed to the air bag schematic diagram by state.
Reference numeral:
A, lever,
B, air bag,
C, breather line,
D, air valve,
The wafer of e, bonding,
F, sample tray,
G, connecting portion.
Detailed description of the invention
Further illustrate the utility model below in conjunction with accompanying drawing and following embodiment, should be understood that accompanying drawing and following embodiment are only for the utility model is described, and unrestricted the utility model.
The many disadvantages existing in the process of bonding for current wafer, the utility model provides a kind of gasbag-type wafer bonding pressing aid handle, comprising: the lever of built-in breather line; Can be installed on to handling the air bag of the top end of described lever; With the air valve of being located on described breather line; One end of described breather line is communicated with described air bag, and the other end of described breather line is connected with air supply unit.
Adopt gasbag-type wafer bonding pressing aid handle of the present utility model, in use first opening air valve inflates air bag, secondly close gas check valve, then use the air bag at the lever top end place of this gasbag-type wafer bonding pressing aid handle to press by the wafer surface of bonding, thereby make wafer bonding tight. Gasbag-type wafer bonding pressing aid handle of the present utility model is with low cost, it is succinct, simple to operate to construct, be easy to carry; protection wafer basis on to wafer bonding region in bubble extrude effect excellence, can in the smooth operation of semiconductor wafer polishing, be widely used.
Particularly, Fig. 1 shows according to the structural representation of the gasbag-type wafer bonding pressing aid handle of the utility model one example; Fig. 2 shows the air bag schematic diagram of the wafer bonding of gasbag-type shown in Fig. 1 pressing aid handle under unaerated state; Fig. 3 shows the wafer bonding of gasbag-type shown in Fig. 1 pressing aid handle, after inflation, bond wafer is pressed to the air bag schematic diagram by state.
As shown in Figure 1, the gasbag-type wafer bonding pressing aid handle of this example, comprises the lever a of built-in breather line c, and is located at the air valve d on breather line c. In this example, this lever a is formed as T-shaped lever. This gasbag-type wafer bonding pressing aid handle also comprises the air bag b that can load and unload the top end that is installed on lever a. One end of breather line c is communicated with air bag b, and the other end of breather line c is connected with diagram abridged air supply unit. Can cut off breather line c that T-shaped lever a includes and the access from the extraneous gas of air supply unit by air valve d, that realizes gas by the open and close of air valve fills, puts operation.
As shown in Figure 1, in this example, this air bag b is positioned at the bottom of T-shaped lever a. And breather line c connects and stretches out to any one end on Bing Cong top, top from the bottom of T-shaped lever a. For example, in this example, breather line c extends outward from the right-hand member on T-shaped lever a top, and air valve d is positioned at the upper right of T-shaped lever a.
Also as shown in Figure 1, air bag b possesses the connecting portion g being connected with the top end of lever a. Preferably, this connecting portion g can be connected by helicitic texture with the top end of lever a. For example, as shown in Figure 1, this connecting portion g possess with top end on the internal thread that matches of the external screw thread that forms, can air bag b be dismantled or be changed by the rotation of this connecting portion g thus.
Preferably, can adopt fire resistant latex to make air bag b, thus can be in hot environment, do not destroy wafer surface in the situation that to the wafer after bonding carry out smooth, press by operation.
As shown in Figures 2 and 3, the gasbag-type wafer bonding pressing aid handle of this example, in use procedure first according to the air bag b of the suitable size of size Selection of bond wafer; Secondly by opening air valve d, air bag b is inflated; Then use the air bag b at the lever a top end place of this gasbag-type wafer bonding pressing aid handle to press by the wafer surface of bonding. Thereby extrude the bubble in bond wafer adhesive surface, make wafer bonding tight.
The gasbag-type wafer bonding pressing aid handle construction of this example is simple, simple to operate, be easy to use, be easy to carry. Can in semiconductor wafer polishing formation process, use efficiently.
Further illustrate gasbag-type wafer bonding pressing aid handle of the present utility model below by preferred embodiment. The air bag of the different size relating in following examples is the suit of the utility model gasbag-type wafer bonding pressing aid handle in actual applications.
Embodiment 1: the gasbag-type wafer bonding pressing aid handle that is applicable to 3 inches of wafers
Select the air bag b of suitable 3 inches of wafers, as shown in Figure 2, be spun on the bottom of the lever a of gasbag-type wafer bonding pressing aid handle, open air valve d air bag b is inflated. The air bag b of this gasbag-type wafer bonding pressing aid handle bottom is aimed to the center of the wafer e on sample tray f, with defeat by, as shown in Figure 3, until air bag size cover wafers completely, maintenance pressure unclamped after 30 seconds. After removing gasbag-type wafer bonding pressing aid handle, check whether wafer back has bubble, on bubble position repeats, step is pressed by operation, until the wafer bonding face after bonding without bubble, closely, wafer entirety bonding is smooth.
Embodiment 2: the gasbag-type wafer bonding pressing aid handle that is applicable to 4 inches of wafers
Select the air bag b of suitable 4 inches of wafers, as shown in Figure 2, be spun on the bottom of the lever a of gasbag-type wafer bonding pressing aid handle, open air valve d air bag b is inflated. The air bag b of this gasbag-type wafer bonding pressing aid handle bottom is aimed to the center of the wafer e on sample tray f, with defeat by, as shown in Figure 3, until air bag size cover wafers completely, maintenance pressure unclamped after 30 seconds. After removing gasbag-type wafer bonding pressing aid handle, check whether wafer back has bubble, on bubble position repeats, step is pressed by operation, until the wafer bonding face after bonding without bubble, closely, wafer entirety bonding is smooth.
Do not departing under the aim of essential characteristic of the present utility model, the utility model can be presented as various ways, therefore the example in the utility model is to be illustrative rather than definitive thereof, be defined by the claims due to scope of the present utility model but not limited by description, and drop on the scope that claim defines, or all changes in the full scope of equivalents of its scope defining are all understood to include in claims.
Claims (7)
1. a gasbag-type wafer bonding pressing aid handle, is characterized in that, comprising:
The lever of built-in breather line;
Can be installed on to handling the air bag of the top end of described lever; With
Be located at the air valve on described breather line;
One end of described breather line is communicated with described air bag, and the other end of described breather line is connected with air supply unit.
2. gasbag-type wafer bonding pressing aid handle according to claim 1, is characterized in that, described lever is formed as T-shaped lever.
3. gasbag-type wafer bonding pressing aid handle according to claim 2, is characterized in that, described air bag is installed on the bottom of described T-shaped lever, and described breather line connects and stretches out to any one end on Bing Cong top, top from the bottom of described T-shaped lever.
4. gasbag-type wafer bonding pressing aid handle according to claim 3, is characterized in that, described air valve is located at the part of the extended described breather line of described T-shaped lever.
5. gasbag-type wafer bonding pressing aid handle according to claim 1, is characterized in that, described air bag possesses the connecting portion being connected with the top end of described lever.
6. gasbag-type wafer bonding pressing aid handle according to claim 5, is characterized in that, described connecting portion is connected by helicitic texture with described top end.
7. according to the gasbag-type wafer bonding pressing aid handle described in any one in claim 1 to 6, it is characterized in that, described air bag is made up of fire resistant latex.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521114038.8U CN205237802U (en) | 2015-12-29 | 2015-12-29 | Gasbag formula wafer bonds and helps pressure handle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521114038.8U CN205237802U (en) | 2015-12-29 | 2015-12-29 | Gasbag formula wafer bonds and helps pressure handle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205237802U true CN205237802U (en) | 2016-05-18 |
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| CN201521114038.8U Active CN205237802U (en) | 2015-12-29 | 2015-12-29 | Gasbag formula wafer bonds and helps pressure handle |
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| CN (1) | CN205237802U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105479327A (en) * | 2015-12-29 | 2016-04-13 | 中国科学院上海硅酸盐研究所 | Air sac type wafer bonding pressure assisting handle |
| CN109192684A (en) * | 2018-09-11 | 2019-01-11 | 德淮半导体有限公司 | Wafer bonding machine |
-
2015
- 2015-12-29 CN CN201521114038.8U patent/CN205237802U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105479327A (en) * | 2015-12-29 | 2016-04-13 | 中国科学院上海硅酸盐研究所 | Air sac type wafer bonding pressure assisting handle |
| CN109192684A (en) * | 2018-09-11 | 2019-01-11 | 德淮半导体有限公司 | Wafer bonding machine |
| CN109192684B (en) * | 2018-09-11 | 2021-04-09 | 德淮半导体有限公司 | Wafer bonding machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201124 Address after: No. 1814, Lianshan District, Shanghai Patentee after: SHANGHAI SHENHE THERMO-MAGNETICS ELECTRONICS Co.,Ltd. Address before: 200050 No. 1295 Dingxi Road, Shanghai, Changning District Patentee before: SHANGHAI INSTITUTE OF CERAMICS, CHINESE ACADEMY OF SCIENCES |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210916 Address after: 244000 Xihu 3rd road, Tongling Economic Development Zone, Anhui Province Patentee after: Anhui microchip Changjiang semiconductor materials Co.,Ltd. Address before: No. 181, Shanlian Road, Baoshan District, Shanghai 200444 Patentee before: SHANGHAI SHENHE THERMO-MAGNETICS ELECTRONICS Co.,Ltd. |