CN203282356U - Polishing grinding wheel - Google Patents
Polishing grinding wheel Download PDFInfo
- Publication number
- CN203282356U CN203282356U CN2013203175757U CN201320317575U CN203282356U CN 203282356 U CN203282356 U CN 203282356U CN 2013203175757 U CN2013203175757 U CN 2013203175757U CN 201320317575 U CN201320317575 U CN 201320317575U CN 203282356 U CN203282356 U CN 203282356U
- Authority
- CN
- China
- Prior art keywords
- polishing
- grinding wheel
- matrix
- emery wheel
- elastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Abstract
The utility model provides a polishing grinding wheel which can be used for automatically polishing corners of some special-shaped components, so that labor intensity is relieved and machining quality is improved. The polishing grinding wheel comprises a disc-shaped rigid substrate, wherein a connection part connected with a middle shaft in a matched mode is arranged in the center of the rigid substrate, or the middle shaft is integrally arranged in the center of the rigid substrate, an elastic substrate is arranged on the surface of the rigid substrate, and polishing pieces are pasted on the surface of the elastic substrate at intervals or continuously. In the polishing process, a motor is used for driving the polishing grinding wheel to rotate through the middle shaft, and the polishing pieces on the surface of the polishing grinding wheel make contact with a part to be polished to polish the part. Due to the fact that the elastic substrate is arranged between the rigid substrate and the polishing pieces, the polishing pieces are in elastic contact with the part to be polished instead of rigid contact, the surface of the part to be polished will not be damaged, and the polishing effect is improved.
Description
Technical field
The utility model belongs to grinding apparatus manufacturing technology field, specially refers to a kind of polishing emery wheel.
Background technology
Grinding apparatus is a kind of for mill floor, metope, the machinery of ceiling, cabinet panel or analog grinding-polishing, its main working parts is exactly emery wheel, the grinding-polishings such as floor, metope, cabinet face are carried out in emery wheel rotation under actuating unit drives, process velocity is fast, efficiency is high, and quality is good., for some form parts, also do not have suitable polishing emery wheel to carry out polishing at present, can only manual polishing, not only labour intensity is large, efficiency is low, and the uniformity of polishing is very poor, and particularly edge is difficult to guarantee crudy.
Summary of the invention
The purpose of this utility model is to propose a kind of polishing emery wheel, utilizes this polishing emery wheel to carry out automatic polishing to the edge of some form parts, thereby reduces labour intensity, improves crudy.
Polishing emery wheel of the present utility model comprises a discoid rigid matrix, the central authorities of described rigid matrix are provided with for the connecting portion that is connected with axis or have been wholely set axis, the surface of described rigid matrix is provided with elastic matrix, described elastic matrix spaced surface or post continuously polished silicon wafer.
When polishing, utilizing motor to drive the polishing emery wheel by axis rotates, the polished silicon wafer on polishing emery wheel surface contacts with polished parts, it is carried out polishing, owing to being provided with elastic matrix between rigid matrix and polished silicon wafer, therefore between polished silicon wafer and polished parts for Elastic Contact rather than pure rigidity contact, so just can not break the surface of polished parts, improved polishing effect.Above-mentioned connecting portion can be axis hole, and rigid matrix can adopt direct axis hole assembling or adopt the assembling mode of tapered end handle to be connected with axis like this.
Further, described polished silicon wafer is formed by abrasive material and scrim layer bonding, and described scrim layer is bonded on elastic matrix.Above-mentioned polished silicon wafer can be made multiple angles and shape, thereby meets the polishing needs of various form parts.
Specifically, described rigid matrix is that metal or duroplasts are made, and described elastic matrix is that rubber or resin are made.
Further, the periphery of described elastic matrix is provided with cambered surface, and this cambered surface can be carried out polishing to the seamed edge of various form parts.
Polishing emery wheel of the present utility model is simple in structure, reliable operation, can replace artificial heterotype edge to Inorganic Non-metallic Materials such as quartz, artificial hilllock stone, stone material, pottery, glass to carry out rough polishing, middle throwing, fine polishing, has good practicality.
Description of drawings
Fig. 1 is the top view of polishing emery wheel of the present utility model.
Fig. 2 is the cutaway view of polishing emery wheel of the present utility model.
Fig. 3 is the structural representation of polished silicon wafer of the present utility model.
The specific embodiment
Below contrast accompanying drawing, by the description to embodiment, the effect of the mutual alignment between the shape of the specific embodiment of the present utility model such as related each member, structure, each several part and annexation, each several part and operation principle etc. are described in further detail.
Embodiment 1:
As shown in Figure 1, 2, the polishing emery wheel of the present embodiment comprises a discoid rigid matrix 1, the central authorities of described rigid matrix 1 have been wholely set axis 2, the surface of described rigid matrix 1 is provided with the elastic matrix 3 that rubber or resin are made, the periphery of elastic matrix 3 is provided with cambered surface 4, and some polished silicon wafer 5 are posted at these cambered surface 4 intervals.
As shown in Figure 3, polished silicon wafer 5 is formed by abrasive material 51 and scrim layer 52 bondings, described scrim layer 52 is bonded on elastic matrix 3, wherein abrasive material 51 is bonded by polishing material, resinoid bonds such as the superhard abrading agents such as diadust, cerium oxide, above-mentioned polished silicon wafer 5 can be made multiple angles and shape, thereby meets the polishing needs of various form parts.Certainly, varigrained abrasive material 51 can be set, so just can realize rough polishing, middle throwing, fine polishing etc.,, through varigrained polishing grinding, make the polishing object present original color and brightness.
When polishing, utilize motor to pass through axis 2 and drive the rotation of polishing emery wheel, the polished silicon wafer 5 on polishing emery wheel surface contacts with polished parts, it is carried out polishing, owing to being provided with elastic matrix 3 between rigid matrix 1 and polished silicon wafer 5, therefore between polished silicon wafer 5 and polished parts for Elastic Contact rather than pure rigidity contact, so just can not break the surface of polished parts, improved polishing effect.
Claims (4)
1. polishing emery wheel, it is characterized in that comprising a discoid rigid matrix, the central authorities of described rigid matrix are provided with for the connecting portion that is connected with axis or have been wholely set axis, the surface of described rigid matrix is provided with elastic matrix, described elastic matrix spaced surface or post continuously polished silicon wafer.
2. polishing emery wheel according to claim 1, is characterized in that described polished silicon wafer is formed by abrasive material and scrim layer bonding, and described scrim layer is bonded on elastic matrix.
3. polishing emery wheel according to claim 1 and 2, is characterized in that described rigid matrix is that metal or duroplasts are made, and described elastic matrix is that rubber or resin are made.
4. polishing emery wheel according to claim 1 and 2, is characterized in that the periphery of described elastic matrix is provided with cambered surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203175757U CN203282356U (en) | 2013-06-04 | 2013-06-04 | Polishing grinding wheel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203175757U CN203282356U (en) | 2013-06-04 | 2013-06-04 | Polishing grinding wheel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203282356U true CN203282356U (en) | 2013-11-13 |
Family
ID=49538733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013203175757U Expired - Lifetime CN203282356U (en) | 2013-06-04 | 2013-06-04 | Polishing grinding wheel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203282356U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103921206A (en) * | 2014-04-03 | 2014-07-16 | 东华大学 | Rotary part arc dressing tool and processing technique thereof |
| CN108942720A (en) * | 2018-08-30 | 2018-12-07 | 大连威尔博合金科技有限公司 | A kind of polishing sand cotton piece buff suitable for complicated face |
| CN110883709A (en) * | 2018-09-10 | 2020-03-17 | 合肥江丰电子材料有限公司 | Target polishing device |
-
2013
- 2013-06-04 CN CN2013203175757U patent/CN203282356U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103921206A (en) * | 2014-04-03 | 2014-07-16 | 东华大学 | Rotary part arc dressing tool and processing technique thereof |
| CN108942720A (en) * | 2018-08-30 | 2018-12-07 | 大连威尔博合金科技有限公司 | A kind of polishing sand cotton piece buff suitable for complicated face |
| CN110883709A (en) * | 2018-09-10 | 2020-03-17 | 合肥江丰电子材料有限公司 | Target polishing device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8366518B2 (en) | Orbital smoothing device | |
| CN203418389U (en) | Wafer chamfering machine | |
| CN203282356U (en) | Polishing grinding wheel | |
| CN104625940A (en) | Silicon wafer grinding and optical polishing system and machining technology thereof | |
| CN203371400U (en) | Integrated polishing abrasive wheel | |
| CN202556218U (en) | A grinder | |
| TWI577502B (en) | The method of dressing the elastic stone | |
| CN104139336A (en) | A trimming tool | |
| CN208451389U (en) | A kind of grinding pad finishing jig and grinding pad trimming device | |
| JP6830614B2 (en) | Flat glass manufacturing method, flat glass manufacturing equipment | |
| CN102990491A (en) | Grinding jig of spherical glass | |
| CN202934465U (en) | Polishing tool for ceramic restoration | |
| CN103358236B (en) | Integrated polishing emery wheel | |
| CN205271740U (en) | Polishing pad dresser and polishing device | |
| CN103659580A (en) | Clad sheet plane lapping tool | |
| CN204546163U (en) | A kind of dust-collecting type floor grinding mill | |
| CN207824717U (en) | A kind of diamond disk | |
| CN201493768U (en) | Fan-shaped bonding grinding block and grinding disk | |
| CN205734356U (en) | A kind of copper bar surface polishing device | |
| CN205021360U (en) | Case positioning head grinding device | |
| CN202572082U (en) | Polishing device with improved structure | |
| CN203622238U (en) | Grinding piece for dust-free polishing | |
| CN203045547U (en) | Diamond grinding wheel | |
| CN202985378U (en) | Elastic diamond grinding wheel | |
| CN202344412U (en) | Inlay adhesion type abrasive disk |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131113 |