CN205229958U - High radiating efficiency computer mainboard heat abstractor - Google Patents
High radiating efficiency computer mainboard heat abstractor Download PDFInfo
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- CN205229958U CN205229958U CN201521064890.9U CN201521064890U CN205229958U CN 205229958 U CN205229958 U CN 205229958U CN 201521064890 U CN201521064890 U CN 201521064890U CN 205229958 U CN205229958 U CN 205229958U
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- heat
- conducting substrate
- main board
- base plate
- cooling efficiency
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Abstract
The utility model relates to a high radiating efficiency computer mainboard heat abstractor, including heat conduction base plate and heat pipe, heating element or radiator part closely laminate and are connected on the one side of heat conduction base plate and the mainboard, the another side of heat conduction base plate with the heat pipe connection of closely laminating, the exit end of heat pipe is equipped with the radiator that communicates with the external world, the another side of heat conduction base plate still is equipped with two elastic mounting pieces, extend at elastic mounting piece both ends the body of heat conduction base plate, and with mainboard connection, the heat pipe covers area on the heat conduction base plate does 60 percent to 80 percent of heat conduction base plate area. Because the heat pipe covers area on the heat conduction base plate does 60 percent to 80 percent of heat conduction base plate area, about the heat conduction base plate is compared present structure and can be promoted the one time to the hot conduction efficiency of heat pipe to make whole heat abstractor's radiating efficiency also can improve greatly.
Description
Technical field
The utility model relates to laptop radiating technical field, particularly a kind of high cooling efficiency computer main board heat abstractor.
Background technology
The absorber plate that existing main board for notebook computer heat abstractor comprises heat dissipation element, connects the heat pipe of described heat dissipation element and heater element and be connected on described heat pipe, described absorber plate is provided with for the recess of accommodating described heater element and adjustment tapped through hole and fastening through hole, described adjustment tapped through hole is used for set screw and pass and allow the amount to adjustment tip of screw exposes second to regulate.The 20%-40% of the heat pipe of this heat abstractor and the contact area of absorber plate the chances are absorber plate area, because the contact area of heat pipe and absorber plate is less, its heat transfer efficiency is lower.
Utility model content
The utility model provides a kind of high cooling efficiency computer main board heat abstractor, less with the contact area solving above-mentioned heat pipe and absorber plate, the technical matters that its heat transfer efficiency is lower.
In order to solve the problems of the technologies described above, the utility model provides a kind of high cooling efficiency computer main board heat abstractor, comprise heat-conducting substrate and heat pipe, the one side of described heat-conducting substrate fits tightly with heater element on mainboard or heat dissipation element and is connected, the another side of described heat-conducting substrate fits tightly with described heat pipe and is connected, the endpiece of described heat pipe is provided with the heating radiator be in communication with the outside, the another side of described heat-conducting substrate is also provided with two elasticity installation sheets, the body of described heat-conducting substrate is extended at described elasticity installation sheet two ends, and be connected with described mainboard, the described heat pipe area covered on described heat-conducting substrate is 60% to 80% of described heat-conducting substrate area.
The beneficial effects of the utility model are: the area covered on heat-conducting substrate due to heat pipe is 60% to 80% of heat-conducting substrate area; The heat conduction efficiency of heat-conducting substrate heat conductive pipes is compared existing structure and can be promoted about one times, thus the radiating efficiency of whole heat abstractor also can be improved greatly.
Further, described high cooling efficiency computer main board heat abstractor also comprises radiator fan, and the air outlet of described radiator fan aims at described heating radiator.
The beneficial effect of above-mentioned further scheme is adopted to be: the air outlet of radiator fan aims at heating radiator, improves the radiating efficiency of heating radiator.
Further, dust guard is provided with between the endpiece of described heat pipe and described radiator fan.
The beneficial effect of above-mentioned further scheme is adopted to be: the endpiece of heat pipe is provided with dust guard, and the dust avoided in heat pipe enters in heating radiator, can not have influence on the radiating effect of heating radiator.
Further, described dust guard comprises the first filter screen and the second filter screen, and described first filter screen is near the endpiece of described heat pipe, and the aperture of described first filter screen is greater than the aperture of described second filter screen.
The beneficial effect of above-mentioned further scheme is adopted to be: to be filtered by the two poles of the earth of the first filter screen and the second filter screen, improve the filter effect of dust guard; Meanwhile, the aperture of the first filter screen is greater than the aperture of the second filter screen, improves the validity of dust guard, and not easily causes the obstruction of screen pack.
Further, described elasticity installation sheet is connected with described mainboard by buckle structure.
The beneficial effect of above-mentioned further scheme is adopted to be: elasticity installation sheet is connected with mainboard by buckle structure, facilitates the installation of heat abstractor, does not need extra installing component and instrument, improves installation effectiveness.
Further, the material of described heat-conducting substrate is copper.
The beneficial effect of above-mentioned further scheme is adopted to be: the heat-conducting substrate of Copper base material matter, has good heat conductivity, and radiating efficiency is very high.
Further, the one side of described heat-conducting substrate is provided with the installation groove matched with described heater element or described heat dissipation element profile.
The beneficial effect of above-mentioned further scheme is adopted to be: the one side of heat-conducting substrate is provided with the installation groove matched with heater element or heat dissipation element profile, facilitates the location with components and parts in installation process, and improves radiating efficiency further.
Further, the degree of depth of described installation groove is less than the thickness of described heater element or described heat dissipation element.
The beneficial effect of above-mentioned further scheme is adopted to be: the degree of depth of installing groove is less than the thickness of heater element or heat dissipation element, guarantees the upper surface good contact of heat-conducting substrate and heater element or heat dissipation element.
Accompanying drawing explanation
Fig. 1 is the structural drawing of the utility model high cooling efficiency computer main board heat abstractor embodiment one,
Fig. 2 is the structural drawing of the utility model high cooling efficiency computer main board heat abstractor embodiment two,
Fig. 3 is the cut-open view of A-A in Fig. 2,
Fig. 4 is the structural drawing of the utility model high cooling efficiency computer main board heat abstractor embodiment three,
Fig. 5 is the cut-open view of A-A in Fig. 4.
In accompanying drawing, the list of parts representated by each label is as follows:
01, heat-conducting substrate, 011, elasticity installation sheet, 012, buckle structure, 013, groove is installed, 02, heat pipe, 03, heating radiator, 04, dust guard, the 041, first filter screen, the 042, second filter screen, 05, radiator fan
Embodiment
Below in conjunction with drawings and embodiments, the utility model is further described.
The structural drawing of the utility model high cooling efficiency computer main board heat abstractor embodiment one is see Fig. 1, comprise heat-conducting substrate 01 and heat pipe 02, the one side of heat-conducting substrate 01 fits tightly with heater element on mainboard or heat dissipation element and is connected, the another side of heat-conducting substrate 01 fits tightly with heat pipe 02 and is connected, the endpiece of heat pipe 02 is provided with the heating radiator 03 be in communication with the outside, the another side of heat-conducting substrate 01 is also provided with two elasticity installation sheets 011, the body of heat-conducting substrate 01 is extended at elasticity installation sheet 011 two ends, and be connected with mainboard, heat pipe 02 area covered on heat-conducting substrate 01 is 68% of heat-conducting substrate 01 area, high cooling efficiency computer main board heat abstractor also comprises radiator fan 05, the air outlet of radiator fan 05 aims at heating radiator 03, dust guard 04 is provided with between the endpiece of heat pipe 02 and radiator fan 05, dust guard 04 comprises the first filter screen 041 and the second filter screen 042, first filter screen 041 is near the endpiece of heat pipe 02, and the aperture of the first filter screen 041 is greater than the aperture of the second filter screen 042, the material of heat-conducting substrate 01 is copper.
The area covered on heat-conducting substrate due to heat pipe is 8% of heat-conducting substrate area; The heat conduction efficiency of heat-conducting substrate heat conductive pipes is compared existing structure and can be promoted about one times, thus the radiating efficiency of whole heat abstractor also can be improved greatly; The air outlet of radiator fan aims at heating radiator, improves the radiating efficiency of heating radiator; The endpiece of heat pipe is provided with dust guard, and the dust avoided in heat pipe enters in heating radiator, can not have influence on the radiating effect of heating radiator; Filtered by the two poles of the earth of the first filter screen and the second filter screen, improve the filter effect of dust guard; Meanwhile, the aperture of the first filter screen is greater than the aperture of the second filter screen, improves the validity of dust guard, and not easily causes the obstruction of screen pack; The heat-conducting substrate of Copper base material matter, has good heat conductivity, and radiating efficiency is very high.
The structural drawing of the utility model high cooling efficiency computer main board heat abstractor embodiment two is see Fig. 2 and Fig. 3, and compared with embodiment one, its difference is, elasticity installation sheet 011 is connected with mainboard by buckle structure 012.
Elasticity installation sheet is connected with mainboard by buckle structure, facilitates the installation of heat abstractor, does not need extra installing component and instrument, improves installation effectiveness.
The structural drawing of the utility model high cooling efficiency computer main board heat abstractor embodiment three is see Fig. 4 and Fig. 5, and compared with embodiment two, its difference is, the one side of heat-conducting substrate 01 is provided with the installation groove 013 matched with heater element or heat dissipation element profile; The degree of depth of installing groove 013 is less than the thickness of heater element or heat dissipation element.
The one side of heat-conducting substrate is provided with the installation groove matched with heater element or heat dissipation element profile, facilitates the location with components and parts in installation process, and improves radiating efficiency further; The degree of depth of installing groove is less than the thickness of heater element or heat dissipation element, guarantees the upper surface good contact of heat-conducting substrate and heater element or heat dissipation element.
In description of the present utility model, it will be appreciated that, term " " center ", " length ", " width ", " on ", D score, " vertically ", " level ", " top ", " end ", the orientation of the instruction such as " interior " or position relationship be based on orientation shown in the drawings or position relationship; be only the utility model and simplified characterization for convenience of description; instead of instruction or imply the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as restriction of the present utility model.
In the utility model, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or integral; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements.For the ordinary skill in the art, the concrete meaning of above-mentioned term in the utility model can be understood as the case may be.
In the utility model, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score can comprise the first and second features and directly contact, also can comprise the first and second features and not be directly contact but by the other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above " comprise fisrt feature directly over second feature and oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " comprise fisrt feature immediately below second feature and tiltedly below, or only represent that fisrt feature level height is less than second feature.
Above high cooling efficiency computer main board heat abstractor of the present utility model is described in detail, applies specific case herein and principle of the present utility model and embodiment are set forth.The explanation of above embodiment just understands core concept of the present utility model for helping; Meanwhile, for one of ordinary skill in the art, according to thought of the present utility model, all will change in specific embodiments and applications, in sum, this description should not be construed as restriction of the present utility model.
Claims (8)
1. a high cooling efficiency computer main board heat abstractor, comprise heat-conducting substrate (01) and heat pipe (02), the one side of described heat-conducting substrate (01) fits tightly with heater element on mainboard or heat dissipation element and is connected, the another side of described heat-conducting substrate (01) fits tightly with described heat pipe (02) and is connected, the endpiece of described heat pipe (02) is provided with the heating radiator (03) be in communication with the outside, it is characterized in that, the another side of described heat-conducting substrate (01) is also provided with two elasticity installation sheets (011), the body of described heat-conducting substrate (01) is extended at described elasticity installation sheet (011) two ends, and be connected with described mainboard, described heat pipe (02) area covered on described heat-conducting substrate (01) is 60% to 80% of described heat-conducting substrate (01) area.
2. high cooling efficiency computer main board heat abstractor according to claim 1, it is characterized in that, described high cooling efficiency computer main board heat abstractor also comprises radiator fan (05), and the air outlet of described radiator fan (05) aims at described heating radiator (03).
3. high cooling efficiency computer main board heat abstractor according to claim 2, is characterized in that, is provided with dust guard (04) between the endpiece of described heat pipe (02) and described radiator fan (05).
4. high cooling efficiency computer main board heat abstractor according to claim 3, it is characterized in that, described dust guard (04) comprises the first filter screen (041) and the second filter screen (042), described first filter screen (041) is near the endpiece of described heat pipe (02), and the aperture of described first filter screen (041) is greater than the aperture of described second filter screen (042).
5. high cooling efficiency computer main board heat abstractor according to claim 1, is characterized in that, described elasticity installation sheet (011) is connected with described mainboard by buckle structure (012).
6. the high cooling efficiency computer main board heat abstractor according to the arbitrary claim of claim 1 to 5, is characterized in that, the material of described heat-conducting substrate (01) is copper.
7. the high cooling efficiency computer main board heat abstractor according to the arbitrary claim of claim 1 to 5, it is characterized in that, the one side of described heat-conducting substrate (01) is provided with the installation groove (013) matched with described heater element or described heat dissipation element profile.
8. high cooling efficiency computer main board heat abstractor according to claim 7, is characterized in that, the degree of depth of described installation groove (013) is less than the thickness of described heater element or described heat dissipation element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521064890.9U CN205229958U (en) | 2015-12-18 | 2015-12-18 | High radiating efficiency computer mainboard heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521064890.9U CN205229958U (en) | 2015-12-18 | 2015-12-18 | High radiating efficiency computer mainboard heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205229958U true CN205229958U (en) | 2016-05-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521064890.9U Expired - Fee Related CN205229958U (en) | 2015-12-18 | 2015-12-18 | High radiating efficiency computer mainboard heat abstractor |
Country Status (1)
| Country | Link |
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| CN (1) | CN205229958U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108762443A (en) * | 2018-05-24 | 2018-11-06 | 郑州云海信息技术有限公司 | A kind of T-type radiator applied to computer |
-
2015
- 2015-12-18 CN CN201521064890.9U patent/CN205229958U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108762443A (en) * | 2018-05-24 | 2018-11-06 | 郑州云海信息技术有限公司 | A kind of T-type radiator applied to computer |
| CN108762443B (en) * | 2018-05-24 | 2020-08-04 | 苏州浪潮智能科技有限公司 | T-shaped heat dissipation device applied to computer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160511 Termination date: 20161218 |