CN202178247U - Radiating structure for insulated gate bipolar transistor (IGBT) and bridge rectifier of induction cooker - Google Patents
Radiating structure for insulated gate bipolar transistor (IGBT) and bridge rectifier of induction cooker Download PDFInfo
- Publication number
- CN202178247U CN202178247U CN 201120281807 CN201120281807U CN202178247U CN 202178247 U CN202178247 U CN 202178247U CN 201120281807 CN201120281807 CN 201120281807 CN 201120281807 U CN201120281807 U CN 201120281807U CN 202178247 U CN202178247 U CN 202178247U
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- CN
- China
- Prior art keywords
- igbt
- base portion
- bridge rectifier
- radiating
- inclination base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000006698 induction Effects 0.000 title abstract 2
- 239000004519 grease Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 238000009434 installation Methods 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- 230000007704 transition Effects 0.000 description 2
- 239000004568 cement Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
A radiating structure for an insulated gate bipolar transistor (IGBT) and a bridge rectifier of an induction cooker comprises a pectination radiating element provided with an inclined base portion and a plurality of layers of radiating fins horizontally extending from the inclined base portion. A crew hole for connecting a printed circuit board (PCB) is arranged on the bottom surface of the inclined base portion, the IGBT and the bridge rectifier are tightly attached to an inclined combination surface of the IGBT and the bridge rectifier through screws in a fastening mode. By means of special structural design of the pectination radiating element provided with the inclined base portion, the installation of the IGBT and the bridge rectifier and the PCB at a certain inclined angle is achieved, and the welding between the IGBT and the bridge rectifier and the PCB is facilitated. By means of the plurality of layers of radiating fins, radiating area is enlarged, and heat is evenly and effectively conducted to peripheries of fins and taken away by cool air generated by a radiating fan.
Description
Technical field
The utility model relates to the radiating component of electronic component, particularly a kind of IGBT and bridge heap radiator structure that is used for electromagnetic oven.
Background technology
Electromagnetic oven generally adopts fin that the heat that IGBT and Qiao Dui send is conducted to air, cooperates radiator fan to reduce temperature, avoids IGBT and bridge to pile and damages because of high temperature.The faying face of traditional heat-dissipating sheet and IGBT and bridge heap is in the bottom, and mounting process is comparatively complicated, and the utility model fin adopts IGBT and Qiao Dui side mounting means, simple and effective.
Summary of the invention
Efficient quick heat radiating for IGBT in the electromagnetic oven and bridge heap; The utility model provides a kind of IGBT and bridge heap radiator structure that is used for electromagnetic oven; It piles the structure that directly is closely as one through a pectination heat sink with IGBT, bridge; To improve radiating effect, simplify mounting means, reduce production costs.
IGBT that is used for electromagnetic oven that the utility model provides and bridge heap radiator structure; Comprise a pectination heat sink; The multilayer radiating fin that the pectination heat sink has the inclination base portion and extend horizontally away from this inclination base portion; Establish the screw hole that connection PCB is used on the bottom surface of this inclination base portion, IGBT and bridge heap fit tightly on the oblique faying face of this inclination base portion through screw is fastening.
Wherein, between the oblique faying face of the inclination base portion of the binding face of the binding face of IGBT, bridge heap and said pectination heat sink the heat-conducting silicone grease layer is set.
In the said pectination heat sink, the angle between the oblique faying face of said inclination base portion and the bottom surface of said inclination base portion is the 45-80 degree.The surface of said radiating fin is a corrugated.
The utility model directly is close to IGBT and bridge heap on the oblique faying face of inclination base portion of pectination heat sink through holding screw; The pectination heat sink conducts to air through radiating fin with the heat that IGBT and Qiao Dui distribute; Cooperate the air channel design through radiator fan; Hot blast is blown out, reach the purpose that reduces IGBT and bridge stack temperature, avoid IGBT and bridge heap to damage because of high temperature.
Pectination heat sink special construction design with inclination base portion; Realized IGBT and bridge heap and the installation of pcb board inclination certain angle, also made things convenient for IGBT and bridge heap and pcb board welding, in conjunction with the setting of multilayer radiating fin; The radiating fin surface is a corrugated; Increase area of dissipation, heat is conducted to around the fin uniformly and effectively, taken away by the cold air that radiator fan blows.
Pectination heat sink bottom is provided with the holding screw installing hole, through screw the pectination heat sink is fastened on an end of pcb board, makes the multilayer radiating fin of pectination heat sink be arranged in heat dissipation wind channel and helps distributing of heat.
Description of drawings
Fig. 1 is the exploded view of the utility model radiator structure one embodiment;
Fig. 2 is the front view that Fig. 1 embodiment is installed on the pcb board state;
Fig. 3 is the vertical view of Fig. 2.
Embodiment
Below in conjunction with the embodiment description of drawings.
IGBT and bridge heap radiator structure that Fig. 1,2 embodiment are used for electromagnetic oven comprise pectination heat sink 1; The multilayer radiating fin 12 that pectination heat sink 1 has inclination base portion 11 and extend horizontally away from this inclination base portion 11; Establish the screw hole 16 of connection PCB plate 6 usefulness on the bottom surface 10 of this inclination base portion 11; Open screw hole 15 on the oblique faying face 14 of this inclination base portion 11; IGBT 2 is through on the fastening position, oblique faying face 14 left side that is fitted in this inclination base portion 11 of screw 3, and bridge heap 4 is through on the fastening oblique faying face 14 right positions that are fitted in this inclination base portion 11 of screw 5.The oblique faying face 14 of this inclination base portion 11 and tiltedly between the faying face 14 through connecting through a transition plane or transition cambered surface 13.
Between the oblique faying face 14 of the inclination base portion 11 of the binding face of the binding face of IGBT 2, bridge heap 4 and said pectination heat sink 1, be provided with the heat-conducting silicone grease layer.
Said pectination heat sink 1 has 6 layers of radiating fin 12, and every layer of width increases progressively from top to bottom.The surface of said radiating fin 12 is a corrugated, from inside to outside is to thin by thick.
Angle between the oblique faying face 14 of said inclination base portion 11 and the bottom surface 10 of said inclination base portion 11 is 60 degree, can between the 45-80 degree, select according to this angle of design demand.
Be installed on the sketch map 2-3 of pcb board with reference to Fig. 1 embodiment radiator structure.Coated with thermally conductive silicone grease on the oblique faying face 14 of the inclination base portion 11 of the binding face of IGBT 2, the binding face of bridge heap 4, said pectination heat sink 1; With IGBT 2 through on the fastening position, oblique faying face 14 left side that is fitted in this inclination base portion 11 of screw 3; With bridge heap 4 through on the fastening oblique faying face 14 right positions that are fitted in this inclination base portion 11 of screw 5; The mounting hole site of then screw hole 16 of the bottom surface 10 of pectination heat sink 1 being aimed at pcb boards 6; Use holding screw that pectination heat sink 1 is locked on the pcb board 6, wherein the pin (21 is pins of IGBT 2 among Fig. 3) of IGBT 2 and the bridge heap 4 corresponding aperture position that tilts to pass on the pcb board 6 is welded to pcb board then.After Fig. 1 embodiment radiator structure is installed on pcb board 6 one ends; Pectination heat sink 1 conducts to air with IGBT 2 with the heat that bridge heap 4 distributes through radiating fin 12; Cooperate the design of radiator fan and plastic cement structural member air channel; Make cold air take away the heat on fin fin two sides, realize reducing the purpose of IGBT and bridge stack temperature, avoid IGBT and bridge heap to damage because of high temperature.
Claims (5)
1. an IGBT and a bridge that is used for electromagnetic oven piled radiator structure; It is characterized in that comprising a pectination heat sink; The multilayer radiating fin that the pectination heat sink has the inclination base portion and extend horizontally away from this inclination base portion; Establish the screw hole that the connection PCB plate is used on the bottom surface of this inclination base portion, IGBT and bridge heap fit tightly on the oblique faying face of this inclination base portion through screw is fastening.
2. IGBT and the bridge heap radiator structure that is used for electromagnetic oven according to claim 1 is characterized in that: between the oblique faying face of the binding face of the binding face of said IGBT, bridge heap and the inclination base portion of said pectination heat sink the heat-conducting silicone grease layer is set.
3. IGBT and the bridge heap radiator structure that is used for electromagnetic oven according to claim 1 and 2, it is characterized in that: the surface of said radiating fin is a corrugated, from inside to outside is to thin by thick.
4. IGBT and the bridge heap radiator structure that is used for electromagnetic oven according to claim 1 and 2, it is characterized in that: said pectination heat sink has 3-8 layer radiating fin, and every layer of width increases progressively from top to bottom.
5. IGBT and the bridge heap radiator structure that is used for electromagnetic oven according to claim 1 and 2, it is characterized in that: the angle between the oblique faying face of said inclination base portion and the bottom surface of said inclination base portion is the 45-80 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120281807 CN202178247U (en) | 2011-08-04 | 2011-08-04 | Radiating structure for insulated gate bipolar transistor (IGBT) and bridge rectifier of induction cooker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120281807 CN202178247U (en) | 2011-08-04 | 2011-08-04 | Radiating structure for insulated gate bipolar transistor (IGBT) and bridge rectifier of induction cooker |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202178247U true CN202178247U (en) | 2012-03-28 |
Family
ID=45868115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120281807 Expired - Fee Related CN202178247U (en) | 2011-08-04 | 2011-08-04 | Radiating structure for insulated gate bipolar transistor (IGBT) and bridge rectifier of induction cooker |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202178247U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102809179A (en) * | 2012-05-04 | 2012-12-05 | 米技电子电器(上海)有限公司 | Induction cooker with novel radiating structure |
| CN106571349A (en) * | 2015-10-09 | 2017-04-19 | 上海纯米电子科技有限公司 | IGBT heat radiation structure and electric rice cooker |
-
2011
- 2011-08-04 CN CN 201120281807 patent/CN202178247U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102809179A (en) * | 2012-05-04 | 2012-12-05 | 米技电子电器(上海)有限公司 | Induction cooker with novel radiating structure |
| CN102809179B (en) * | 2012-05-04 | 2014-11-05 | 米技电子电器(上海)有限公司 | Induction cooker with novel radiating structure |
| CN106571349A (en) * | 2015-10-09 | 2017-04-19 | 上海纯米电子科技有限公司 | IGBT heat radiation structure and electric rice cooker |
| CN106571349B (en) * | 2015-10-09 | 2020-03-24 | 上海纯米电子科技有限公司 | IGBT heat radiation structure and electric rice cooker |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN XINHUI TECHNOLOGY CO., LTD. Free format text: FORMER NAME: SHENZHEN CHK ELECTRONICS CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Post office building Baoan District 13 Baomin Shenzhen city Guangdong province 518101 Road 27 layer Patentee after: Xin Huike limited company of Shenzhen Address before: Post office building Baoan District 13 Baomin Shenzhen city Guangdong province 518101 Road 27 layer Patentee before: Shenzhen CHK Electronics Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120328 Termination date: 20180804 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |