CN205213137U - Mining ann's type circuit board for pressure sensor - Google Patents
Mining ann's type circuit board for pressure sensor Download PDFInfo
- Publication number
- CN205213137U CN205213137U CN201520868563.2U CN201520868563U CN205213137U CN 205213137 U CN205213137 U CN 205213137U CN 201520868563 U CN201520868563 U CN 201520868563U CN 205213137 U CN205213137 U CN 205213137U
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- CN
- China
- Prior art keywords
- circuit board
- layer
- components
- recess
- welding
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a mining ann's type circuit board for pressure sensor, includes metal basic unit, insulating layer and line layer, connects through the binder between each layer and fixes, the insulating layer is soft silica gel layer be provided with the recess on the line layer it has pottery porcelain ring to inlay in the recess, be provided with components and parts welding position in the recess, the line layer is followed the blind groove of running through the insulating layer is vertically seted up to components and parts welding position the back of metal basic unit still is equipped with radiating fin, the utility model discloses simple structure has improved the whole radiating effect of circuit board greatly, and through set up recess and pottery porcelain ring at the welding bit position, in welding pin directly stretched into the recess, pottery porcelain ring's distribution messenger welding point distribution was more even for the distribution of temperature of circuit board is also relatively more even, electronic components installs at blind inslot, makes that components and parts are direct to dispel the heat through metal basic unit, has improved the whole radiating effect of circuit board greatly, has prolonged the life of circuit board.
Description
Technical field
The utility model relates to electronic unit, particularly relates to a kind of Mine-used I. S pressure detecting instrument wiring board.
Background technology
Wiring board is important electronic original part, is the supporter of electronic devices and components, is the supplier of electronic devices and components electrical connection; Along with the development of science and technology and the demand of mining production, the integrated level of Mine-used I. S pressure detecting instrument is more and more higher, volume is more and more less, make the components and parts caloric value on wiring board increasing, and for wiring board, as not distribute heat rapidly, adverse influence can be produced to wiring board, so can damaged line plate; In addition, when welding wiring board, not only to ensure the firm of pad, also will ensure that the heat radiation of pad is even, the bad welding phenomena such as sealing-off, rosin joint can not occur; Therefore, the quality of heat radiation is directly connected to the quality of product and uses mission, and existing common line plate cannot meet the needs of this kind of product.
Summary of the invention
The purpose of this utility model is the Mine-used I. S pressure detecting instrument wiring board providing a kind of perfect heat-dissipating for solving the deficiencies in the prior art.
The technical scheme in the invention for solving the technical problem is: a kind of Mine-used I. S pressure detecting instrument wiring board, comprise metal-based layer, insulating barrier and line layer, be connected and fixed by binding agent between each layer, described insulating barrier is soft silicon glue-line, the thickness of described soft silicon glue-line is 1.5-2.0mm, described line layer is provided with groove, ceramic ring is inlaid with in described groove, components and parts welding position is provided with in described groove, described line layer longitudinally offers the blind slot running through insulating barrier along described components and parts welding position, described groove and blind slot are crisscross arranged in the circuit board, also radiating fin is provided with at the back side of described metal-based layer.
Preferably, described radiating fin is for rolling chip.
The beneficial effects of the utility model are: the utility model structure is simple, substantially increase the integral heat sink effect of wiring board, by arranging groove and ceramic ring in the position of welding position, welding pin directly stretches in groove, ceramic ring is high temperature resistant, the distribution of ceramic ring makes pad distribution more even, makes the Temperature Distribution of wiring board also more even; Electronic devices and components are arranged in blind slot, components and parts are directly dispelled the heat by metal-based layer, metal-based layer is provided with radiating fin, thus substantially increase the integral heat sink effect of wiring board, extend the useful life of wiring board.
Accompanying drawing explanation
Fig. 1 is main TV structure schematic diagram of the present utility model.In figure:
1. ceramic ring, 2. groove, 3. blind slot, 4. line layer, 5. insulating barrier, 6. metal-based layer, 7. radiating fin.
Embodiment
The technical solution of the utility model is further illustrated below by specific embodiment.
As shown in Figure 1: a kind of Mine-used I. S pressure detecting instrument wiring board, comprise metal-based layer 6, insulating barrier 5 and line layer 4, be connected and fixed by binding agent between each layer, described insulating barrier 5 is soft silicon glue-line, there is the good capacity of heat transmission and insulation characterisitic, be good heat sink material, improve the heat sinking function of wiring board; The thickness of described soft silicon glue-line is 1.5-2.0mm, described line layer 4 is provided with groove 2, ceramic ring 1 is inlaid with in described groove 2, components and parts welding position is provided with in described groove 2, described line layer 4 longitudinally offers the blind slot 3 running through insulating barrier 5 along described components and parts welding position, and be provided with radiating fin 7 at the back side of described metal-based layer 6, described radiating fin 7 is for rolling chip, such design makes the heat dispersion of wiring board better, ensure that the reliability of whole wiring board work.
The utility model structure is simple, substantially increase the integral heat sink effect of wiring board, by arranging groove 2 and ceramic ring 1 in the position of welding position, welding pin directly stretches in groove 2, ceramic ring 1 is high temperature resistant, can not melting fall, substantially increase the quality of welding, the distribution of ceramic ring 1 makes pad distribution more even, make the Temperature Distribution of wiring board also more even, electronic devices and components are arranged in blind slot 3, components and parts are directly dispelled the heat by metal-based layer 6, described metal-based layer 6 is provided with radiating fin 7, thus substantially increase the integral heat sink effect of wiring board, extend the useful life of wiring board.
The foregoing is only the utility model preferred embodiment, not in order to limit the utility model, all any amendments, equivalent replacement and improvement etc. done within the utility model spirit and principle, all should be included within the utility model protection range.
Claims (2)
1. a Mine-used I. S pressure detecting instrument wiring board, comprise metal-based layer (6), insulating barrier (5) and line layer (4), be connected and fixed by binding agent between each layer, it is characterized in that described insulating barrier (5) is for soft silicon glue-line, the thickness of described soft silicon glue-line is 1.5-2.0mm, described line layer (4) is provided with groove (2), ceramic ring (1) is inlaid with in described groove (2), described groove is provided with components and parts welding position in (2), described line layer (4) longitudinally offers the blind slot (3) running through insulating barrier (5) along described components and parts welding position, described groove (2) and blind slot (3) are crisscross arranged in the circuit board, radiating fin (7) is also provided with at the back side of described metal-based layer (6).
2. Mine-used I. S pressure detecting instrument wiring board according to claim 1, is characterized in that: described radiating fin (7) is for rolling chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520868563.2U CN205213137U (en) | 2015-11-04 | 2015-11-04 | Mining ann's type circuit board for pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520868563.2U CN205213137U (en) | 2015-11-04 | 2015-11-04 | Mining ann's type circuit board for pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205213137U true CN205213137U (en) | 2016-05-04 |
Family
ID=55850821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520868563.2U Expired - Fee Related CN205213137U (en) | 2015-11-04 | 2015-11-04 | Mining ann's type circuit board for pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205213137U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110159643A (en) * | 2019-06-18 | 2019-08-23 | 苏州济和精密传动系统有限公司 | A kind of sensing combinational gap piece and its processing method |
| CN113411952A (en) * | 2021-06-07 | 2021-09-17 | 中国电子科技集团公司第二十九研究所 | Embedded micro-channel printed circuit board compatible with various blind grooves and preparation method thereof |
-
2015
- 2015-11-04 CN CN201520868563.2U patent/CN205213137U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110159643A (en) * | 2019-06-18 | 2019-08-23 | 苏州济和精密传动系统有限公司 | A kind of sensing combinational gap piece and its processing method |
| CN110159643B (en) * | 2019-06-18 | 2023-12-15 | 苏州济和精密传动系统有限公司 | Sensing combined gap piece and processing method thereof |
| CN113411952A (en) * | 2021-06-07 | 2021-09-17 | 中国电子科技集团公司第二十九研究所 | Embedded micro-channel printed circuit board compatible with various blind grooves and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160504 Termination date: 20161104 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |