CN205188424U - Batch silicon chip substrate processing device in sputtering technology - Google Patents
Batch silicon chip substrate processing device in sputtering technology Download PDFInfo
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- CN205188424U CN205188424U CN201520929753.0U CN201520929753U CN205188424U CN 205188424 U CN205188424 U CN 205188424U CN 201520929753 U CN201520929753 U CN 201520929753U CN 205188424 U CN205188424 U CN 205188424U
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- holding tray
- silicon chip
- filter screen
- placing
- supporting frame
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Abstract
The utility model discloses a batch silicon chip substrate processing device in sputtering technology, it is including the dish of placing that is used for placing the silicon chip, the bottom face of placing the dish is provided with a plurality of bottoming holes, and the bottoming hole intercommunication is to setting up at the water back of placing set outside, and the water back is connected with the heating source, be provided with the filter screen that extends among placing the dish on the horizontal direction, the limit portion of filter screen is provided with the support frame, supports the frame and fixes the side end face that sets up in placing the dish, among placing the dish, the bottom portion that supports the frame is provided with a plurality of vibrating motor, adopt above -mentioned technical scheme's batch silicon chip substrate processing device in sputtering technology, the vibrating motor accessible of filter screen below orders about the filter screen vibration so that batch silicon chip on the filter screen can evenly distributed, avoids needing artifical putting evenly to descend with the efficiency that leads to in the silicon chip processing procedure in batches, and can make silicon chip heating in process of production in batches all spend simultaneously can improve.
Description
Technical field
The present invention relates to a kind of semiconductor processing equipment, the batch silicon wafer lining processor in especially a kind of sputtering technology.
Background technology
Semiconductor production silicon chip, in the sputtering course of processing, need carry out heat treated to silicon chip substrate.Existing heating process often adopts back of the body pressure spray process, is positioned over internal tank by silicon chip, carries heated air by the bottoming hole of container bottom to silicon chip, is heated to make silicon chip substrate; But, when above-mentioned technique processes, if relate to the silicon of batch silicon wafer, then need, by manually putting evenly to it, to avoid silicon chip substrate cannot contact with heating medium, thus cause production efficiency to reduce.
Summary of the invention
The technical problem to be solved in the present invention is to provide the batch silicon wafer lining processor in a kind of sputtering technology, and it can carry out uniform silicon process to the silicon chip of batch machining.
For solving the problems of the technologies described above, the present invention relates to the batch silicon wafer lining processor in a kind of sputtering technology, it includes the holding tray for placing silicon chip; The bottom face of described holding tray is provided with multiple bottoming hole, and bottoming hole is communicated to the water back being arranged on holding tray outside, and water back is connected with heating source; Be provided with the filter screen extended in the horizontal direction among described holding tray, the edge of filter screen is provided with supporting frame, and supporting frame is fixedly installed on the side end face of holding tray; Among described holding tray, the bottom of supporting frame is provided with multiple vibrating motor, and multiple vibrating motor becomes Rotational Symmetry about the axis of supporting frame.
As a modification of the present invention, the bottom of described supporting frame is provided with at least 3 vibrating motors, and it can vibrate from multiple position uniformly to the silicon chip in filter screen, to make the distribution of silicon chip more even.
As a modification of the present invention, be provided with solar heat protection dividing plate between each vibrating motor and bottom face of holding tray, solar heat protection dividing plate adopts arcuate structure, and it bends towards holding tray bottom face, and described vibrating motor is arranged at solar heat protection diaphragm internal.Adopt above-mentioned design, it intercepts the heating medium exported from bottoming hole by solar heat protection dividing plate, extend towards its interior along the curved-surface structure of solar heat protection dividing plate to make heating medium, to heat silicon chip, thus avoid vibrating motor and contact with heating medium and then cause damage.
As a modification of the present invention, the side end face of described holding tray is provided with blowpit, and blowpit extends between supporting frame and the upper end of holding tray; Described blowpit both sides are provided with chute, are provided with discharge plate among blowpit, and it extends to chute inside.Adopt above-mentioned design, the silicon chip carrying out batch machining after silicon chip completes substrate processing, can be toppled over by blowpit, thus makes overall processing efficiency be able to remarkable improvement by it.
Adopt the batch silicon wafer lining processor in the sputtering technology of technique scheme, it is arranged to there is certain interval between silicon chip and the bottom face of holding tray by filter screen, thus heating medium can be uniformly distributed between filter screen and holding tray bottom, and then the treatment effect of silicon chip substrate is improved; Meanwhile, vibrating motor below filter screen is by ordering about filter screen vibration to make the batch silicon wafer on filter screen be uniformly distributed, avoid needing in batch silicon wafer treating processes manually to put evenly with the decrease in efficiency caused, batch silicon wafer heating in process of production can be made all to spend simultaneously and be improved.
Accompanying drawing explanation
Fig. 1 is schematic diagram of the present invention;
Fig. 2 is blowpit front view in the present invention;
Reference numerals list:
1-holding tray, 2-bottoming hole, 3-water back, 4-heating source, 5-filter screen, 6-supporting frame, 7-vibrating motor, 8-solar heat protection dividing plate, 9-blowpit, 10-discharge plate.
Embodiment
Below in conjunction with embodiment, illustrate the present invention further, following embodiment should be understood and be only not used in for illustration of the present invention and limit the scope of the invention.
Embodiment 1
Batch silicon wafer lining processor in a kind of sputtering technology as shown in Figure 1, it includes the holding tray 1 for placing silicon chip; The bottom face of described holding tray 1 is provided with multiple bottoming hole 2, and bottoming hole 2 is communicated to the water back 3 being arranged on holding tray 1 outside, and water back 3 is connected with heating source 4; Be provided with the filter screen 5 extended in the horizontal direction among described holding tray 1, the edge of filter screen 5 is provided with supporting frame 6, and supporting frame 6 is fixedly installed on the side end face of holding tray 1; Among described holding tray 1, the bottom of supporting frame 6 is provided with multiple vibrating motor 7, and multiple vibrating motor 7 becomes Rotational Symmetry about the axis of supporting frame 6.
As a modification of the present invention, the bottom of described supporting frame 6 is provided with 4 vibrating motors 7, and it can vibrate from multiple position uniformly to the silicon chip in filter screen, to make the distribution of silicon chip more even.
As a modification of the present invention, be provided with solar heat protection dividing plate 8 between each vibrating motor 7 and bottom face of holding tray 1, solar heat protection dividing plate 8 adopts arcuate structure, and it bends towards holding tray 1 bottom face, and it is inner that described vibrating motor 7 is arranged at solar heat protection dividing plate 8.Adopt above-mentioned design, it intercepts the heating medium exported from bottoming hole by solar heat protection dividing plate, extend towards its interior along the curved-surface structure of solar heat protection dividing plate to make heating medium, to heat silicon chip, thus avoid vibrating motor and contact with heating medium and then cause damage.
Adopt the batch silicon wafer lining processor in the sputtering technology of technique scheme, it is arranged to there is certain interval between silicon chip and the bottom face of holding tray by filter screen, thus heating medium can be uniformly distributed between filter screen and holding tray bottom, and then the treatment effect of silicon chip substrate is improved; Meanwhile, vibrating motor below filter screen is by ordering about filter screen vibration to make the batch silicon wafer on filter screen be uniformly distributed, avoid needing in batch silicon wafer treating processes manually to put evenly with the decrease in efficiency caused, batch silicon wafer heating in process of production can be made all to spend simultaneously and be improved.
Embodiment 2
As a modification of the present invention, as shown in Figure 2, the side end face of described holding tray 1 is provided with blowpit 9, and blowpit 9 extends between supporting frame 6 and the upper end of holding tray 1; Described blowpit 9 both sides are provided with chute, and be provided with discharge plate 10 among blowpit 9, it extends to chute inside.Adopt above-mentioned design, the silicon chip carrying out batch machining after silicon chip completes substrate processing, can be toppled over by blowpit, thus makes overall processing efficiency be able to remarkable improvement by it.
All the other feature & benefits of the present embodiment are all identical with embodiment 1.
Claims (4)
1. the batch silicon wafer lining processor in sputtering technology, it includes the holding tray for placing silicon chip; It is characterized in that, the bottom face of described holding tray is provided with multiple bottoming hole, and bottoming hole is communicated to the water back being arranged on holding tray outside, and water back is connected with heating source; Be provided with the filter screen extended in the horizontal direction among described holding tray, the edge of filter screen is provided with supporting frame, and supporting frame is fixedly installed on the side end face of holding tray; Among described holding tray, the bottom of supporting frame is provided with multiple vibrating motor, and multiple vibrating motor becomes Rotational Symmetry about the axis of supporting frame.
2. according to the batch silicon wafer lining processor in sputtering technology according to claim 1, it is characterized in that, the bottom of described supporting frame is provided with at least 3 vibrating motors.
3. according to the batch silicon wafer lining processor in sputtering technology according to claim 2, it is characterized in that, solar heat protection dividing plate is provided with between each vibrating motor and bottom face of holding tray, solar heat protection dividing plate adopts arcuate structure, it bends towards holding tray bottom face, and described vibrating motor is arranged at solar heat protection diaphragm internal.
4. according to the batch silicon wafer lining processor in sputtering technology according to claim 3, it is characterized in that, the side end face of described holding tray is provided with blowpit, and blowpit extends between supporting frame and the upper end of holding tray; Described blowpit both sides are provided with chute, are provided with discharge plate among blowpit, and it extends to chute inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520929753.0U CN205188424U (en) | 2015-11-20 | 2015-11-20 | Batch silicon chip substrate processing device in sputtering technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520929753.0U CN205188424U (en) | 2015-11-20 | 2015-11-20 | Batch silicon chip substrate processing device in sputtering technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205188424U true CN205188424U (en) | 2016-04-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520929753.0U Withdrawn - After Issue CN205188424U (en) | 2015-11-20 | 2015-11-20 | Batch silicon chip substrate processing device in sputtering technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205188424U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105441882A (en) * | 2015-11-20 | 2016-03-30 | 苏州赛森电子科技有限公司 | Treating device for substrates of batches of silicon wafers in sputtering technology |
-
2015
- 2015-11-20 CN CN201520929753.0U patent/CN205188424U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105441882A (en) * | 2015-11-20 | 2016-03-30 | 苏州赛森电子科技有限公司 | Treating device for substrates of batches of silicon wafers in sputtering technology |
| CN105441882B (en) * | 2015-11-20 | 2018-04-24 | 苏州赛森电子科技有限公司 | Batch silicon wafer lining processor in sputtering technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20160427 Effective date of abandoning: 20180424 |