CN203878203U - Coating device - Google Patents
Coating device Download PDFInfo
- Publication number
- CN203878203U CN203878203U CN201420295907.0U CN201420295907U CN203878203U CN 203878203 U CN203878203 U CN 203878203U CN 201420295907 U CN201420295907 U CN 201420295907U CN 203878203 U CN203878203 U CN 203878203U
- Authority
- CN
- China
- Prior art keywords
- vapor deposition
- chip carrier
- coating apparatus
- film coating
- connection supporter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000576 coating method Methods 0.000 title abstract description 8
- 239000011248 coating agent Substances 0.000 title abstract description 7
- 238000007740 vapor deposition Methods 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 16
- 239000000969 carrier Substances 0.000 claims abstract description 7
- 238000007747 plating Methods 0.000 claims description 22
- 230000008020 evaporation Effects 0.000 claims description 19
- 238000001704 evaporation Methods 0.000 claims description 19
- 239000007888 film coating Substances 0.000 claims description 15
- 238000009501 film coating Methods 0.000 claims description 15
- 230000001105 regulatory effect Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
The utility model discloses a coating device which comprises a vapor deposition source material and a vapor deposition pot, wherein the vapor deposition pot and the vapor deposition source material are arranged in opposite. The coating device is characterized in that the vapor deposition pot comprises a plurality of wafer carriers which are arranged around the center of the pot; the wafer carriers are fixed to the vapor deposition pot through a connecting support; and the distance between the wafer carriers and vapor deposition pot is adjusted by adjusting the height of the connecting support, so that the wafer carriers are perpendicular to the atom incidence direction of the vapor deposition source material.
Description
Technical field
The utility model relates to technical field of semiconductors, relates in particular to a kind of film coating apparatus.
Background technology
In semiconductor chip fabrication process, a lot of structural sheets need to be made through coating process, and therefore plated film step has considerable effect in semi-conductor chip preparation, particularly use at present ripe technique for vacuum coating to be widely used especially.So-called vacuum plating is about to treat that plating wafer (being thing to be plated) is placed in vacuum chamber, makes to plate the process of source atomic deposition to wafer surface by heating or beam bombardment plating source material.Taking evaporation as example, in the film coating apparatus using at present, evaporation pot 200 for fixed wafer carrier 220 is suspended in evaporation board inner chamber 100, put in opposite directions with vapor deposition source 300, there is the θ angle (referring to accompanying drawing 1) of on-right angle in its wafer surface and plating source atom incident direction 310, it causes the atom incident path in plating source to increase, and easily causes the waste of plating source material; And wafer surface coating skewness, regional area coating is thicker, has the unusual phenomenoies of many gold in successive process after being prone to coating and peeling off.
Summary of the invention
For the problems referred to above, the utility model proposes a kind of film coating apparatus, it makes its wafer in processing procedure vertical with the incident direction of plating source material atom, and then changes atom incident path by regulating evaporation Cooker structure, improves metal consumption and how golden unusual phenomenon.
The technical scheme of the utility model technical solution is: film coating apparatus comprises: vapor deposition source material, evaporation pot, and plating pot is placed in opposite directions with described vapor deposition source material; And described evaporation pot body comprises around the centrally disposed multiple chip carriers of described pot body, described chip carrier is fixed on evaporation pot body through a connection supporter, by regulating the height of described connection supporter to regulate the distance of chip carrier and evaporation pot body, make described chip carrier and vapor deposition source material atom incident direction angle be vertical relation.
Preferably, the height of described connection supporter is along increasing successively from the center to edge direction.
Preferably, the altitude range of described connection supporter is: inner ring 0.8～1.3cm, inferior inner ring 1.3～1.8cm, inferior outer ring 1.8～2.3cm, outer ring 2.3～2.8cm.
Preferably, the altitude range of described connection supporter is: inner ring 0.8～1.8cm, outer ring 1.8～2.8cm.
In certain embodiments, described connection supporter is bar shaped support bar, is spaced from each other the edge bottom that is placed in chip carrier, and fixed wafer carrier is on plating pot, and support wafer carrier and plating pot be apart from certain altitude, and make chip carrier vertical with the source of plating incident direction angle.
In further embodiments, the integral part that described support and connection body is described chip carrier, is directly used in fixed wafer, and its chip carrier is a ring texture, the sidewall that support and connection body is ring-type.
The utility model at least has following beneficial effect: by regulating the structure of chip carrier, make its wafer in processing procedure vertical with the incident direction angle of plating source material atom, and then atom incident path while reducing plated film, thereby improve metal consumption and how golden unusual phenomenon.
Brief description of the drawings
Accompanying drawing is used to provide a further understanding of the present invention, and forms a part for specification sheets, is used from explanation the present invention with embodiment mono-of the present utility model, does not form restriction of the present utility model.In addition, accompanying drawing data are to describe summary, are not to draw in proportion.
Fig. 1 is existing a kind of film coating apparatus structural section figure.
Fig. 2 ~ Fig. 3 is a kind of film coating apparatus structural section figure of the embodiment 1 of the utility model.
Fig. 4 is that in Fig. 3, schematic perspective view amplifies in I portion.
Fig. 5 ~ Fig. 6 is a kind of film coating apparatus structural section figure of the embodiment 2 of the utility model.
Fig. 7 is that in Fig. 6, schematic perspective view amplifies in I portion.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is elaborated.
embodiment 1
Please refer to accompanying drawing 2 and 3, film coating apparatus comprises: evaporation board inner chamber 100, vapor deposition source material 300 and evaporation pot 200, and wherein evaporation pot 200 is suspended in evaporation board inner chamber 100, places in opposite directions with described vapor deposition source material 300; And described evaporation pot 200 comprises around the centrally disposed multiple chip carriers 220 of described pot body, described chip carrier 220 is fixed on evaporation pot 200 through a connection supporter 210, by regulating the height of described connection supporter 210 to regulate the spacing of chip carrier 220 and evaporation pot 200, thereby make described chip carrier and vapor deposition source material atom incident direction 310 vertical (θ=90 °).
Concrete, connecting supporter is bar shaped support bar, be spaced from each other and be placed in chip carrier edge bottom (please refer to accompanying drawing 4), fixed wafer carrier 220 is placed on plating pot 200, and support wafer carrier 220 with plating pot 200 apart from certain altitude, and this height increases successively along center to edge direction, in the time that this plating pot 200 comprises the chip carrier 220 that is greater than 2 circles, its altitude range is followed successively by: inner ring a is 0.8～1.3cm, inferior inner ring b is 1.3～1.8cm, inferior outer ring c is 1.8～2.3cm, and outer ring d is 2.3～2.8cm; When this plating pot 200 comprises while being less than or equal to 2 circle chip carrier 220, its altitude range is followed successively by: inner ring a is 0.8～1.8cm, outer ring d is 1.8～2.8cm, by regulating this altitude range and then making chip carrier 220 vertical with plating source 300 incident directions 310, and ensure to treat that plating wafer is vertical with this incident direction, thereby reduce to plate source atom incident distance, and improve the coating uniformity of wafer surface, improve the many gold of regional area abnormal.
embodiment 2
Please refer to accompanying drawing 5 and 6, connecting supporter 210 is the integral part of chip carrier 220, is directly used in fixed wafer; Its chip carrier 220 is a ring texture, treat that plating wafer is fixed in ring texture, the sidewall (please refer to accompanying drawing 7) that support and connection body 210 is ring-type, regulate the height of sidewall, regulate chip carrier and the distance of plating pot 200, ensure that wafer surface to be plated is vertical with plating source atom incident direction, its sidewall altitude range and the chip carrier number of turns can be with embodiment 1.
Should be understood that, above-mentioned specific embodiments is the preferred embodiments of the present invention, and scope of the present invention is not limited to this embodiment, and all any changes of doing according to the present invention, within all belonging to protection scope of the present invention.
Claims (6)
1. a film coating apparatus, comprise: vapor deposition source material, evaporation pot body, described plating pot is placed in opposite directions with described vapor deposition source material, it is characterized in that: described evaporation pot body comprises around the centrally disposed multiple chip carriers of described pot body, described chip carrier is fixed on evaporation pot body through a connection supporter, by regulating the height of described connection supporter to regulate the distance of chip carrier and evaporation pot body, make described chip carrier vertical with vapor deposition source material atom incident direction.
2. film coating apparatus according to claim 1, is characterized in that: the height of described connection supporter is along increasing successively from the center to edge direction.
3. film coating apparatus according to claim 2, is characterized in that: the altitude range of described connection supporter is: inner ring 0.8～1.3cm, inferior inner ring 1.3～1.8cm, inferior outer ring 1.8～2.3cm, outer ring 2.3～2.8cm.
4. film coating apparatus according to claim 2, is characterized in that: the altitude range of described connection supporter is: inner ring 0.8～1.8cm, outer ring 1.8～2.8cm.
5. film coating apparatus according to claim 1, is characterized in that: described connection supporter is the bar shaped support bar that is placed in described chip carrier bottom.
6. film coating apparatus according to claim 1, is characterized in that: the integral part that described connection supporter is described chip carrier, is directly used in fixed wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420295907.0U CN203878203U (en) | 2014-06-05 | 2014-06-05 | Coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420295907.0U CN203878203U (en) | 2014-06-05 | 2014-06-05 | Coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203878203U true CN203878203U (en) | 2014-10-15 |
Family
ID=51678725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420295907.0U Expired - Lifetime CN203878203U (en) | 2014-06-05 | 2014-06-05 | Coating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203878203U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113355640A (en) * | 2021-07-20 | 2021-09-07 | 苏州佑伦真空设备科技有限公司 | Vacuum evaporation machine with double-pump structure |
| CN113832443A (en) * | 2021-07-29 | 2021-12-24 | 华灿光电（浙江）有限公司 | Electrode evaporation equipment and method thereof |
-
2014
- 2014-06-05 CN CN201420295907.0U patent/CN203878203U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113355640A (en) * | 2021-07-20 | 2021-09-07 | 苏州佑伦真空设备科技有限公司 | Vacuum evaporation machine with double-pump structure |
| CN113832443A (en) * | 2021-07-29 | 2021-12-24 | 华灿光电（浙江）有限公司 | Electrode evaporation equipment and method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141015 |