CN2051427U - Metallized-hole-free single face multi-layer printing circuit board - Google Patents
Metallized-hole-free single face multi-layer printing circuit board Download PDFInfo
- Publication number
- CN2051427U CN2051427U CN 89205122 CN89205122U CN2051427U CN 2051427 U CN2051427 U CN 2051427U CN 89205122 CN89205122 CN 89205122 CN 89205122 U CN89205122 U CN 89205122U CN 2051427 U CN2051427 U CN 2051427U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- hole
- printed circuit
- conducting
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model relates to a metallized-hole-free single face multi-layer printing circuit board, which is a double-layer or a multi-layer printing circuit board made of insulating paint and conducting paint on one face of a common flexible or hard single face copper foil board or flexible or hard insulating base material by utilizing the basic principle and the technology of the design and the manufacture of a printing circuit board. The conduction of circuits between layers is completed by joints without need of the complicated metallization of holes. The utility model has the advantages of simple producing process, easy implementation, reliable performance, low cost, and light weight. The utility model is suitable for the electronic equipment with complicated circuits, or with high density of assembled electronic components, or with small size, or with light weight, or with necessity of flexible connection, and the products of membrane switches.
Description
The utility model is a kind of no plated-through hole single face multilayer printed circuit board that is used for electronic equipment and thin film switch product, belongs to electronic technology field.
Existing two-sided and two-sided above multilayer printed circuit board is though solved the inevitable crisscross lead layout that occurs in single-clad board unappeasable complicated circuit wiring connection and the wiring.But two-sided and two-sided above multilayer printed circuit board must utilize the metalized in hole to reach the interlayer circuit turn-on of two-sided or multilayer.This is complex manufacturing not only, and equipment investment is big, and work efficiency is low, and product quality is difficult to guarantee.Existing structure brief introduction two-sided and perforated metallization printed circuit board is as follows:
Fig. 1 is existing two-sided hole metallization printed circuit board section of structure.
With reference to Fig. 1.
(1), (2), (3) are the Copper Foil conductive patterns that etches with common process on the same plane of double-sided copper-clad paper tinsel plate.Designing requirement (1) connects conducting with (3), but owing to be subjected to the obstruct of Copper Foil conductive pattern (2), (1), (3) can't connect with a first line of a couplet, therefore being designed to etch on the another side Copper Foil of insulated substrate (4) Copper Foil leads figure (5), and gets out through hole (7) and (6) at (1), (3) position; With hole metallization technology the hole wall of hole (6), (7) is plated pre-treatment, heavy copper, electroplating bright copper, processing such as electrotinning aluminium alloy, hot melt, it is topped to make the surface of the hole wall of hole (6), (7) and Copper Foil conductive pattern (1), (2), (3), (5) all be engaged firm coated metal (8) institute.Thereby make the wall portion metal (8) and Copper Foil conductive pattern (5) conducting of Copper Foil conductive pattern (1) by hole (7), (5) again by the wall portion metal and Copper Foil conductive pattern (3) conducting in hole (6), finally reach the designing requirement of Copper Foil conductive pattern (1) and (3) conducting.Can insert former device as requested in hole (6), (7) welds.
Fig. 2 is the existing section of structure of using the two-sided hole metallization printed circuit board of single face copper coated foil plate making.
With reference to Fig. 2.
(9), (10), (11) are the Copper Foil conductive patterns that the copper-clad surface at the single face copper coated foil plate etches with common process.Designing requirement conductive pattern (9) connects conducting with (11), but owing to be subjected to the obstruct of conductive pattern (10), (9) can't connect with a first line of a couplet with (11), therefore on the no copper-clad surface of insulating substrate (12), print one deck conductive pattern (13) with electrically-conducting paint, and, make hole (15), (16) internal metallization with electrically-conducting paint pack hole (15), (16).The electrically-conducting paint of filling passes through to need contact with conductive pattern (9), (11) behind hole (15), (16), as contact (18).Treat promptly to reach after electrically-conducting paint solidifies the requirement of Copper Foil conductive pattern (9) and (11) conducting, but insert former device welding, have only and use hole (14) and (17) in addition in order to adorn.Be difficult to the hole count that is multiplied under the intensive situation that connects up, this printed circuit board is used for the little design of wiring density more.
Fig. 3 is the section of structure that existing perforated metallization printed circuit board interlayer decomposes.
With reference to Fig. 3.
(19), (21), (23), (25) are with common process etched Copper Foil conductive pattern on double-sided copper-clad paper tinsel plate; (20), (24) are the insulating substrates of double-sided copper-clad paper tinsel plate; (22) be the semi-solid preparation insulating trip, play double sided board (20) and (24) isolated insulation effect behind hot pressing, and make double sided board (20) and (24) be bonded as integrally formed sandwich construction conductive pattern (21), (23); When being the multi-layer sheet hot pressing, arrow (26) is subjected to force direction.
Fig. 4 is existing 4 layers of hole metallization printed circuit board interlayer section of structure.
With reference to Fig. 4.
The multilayer printed circuit board that hot pressing is integrated and holes through multilayer is after the hole wall metalized that Fig. 1 introduced, its continuous coat of metal (27) carries out the conducting of ring-type with the Copper Foil of each layer on the inwall in hole, carry out planar the combination with the Copper Foil conductive pattern on top layer, thereby make the comprehensive conducting of interlayer circuit that needs conducting.
More than the printed circuit board of existing double-side conduction or multilayer interlayer conduction, no matter with just plating method or the anti-method of plating, still adopting electrically-conducting paint filling hole, all is to make conductive pattern and undertaken two-sided or interlayer conduction by the metalized in hole on two faces of insulating sheet material.
Task of the present utility model is that a kind of of design is on a face of insulating material and need not the multilayer printed circuit board more than 2 layers and 2 layers that hole metallization is handled.It has, and production technology is simple, enforcement is convenient, dependable performance, with low cost, in light weight, characteristic of strong applicability.Be applicable to that complicated circuit, former device density are big, volume is little, in light weight or need products such as the electronic equipment of flexible connection and thin film switch.
Solution of the present utility model has been used the basic principle and the technology of ordinary printed board design and making, cover the rigid plate of Copper Foil or soft board is substrate with common single face, make the ground floor circuitous pattern earlier at copper-clad surface, and then this face with coatings alternate successively with electrically-conducting paint produce the second layer and insulating barrier more than the second layer and conductive pattern, thereby reach the function of two-sided or multilayer printed circuit board.Ground floor copper clad patterns (circuit) is provided with and is not insulated the topped Copper Foil contact that exposes to the open air of layer or the contact of electrically-conducting paint figure, and this contact is the circuit turn-on that can make between each interlayer or adjacent layer.Coatings can be dielectric ink, insulating varnish, welding resistance printing ink, is best with the dielectric ink.Electrically-conducting paint can be from leading low-temperature silver slurry or carbon pastes or carbon silver mixed slurry.Between each of printed circuit board layer can be that insulating barrier is coated in holostrome or part.Single face copper coated foil plate base material can be soft polyester or pi material, also can be rigid paper substrate or epoxy fibreglass cloth laminated board base or dicyandiamide or polyfluortetraethylene plate base.
The utility model will be further described below in conjunction with accompanying drawing.
Fig. 5: cross-sectional view of the present utility model is identical with Fig. 4 multilayer printed circuit board function.With reference to Fig. 5.
(28) be the insulating substrate of common single face copper coated foil plate;
(29) be the single face Copper Foil conductive pattern that adopts common process to etch;
(30) be the formed insulating protective layer of printing of ground floor coatings, its objective is and allow the non-contact of conductive pattern (29), (31) and non-solder joint partly carry out whole or local insulation isolation, and the circuit turn-on contact (32) of conductive pattern (29), (31) is located, and does not require to stamp coatings; Locate also not require in contact (37), (38) to stamp coatings, so as with printed conductive figure (34) conducting afterwards.
(31) be to go up the formed circuitous pattern of printing of one deck electrically-conducting paint at the insulating protective layer (30) that ground floor is printed; designing requirement is pressed in it and conductive pattern (29), (34); non-conduction part is isolated by insulating protective layer (30), (33), and the turning part is by contact (32), (35) conducting.Thereby the interlayer draw bail of conductive pattern (29), (31), (34) has been cancelled plated-through hole;
(32) be contact, when printing ground floor coatings (30), locate to reserve neutral gear at the contact (32) on copper-foil conducting electricity (29) surface, Copper Foil is exposed to the open air, when printing conductive pattern (31), electrically-conducting paint is located and directly conducting of copper-foil conducting electricity (29) in (32);
(33) be to go up the formed insulating protective layer of printing of second layer coatings at conductive pattern (31).Its objective is and allow the non-contact portions of conductive pattern (31), (34) carry out whole or local insulation isolation, and the contact (35) of conductive pattern (31) and (34) is located not require and is stamped coatings, simultaneously contact (37), (38) two places do not require yet and stamp coatings, so as with printed conductive figure (34) conducting afterwards;
(34) be to go up the formed conductive pattern of printing of one deck electrically-conducting paint at second layer insulating protective layer (33); designing requirement is pressed in it and circuitous pattern (29), (31); non-conduction part is isolated by insulating barrier, and the turning part is respectively by contact (37), (38), (35) conducting.Wherein contact (37), (38) are conductive pattern (34) and directly conducting of copper-foil conducting electricity (29).By this design, the conductive pattern of random layer all can be designed to and directly conducting of copper-foil conducting electricity (29);
(35) be the contact of conductive pattern (34) and (31), contact (35) is located naked coating, makes (31), (34) two-tier circuit conducting.Conductive pattern (34) is by after contact (35) and conductive pattern (31) conducting, again through conductive pattern (31) and contact (32), can with copper-foil conducting electricity figure (29) conducting indirectly.Contact (35) is mainly used in the conducting of adjacent conductive pattern and the indirect conducting of interlayer conductive pattern and copper-foil conducting electricity (29);
(36) be the surperficial overcoat that solder mask ink is printed, reserve all solder joints, can print former device character marking at this laminar surface for former device dress connection.Can be according to the choice of designing requirement decision to (36);
(37), (38) be contact, is conductive pattern (34) and the contact place, direct connection place of (29) does not have exhausted paper tinsel coating, when printing conductive pattern (34), makes the direct conducting of exposed Copper Foil of electrically-conducting paint and conductive pattern (29).
The base material that the utility model uses also can adopt soft or rigid insulating substrate except that the soft or rigid single face copper coated foil plate of above-mentioned employing, the printed circuit board that this kind structure is mainly used in not to be needed to weld former device, connect by grafting or crimping mode.Below in conjunction with Fig. 5 the multilayer printed circuit board that uses soft or rigid insulation base material to make carrier is done detailed structure explanation:
With reference to Fig. 5.
(28) be soft or rigid insulating substrate;
(29) be the ground floor conductive pattern of printing with electrically-conducting paint;
(30) be the ground floor insulating protective layer of printing with coatings, contact (32), (37), (38) are located not require and are stamped coatings;
(31) be the second layer conductive pattern of printing with electrically-conducting paint, be abutted against point (32) and make (31) and (29) conducting;
(33) be the second layer insulating protective layer of printing with coatings, contact (35), (37), (38) are located not require and are stamped coatings;
(34) be the 3rd layer of circuit of printing with electrically-conducting paint, locate conductive pattern (34) and (31) conducting, locate, the 3rd layer of conductive pattern (34) and ground floor conductive pattern (29) conducting in contact (37), (38) at contact (35).
Fig. 5,6,7,8,9, the 10th, the utility model do not have the structure chart of plated-through hole single face multilayer printed board interlayer conductive pattern conducting.
With reference to Fig. 6, Fig. 7, Fig. 8, by Fig. 6, Fig. 7, Fig. 8 represented the non-contact of levels conductive pattern and non-solder joint partly all insulate isolate after, realize no plated-through hole and make the forming process of levels circuitous pattern conducting.
Fig. 6 is the circuitous pattern that etches with common process on the single face copper coated foil plate; (39) be the plug of circuit; (43), (44) are the holes that pad and dress are inserted original paper; (40), (41), (42) are the contacts that connects conducting with the second layer or multilayer circuit figure, it is the rectangle Copper Foil that etches on the single face copper coated foil plate, so that carry out the difference of function, and provides bigger contact area.
Fig. 7 is a schematic diagram of printing out dielectric isolation layer (49) on the single-clad board conductive pattern face of Fig. 6 with coatings; except that the copper-foil conducting electricity with each plug (39), solder joint (43), (44), contact (40), (41), (42) exposed, the non-contact in the circuitous pattern, non-solder joint part used insulating barrier (49) to protect all.
Fig. 8 is that formed insulating barrier (49) is gone up according to the requirement of second layer conductive pattern in Fig. 7, second layer conductive pattern (50), (51) printed with electrically-conducting paint, and directly contact conducting with contact (40), (41), (42) of ground floor copper-foil conducting electricity.
With reference to Fig. 6, Fig. 9, Figure 10, Fig. 6, Fig. 9, Figure 10 have represented that the non-contact of levels circuitous pattern and non-solder joint carry out the minor insulation insulation blocking, realize the forming process of no plated-through hole levels conductive pattern conducting.
Fig. 9 is illustrated in the intersection of the copper-foil conducting electricity of single-clad board of Fig. 6 and second layer electrically-conducting paint printed conductive figure (54), (55), the minor insulation layer (52), (53) that are printed to coloured coatings.
Figure 10 is second layer conductive pattern (54), (55 of printing with electrically-conducting paint on the formed minor insulation layer of Fig. 9), and with ground floor copper-foil conducting electricity contact (40), (41), (42) directly conducting.
Embodiment by above-mentioned Fig. 5, Fig. 6, Fig. 7, Fig. 8, Fig. 9, Figure 10, illustrate that the utility model is to adopt electrically-conducting paint alternate one by one with coatings and finish the structure of interlayer conduction by contact on a face of insulating carrier, finish the function of multilayer printed circuit board, thereby can replace the hole metallization structure of existing multilayer printed circuit board.
Claims (6)
1, a kind of bilayer or double layer printed circuit plate that does not have plated-through hole; it is characterized in that making conductive copper platinum figure (circuit) with the single face copper coated foil plate; on the copper-foil conducting electricity figure, print one deck insulating protective layer, and one deck or multilayer insulation coating and electrically-conducting paint are arranged on insulating barrier.
2, no plated-through hole bilayer according to claim 1 or multilayer printed circuit board, it is characterized in that being provided with on ground floor copper clad patterns (circuit) and be not insulated the topped Copper Foil contact that exposes to the open air of layer or the contact of electrically-conducting paint figure, this contact is the circuit turn-on that can make each interlayer or adjacent.
3, no plated-through hole bilayer according to claim 1 or multilayer printed circuit board is characterized in that coatings can be dielectric ink, insulating varnish, welding resistance printing ink, are best with the dielectric ink.
4, no plated-through hole bilayer according to claim 1 or multilayer printed circuit board is characterized in that electrically-conducting paint can be from leading low-temperature silver slurry or carbon pastes or carbon silver mixed slurry.
5, no plated-through hole bilayer according to claim 1 or multilayer printed circuit board is characterized in that between each layer of printed circuit board can be that insulating barrier is coated in holostrome or part.
6, no plated-through hole bilayer according to claim 1 or multilayer printed circuit board, it is characterized in that single face copper coated foil plate base material can be soft polyester or pi material, also can be rigid paper substrate or epoxy fibreglass cloth laminated board base or dicyandiamide or polyfluortetraethylene plate base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89205122 CN2051427U (en) | 1989-05-29 | 1989-05-29 | Metallized-hole-free single face multi-layer printing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89205122 CN2051427U (en) | 1989-05-29 | 1989-05-29 | Metallized-hole-free single face multi-layer printing circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2051427U true CN2051427U (en) | 1990-01-17 |
Family
ID=4862341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 89205122 Withdrawn CN2051427U (en) | 1989-05-29 | 1989-05-29 | Metallized-hole-free single face multi-layer printing circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2051427U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102029922A (en) * | 2009-09-27 | 2011-04-27 | 天津市松正电动科技有限公司 | Double-sided aluminum substrate-based power metal oxide semiconductor field effect transistor (MOSFET) parallel circuit and structural design |
| CN104047041A (en) * | 2013-03-15 | 2014-09-17 | 深圳市九和咏精密电路有限公司 | Preparation method for printed circuit board |
-
1989
- 1989-05-29 CN CN 89205122 patent/CN2051427U/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102029922A (en) * | 2009-09-27 | 2011-04-27 | 天津市松正电动科技有限公司 | Double-sided aluminum substrate-based power metal oxide semiconductor field effect transistor (MOSFET) parallel circuit and structural design |
| CN102029922B (en) * | 2009-09-27 | 2015-01-21 | 天津市松正电动汽车技术股份有限公司 | Double-sided aluminum substrate-based power metal oxide semiconductor field effect transistor (MOSFET) parallel circuit and structural design |
| CN104047041A (en) * | 2013-03-15 | 2014-09-17 | 深圳市九和咏精密电路有限公司 | Preparation method for printed circuit board |
| CN104047041B (en) * | 2013-03-15 | 2017-04-26 | 深圳市九和咏精密电路有限公司 | Preparation method for printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0282625A2 (en) | Method for producing rigid-type multilayer printed wiring board | |
| EP1903842A3 (en) | Multilayer printed wiring board | |
| EP1146149A4 (en) | Aqueous dispersion for forming conductive layer, conductive layer, electronic component, circuit board and method for manufacturing the same, and multilayer wiring board and method for manufacturing the same | |
| JPS63211692A (en) | Double-sided interconnection board | |
| EP1720393A3 (en) | Multilayered printed wiring board and its manufacture | |
| CN213073220U (en) | Adopt flexible double-sided circuit board for LED lamp area of blind hole structure | |
| MY124084A (en) | A clad sheet for printed circuit board, a multilayered printed circuit board using thereof and manufacturing method thereof | |
| JPH1117341A (en) | Frinted multilayer wiring board | |
| CN2051427U (en) | Metallized-hole-free single face multi-layer printing circuit board | |
| US5878487A (en) | Method of supporting an electrical circuit on an electrically insulative base substrate | |
| CN216291577U (en) | Multilayer circuit board | |
| CN213152527U (en) | Multilayer circuit board | |
| CN101641461B (en) | Multilayer printed wiring boards with copper filled through-holes | |
| CN114007346A (en) | Multilayer circuit board manufacturing method and multilayer circuit board | |
| JP3414653B2 (en) | Method of manufacturing multilayer substrate and multilayer substrate | |
| CN1090892C (en) | Method for mfg. of double-side conductive metal foil type circuit board and products thereof | |
| JP2741238B2 (en) | Flexible printed wiring board and method of manufacturing the same | |
| JPH088417B2 (en) | Multilayer printed wiring board | |
| CN1747629A (en) | Production of duoble-face printing circuit board | |
| CN218851031U (en) | Asymmetric PCB | |
| JPH02301187A (en) | Manufacture of both-sided wiring board | |
| JP2547650B2 (en) | Multilayer substrate with resistor inside | |
| JP3165617B2 (en) | Multilayer printed wiring board and method of manufacturing the same | |
| KR200199631Y1 (en) | Multi-layer printed circuit board | |
| JPH06342986A (en) | Multilayer circuit board structure and multilayer metal base board using the multilayer circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |