CN205028924U - 一种led光源 - Google Patents
一种led光源 Download PDFInfo
- Publication number
- CN205028924U CN205028924U CN201520741662.4U CN201520741662U CN205028924U CN 205028924 U CN205028924 U CN 205028924U CN 201520741662 U CN201520741662 U CN 201520741662U CN 205028924 U CN205028924 U CN 205028924U
- Authority
- CN
- China
- Prior art keywords
- led
- light source
- lens
- support
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520741662.4U CN205028924U (zh) | 2015-09-23 | 2015-09-23 | 一种led光源 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520741662.4U CN205028924U (zh) | 2015-09-23 | 2015-09-23 | 一种led光源 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205028924U true CN205028924U (zh) | 2016-02-10 |
Family
ID=55261436
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201520741662.4U Active CN205028924U (zh) | 2015-09-23 | 2015-09-23 | 一种led光源 |
Country Status (1)
Country | Link |
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CN (1) | CN205028924U (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106992260A (zh) * | 2017-03-10 | 2017-07-28 | 上海小糸车灯有限公司 | 一种oled车灯及其oled屏体安装结构及安装方法 |
CN107101132A (zh) * | 2017-06-09 | 2017-08-29 | 浙江博上光电有限公司 | 一种大功率led路灯防护结构 |
CN107248547A (zh) * | 2017-06-21 | 2017-10-13 | 鸿宝科技股份有限公司 | 一种大功率led芯片集成封装结构及其封装方法 |
CN107477377A (zh) * | 2017-08-24 | 2017-12-15 | 深圳市圣心照明科技有限公司 | 一种led光源板、led玻璃灯管及制造方法 |
CN108645544A (zh) * | 2018-05-10 | 2018-10-12 | 厦门多彩光电子科技有限公司 | 一种检测封装胶的应力的方法及装置 |
CN109155118A (zh) * | 2018-07-20 | 2019-01-04 | 深圳市雷迪奥视觉技术有限公司 | 显示屏面罩的制备工艺及显示屏 |
CN109727963A (zh) * | 2019-01-11 | 2019-05-07 | 深圳市同一方光电技术有限公司 | 一种超耐高温不死灯封装的新型正装cob光源 |
-
2015
- 2015-09-23 CN CN201520741662.4U patent/CN205028924U/zh active Active
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106992260A (zh) * | 2017-03-10 | 2017-07-28 | 上海小糸车灯有限公司 | 一种oled车灯及其oled屏体安装结构及安装方法 |
CN107101132A (zh) * | 2017-06-09 | 2017-08-29 | 浙江博上光电有限公司 | 一种大功率led路灯防护结构 |
CN107248547A (zh) * | 2017-06-21 | 2017-10-13 | 鸿宝科技股份有限公司 | 一种大功率led芯片集成封装结构及其封装方法 |
CN107477377A (zh) * | 2017-08-24 | 2017-12-15 | 深圳市圣心照明科技有限公司 | 一种led光源板、led玻璃灯管及制造方法 |
CN107477377B (zh) * | 2017-08-24 | 2023-11-03 | 深圳市圣心照明科技有限公司 | 一种led光源板、led玻璃灯管及制造方法 |
CN108645544A (zh) * | 2018-05-10 | 2018-10-12 | 厦门多彩光电子科技有限公司 | 一种检测封装胶的应力的方法及装置 |
CN108645544B (zh) * | 2018-05-10 | 2020-03-20 | 厦门多彩光电子科技有限公司 | 一种检测封装胶的应力的方法及装置 |
CN109155118A (zh) * | 2018-07-20 | 2019-01-04 | 深圳市雷迪奥视觉技术有限公司 | 显示屏面罩的制备工艺及显示屏 |
CN109727963A (zh) * | 2019-01-11 | 2019-05-07 | 深圳市同一方光电技术有限公司 | 一种超耐高温不死灯封装的新型正装cob光源 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: LED light source illumination lamp fitting Effective date of registration: 20190918 Granted publication date: 20160210 Pledgee: Xiamen finance Company limited by guarantee Pledgor: Xiamen Colorful Optoelectronics Technology Co.,Ltd. Registration number: Y2019990000252 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220221 Granted publication date: 20160210 Pledgee: Xiamen finance Company limited by guarantee Pledgor: XIAMEN DACOL PHOTOELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: Y2019990000252 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |