CN205004350U - 一种朗伯型大功率led封装结构 - Google Patents
一种朗伯型大功率led封装结构 Download PDFInfo
- Publication number
- CN205004350U CN205004350U CN201520570483.9U CN201520570483U CN205004350U CN 205004350 U CN205004350 U CN 205004350U CN 201520570483 U CN201520570483 U CN 201520570483U CN 205004350 U CN205004350 U CN 205004350U
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- CN
- China
- Prior art keywords
- lens
- copper post
- lambert
- power led
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Led Device Packages (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520570483.9U CN205004350U (zh) | 2015-08-03 | 2015-08-03 | 一种朗伯型大功率led封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520570483.9U CN205004350U (zh) | 2015-08-03 | 2015-08-03 | 一种朗伯型大功率led封装结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205004350U true CN205004350U (zh) | 2016-01-27 |
Family
ID=55161222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201520570483.9U Expired - Fee Related CN205004350U (zh) | 2015-08-03 | 2015-08-03 | 一种朗伯型大功率led封装结构 |
Country Status (1)
Country | Link |
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CN (1) | CN205004350U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106025011A (zh) * | 2016-07-19 | 2016-10-12 | 江西利能低碳科技股份有限公司 | Led光源减蓝光方法、led减蓝光光源装置及其安装方法 |
WO2019047149A1 (zh) * | 2017-09-08 | 2019-03-14 | 深圳前海小有技术有限公司 | 半导体元件的封装结构及其封装方法 |
-
2015
- 2015-08-03 CN CN201520570483.9U patent/CN205004350U/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106025011A (zh) * | 2016-07-19 | 2016-10-12 | 江西利能低碳科技股份有限公司 | Led光源减蓝光方法、led减蓝光光源装置及其安装方法 |
WO2019047149A1 (zh) * | 2017-09-08 | 2019-03-14 | 深圳前海小有技术有限公司 | 半导体元件的封装结构及其封装方法 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP03 | Change of name, title or address |
Address after: Baoan District Shiyan street Shenzhen city Guangdong province 518000 house community Stone Ring Road 202 wealth B building science and Technology Parks plant 3-5 layer Patentee after: SHENZHEN LEPOWER OPTO ELECTRONICS CO., LTD. Address before: 518000, Baoan District, Shiyan City, Guangdong province Shenzhen street community B the Great Wall Road, paddy field industrial zone, 5 floor Patentee before: Shenzhen Leyond Opto Electronics Co., Ltd. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160612 Address after: Baoan District Shiyan street Shenzhen city Guangdong province 518000 house community Stone Ring Road 202 chanf Technology Park building B Patentee after: Shenzhen top lighting technology Co., Ltd. Address before: Baoan District Shiyan street Shenzhen city Guangdong province 518000 house community Stone Ring Road 202 wealth B building science and Technology Parks plant 3-5 layer Patentee before: SHENZHEN LEPOWER OPTO ELECTRONICS CO., LTD. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160127 Termination date: 20160803 |