CN204959025U - Planar cathode that magnetron sputtering coating film was used - Google Patents
Planar cathode that magnetron sputtering coating film was used Download PDFInfo
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- CN204959025U CN204959025U CN201520718921.1U CN201520718921U CN204959025U CN 204959025 U CN204959025 U CN 204959025U CN 201520718921 U CN201520718921 U CN 201520718921U CN 204959025 U CN204959025 U CN 204959025U
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Abstract
The utility model relates to a magnetron sputtering device field, in particular to planar cathode that magnetron sputtering coating film was used. The utility model discloses a planar cathode that magnetron sputtering coating film was used is including sputtering target, target cover, vacuum cavity, bench insulator, negative pole seat, copper backplate, adjustable magnetic pole board and substrate frame. The utility model discloses in, cool off the copper backplate through adopting entirely water -cooled mode, can taking away of maximize sputter the heat that produces in process of production, but also cool off through adopting the complete water -cooled mode of adjustable magnetic pole board to carry out the magnetic pole board, therefore the stability in magnetic field is strong, can keep the stability in magnetic field for a long time, in addition, the static seal is adopted in combination department of each part, and is sealed effectual, has prevented effectively to leak, the emergence of gas leakage and negative pole short circuit phenomenon, has reduced cost of maintenance, makes the utility model discloses life increases. The utility model discloses sputter the target high -usage, the sputtering sedimentation is even, the negative pole cooling effect is good.
Description
Technical field
The utility model relates to magnetic control sputtering device field, particularly a kind of planar cathode of use in magnetron sputtering coating.
Background technology
Big area magnetron sputtering is widely used in the industries such as optics, semi-conductor, photoelectric display, nano material, integrated circuit and building decoration, in current vacuum coating film equipment, rectangle plane sputter cathode is its nucleus equipment, especially all the more so in large-area vacuum filming equipment.Planar cathode designs the cathode sputtering system with widespread use the earliest, the widespread use being especially DC magnetron sputtering process in the sputtering sedimentation plated film field of metallic substance and metalloid material.As the magnetic control sputtering cathode structure design that the stability of maturation is best, big area linear plane magnetic control sputtering cathode has a lot of derivative design, be widely used in rectangle plane sputter cathode large in plated film industrial trade at present, it is provided with shielding case around negative electrode, shielding case lower end is connected with anode frame, wherein, anode frame, shielding case and positive source, ground wire is connected and maintains a certain distance with cathode, the electronics that non-target is launched intercepted and captured by the shielding case of zero potential, avoid argon gas to ionize and produce glow discharge, the parts such as target stand are stoped to produce sputtering, effective guarantee coating quality, but it is not high all to there is sputtering target material utilization ratio in these Cathode Design, the problem of the uneven and cooled cathode poor effect of sputtering sedimentation, affect and limit the application of linear plane negative electrode in big area magnetron sputtering field.
Publication number is the Chinese patent of CN203021644U, discloses a kind of plated film negative electrode magnetic-rod device with core axis device, the sputter rate of plated film cathode target, and sedimentation rate and target utilization still not, make linear plane negative electrode apply and are affected.
Utility model content
In order to overcome deficiency described above, the purpose of this utility model is to provide the planar cathode of the use in magnetron sputtering coating that a kind of utilization ratio is high, sputtering sedimentation is even, cooled cathode is effective.
The technical scheme in the invention for solving the technical problem is:
A planar cathode for use in magnetron sputtering coating, wherein, comprise sputtering target, target cover, vacuum cavity, bench insulator, cathode block, copper backboard, adjustable pole plate, substrate frame, described target cover is tightly connected by the first vaccum seal ring and described vacuum cavity; Described bench insulator is overlapped with described target by the second vaccum seal ring and is connected; Described cathode block is connected with described bench insulator by the 3rd vaccum seal ring; Described copper backboard is connected with described cathode block by the 4th vaccum seal ring; Cooling water cavity is formed between described cathode block and described copper backboard; Described sputtering target is fixed on described copper backboard; Described adjustable pole plate is fixed in described cooling water cavity, and described adjustable pole plate is connected with described substrate frame.
Improve as one of the present utility model, described target cover is fastenedly connected with anode seat, is provided with technique uptake, described anode seat is fastenedly connected with equal atmospheric pressure board between described target cover and described anode seat.
As further improvement of the utility model, described adjustable pole plate is provided with S pole magnetic pole, N pole magnetic pole, pole shoe seat, pole shoe lid, magnetic sheet locating dowel, magnetic sheet set nut, water-tight lid, adjusting seat, regulating rod and adjusting nut; Described S pole magnetic pole and N pole magnetic pole are in the pole shoe space that formed between described pole shoe seat and described pole shoe lid, described S pole magnetic pole and N pole magnetic pole are fixed in described pole plate locating dowel, described magnetic sheet set nut, described adjusting nut are connected with described regulating rod respectively, described regulating rod is connected with described cathode block by the 5th vaccum seal ring, and described adjusting nut is fixed in described adjusting seat.
Further improve as of the present utility model, described cathode block is provided with prosopyle and posticum, and described prosopyle and posticum are connected with described cooling water cavity respectively.
Further improve as of the present utility model, the material of described bench insulator is polyoxymethylene.
The planar cathode of a kind of use in magnetron sputtering coating of the present utility model comprises sputtering target, target cover, vacuum cavity, bench insulator, cathode block, copper backboard, adjustable pole plate, substrate frame, and target cover is tightly connected by the first vaccum seal ring and vacuum cavity; Bench insulator is overlapped with target by the second vaccum seal ring and is connected; Cathode block is connected with bench insulator by the 3rd vaccum seal ring; Copper backboard is connected with cathode block by the 4th vaccum seal ring; Cooling water cavity is formed between cathode block and copper backboard; Sputtering target is fixed on copper backboard; Adjustable pole plate is fixed in cooling water cavity, and adjustable pole plate is connected with substrate frame.In the utility model, by adopting the mode of full water cooling to cool copper backboard, maximizedly can take away the heat that sputtering produces in process of production; But also by adopting the mode of adjustable pole plate full water cooling to carry out pole plate cooling, therefore the stability in magnetic field is strong, can keep the stability in magnetic field for a long time; In addition, the junction of each parts adopts static seal, good sealing effect, effectively prevent to leak, leak gas and the generation of negative electrode short circuit phenomenon, decreases maintenance cost, the utility model is increased work-ing life.The utility model sputtering target utilization ratio is high, sputtering sedimentation is even, cooled cathode is effective.
Accompanying drawing explanation
For ease of illustrating, the utility model is described in detail by following preferred embodiment and accompanying drawing.
Fig. 1 is front view of the present utility model;
Fig. 2 is the left view of Fig. 1;
Fig. 3 is the vertical view of Fig. 1;
Fig. 4 is the front view of an embodiment of the present utility model;
Fig. 5 is the left view of Fig. 4;
Fig. 6 is the vertical view of Fig. 4;
Reference numeral: 1-target cover, 2-bench insulator, 3-cathode block, 4-anode seat, the equal atmospheric pressure board of 5-, 6-cease spark cover, 7-technique uptake, 8-copper backboard, 9-sputtering target, pole plate that 10-is adjustable, 10-1-S pole magnet, 10-2-N pole magnet, 10-3-pole shoe seat, 10-4-pole shoe lid, 10-5-pole plate locating dowel, 10-6-magnetic sheet set nut, 10-7-water-tight lid, 10-8-adjusting seat, 10-9-regulating rod, 10-10-adjusting nut, 11-vacuum cavity, 12-substrate frame, 13-1-target cover vaccum seal ring, 13-2-insulation covering vaccum seal ring, 13-3-cathode block vaccum seal ring, 13-4-copper backboard vaccum seal ring, 13-5-regulating rod sealing-ring, 14-prosopyle, 15-posticum, 16-cooling water cavity.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
As shown in Figure 1, Figure 2, shown in Fig. 3, Fig. 4, Fig. 5 and Fig. 6, the planar cathode of a kind of use in magnetron sputtering coating of the present utility model, comprise sputtering target 9, target cover 1, vacuum cavity 11, bench insulator 2, cathode block 3, copper backboard 8, adjustable pole plate 10, substrate frame 12, target cover 1 is tightly connected by the first vaccum seal ring and vacuum cavity 11; Bench insulator 2 overlaps 1 by the second vaccum seal ring with target and is connected; Cathode block 3 is connected with bench insulator 2 by the 3rd vaccum seal ring; Copper backboard 8 is connected with cathode block 3 by the 4th vaccum seal ring; Cooling water cavity 11 is formed between cathode block 3 and copper backboard 8; Sputtering target 9 is fixed on copper backboard 8; Adjustable pole plate 10 is fixed in cooling water cavity 11, and adjustable pole plate 11 is connected with substrate frame 12.
In the utility model, by adopting the mode of full water cooling to cool copper backboard 8, maximizedly can take away the heat that sputtering produces in process of production; But also by adopting the mode of adjustable pole plate 10 full water cooling to carry out pole plate cooling, therefore the stability in magnetic field is strong, can keep the stability in magnetic field for a long time; In addition, the junction of each parts adopts static seal, good sealing effect, effectively prevent to leak, leak gas and the generation of negative electrode short circuit phenomenon, decreases maintenance cost, the utility model is increased work-ing life.
Further, target cover 1 of the present utility model is fastenedly connected with anode seat 4, is provided with technique uptake 7, anode seat 4 is fastenedly connected with equal atmospheric pressure board 5 between target cover 1 and anode seat 4; Have employed the technique admission passage of new design, by even inlet system, process gas is arranged in uniformly the surface of negative electrode, strengthen utilization ratio and equal gas effects of gas.
The utility model provides a kind of embodiment of adjustable pole plate 10, and adjustable pole plate 10 is provided with magnetic pole 10-1, N pole, S pole magnetic pole 10-2, pole shoe seat 10-3, pole shoe lid 10-4, magnetic sheet locating dowel 10-5, magnetic sheet set nut 10-6, water-tight lid 10-7, adjusting seat 10-8, regulating rod 10-9 and adjusting nut 10-10; Wherein, S pole magnetic pole 10-1 and N pole magnetic pole 10-2 is in the pole shoe space that formed between pole shoe seat 10-3 and pole shoe lid 10-4, S pole magnetic pole 10-1 and N pole magnetic pole 10-2 is fixed on pole plate locating dowel 10-5, magnetic sheet set nut 10-6, adjusting nut 10-10 are connected with regulating rod 10-9 respectively, regulating rod 10-9 is connected with cathode block 3 by the 5th vaccum seal ring, and adjusting nut 10-10 is fixed on adjusting seat 10-8; The adjustable pole plate 10 adopted can adjust magnetic cardinal distance, thus under the condition not destroying vacuum, can supplement adjustment, thus realize real-time adjustment and control deposition uniformity uneven the carrying out of the deposition of local.
In order to make the continuous flow of water coolant of the present utility model, cathode block 3 is provided with prosopyle 14 and posticum 15, and prosopyle 14 is connected with cooling water cavity 16 with posticum 15.
Further, in order to make the utility model not be short-circuited phenomenon, the material of bench insulator 2 is polyoxymethylene.
The utility model can adopt separately magnetically controlled DC sputtering and rf magnetron sputtering to form plasma body between substrate frame 12 and the sputtering target 9 being welded on copper backboard 8, sputtering occurs and by deposition of material in substrate frame 12.
The utility model provides a kind of embodiment, as shown in Figure 4, Figure 5 and Figure 6, the present embodiment comprises target cover 1, bench insulator 2, cathode block 3, anode seat 4, air flue lid 5, cease spark cover 6, inlet pipe 7, copper backboard 8, sputtering target 9, adjustable pole plate 10, vacuum cavity 11, substrate frame 12, vacuum-sealing 13, prosopyle 14 and posticum 15; Target cover 1 is tightly connected by target cover vaccum seal ring 13-1 and vacuum cavity 11; Bench insulator 2 overlaps 1 by bench insulator vaccum seal ring 13-2 with target and is connected; Cathode block 3 is connected with bench insulator 2 by cathode block vaccum seal ring 13-3; Copper backboard 8 is connected with cathode block 3 by copper backboard vaccum seal ring 13-4; In the cooling water cavity 16 be made up of cathode block 3 and copper backboard 8, adjustable pole plate 10 is fixed on pole plate locating dowel 10-5.
In the present embodiment, target cover 1 is fastenedly connected with anode seat 4, and opens the technique uptake 7 be communicated with on target cover 1 with anode seat 4; Anode seat 4 is fastenedly connected with equal atmospheric pressure board 5, the process gas entering vacuum is arranged in cathode zone uniformly.
In the present embodiment, adjustable pole plate 10 includes magnetic pole 10-1, N pole, S pole magnetic pole 10-2, pole shoe seat 10-3, pole shoe lid 10-4, magnetic sheet locating dowel 10-5, magnetic sheet set nut 10-6, water-tight lid 10-7, adjusting seat 10-8, regulating rod 10-9 and adjusting nut 10-10; S pole magnetic pole 10-1 and N pole magnetic pole 10-2 is fastening and totally-enclosed in pole shoe by pole shoe seat 10-3 and pole shoe lid 10-4, and is fixed on pole plate locating dowel 10-5, and two ends are locked on regulating rod 10-9 by magnetic sheet set nut 10-6; Regulating rod 10-9 is connected with cathode block 3 by regulating rod sealing-ring 13-5, and rotated by regulating rod 10-9 drive adjustable pole plate 10 fastening with it by the adjusting nut 10-10 be fixed on adjusting seat 10-8, and change the distance of adjustable pole plate 10 and substrate frame 12; Cathode block 3 has prosopyle 14 and posticum 15, and with cooling water cavity 16 UNICOM, ensure the continuous flow of water coolant; The material that bench insulator 2 adopts is polyoxymethylene.
The present embodiment adopts medium frequency magnetron sputtering to form plasma body in pairs between substrate frame 12 and the sputtering target 9 being welded on copper backboard 8, sputtering occurs and by deposition of material in substrate frame 12.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection domain of the present utility model.
Claims (5)
1. the planar cathode of a use in magnetron sputtering coating, it is characterized in that, comprise sputtering target, target cover, vacuum cavity, bench insulator, cathode block, copper backboard, adjustable pole plate, substrate frame, described target cover is tightly connected by the first vaccum seal ring and described vacuum cavity; Described bench insulator is overlapped with described target by the second vaccum seal ring and is connected; Described cathode block is connected with described bench insulator by the 3rd vaccum seal ring; Described copper backboard is connected with described cathode block by the 4th vaccum seal ring; Cooling water cavity is formed between described cathode block and described copper backboard; Described sputtering target is fixed on described copper backboard; Described adjustable pole plate is fixed in described cooling water cavity, and described adjustable pole plate is connected with described substrate frame.
2. the planar cathode of a kind of use in magnetron sputtering coating according to claim 1, is characterized in that, described target cover is fastenedly connected with anode seat, is provided with technique uptake, described anode seat is fastenedly connected with equal atmospheric pressure board between described target cover and described anode seat.
3. the planar cathode of a kind of use in magnetron sputtering coating according to claim 2, it is characterized in that, described adjustable pole plate is provided with S pole magnetic pole, N pole magnetic pole, pole shoe seat, pole shoe lid, magnetic sheet locating dowel, magnetic sheet set nut, water-tight lid, adjusting seat, regulating rod and adjusting nut; Described S pole magnetic pole and N pole magnetic pole are in the pole shoe space that formed between described pole shoe seat and described pole shoe lid, described S pole magnetic pole and N pole magnetic pole are fixed in described pole plate locating dowel, described magnetic sheet set nut, described adjusting nut are connected with described regulating rod respectively, described regulating rod is connected with described cathode block by the 5th vaccum seal ring, and described adjusting nut is fixed in described adjusting seat.
4. the planar cathode of a kind of use in magnetron sputtering coating according to claim 3, is characterized in that, described cathode block is provided with prosopyle and posticum, and described prosopyle and posticum are connected with described cooling water cavity respectively.
5. the planar cathode of a kind of use in magnetron sputtering coating according to claim 4, is characterized in that, the material of described bench insulator is polyoxymethylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520718921.1U CN204959025U (en) | 2015-09-16 | 2015-09-16 | Planar cathode that magnetron sputtering coating film was used |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520718921.1U CN204959025U (en) | 2015-09-16 | 2015-09-16 | Planar cathode that magnetron sputtering coating film was used |
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| Publication Number | Publication Date |
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| CN204959025U true CN204959025U (en) | 2016-01-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520718921.1U Expired - Fee Related CN204959025U (en) | 2015-09-16 | 2015-09-16 | Planar cathode that magnetron sputtering coating film was used |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106350777A (en) * | 2016-11-22 | 2017-01-25 | 新奥光伏能源有限公司 | Magnetic control sputtering cathode device and magnetic control sputtering device |
| CN107761065A (en) * | 2017-09-15 | 2018-03-06 | 信义玻璃工程（东莞）有限公司 | Coating wire planar cathode short circuit repair method |
| CN111560588A (en) * | 2020-05-09 | 2020-08-21 | 南方科技大学 | Magnetron sputtering target and magnetron sputtering device for ultrahigh vacuum environment |
-
2015
- 2015-09-16 CN CN201520718921.1U patent/CN204959025U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106350777A (en) * | 2016-11-22 | 2017-01-25 | 新奥光伏能源有限公司 | Magnetic control sputtering cathode device and magnetic control sputtering device |
| CN106350777B (en) * | 2016-11-22 | 2019-01-15 | 新奥光伏能源有限公司 | A kind of magnetic control sputtering cathode device and magnetic control sputtering device |
| CN107761065A (en) * | 2017-09-15 | 2018-03-06 | 信义玻璃工程（东莞）有限公司 | Coating wire planar cathode short circuit repair method |
| CN107761065B (en) * | 2017-09-15 | 2019-04-19 | 信义玻璃工程（东莞）有限公司 | Coating wire planar cathode short circuit repair method |
| CN111560588A (en) * | 2020-05-09 | 2020-08-21 | 南方科技大学 | Magnetron sputtering target and magnetron sputtering device for ultrahigh vacuum environment |
| CN111560588B (en) * | 2020-05-09 | 2022-05-03 | 南方科技大学 | Magnetron sputtering target and magnetron sputtering device for ultrahigh vacuum environment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160113 Termination date: 20200916 |