CN106399958B - A kind of rectangle magnetic controlled sputtering target for metal coating - Google Patents
A kind of rectangle magnetic controlled sputtering target for metal coating Download PDFInfo
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- CN106399958B CN106399958B CN201610360061.8A CN201610360061A CN106399958B CN 106399958 B CN106399958 B CN 106399958B CN 201610360061 A CN201610360061 A CN 201610360061A CN 106399958 B CN106399958 B CN 106399958B
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- target
- water cooling
- magnet
- rectangle
- stand
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a kind of rectangle magnetic controlled sputtering targets for metal coating, including anode seat, water cooling target stand, magnet assemblies, target and target backboard, anode seat is equipped with rectangle mounting groove, water cooling target stand is installed in rectangle mounting groove, magnet assemblies are installed in water cooling target stand and by target back plate seals, target is installed on target backboard, magnet assemblies include centring magnet, two end magnets and multiple side magnet, two end magnets and multiple side magnet constitute rectangular magnet frame, centring magnet is fixed on inside rectangular magnet frame along rectangular magnet frame length direction, each fixed fixed block of side magnet, multiple installation convex blocks are equipped in water cooling target stand, the fixed block and installation convex block correspond, fixed block is movably connect with installation convex block.Target material surface magnetic field distribution can be changed in the present invention, improves the heavy film uniformity of rectangle magnetic controlled sputtering target, increases the effectively heavy diaphragm area of sputtering target, improves the utilization rate of target.
Description
Technical field
The present invention relates to the preparation technical fields of thin film hybrid IC upper conductive film layer, more particularly to one kind is for gold
Belong to the rectangle magnetic controlled sputtering target of plated film.
Background technique
As the thin film hybrid circuit substrate size for developing high-end microwave device increases, production capacity increases and performance boost, magnetic
It is also higher and higher to control requirement of the sputtering system to magnetic controlled sputtering target, such as target utilization, heavy film uniformity, maximum load power
Deng.Traditional rectangular magnetic controlled sputtering target uses rectangle magnetic steel structure, and both ends Distribution of Magnetic Field and middle part are inconsistent, and final effectively sputtering is heavy
Diaphragm area only has medium position, causes target significant wastage, and heavy film uniformity is limited by Distribution of Magnetic Field, can not be promoted.
Summary of the invention
The technical problem to be solved by the present invention is to overcome the deficiencies in the prior art, provide a kind of changeable target material surface magnetic field
Intensity distribution improves the heavy film uniformity of rectangle magnetic controlled sputtering target, increases the effectively heavy diaphragm area of sputtering target, improves the utilization of target
The rectangle magnetic controlled sputtering target for metal coating of rate.
In order to solve the above technical problems, the invention adopts the following technical scheme:
A kind of rectangle magnetic controlled sputtering target for metal coating, including anode seat, water cooling target stand, magnet assemblies, target and
Target backboard, the anode seat are equipped with rectangle mounting groove, and the water cooling target stand is installed in rectangle mounting groove, the magnet assemblies peace
Loaded in water cooling target stand and by target back plate seals, the target is installed on target backboard, and the magnet assemblies include center magnetic
Iron, two end magnets and multiple side magnet, described two end magnets and multiple side magnet constitute rectangular magnet frame, institute
It states centring magnet to be fixed on inside rectangular magnet frame along rectangular magnet frame length direction, each fixed fixed block of side magnet,
Multiple installation convex blocks are equipped in the water cooling target stand, the fixed block and installation convex block correspond, and the fixed block is removable
With installation convex block connect.
As a further improvement of the above technical scheme:
The fixed block is equipped with the waist-shaped hole being arranged along the width direction of rectangular magnet frame, and the installation convex block is equipped with
For fixing the mounting hole of the fixed block.
It wraps up for cooling water to be isolated the outer surface of the centring magnet, two end magnets and multiple side magnet
Plastic layer.
The rectangle magnetic controlled sputtering target for metal coating further includes target buckle, and target is pressed in target by the target buckle
On backboard.
Insulating part, and four sides of water cooling target stand and rectangle mounting groove are equipped between the water cooling target stand and rectangle mounting groove
There is certain interval between wall.
Notch end on the rectangle mounting groove is installed with the anode plate of square frame-shaped, has between the anode plate and target buckle
There is certain interval.
Notch end on the rectangle mounting groove is equipped with the first threaded hole for installing anode plate, the rectangle mounting groove
Side wall be equipped with the gas vent that can be connected to first threaded hole.
The water cooling target stand is equipped with the second threaded hole for installing target backboard, and the side wall of the water cooling target stand is equipped with can
The gas vent being connected to second threaded hole.
The bottom of the rectangle mounting groove is equipped with the inlet and outlet passed through for cooling water inlet pipe, cooling water outlet pipe, with
And the electrode introduction hole passed through for electrode wires, the cooling water inlet pipe is connected to cooling water outlet Guan Junyu water cooling target stand, described
Electrode wires pass through electrode introduction hole and connect with water cooling target stand.
The medial surface of the end magnets is arc surface.
Compared with the prior art, the advantages of the present invention are as follows:
Rectangle magnetic controlled sputtering target for metal coating of the invention after magnet assemblies are installed in water cooling target stand, is adjusted
It saves fixed block, fixed block and side magnet can be driven mobile, change the spacing between side magnet and centring magnet, in sputtering work
Target material surface magnetic field strength can be changed according to the spacing of heavy film uniformity local directed complete set side magnet and centring magnet during skill
Distribution increases the effectively heavy diaphragm area of sputtering target, improves the utilization of target to improve the heavy film uniformity of rectangle magnetic controlled sputtering target
Rate.
Further, the rectangle magnetic controlled sputtering target for metal coating of the invention, magnet assemblies shape in water cooling target stand
At two waterway channels from one end to the other side, the installation convex block in water cooling target stand can form water flow and hinder in the channel,
To which water flow is become turbulence form, increase the heat exchange of water flow and water cooling target stand and magnet assemblies, to preferably reach cold
But effect, the power that loads for helping to improve sputtering target improve sputtering target sputtering yield.
Detailed description of the invention
Fig. 1 is stereochemical structure decomposing schematic representation of the present invention.
Fig. 2 is the structural schematic diagram of magnet assemblies in the present invention.
Fig. 3 is the structural schematic diagram of water cooling target stand in the present invention.
Each label indicates in figure:
1, anode seat；11, rectangle mounting groove；111, the first threaded hole；12, mounting flange；2, insulating part；3, water cooled target
Seat；31, convex block is installed；311, mounting hole；32, the second threaded hole；4, magnet assemblies；41, side magnet；42, end magnets；
43, centring magnet；44, fixed block；441, waist-shaped hole；5, target backboard；6, target；7, target buckle；8, anode plate；9, gas vent.
Specific embodiment
Below in conjunction with Figure of description and specific embodiment, invention is further described in detail.
Fig. 1 to Fig. 3 shows a kind of embodiment of the present invention for the rectangle magnetic controlled sputtering target of metal coating, this is used for gold
The rectangle magnetic controlled sputtering target for belonging to plated film includes anode seat 1, water cooling target stand 3, magnet assemblies 4, target 6 and target backboard 5, anode seat 1
Equipped with rectangle mounting groove 11, water cooling target stand 3 is installed in rectangle mounting groove 11, and magnet assemblies 4 are installed in water cooling target stand 3 and lead to
The sealing of target backboard 5 is crossed, target 6 is installed on target backboard 5, and magnet assemblies 4 include 43, two end magnets 42 of centring magnet and more
A side magnet 41, two end magnets 42 and multiple side magnet 41 constitute rectangular magnet frame, and centring magnet 43 is along rectangle magnetic
Iron frame length direction is fixed on inside rectangular magnet frame, the fixed fixed block 44 of each side magnet 41, is equipped in water cooling target stand 3
Multiple installation convex blocks 31, fixed block 44 and installation convex block 31 correspond, and fixed block 44 is movably connect with installation convex block 31.
After magnet assemblies 4 are installed in water cooling target stand 3, fixed block 44 is adjusted, fixed block 44 is moved with that can drive each side magnet 41
It is dynamic, change the spacing between side magnet 41 and centring magnet 43, it can be according to heavy film uniformity part during sputtering technology
The spacing of side magnet 41 and centring magnet 43 is adjusted, changes 6 Surface field intensity distribution of target, is splashed to improve rectangle magnetic control
The heavy film uniformity shot at the target increases the effectively heavy diaphragm area of sputtering target, improves the utilization rate of target 6.
In the present embodiment, installation convex block 31 in water cooling target stand 3 is set as two rows of, the centring magnet of magnet assemblies 4 43
Between two rows installation convex block 31, fixed block 44 is equipped with the waist-shaped hole 441 being arranged along the width direction of rectangular magnet frame, installation
Convex block 31 is equipped with the mounting hole 311 for fixing fixed block 44.Fixed block 44 is fixed by clamping screw (not shown)
On installation convex block 31, loose clamping screw is adjusted, side magnet 41 can be moved along the width direction of rectangular magnet frame；It can same step
Side magnet 41 is saved, side magnet 41 can also be individually adjusted.
In the present embodiment, the medial surface of end magnets 42 is arc surface, can effectively improve the magnetic field on 6 surface of position target
Intensity.
In the present embodiment, water cooling target stand 3 is made of oxygenless copper material, is equipped between water cooling target stand 3 and rectangle mounting groove 11
Insulating part 2, and there is certain interval between water cooling target stand 3 and the surrounding side wall of rectangle mounting groove 11, by insulating part 2 by water cooling
Target stand 3 and magnet assemblies 4, target 6 and anode seat 1 in it insulate.The bottom of rectangle mounting groove 11 be equipped with for it is cooling into
The inlet and outlet (not shown) that water pipe (not shown), cooling water outlet pipe (not shown) pass through, and for
The electrode introduction hole (not shown) that electrode wires (not shown) passes through, cooling water inlet pipe and cooling water outlet Guan Junyu water cooling
Target stand 3 is connected to, and electrode wires pass through electrode introduction hole and connect with water cooling target stand 3.Cooling water inlet pipe provides cooling to water cooling target stand 3
Water, electrode wires introduce cathode voltage in water cooling target stand 3, and magnet assemblies 4 will be formed from one end to the other side in water cooling target stand 3
Two waterway channels, the installation convex block 31 in water cooling target stand 3 can form water flow and hinder in the channel, so that water flow is become rapid
Manifold formula, the heat exchange for increasing water flow and water cooling target stand 3 and magnet assemblies 4 help to mention to preferably reach cooling effect
The power that loads of high sputtering target improves sputtering target sputtering yield.
In the present embodiment, use is wrapped up in the outer surface of 43, two end magnets 42 of centring magnet and multiple side magnet 41
In the plastic layer of isolation cooling water.
In the present embodiment, the rectangle magnetic controlled sputtering target for metal coating further includes target buckle 7, and target buckle 7 presses target 6
Tightly on target backboard 5.Target buckle 7 and target backboard 5 are bolted on water cooling target stand 3, and target 6 is located in target buckle 7
Between target backboard 5, target buckle 7 is square frame-shaped structure, for target 6 is exposed outside.
In the present embodiment, the notch end on rectangle mounting groove 11 is installed with the anode plate 8 of square frame-shaped, and anode plate 8 and target are buckled
There is certain interval between plate 7.Target 6, magnet assemblies 4, water cooling target stand 3 are respectively positioned in rectangle mounting groove 11 after installation, are passed through
Increase anode plate 8 at the notch end of rectangle mounting groove 11, forms the electric field of certain orientation on 6 surface of target, anode plate 8 and target are buckled
The gap of 2-3mm is reserved between plate 7.
In the present embodiment, the notch end on rectangle mounting groove 11 is equipped with the first threaded hole 111 for installing anode plate 8,
The side wall of rectangle mounting groove 11 is equipped with the gas vent 9 that can be connected to the first threaded hole 111.Water cooling target stand 3 is equipped with for pacifying
The second threaded hole 32 of target backboard 5 is filled, the side wall of water cooling target stand 3 is equipped with the gas vent 9 that can be connected to the second threaded hole 32.It avoids
It is threadedly engaged and forms air bag influence vacuum in vacuum environment.The trench bottom periphery of rectangle mounting groove 11 is equipped with for installing anode
The mounting flange 12 of seat 1.
In the present embodiment, rectangle magnetic controlled sputtering target installation process includes: that insulating part 2 is put into rectangle mounting groove 11, then
Water cooling target stand 3 is installed, then the magnet assemblies 4 combined are fixed on the installation convex block 31 in water cooling target stand 3, are carried on the back by target
Magnet assemblies 4 are sealed in water cooling target stand 3 by plate 5, target 6 are fixed on target backboard 5 by target buckle 7, after installing
Target 6, magnet assemblies 4, water cooling target stand 3 are respectively positioned in rectangle mounting groove 11, and anode plate 8 is finally fixed on rectangle mounting groove 11
Notch on.All vacuum sealings and water-stop are all made of O-ring sealing.
In the present embodiment, rectangle magnetic controlled sputtering target working principle:
Anode seat 1 is mounted on to the flange (not shown) of magnetic control sputtering system processing chamber by mounting flange 12
On, the sealed connection with vacuum chamber flange, can be made edge seal or O-ring sealing, target 6 are located in processing chamber
Portion, for carrying out heavy film to the substrate (not shown) on scanning trolley；From the bottom pair of the rectangle mounting groove 11 of anode seat 1
Water cooling target stand 3 is passed through cathode voltage and cooling water；Power is increased to water cooling target stand 3 by power supply, cooling water is right in the process
Magnet assemblies 4 in water cooling target stand 3 and the target backboard 5 above it, target 6 are cooled down；It is passed through in processing chamber a certain amount of
Process gas argon gas is ionized argon gas using the electromagnetic field effect on 6 surface of target, 6 surface of target formed ion plasma, argon from
Son bombards target 6 under the gravitation of cathode target, and 6 atom sputtering of target is come out and is deposited on target substrate；It sinks according on substrate
Long-pending film thickness uniformity distribution, can the side magnet 41 to the length direction of magnet assemblies 4 carry out local directed complete set；If certain position
It is small to set heavy film thickness, can be close by suitably adjusting this section of side magnet 41 to centring magnet 43, increase the 6 surface magnetic of position target
Field intensity improves heavy film uniformity to increase the sputter rate of the position.
Although the present invention has been disclosed as a preferred embodiment, however, it is not intended to limit the invention.It is any to be familiar with ability
The technical staff in domain, without deviating from the scope of the technical scheme of the present invention, all using the technology contents pair of the disclosure above
Technical solution of the present invention makes many possible changes and modifications or equivalent example modified to equivalent change.Therefore, all
Without departing from the content of technical solution of the present invention, according to the present invention technical spirit any simple modification made to the above embodiment,
Equivalent variations and modification, all shall fall within the protection scope of the technical scheme of the invention.
Claims (10)
1. a kind of rectangle magnetic controlled sputtering target for metal coating, it is characterised in that: including anode seat (1), water cooling target stand (3),
Magnet assemblies (4), target (6) and target backboard (5), the anode seat (1) are equipped with rectangle mounting groove (11), the water cooling target stand
(3) it is installed in rectangle mounting groove (11), the magnet assemblies (4) are installed in water cooling target stand (3) and close by target backboard (5)
Envelope, the target (6) are installed on target backboard (5), and the magnet assemblies (4) include centring magnet (43), two end magnets
(42) and multiple side magnet (41), described two end magnets (42) and multiple side magnet (41) constitute rectangular magnet frame,
The centring magnet (43) is fixed on inside rectangular magnet frame along rectangular magnet frame length direction, and each side magnet (41) is fixed
One fixed block (44), the water cooling target stand (3) is interior to be equipped with multiple installation convex blocks (31), the fixed block (44) and installation convex block
(31) correspond, the multiple installation convex block (31) is arranged in two rows of, the fixed block (44) movably with installation
Convex block (31) connection, the bottom of the rectangle mounting groove (11) are equipped with the import passed through for cooling water inlet pipe, cooling water outlet pipe
And outlet, water cooling target stand (3) both ends are respectively equipped with water cooling import and water cooling outlet, the cooling water inlet pipe and the water cooling
Inlet communication, the cooling water outlet pipe and water cooling outlet, the water cooling import and water cooling outlet are located at two rows of installation convex blocks
(31) between.
2. the rectangle magnetic controlled sputtering target according to claim 1 for metal coating, it is characterised in that: the fixed block
(44) it is equipped with the waist-shaped hole (441) being arranged along the width direction of rectangular magnet frame, the installation convex block (31) is equipped with and is used for
The mounting hole (311) of the fixed fixed block (44).
3. the rectangle magnetic controlled sputtering target according to claim 1 for metal coating, it is characterised in that: the centring magnet
(43), the plastic layer for cooling water to be isolated is wrapped up in the outer surface of two end magnets (42) and multiple side magnet (41).
4. according to claim 1 to the rectangle magnetic controlled sputtering target for being used for metal coating described in 3 any one, it is characterised in that:
The rectangle magnetic controlled sputtering target for metal coating further includes target buckle (7), and target (6) is pressed in by the target buckle (7)
On target backboard (5).
5. according to claim 1 to the rectangle magnetic controlled sputtering target for being used for metal coating described in 3 any one, it is characterised in that:
Insulating part (2) are equipped between the water cooling target stand (3) and rectangle mounting groove (11), and water cooling target stand (3) and rectangle mounting groove
(11) there is certain interval between surrounding side wall.
6. according to claim 1 to the rectangle magnetic controlled sputtering target for being used for metal coating described in 3 any one, it is characterised in that:
Notch end on the rectangle mounting groove (11) is installed with the anode plate (8) of square frame-shaped, the anode plate (8) and target buckle (7)
Between have certain interval.
7. the rectangle magnetic controlled sputtering target according to claim 6 for metal coating, it is characterised in that: the rectangle installation
Notch end on slot (11) is equipped with the first threaded hole (111) for installing anode plate (8), the side of the rectangle mounting groove (11)
Wall is equipped with the gas vent (9) that can be connected to first threaded hole (111).
8. according to claim 1 to the rectangle magnetic controlled sputtering target for being used for metal coating described in 3 any one, it is characterised in that:
The water cooling target stand (3) is equipped with the second threaded hole (32) for installing target backboard (5), the side wall of the water cooling target stand (3)
Equipped with the gas vent (9) that can be connected to second threaded hole (32).
9. according to claim 1 to the rectangle magnetic controlled sputtering target for being used for metal coating described in 3 any one, it is characterised in that:
The bottom of the rectangle mounting groove (11) is equipped with the electrode introduction hole passed through for electrode wires, and the electrode wires are introduced across electrode
Hole is connect with water cooling target stand (3).
10. according to claim 1 to the rectangle magnetic controlled sputtering target for being used for metal coating described in 3 any one, it is characterised in that:
The medial surface of the end magnets (42) is arc surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610360061.8A CN106399958B (en) | 2016-05-27 | 2016-05-27 | A kind of rectangle magnetic controlled sputtering target for metal coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610360061.8A CN106399958B (en) | 2016-05-27 | 2016-05-27 | A kind of rectangle magnetic controlled sputtering target for metal coating |
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| Publication Number | Publication Date |
|---|---|
| CN106399958A CN106399958A (en) | 2017-02-15 |
| CN106399958B true CN106399958B (en) | 2019-01-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610360061.8A Active CN106399958B (en) | 2016-05-27 | 2016-05-27 | A kind of rectangle magnetic controlled sputtering target for metal coating |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111334764A (en) * | 2020-03-12 | 2020-06-26 | 苏州求是真空电子有限公司 | Coating device capable of improving coating uniformity of inner wall |
| CN114250439A (en) * | 2021-12-13 | 2022-03-29 | 华虹半导体(无锡)有限公司 | Magnetron sputtering method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101148752A (en) * | 2006-09-19 | 2008-03-26 | 中国科学院合肥物质科学研究院 | Sealing device used for 10(-8)Pa ultra-high vacuum round plane magnetron sputtering target |
| CN101775588A (en) * | 2010-02-01 | 2010-07-14 | 中国电子科技集团公司第四十八研究所 | Rectangular target with high target utilization ratio |
| CN102097270A (en) * | 2009-12-09 | 2011-06-15 | 株式会社爱发科 | Magnet group for magnetron sputtering electrode and sputtering apparatus |
| CN103132032A (en) * | 2013-03-15 | 2013-06-05 | 上海和辉光电有限公司 | Sputtering equipment for reducing indium tin oxide (ITO) sputtering damage substrate and method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5219748B2 (en) * | 2008-11-06 | 2013-06-26 | 株式会社アルバック | Sputtering equipment |
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2016
- 2016-05-27 CN CN201610360061.8A patent/CN106399958B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101148752A (en) * | 2006-09-19 | 2008-03-26 | 中国科学院合肥物质科学研究院 | Sealing device used for 10(-8)Pa ultra-high vacuum round plane magnetron sputtering target |
| CN102097270A (en) * | 2009-12-09 | 2011-06-15 | 株式会社爱发科 | Magnet group for magnetron sputtering electrode and sputtering apparatus |
| CN101775588A (en) * | 2010-02-01 | 2010-07-14 | 中国电子科技集团公司第四十八研究所 | Rectangular target with high target utilization ratio |
| CN103132032A (en) * | 2013-03-15 | 2013-06-05 | 上海和辉光电有限公司 | Sputtering equipment for reducing indium tin oxide (ITO) sputtering damage substrate and method thereof |
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| CN106399958A (en) | 2017-02-15 |
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