CN204861021U

CN204861021U - Fragile piece of compound fruit vegetables

Info

Publication number: CN204861021U
Application number: CN201520409218.2U
Authority: CN
Inventors: 刘剑雄
Original assignee: Hubei Kanghong Cereal And Oil Food Co Ltd
Current assignee: Hubei Kanghong Cereal And Oil Food Co Ltd
Priority date: 2015-06-15
Filing date: 2015-06-15
Publication date: 2015-12-16
Anticipated expiration: 2025-06-15

Abstract

The utility model discloses a fragile piece of compound fruit vegetables belongs to the fragile piece processing technology field of fruit vegetables. This fragile piece of compound fruit vegetables include main part and cladding in the main part is outer scribbles the rete, the main part includes first lamella and second lamella, first lamella and second lamella are different kinds of resolute vegetables, still be equipped with an intermediate layer between first lamella and the second lamella, the intermediate layer is syrup adhesion layer. The utility model discloses a set for first lamella and second lamella, the resolute vegetables that make different tastes are closed to together, rethread syrup adhesion layer make first lamella and second lamella can better adhesion together, guarantee the incorporation of different fruit vegetables tastes together, satisfy different crowd's demands.

Description

A kind of compound fruit and vegetable crisp chip

Technical field

The utility model relates to fruit and vegetable crisp chip processing technique field, is specifically related to a kind of compound fruit and vegetable crisp chip.

Background technology

Fruit and vegetable crisp chip is the general designation of fruit crisp slices and crisp slices of vegetable, is with fruit, vegetables for primary raw material, through all kinds of fruit, the crisp slices of vegetable of the explained hereafter such as vacuum frying dehydration.Fruit and vegetable crisp chip crispy in taste, local flavor are different, good for health, all-ages.Save the color and luster of fresh fruit of vegetables pure natural, nutrition and local flavor, have again the feature of low fat, low in calories and high-cellulose, oil content is starkly lower than traditional oils deep-fried food, without greasy feeling, also can not produce the carcinogenic substances such as 3-4 benzo Bi and acrylamide.And long shelf-life, the range of work is extensive.Fruit and vegetable crisp chip is as a kind of novel high-grade nutrition leisure food liking more and more by consumer.But the fruit and vegetable crisp chip produced at present is all that kind is single, taste is single, can not meet the taste requirements of different crowd to fruit and vegetable crisp chip.

Utility model content

The purpose of this utility model is to overcome above-mentioned technical deficiency, proposes a kind of compound fruit and vegetable crisp chip, solves the technical problem that fruit and vegetable crisp chip kind of the prior art is single, taste is single.

For reaching above-mentioned technical purpose, the technical solution of the utility model provides a kind of compound fruit and vegetable crisp chip, comprise main body and be coated on the film layer outside described main body, described main body comprises the first lamella and the second lamella, described first lamella and the second lamella are dissimilar fruits and vegetables, also be provided with an interlayer between described first lamella and the second lamella, described interlayer is syrup adhering layer.

Preferably, described fruit and vegetable crisp chip is also evenly provided with multiple through hole.

Preferably, described first lamella and interlayer are provided with multiple the first through hole matched, and described second lamella and interlayer are provided with multiple the second through hole matched, and make the upper and lower side of described main body all form multiple groove.

Preferably, in described syrup adhering layer, also bag is provided with multiple sesame seed.

Preferably, described first lamella is fruit slice, and the second lamella is vegetable tablets.

Preferably, described first lamella and the second lamella are fruit slice.

Preferably, described first lamella and the equal vegetable tablets of the second lamella.

Preferably, described first lamella is apple flakes, and described second lamella is cucumber slice.

Preferably, described first lamella is strawberry slice, and described second lamella is pineapple slice.

Preferably, described first lamella is cucumber slice, and described second lamella is pumpkin slice.

Compared with prior art, the beneficial effects of the utility model comprise: by setting the first lamella and the second lamella, the fruits and vegetables of different taste are made to be combined into together, the first lamella and the second lamella is enable better together with adhesion again by syrup adhering layer, ensure that different fruits and vegetables taste merges together, meet different crowd demand.

Accompanying drawing explanation

Fig. 1 is the structural representation of the utility model first embodiment;

Fig. 2 is the A-A direction view of Fig. 1 of the present utility model;

Fig. 3 is the structural representation of the utility model second embodiment;

Fig. 4 is the B-B direction view of Fig. 2 of the present utility model.

Detailed description of the invention

In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.

The utility model provides a kind of compound fruit and vegetable crisp chip, comprise main body and be coated on the film layer outside described main body, described main body comprises the first lamella and the second lamella, described first lamella and the second lamella are dissimilar fruits and vegetables, also be provided with an interlayer between described first lamella and the second lamella, described interlayer is syrup adhering layer.The utility model by setting first lamella and the second lamella, makes the fruits and vegetables of different taste be combined into together, then enables the first lamella and the second lamella better together with adhesion by syrup adhering layer, ensures that different fruits and vegetables taste merges together, meets different crowd demand.

embodiment 1:

Of the present utility modelly example 1 provides a kind of compound fruit and vegetable crisp chip, as shown in Figure 1 and Figure 2, the film layer 2 comprising main body 1 and be coated on outside described main body 1, described main body 1 comprises the first lamella 101 and the second lamella 102, described first lamella 101 and the second lamella 102 are dissimilar fruits and vegetables, also be provided with an interlayer 103 between described first lamella 101 and the second lamella 102, described interlayer 103 is syrup adhering layer.

Embodiment 1 of the present utility model is by setting first lamella 101 and the second lamella 102, the fruits and vegetables of different taste are made to be combined into together, the first lamella 101 and the second lamella 102 is made better together with adhesion, to ensure that different fruits and vegetables taste merges together, to meet different crowd demand by syrup adhering layer again.

Further, because fruit and vegetable crisp chip has three layers, in order to ensure the mouthfeel after its low-temperature frying, described fruit and vegetable crisp chip is also evenly provided with multiple through hole 3, and make the overall fried equilibrium of fruit and vegetable crisp chip, mouthfeel is better.

In order to satisfied different consumer demand, can wrap in syrup adhering layer and establish multiple sesame seed, make fruit and vegetable crisp chip fragrance denseer, taste is better.

Further, can according to different taste demands, the first lamella 101 and the second lamella 102 can be provided with dissimilar fruits and vegetables.Concrete, first lamella 101 can be set to fruit slice, the second lamella 102 is set to vegetable tablets, preferably the first lamella 101 is apple flakes, the second lamella 102 is cucumber slice, also can the first lamella 101 and the second lamella 102 be all set to as fruit slice, preferably the first lamella 101 is strawberry slice, the second lamella 102 is pineapple slice, in addition also the first lamella 101 and the second lamella 102 all can be set to vegetable tablets, preferably the first lamella 101 is cucumber slice, the second lamella 102 is pumpkin slice.

embodiment 2:

Embodiment 2 of the present utility model is substantially identical with the scheme of embodiment 1, as Fig. 3, shown in Fig. 4, its difference is, described first lamella 101 and interlayer 103 are provided with multiple the first through hole 104 matched, described second lamella 102 and interlayer 103 are provided with multiple the second through hole 105 matched, make in described main body 1, downside all forms multiple groove, when carrying out low-temperature frying like this, first lamella 101 can project to the second lamella 102 with the groove that interlayer 103 matches, and the second lamella 102 can project to the first lamella 101 with the groove that interlayer 103 matches, thus make together with the first lamella 101 and the better intertexture of the second lamella 102, the taste of the two is made better to merge together.

The above detailed description of the invention of the present utility model, does not form the restriction to the utility model protection domain.Any various other made according to technical conceive of the present utility model change and distortion accordingly, all should be included in the protection domain of the utility model claim.

Claims

1. a compound fruit and vegetable crisp chip, comprise main body and be coated on the film layer outside described main body, it is characterized in that, described main body comprises the first lamella and the second lamella, described first lamella and the second lamella are dissimilar fruits and vegetables, also be provided with an interlayer between described first lamella and the second lamella, described interlayer is syrup adhering layer.

2. compound fruit and vegetable crisp chip according to claim 1, is characterized in that, described fruit and vegetable crisp chip is also evenly provided with multiple through hole.

3. compound fruit and vegetable crisp chip according to claim 1, it is characterized in that, described first lamella and interlayer are provided with multiple the first through hole matched, described second lamella and interlayer are provided with multiple the second through hole matched, first through hole and the second through hole shift to install, and make the upper and lower side of described main body all form multiple groove.

4. compound fruit and vegetable crisp chip according to claim 1, is characterized in that, in described syrup adhering layer, also bag is provided with multiple sesame seed.

5., according to the arbitrary described compound fruit and vegetable crisp chip of claim 1 ~ 4, it is characterized in that, described first lamella is fruit slice, and the second lamella is vegetable tablets.

6., according to the arbitrary described compound fruit and vegetable crisp chip of claim 1 ~ 4, it is characterized in that, described first lamella and the second lamella are fruit slice.

7., according to the arbitrary described compound fruit and vegetable crisp chip of claim 1 ~ 4, it is characterized in that, described first lamella and the equal vegetable tablets of the second lamella.

8. compound fruit and vegetable crisp chip according to claim 5, is characterized in that, described first lamella is apple flakes, and described second lamella is cucumber slice.

9. compound fruit and vegetable crisp chip according to claim 6, is characterized in that, described first lamella is strawberry slice, and described second lamella is pineapple slice.

10. compound fruit and vegetable crisp chip according to claim 7, is characterized in that, described first lamella is cucumber slice, and described second lamella is pumpkin slice.