CN204789822U - Integrated encapsulation radio frequency device test fixture of surface mounting formula - Google Patents
Integrated encapsulation radio frequency device test fixture of surface mounting formula Download PDFInfo
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- CN204789822U CN204789822U CN201520516920.9U CN201520516920U CN204789822U CN 204789822 U CN204789822 U CN 204789822U CN 201520516920 U CN201520516920 U CN 201520516920U CN 204789822 U CN204789822 U CN 204789822U
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Abstract
The utility model discloses an integrated encapsulation radio frequency device test fixture of surface mounting formula, including test printing board, fix the test seat on test printing board, the welding the one end of test printing board and respectively with power and control box connection's low frequency socket to and radio frequency input port, local oscillator mouth and the IF output mouth of welding at the other end of test printing board, the radio frequency input port is connected with network analyzer, and the local oscillator mouth is connected with the frequency spectrograph, and the IF output mouth is connected with the frequency source, install the reed of taking the microTF cassette in the test seat. The utility model discloses a contact is reliable, do not keep the indentation, conveniently install and remove, used repeatedly and structure are compatible.
Description
Technical field
The utility model relates to a kind of surface-adhered type integration packaging radio-frequency devices test fixture.
Background technology
Mounted type integration packaging radio-frequency devices, without pin, utilizes bottom surface pad to be mounted in test printed board and uses.It can not destroy pad appearance in research and production, needs to adopt the mode of Wuxi crimping to test.
Such devices is independent development, encapsulates nonstandard, multi items, and has RF index requirement, the test fixture do not mated on the market.If customization, cost is very high, and the cycle is very long.Actual based on self, need design a kind of easily manufactured, with low cost, the test fixture be simple and easy to.Successively carried out conductive rubber pad, reed, beaten spun gold, the design of spring probe contact scheme test fixture and checking.
Conductive rubber pad contact scheme empirical tests can the requirement of the few and short time test of meet volume, but the amount of not being suitable for greatly and the single-piece situation of testing for a long time.The deficiency of the program is that measured piece is stressed very large, and pad is easily out of shape, and load-carrying surface outward appearance is easily destroyed, and tested index is unstable, if the pad of measured piece and spacing less, conductive rubber pad easily comes off.
Switch jaw contact scheme empirical tests is applicable to the situation of measured piece disposable test and ageing.But the stressed rear easy excessive deformation of reed crimping cannot recover, cause needing again to change reed when carrying out test next time, this is obviously not suitable with the requirement of batch testing.
Beat the situation of the few and low appearance requirement of the spun gold scheme empirical tests amount of being applicable to.But each measured piece will beat spun gold separately, gets spun gold, and efficiency is low.The pressure welding point of spun gold and measured piece pad can be left a trace after removing spun gold in addition, therefore the inapplicable situation very high to pad appearance requirement.
Spring probe scheme empirical tests is applicable to the test of non-radio frequencies device.But the radio frequency pad for radio-frequency devices needs design to meet the coaxial configuration of 50 Ω impedance matchings, this just requires that probe is enough thin and solder pad space length is enough large.But easily there is impression with during pad forced contact in too thin probe.
In order to meet the testing requirement from grinding many specifications, in enormous quantities, closely spaced SMD integration packaging radio-frequency devices, need design a kind of seamless, efficiently, reliably, stable, compatible, cheap test fixture.
Utility model content
The purpose of this utility model is to provide a kind of surface-adhered type integration packaging radio-frequency devices test fixture, achieves contact and reliably, does not stay impression, conveniently installs and removes, reuses and structural member compatibility.
For solving the problems of the technologies described above, the utility model provides a kind of surface-adhered type integration packaging radio-frequency devices test fixture, comprise test printed board, be fixed on the test bench in test printed board, be welded on test one end of printed board and the low frequency socket is connected with power supply and control enclosure respectively, and be welded on the rf input port of the other end testing printed board, local oscillator mouth and intermediate frequency delivery outlet; Rf input port is connected with network analyzer, and local oscillator mouth is connected with frequency spectrograph, and intermediate frequency delivery outlet is connected with frequency source; The reed of band MicroTF deck is installed in test bench.
Further, the welding end of reed is welded in test printed board, and the top of reed is provided with one for the limiting plate of clip, and the middle part of limiting plate is provided with one for the spacing hole of fixing measured piece.
Further, test bench is provided with the cover plate of a horizontally set, and one end of cover plate is by being with one end being hingedly connected at the pedestal of test bench of torsion spring, and the other end is fixed on the other end of the pedestal of test bench by buckle.
Further, the medial surface of cover plate is provided with a plastics briquetting.
Further, the surrounding of spacing hole is provided with the reed stopper slot matched with reed.
Further, what limiting plate adopted is transparent acryl plates.
The beneficial effects of the utility model are: the reed being welded with low frequency socket, radio frequency IO interface, band MicroTF deck above test printed board, can realize measured device and the electrical connection between testing tool and power supply.Test bench is made up of pedestal, cover plate, plastics briquetting, buckle, torsion spring and rotating shaft, and the folding of test bench realizes measured piece pressurization, locking, unlocks and take out.Control enclosure is made up of the white box of ambroin common on the market, toggle switch and low-frequency cable assembly, realizes the control to measured piece.Limiting plate for ensureing the pad of measured piece and the accurate contraposition of MicroTF deck reed and spacing to measured piece, and is convenient to observe device alignment situation.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model most preferred embodiment;
Fig. 2 is the structural representation of the limiting plate of the utility model most preferred embodiment.
Wherein: 1, test printed board; 11, low frequency socket; 111, power supply; 112, control enclosure; 12, rf input port; 121, network analyzer; 13, local oscillator mouth; 131, frequency source; 14, intermediate frequency delivery outlet; 141, frequency spectrograph; 2, pedestal; 21, cover plate; 211, plastics briquetting; 22, hinge; 23, buckle; 3, test bench; 31, reed; 4, limiting plate; 41, reed stopper slot; 42, spacing hole.
Embodiment
Below embodiment of the present utility model is described; so that those skilled in the art understand the utility model; but should be clear; the utility model is not limited to the scope of embodiment; to those skilled in the art; as long as various change to limit and in the spirit and scope of the present utility model determined, these changes are apparent, and all innovation and creation utilizing the utility model to conceive are all at the row of protection in appended claim.
Surface-adhered type integration packaging radio-frequency devices test fixture as shown in Figure 1, comprise test printed board 1, be fixed on the test bench 3 in test printed board 1, be welded on test one end of printed board 1 and the low frequency socket 11 is connected with power supply 111 and control enclosure 112 respectively, and be welded on the rf input port 12 of the other end testing printed board 1, local oscillator mouth 13 and intermediate frequency delivery outlet 14; Rf input port 12 is connected with network analyzer 121, and local oscillator mouth 13 is connected with frequency spectrograph 141, and intermediate frequency delivery outlet 14 is connected with frequency source 131; The reed 31 of band MicroTF deck is installed in test bench 3.
According to an embodiment of the application, the welding end of above-mentioned reed 31 is welded in test printed board 1, is provided with one for the limiting plate 4 of clip 31 above reed 31.As shown in Figure 2, the middle part of limiting plate 4 is provided with one for the spacing hole 42 of fixing measured piece.The surrounding of spacing hole 42 is provided with the reed stopper slot 41 matched with reed 31.Further, what test printed board 1 adopted is transparent acryl plates, this material transparent, and machine additivity is good, and hardness is high, can keep good dimensional stability and non-warpage, indeformable under-55 DEG C ~+85 DEG C environment.Limiting plate 4 ensure that the pad of measured piece and reed 31 carry out accurate contraposition, and is convenient to observe device alignment situation.
According to an embodiment of the application, test bench 3 is provided with the cover plate 21 of a horizontally set, one end of cover plate 21 is connected to one end of the pedestal 2 of test bench 3 by the hinge 22 of band torsion spring, when testing, the other end of cover plate 21 is fixed on the other end of the pedestal 2 of test bench 3 by buckle 23.。The folding of cover plate 21 realizes measured piece pressurization, locking, unlocks and take out.
According to an embodiment of the application, the medial surface of cover plate 21 is provided with a plastics briquetting 211, the measured piece in limiting plate 4 can be pushed down with fixing.
The control enclosure 112 that the application adopts is made up of the white box of ambroin common on the market, toggle switch and low-frequency cable assembly, realizes the control to measured piece.
Can locate by limiting plate 4 measured piece be placed on reed 31 in test process, and then the alignment situation of reed 31 of measured piece and correspondence position is confirmed through transparent limiting plate 4, again by test bench 3 clamping measured piece, after last seat to be tested 3 locks, carry out adding electrical testing, RF index has tested rear first power-off, then unlocks test bench 3 by measured piece taking-up, repeats above-mentioned steps and carries out more than one piece test.The application achieves contact and reliably, does not stay impression, conveniently installs and removes, reuses and structural member compatibility.
First limiting plate 4 is fixed by screws on base plate, thus realizes limiting plate 4 to be positioned in the test printed board 1 on base plate; Then measured piece is placed in the spacing hole 42 of limiting plate 4, thus measured piece is located.Because we need the measured piece tested to be rectangle, so the spacing hole 42 of limiting plate 4 is rectangles in Fig. 2, if measured piece is circular, polygon or abnormity, so accordingly spacing hole 42 will be done circular, polygon or abnormity.
The dimensional tolerence of the spacing hole 42 of limiting plate 4 is [0 ,+0.05mm], and lower size limit should 0.05mm ~ 0.1mm larger than the upper dimension bound of measured piece.The accuracy of location, the dirigibility of operation and the convenience of use are taken into account like this.
On the other hand, the welding end of reed 31 is welded in test printed board 1, and the free end that reed 31 tilts, by the secondary location of the upper reed plate stopper slot 41 of limiting plate 4, prevents short circuit between measured piece adjacent pad while raising positioning precision.Reed 31 inclined-plane of stepping down makes reed free end naturally upspring, and ensure that the access times of reed 31.This improves the reliability and stability of test fixture.
Claims (6)
1. a surface-adhered type integration packaging radio-frequency devices test fixture, it is characterized in that, comprise test printed board, be fixed on the test bench in described test printed board, be welded on test one end of printed board and the low frequency socket be connected with power supply and control enclosure respectively, and be welded on the rf input port of the other end of described test printed board, local oscillator mouth and intermediate frequency delivery outlet; Described rf input port is connected with network analyzer, and described local oscillator mouth is connected with frequency spectrograph, and described intermediate frequency delivery outlet is connected with frequency source; The reed of band MicroTF deck is installed in described test bench.
2. surface-adhered type integration packaging radio-frequency devices test fixture according to claim 1, it is characterized in that, the welding end of described reed is welded in described test printed board, the top of described reed is provided with one for the limiting plate of clip, and the middle part of described limiting plate is provided with one for the spacing hole of fixing measured piece.
3. surface-adhered type integration packaging radio-frequency devices test fixture according to claim 2, it is characterized in that, described test bench is provided with the cover plate of a horizontally set, one end of described cover plate is by being with one end being hingedly connected at the pedestal of test bench of torsion spring, and the other end is fixed on the other end of the pedestal of test bench by buckle.
4. surface-adhered type integration packaging radio-frequency devices test fixture according to claim 3, is characterized in that, the medial surface of described cover plate is provided with a plastics briquetting.
5. surface-adhered type integration packaging radio-frequency devices test fixture according to claim 2, is characterized in that, the surrounding of described spacing hole is provided with the reed stopper slot matched with described reed.
6. the surface-adhered type integration packaging radio-frequency devices test fixture according to claim 2 or 5, is characterized in that, what described limiting plate adopted is transparent acryl plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520516920.9U CN204789822U (en) | 2015-07-16 | 2015-07-16 | Integrated encapsulation radio frequency device test fixture of surface mounting formula |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520516920.9U CN204789822U (en) | 2015-07-16 | 2015-07-16 | Integrated encapsulation radio frequency device test fixture of surface mounting formula |
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| Publication Number | Publication Date |
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| CN204789822U true CN204789822U (en) | 2015-11-18 |
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| CN201520516920.9U Active CN204789822U (en) | 2015-07-16 | 2015-07-16 | Integrated encapsulation radio frequency device test fixture of surface mounting formula |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106093484A (en) * | 2016-07-28 | 2016-11-09 | 中国电子科技集团公司第二十六研究所 | Surface mount SAW filter test fixture |
| CN110108907A (en) * | 2019-04-26 | 2019-08-09 | 中国电子科技集团公司第二十九研究所 | A kind of BGA package product radio frequency performance test fixture |
| CN115499070A (en) * | 2022-08-08 | 2022-12-20 | 成都万创科技股份有限公司 | Wireless module testing system and method |
-
2015
- 2015-07-16 CN CN201520516920.9U patent/CN204789822U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106093484A (en) * | 2016-07-28 | 2016-11-09 | 中国电子科技集团公司第二十六研究所 | Surface mount SAW filter test fixture |
| CN110108907A (en) * | 2019-04-26 | 2019-08-09 | 中国电子科技集团公司第二十九研究所 | A kind of BGA package product radio frequency performance test fixture |
| CN110108907B (en) * | 2019-04-26 | 2021-10-22 | 中国电子科技集团公司第二十九研究所 | Radio frequency performance test fixture for BGA (ball grid array) packaged product |
| CN115499070A (en) * | 2022-08-08 | 2022-12-20 | 成都万创科技股份有限公司 | Wireless module testing system and method |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |