JP2013083506A - Electric component socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric component socket capable of dissipating electric charges so as to have a charge amount sufficient to achieve desired inspection accuracy at all times when a cover member is attached to and removed from the socket.SOLUTION: An IC socket 10 includes: a socket body 13 accommodating an electric component provided with terminals and disposed on a wiring board 20; and contact pins provided to the socket body 13 and each having an upper contact part brought into contact with one of the terminals of the electric component and a lower contact part connected to the wiring board 20. The socket body 13 has a conductive coil spring 21 disposed therein. The coil spring 21 includes: a wiring board side grounding part 21c for grounding by contacting a grounding part provided to the wiring board 20 when the socket body 13 is disposed on the wiring board 20; and a cover member side grounding part 21a for grounding by contacting a cover member for pressing the electric component accommodated on the socket body 13 when the cover member is disposed.

Description

  The present invention relates to a socket for an electric component that is disposed on a wiring board and accommodates the electric component in order to test an electric component such as a semiconductor device (hereinafter referred to as “IC package”).

  Conventionally, as this type of electrical component socket, there is an IC socket for performing an IC package test or the like.

  The IC socket has a socket body that is disposed on the wiring board and accommodates the IC package, and contact pins for electrically connecting the terminals of the IC package and the wiring board to the socket body. In some cases, the socket body is provided with a cover member. In this cover member, a cover base member is disposed on the socket body, and an opening / closing body is provided on the cover base member so as to be freely opened and closed. When the cover member is closed, the accommodated IC package is moved downward by the opening / closing body. Some are configured to press towards.

  However, in such a case, the IC socket itself is charged, which may hinder the inspection of the IC package.

  By the way, what is described in Patent Document 1 has been proposed which prevents charging of the IC socket.

  This is because an IC socket is arranged on a circuit board, an IC is arranged on the IC socket, and a metal fitting for grounding is arranged so as to cover them, and the metal fitting contacts the IC socket. A protrusion is formed, and a tongue-like elastic piece is brought into contact with a ground pattern provided on the circuit board.

  As a result, the charge on the IC socket side is grounded to the ground pattern side through the metal fitting, and charging on the IC socket side is prevented.

Japanese Utility Model Publication No. 7-27633.

  However, in such a device as described in Patent Document 1, a metal fitting for grounding must be separately attached and detached every time the IC is inspected, which is inconvenient. Further, the metal fitting for grounding cannot be applied to the IC socket provided with the cover member described above.

  Incidentally, the IC socket may be used with the cover member removed, and even in such a case, it is necessary to make the socket body groundable.

  Therefore, the present invention is for an electrical component capable of releasing electric charges up to a charge amount capable of always obtaining a desired inspection accuracy by grounding in either a state where the cover member is attached or a state where the cover member is removed. The challenge is to provide sockets.

  In order to achieve such an object, the present invention accommodates an electrical component provided with a terminal, a socket main body disposed on a wiring board, and provided on the socket main body, and is in contact with the terminal of the electrical component. And a contact pin having a lower contact portion connected to the wiring board, and the socket body is provided with a conductive earth member, When the socket main body is disposed on the wiring board, the ground member includes a wiring board-side grounding portion that is connected to a grounding portion provided on the wiring board so as to be grounded; When a cover member that presses the accommodated electrical component is disposed on the cover member, the electrical component socket includes a cover member-side ground portion that is in contact with the cover member and performs grounding. And characterized in that a door.

  In another feature, the cover member includes a cover base member fixed on the socket body, and an opening / closing body rotatably disposed on the cover base member, and the cover base member is attached to the socket. The cover member-side ground portion of the ground member is in contact with and connected to the cover base member while being fixed on the main body, and the ground from the cover member side is performed via the ground member. It is to have done.

  Another feature is that the ground member is a coil spring that is elastically deformable.

  Another feature is that the coil spring is prevented from being pulled out to have a larger diameter than the diameter of the cover member side grounding portion provided at the upper end and the wiring board side grounding portion provided at the lower end. A large-diameter portion is formed between the cover member-side ground portion and the wiring board-side ground portion, and the pull-out preventing large-diameter portion is accommodated in the concave portion of the socket body and pressed from above by a fixing plate member. There is.

  According to the present invention, the socket main body is provided with a conductive earth member, and the earth member abuts against the earth portion provided on the wiring board when the socket main body is arranged on the wiring board. When the wiring board side grounding portion that is connected and grounded and the cover member that presses the electrical component housed on the socket body are provided, the cover member that is connected to the cover member and grounded Since the grounding portion is provided, the grounding can be performed to release the charge up to a charge amount at which a desired inspection accuracy can always be obtained, regardless of whether the cover member is attached or removed.

  According to another feature, the large diameter portion of the coil spring that prevents extraction is configured to have a larger diameter than the diameter of the grounding portion on the cover member side. The coil spring can be easily disposed by holding down.

1 is an exploded perspective view illustrating an overall configuration of an IC socket according to an embodiment of the present invention. It is a perspective view of the cover member of the IC socket which concerns on the same embodiment. It is a side view of the state which has arrange | positioned the IC socket which concerns on the embodiment to the wiring board. The socket main body of the IC socket which concerns on the embodiment, (a) is a top view of a socket main body, (b) is sectional drawing which follows the AA line of (a), (c) is a front view of a socket main body. is there. It is an expanded sectional view of the contact pin arrangement state of the IC socket according to the same embodiment. It is a disassembled perspective view explaining the structure of the arrow A part of FIG. 1 which concerns on the embodiment. It is sectional drawing of the principal part which shows the IC socket which concerns on the embodiment, and shows the state by which the socket main body was covered with the cover member. It is a top view of the stationary plate member concerning the embodiment. It is a front view of the coil spring which concerns on the same embodiment. It is a top view of the coil spring which concerns on the same embodiment. It is principal part sectional drawing of the state which has arrange | positioned the cover member of the IC socket which concerns on the embodiment. It is principal part sectional drawing of the state which removed the cover member of the IC socket which concerns on the embodiment. It is a figure which shows the IC package which concerns on the embodiment, (a) is a front view, (b) is a bottom view.

  Embodiments of the present invention will be described below.

  1 to 13 show an embodiment of the present invention.

  First, the configuration will be described. Reference numeral 10 in FIG. 1 denotes an IC socket as an “electrical component socket”. The IC socket 10 is arranged on the wiring board 20 and is an “electrical component”. The IC package 11 is accommodated to perform a burn-in test or the like.

  As shown in FIG. 13, the IC package 11 has a rectangular package body 11a in plan view. A plurality of semi-spherical terminals 11b are vertically and horizontally arranged on the lower surface of the package body 11a. Are arranged at equal intervals.

  On the other hand, as shown in FIGS. 1 and 2, the IC socket 10 includes a socket main body 13 having an accommodating surface portion 13 a for accommodating the IC package 11, and the socket main body 13 is provided between the wiring board 20 and the IC package 11. A plurality of contact pins 14 are connected to each other, and a cover member 16 is provided on the socket body 13. The IC socket 10 may be used with the cover member 16 removed from the socket body 13.

  As shown in FIG. 3, the socket body 13 is disposed on the wiring board 20, and a base 18 and a base plate 19 are disposed below the wiring board 20. The base 18 and the base plate 19 are attached via screws 30 with the wiring board 20 interposed therebetween.

  As shown in FIGS. 1 and 4, the socket body 13 is made of a synthetic resin and has a body plate 22 formed in a frame shape, and an upper plate 12a and a lower plate 12b disposed inside the frame shape. As shown in FIG. 5, a plurality of contact pins 14 are disposed by both the plates 12a and 12b.

  As shown in FIG. 5, the contact pins 14 are provided with upper contact portions 14 b which are respectively in contact with the terminals 11 b of the IC package 11 and lower contact portions 14 a which are respectively connected to the wiring board 20. It has been. The upper contact portion 14b and the lower contact portion 14a are urged in a direction away from each other by a built-in spring.

  The main body plate 22 is made of a synthetic resin having antistatic properties, and is arranged on the wiring board 20 on the peripheral edge side as shown in FIGS. In this state, a coil spring 21 is provided as a conductive “ground member” that can be connected to a ground portion (not shown) provided on the wiring board 20.

  Specifically, as shown in FIGS. 6, 9, and 10, the coil spring 21 has a cover member-side ground portion 21 a that contacts the cover member 16 at the upper end portion for grounding, and a wiring substrate 20 at the lower end portion. A wiring board-side ground portion 21c that provides grounding by contact is provided, and the cover member-side ground portion 21a and the wiring board-side ground portion 21c are prevented from being pulled out with a larger diameter than these diameters. A large diameter portion 21b is formed.

  When the socket body 13 is disposed on the wiring board 20, the wiring board-side ground part 21 c is configured to abut against the ground part provided on the wiring board 20 and be elastically deformed and connected to perform grounding. Has been. Further, when the cover member 16 is disposed, the cover member-side ground portion 21a is configured to abut against the cover member 16 and be elastically deformed and connected to perform grounding.

  Further, as shown in FIGS. 6, 7, 11, and 12, the main body plate 22 of the socket body 13 is formed with a storage recess 23 at one side edge.

  As shown in FIGS. 6 and 7, a fixing screw member 25 is screwed into the housing recess 23 with a spring opening hole 24 for housing the coil spring 21 and a female screw portion formed on the inner surface. A screw opening 27 for fixing the flat fixing plate member 26 so as to close the opening of the housing recess 23 is formed side by side.

  As shown in FIGS. 10 and 11, the wiring board-side ground portion 21 c of the coil spring 21 is inserted into the spring opening hole portion 24, and has a round hole-like small diameter smaller than the diameter of the extraction preventing large diameter portion 21 b. A hole 24a and a large-diameter hole 24b that is connected to the same central axis as the small-diameter hole 24a and accommodates the pull-out preventing large-diameter part 21b that has a larger diameter than the small-diameter hole 24a. And a step 24c is formed between them.

  Further, as shown in FIGS. 6 and 8, the fixing plate member 26 has a spring insertion hole 26 a and a screw insertion hole at positions corresponding to the large diameter hole 24 b and the screw opening 27 of the spring opening hole 24. An opening 26b is formed.

  Among these, as shown in FIG. 11, the spring insertion hole 26a allows the cover member-side ground portion 21a of the coil spring 21 to be inserted, and the extraction preventing large-diameter portion 21b has an inner diameter dimension that prevents insertion / removal. doing.

  Then, the pull-out prevention large-diameter portion 21b of the coil spring 21 is engaged with the lower surface side of the peripheral edge portion 26c of the spring insertion hole 26a, and the cover member-side ground portion 21a of the coil spring 21 is connected to the fixing plate member 26. The coil spring 21 is disposed in a state of protruding from the upper surface portion 26d.

  Further, as shown in FIG. 1 and the like, the cover member 16 includes a plate-like cover base member 28 fixed on the main body plate 22 of the socket main body 13 by screws or the like, and a rotation shaft member on the cover base member 28. 17 and an opening / closing body 29 rotatably disposed. In the closed state of the opening / closing body 29, the IC package 11 accommodated is pressed downward by the opening / closing body 29.

  Further, a lock lever member 15 is rotatably provided on a side portion of the cover base member 28 opposite to the rotation shaft member 17 via a shaft portion 15a. As shown in FIG. By tilting the lock lever member 15 with the body 29 closed, the lock portion 15b is engaged with the tip end portion 29a of the opening / closing body 29, so that the closed state of the opening / closing body 29 is maintained. Yes.

  Next, how to use the IC socket 10 will be described.

  In a state where the IC socket 10 is fixed on the wiring board 20, as shown in FIG. 11, the wiring board-side ground portion 21 c of the coil spring 21 provided on the main body plate 22 is elastically deformed and the grounding of the wiring board 20 is performed. And the cover member-side ground portion 21a of the coil spring 21 is in contact with the cover base member 28 of the cover member 16 fixed on the main body plate 22 in an elastically deformed state.

  As a result, the socket body 13 side and the cover member 16 side are brought into contact with the ground portion of the wiring board 20 via the coil spring 21 and are grounded, so that the charge amount that always provides the desired inspection accuracy can be obtained. , Can release the charge.

  On the other hand, when the IC socket 10 is used without being provided with the cover member 16 (with the cover member 16 removed), the wiring board side ground portion 21c of the coil spring 21 is elastically deformed as shown in FIG. It is compressed and comes into contact with the wiring board 20. As a result, the socket body 13 is grounded to the ground portion of the wiring board 20, so that the charge can be released to a charge amount that always provides a desired inspection accuracy.

  In this state, the cover member-side ground portion 21 a of the coil spring 21 protrudes upward from the spring insertion hole 26 a of the fixed plate member 26.

  By arranging the grounding coil spring 21 in the socket body 13 in this way, when the cover member 16 is disposed, both the cover member 16 and the socket body 13 can be grounded. Even when the cover member 16 is not provided, the socket body 13 can be grounded.

  By the way, when the IC package 11 is tested using the IC socket 10 in which the cover member 16 is disposed, the test is performed as follows.

  First, the IC package 11 is accommodated on the accommodating surface portion 13 a of the socket body 13 with the lock lever member 15 and the cover member 16 being opened.

  Thereafter, the cover member 16 is closed and the lock lever member 15 is tilted to press the IC package 11 so that the solder balls 11b of the IC package 11 are brought into contact with the contact pins 14 with a desired contact pressure. A burn-in test or the like is performed by bringing the IC package 11 and the wiring board 20 into electrical contact with each other via the connector 14.

  On the other hand, if the cover member 16 is not provided, the IC package 11 is pressed by an automatic machine or the like, and the solder balls 11b of the IC package 11 are brought into contact with the contact pins 14 with a desired contact pressure. Then, a burn-in test or the like is performed by bringing the IC package 11 and the wiring board 20 into electrical contact via the contact pins 14.

  During these tests, the socket body 13 side and the cover member 16 side are brought into contact with the ground portion of the wiring board 20 through the coil spring 21 and grounded, so that the desired charge amount is always obtained. Since charges can be released, desired inspection accuracy can be obtained.

  Further, since the extraction preventing large diameter portion 21b of the coil spring 21 is configured to have a larger diameter than the diameter of the cover member-side ground member 21a, the extraction preventing large diameter portion 21b is The coil spring 21 housed in the spring opening hole 24 in the housing recess 23 is held so that it cannot be pulled out by fixing the fixing plate member 26 by the fixing screw member 25. Therefore, the coil spring 21 can be easily disposed.

  Further, the wiring board-side ground portion 21c of the coil spring 21 is in perpendicular contact with the grounding portion on the wiring board 20 side.

  For this reason, the deformation and deterioration that affect the conductivity, such as abrasion due to sliding contact of the contact portion and peeling of the plating, are suppressed, and the conductivity necessary and sufficient for releasing the charged charges can be maintained for a long time. it can.

  In the above-described embodiment, the present invention is applied to the IC socket 10 as the “electrical component socket”. However, the present invention is not limited to this and can be applied to other devices.

  In addition, the “earth member” has been described using the coil spring 21, but the present invention is not limited to this, and the state where the socket body 13 is disposed on the wiring board 20, such as a probe pin or a leaf spring member. As long as the grounding member that can be connected to the grounding portion provided on the wiring board 20 is provided on the socket body 13, it may of course be configured with other shapes, quantities and materials. It is.

  Further, the cover member 16 of the above embodiment has a cover base member 28 fixed on the socket main body 13, and the cover base member 28 is in contact with the coil spring 21 (ground member). Without being limited thereto, the cover base member 28 is not disposed, and the opening / closing body 29 (cover member) is rotatably disposed on the socket body 13 side. When the opening / closing body 29 is closed, the coil spring 21 ( It is also possible to ground by making contact with the ground member.

10 IC socket (socket for electrical parts)
11 IC package (electrical parts)
13 Socket body
14 Contact pin
14a Lower contact part
14b Upper contact
16 Cover member
20 Wiring board
21 Coil spring (grounding member)
21a Grounding part on cover side
21b Outlet prevention large diameter part
21c Wiring board side ground
26 Fixed plate member
28 Cover base material
29 Opening and closing body

Claims (4)

A socket body that houses electrical components provided with terminals and is arranged on a wiring board;
A contact pin provided on the socket body and formed with an upper contact portion that is in contact with a terminal of the electrical component and a lower contact portion that is connected to the wiring board;
In the socket for electrical parts with
The socket body is provided with a grounding member having conductivity, and when the socket body is disposed on the wiring board, the grounding member abuts on a grounding portion provided on the wiring board. When a wiring board-side grounding portion that is connected and grounded and a cover member that presses the accommodated electrical component is disposed on the socket body, the wiring board side grounding portion is in contact with and connected to the cover member. A socket for electrical parts, comprising: a cover member-side ground portion for performing the above. The cover member has a cover base member fixed on the socket body, and an opening / closing body rotatably disposed on the cover base member,
In a state where the cover base member is fixed on the socket body, the cover member side ground portion of the ground member is in contact with and connected to the cover base member, and the ground from the cover member side is connected to the ground member. The socket for an electrical component according to claim 1, wherein the socket is performed via a socket.   The electrical component socket according to claim 1, wherein the ground member is a coil spring that is elastically deformable.   The coil spring includes an extraction preventing large-diameter portion that has a larger diameter than the diameter of the cover-member-side ground portion provided at the upper end portion and the wiring board-side ground portion provided at the lower end portion, It is formed between the cover member-side ground portion and the wiring board-side ground portion, and the extraction preventing large-diameter portion is accommodated in the concave portion of the socket body and is pressed from above by a fixing plate member. The socket for electrical components according to claim 3.

Images