JP4373134B2 - Electrical connection parts and sockets for electrical parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electrical connection component that performs electrical connection between a terminal of an electrical component such as a semiconductor device (hereinafter referred to as an “IC package”) and a circuit board, and the electrical component provided with the electrical connection component. It relates to sockets.
[0002]
[Prior art]
Conventionally, as this kind of thing, there exists a thing as described in patent document 1, for example. As shown in FIG. 1 of the same document 1, the Kelvin probe is composed of two probes, an insulator inserted between the two probes, and an adhesive for fixing the two probes and the insulator. It is configured. And the front-end | tip part of two probes of this Kelvin probe is comprised so that it may be electrically connected by contacting the semiconductor element pad formed in the semiconductor element.
[0003]
[Patent Document 1]
Japanese Utility Model Laid-Open No. 1-174932.
[0004]
[Problems to be solved by the invention]
However, in such a conventional Kelvin probe, since two probes on a straight line and an insulator are fixed with an adhesive, it is difficult to be elastically deformed and spring property cannot be obtained. It was difficult to obtain a predetermined contact pressure with the element pad.
[0005]
Accordingly, the present invention has been made in view of the above points, and has an electrical connection component that has a spring property and can secure a predetermined contact pressure, and an electrical component socket provided with the electrical connection component. It is an issue to provide.
[0006]
[Means for Solving the Problems]
In order to achieve this object, the invention described in claim 1 has a conductive linear conductive member main body having contact portions formed at both ends, and each of the conductive member main bodies includes the two conductive member main bodies. a plurality of conductive members which the spring portions shaped coil is formed between the contact portion, are disposed superposed with each other insulated with said plurality of conductive members are each coated with an insulating member, each of said conductive member The contact portions are combined so as to be adjacent to each other, and the plurality of adjacent contact portions are configured to be in contact with one terminal of the electrical component.
[0007]
In addition to the structure of Claim 1, the invention described in Claim 2 is configured such that the conductive member is configured by covering a portion other than the contact portion of the conductive member body with an insulating coat, and the conductive member is A plurality of the contact members are disposed so that the contact portions of the conductive members are adjacent to each other, and the adjacent contact portions are configured to be brought into contact with one terminal of the electrical component. Features.
[0009]
The invention described in claim 3 is characterized in that, in addition to the structure described in claim 1 or 2 , a guide member having an insulating property is inserted into the coiled inside of the spring portion.
[0010]
According to a fourth aspect of the present invention, in addition to the configuration according to any one of the first to third aspects, the contact portion side of the plurality of conductive members is inserted into an insertion hole formed in the holding plate of the case member. It is characterized by that.
[0011]
According to a fifth aspect of the present invention, a plurality of electrical connection parts according to any one of the first to fourth aspects are disposed in a socket body in which electrical parts are accommodated. The contact portions adjacent to each other of the plurality of conductive members are configured to be brought into contact with one terminal of the electrical component.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below.
[0013]
1 to 5 show an embodiment of the present invention.
[0014]
First, the configuration will be described. Reference numeral 11 in the drawing is an IC socket as an “electrical component socket” called a so-called clamshell type. The IC socket 11 is a performance test of an IC package 12 that is an “electrical component”. For this purpose, the terminal 12b of the IC package 12 is electrically connected to the circuit board 13 of the measuring instrument (tester).
[0015]
As shown in FIG. 5, the IC package 12 has a rectangular flat package body 12a, and a plurality of terminals 12b are formed at a predetermined pitch on four sides of the lower surface of the package body 12a.
[0016]
As shown in FIGS. 1 and 2, the IC socket 11 has a socket body 15 mounted on a circuit board 13, and the socket body 15 is connected to the socket body 16 as an “electrical connection component”. A cover member 19 for pressing the IC package 12 is rotatably attached to the socket body 16, and a stopper member 20 for maintaining the closed state of the cover member 19 is provided. Is provided.
[0017]
Specifically, a recess 16a larger than the IC package 12 is formed at the center of the socket body 16, and a storage portion 16c for storing a plurality of Kelvin probe units 17 is formed on the bottom plate portion 16b of the recess 16a. In addition, a guide plate 24 is disposed above the bottom plate portion 16b. These storage portions 16c are recesses having a rectangular parallelepiped shape, and are formed at a pitch corresponding to the plurality of IC package terminals 12b.
[0018]
As shown in FIG. 3, the Kelvin probe unit 17 includes two conductive members 21, a guide member 22 inserted into the conductive member 21, and a case member 23 that holds the conductive members 21 and the like. ing.
[0019]
Specifically, the conductive member 21 has a conductive linear conductive member main body 21a having contact portions 21b formed at both ends, and the conductive member main body 21a includes a space between the contact portions 21b. The coil-shaped spring part 21c is formed in this. Sites other than the contact portion 21b of the conductive member main body 21a are covered with an insulating coat 21d. The conductive members 21 are overlapped with each other in an insulated state, and the contact portions 21b of the conductive members 21 are adjacent to each other.
[0020]
The guide member 22 is made of a synthetic resin, has a cylindrical shape, and is inserted into the coil shape of the spring portion 21 c of both the conductive members 21. The guide member 22 guides the spring portion 21c so as not to be bent sideways when the coiled spring portion 21c expands and contracts.
[0021]
Furthermore, the case member 23 is made of an insulating synthetic resin, is formed in a U shape, and holding plates 23a are formed at both ends of the U shape. Each of the holding plates 23a is formed with two insertion holes 23b that are slightly separated from each other. The contact portions 21b of the two conductive members 21 are inserted in these insertion holes 23b so as to be movable up and down, and the contact portions 21b are in contact with each other by separating the two insertion holes 23b. Yes.
[0022]
The Kelvin probe unit 17 configured as described above is accommodated in the accommodating portion 16c of the socket body 16, and the lower contact portion 21b of the conductive member 21 is inserted into the through hole 16d formed in the bottom plate portion 16b of the socket body 16. By being inserted and projecting downward, it is configured to be in contact with and electrically connected to the electrode of the circuit board 13.
[0023]
Further, the contact portion 21b on the upper side of the conductive member 21 is inserted into a through hole 24a formed in the guide plate 24 and protrudes upward, thereby being brought into contact with and electrically connected to the terminal 12b of the IC package 12. It is configured to be.
[0024]
Further, as shown in FIG. 2, the guide plate 24 is formed with four guide portions 24b for guiding the four corners of the IC package 12 on the upper surface portion, and the IC package 12 is guided by these guide portions 24b. Is accommodated (placed) at a predetermined position of the guide plate 24.
[0025]
The terminal 12b of the IC package 12 accommodated on the guide plate 24 is brought into contact with the contact portion 21b on the upper side of the conductive member 21.
[0026]
Further, a set plate 34 made of synthetic resin is fixed to the socket body 16 with bolts 35 and nuts 36 above the guide plate 24 and the socket body 16.
[0027]
On the other hand, as shown in FIG. 1, the cover member 19 is rotatably disposed on the socket body 16 by a rotation shaft 39, is urged in the opening direction by a spring 40, and is a stopper member 20 provided at the distal end portion. Is engaged with and disengaged from the locked portion 16e in which the socket body 16 is formed.
[0028]
Further, the cover presser 19 is provided on the cover member 19 so as to be movable up and down in the state shown in FIG. 1, and the locking claw piece 41a is locked to the cover member 19 to prevent the cover holder 19 from falling off. In the state shown in FIG. 1, the package presser 41 is urged downward by a spring 42.
[0029]
The package presser 41 is formed such that the lower part is formed in a tapered shape, and the package main body 12a is pressed by the pressing part 41b on the lower surface part as shown in FIG.
[0030]
Next, an example of an assembly method of the Kelvin probe unit 17 will be described.
[0031]
First, as shown in FIG. 4A, two conductive members 21 are formed, and as shown in FIG. 4B, the two conductive members 21 are overlapped, and the guide member 22 is placed in the coiled spring portion 21c. Insert. Then, as shown in (c), the contact portion 21b of the conductive member 21 in which the guide member 22 is inserted is inserted into the insertion hole 23b of the holding plate 23a of the case member 23, and is assembled as shown in (d). To complete.
[0032]
Next, the operation will be described.
[0033]
In a state where the IC socket 11 is attached to the circuit board 13 in advance, the contact portions 21 b of the two conductive members 21 are in contact with the electrodes of the circuit board 13.
[0034]
In order to accommodate the IC package 12 from this state, the cover member 19 is opened, and the IC package 12 is guided and accommodated on the guide plate 24 by the guide portion 24b.
[0035]
Thereafter, the cover member 19 is closed, and the stopper member 20 is locked to the locked portion 16e of the socket body 16, whereby the cover member 19 is completely closed.
[0036]
Thereby, as shown in FIG. 2, the upper surface of the package body 12 a is pressed by the pressing portion 41 b of the package presser 41.
[0037]
As a result, the two contact portions 21b of the conductive member 21 come into contact with and press against one terminal 12b of the IC package 12, whereby the spring portion 21c of the conductive member 21 is elastically deformed, and the upper contact portion 21b is Displaces downward. Due to the elastic force of the spring portion 21c, the contact pressure between the two contact portions 21b of the conductive member 21 and the IC package terminal 12b is secured. Thus, the two contact portions 21b can be simultaneously brought into contact with one terminal 12b.
[0038]
In this way, the IC package 12 and the circuit board 13 are electrically connected via the Kelvin probe unit 17, whereby a burn-in test or the like of the IC package 12 is performed.
[0039]
When taking out the IC package 12 for which the test has been completed, the stopper member 20 is rotated to release the locked state, and then the cover member 19 is opened to remove the IC package 12. be able to.
[0040]
Thus, since the contact parts 21b of these conductive members 21 can be brought close to each other by using a plurality of needle-like conductive members 21, even the terminals 12b having a small area can be simultaneously contacted. Further, by bending the conductive member 21 to form the spring portion 21c, the contact pressure between the terminal 12b of the IC package 12 and the contact portion 21b of the conductive member 21 can be secured.
[0041]
In addition, the conductive member 21 is formed by covering the portion other than the contact portion 21b of the conductive member main body 21a with the insulating coat 21d. By providing a plurality of the conductive members 21, the Kelvin probe unit 17 can be easily configured. Can do.
[0042]
Further, since the spring portion 21c of the conductive member 21 is formed in a coil shape and the conductive members 21 are overlapped, it is possible to effectively dispose a plurality of conductive members 21 having spring properties within a narrow range. it can.
[0043]
Further, by inserting the insulating guide member 22 into the coiled inside of the spring portion 21c, it is possible to prevent the spring portion 21c from being bent laterally when the spring portion 21c is expanded or contracted.
[0044]
The Kelvin probe unit 17 can be configured by inserting and holding the contact portions 21b side of the plurality of conductive members 21 through the insertion holes 23b formed in the holding plate 23a of the case member 23. The unit 17 unit It is easy to handle and can be easily assembled and can be easily assembled.
[0045]
In the above-described embodiment, the present invention is applied to the IC socket 11 as the “socket for electrical parts”. However, the present invention is not limited to this and can be applied to other devices. In the above embodiment, the present invention is applied to the so-called clamshell type IC socket 11, but the present invention is not limited to this, and can also be applied to an open top type IC socket. Further, the present invention is applied to an IC socket 11 that accommodates an LGA (Land Grid Array) type IC package 12 as an “electrical component”, but other types such as a BGA (Ball Grid Array) type, a gull wing type, and the like. Of course, the present invention can be applied to an IC socket that accommodates the IC package.
[0046]
Moreover, in the said embodiment, although the two electrically-conductive members are provided, not only this but 3 or more can also be used. Furthermore, both of the two conductive member bodies are covered with an insulating coat, but by covering only one of the conductive member bodies with an insulating coat, it is possible to insulate between the two conductive members. Furthermore, although the spring part of each conductive member is formed in a coil shape, the present invention is not limited to this, and it is of course possible to have an S shape or a U shape as long as the spring property can be obtained. It is. Moreover, in the above-described embodiment, the two conductive members are overlapped. However, the present invention is not limited to this and may be separated.
[0047]
【The invention's effect】
As described above, according to the first aspect of the present invention, a conductive linear conductive member body having contact portions formed at both ends is provided, and each conductive member body has both contact points. a plurality of conductive members which the spring portion is formed between the parts, a plurality of conductive members are disposed in a mutually insulated state while being covered by respective insulating members, each of the contact portions of the conductive members are adjacent to each other Since a plurality of adjacent contact portions are configured to come into contact with one terminal of the electrical component, the spring property can be secured by the spring portion, and a predetermined contact pressure is applied to the electrical component terminal. Can be secured.
[0048]
According to the first aspect of the present invention, since the spring portion is formed in a coil shape and each conductive member is overlapped, a plurality of conductive members having spring properties are effectively disposed within a narrow range. be able to.
[0049]
According to the second aspect of the present invention, a conductive member is formed by covering a portion other than the contact portion of the conductive member body with an insulating coat, and a plurality of conductive members are provided, and each conductive member is contacted. Since the parts are combined so as to be adjacent to each other, a plurality of conductive members can be easily formed, and the conductive members can be easily insulated from each other.
[0050]
According to the third aspect of the present invention, since the insulating guide member is inserted into the coiled inside of the spring portion, it is possible to prevent the spring portion from being bent laterally when the spring portion is expanded or contracted. it can.
[0051]
According to invention of Claim 4 , since the contact part side of the some electrically-conductive member was penetrated by the insertion hole formed in the holding plate of a case member, a some electroconductive member can be integrated and handling is convenient. At the same time, the assemblability can be improved.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an IC socket according to an embodiment of the present invention.
2 is an enlarged cross-sectional view of a portion X in FIG. 1 according to the same embodiment. FIG.
3A and 3B are diagrams showing a Kelvin probe unit according to the embodiment, in which FIG. 3A is a front view thereof, FIG. 3B is a plan view of FIG. 3A, and FIG. 3C is a line AA in FIG. It is sectional drawing which follows.
FIG. 4 is an explanatory view showing a method for assembling the Kelvin probe unit according to the embodiment;
5A and 5B are diagrams showing the IC package according to the embodiment, where FIG. 5A is a bottom view of the IC package and FIG. 5B is a right side view;
[Explanation of symbols]
11 IC socket (socket for electrical parts)
12 IC package (electrical parts)
12a Package body
12b terminal
13 Circuit board
15 Socket body
16 Socket body
16a recess
16b Bottom plate
16c compartment
17 Kelvin probe unit (electrical connection parts)
21 Conductive members
21a Conductive member body
21b Contact area
21c Spring part
21d insulation coat
22 Guide member
23 Case material
23a Retaining plate
23b Insertion hole

Claims (5)

Conductive linear conductive member bodies having contact portions formed at both ends, each conductive member body having a conductive member having a coiled spring portion formed between the contact portions. Multiple
Are arranged superimposed to each other insulated with said plurality of conductive members are each coated with an insulating member, be combined so that each contact portions of the respective conductive members are adjacent to each other, the contact of the plurality of contact該隣An electrical connection component, wherein the portion is configured to be in contact with one terminal of the electrical component.   The conductive member is formed by covering a portion other than the contact portion of the conductive member main body with an insulating coat, a plurality of the conductive members are disposed, and the contact portions of the conductive members are adjacent to each other. The electrical connection component according to claim 1, wherein the electrical connection component is configured such that the plurality of adjacent contact portions are brought into contact with one terminal of the electrical component. Inside coiled the spring portion, the electrical connection part according to claim 1 or 2, she characterized in that the guide member having an insulating property is inserted. The contact portion of the plurality of conductive members, electrical connection component according to any one of claims 1 to 3, characterized in that inserted into the insertion hole formed in the holding plate of the case member. A plurality of electrical connection components according to any one of claims 1 to 4 are disposed in a socket body in which electrical components are accommodated, and a plurality of conductive members of each electrical connection component are adjacent to each other. An electrical component socket, wherein the portion is configured to be brought into contact with one terminal of the electrical component.

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